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市場調查報告書
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1479880

絕緣體上矽 (SOI) 市場 - 2024 年至 2029 年預測

Silicon-on-Insulator (SOI) Market - Forecasts from 2024 to 2029
出版日期: | 出版商: Knowledge Sourcing Intelligence | 英文 145 Pages | 商品交期: 最快1-2個工作天內

價格
簡介目錄

2022年絕緣體上矽（SOI）市值為1,353,442,000美元，預計複合年成長率為19.80%，到2029年市場規模將達到4,595,902,000美元。

稱為絕緣體上矽 (SOI) 技術的新型半導體製造流程提高了積體電路 (IC) 的性能和效率。在氧化矽 (SiO2) 或藍寶石技術中，在絕緣基板的頂部形成一層薄薄的矽（稱為主動層）。在這種「三明治」結構中，絕緣層將主動矽層與基板電隔離。與傳統的體矽基基板相比，這種隔離減少了寄生電容，提高了 IC 速度、功率效率和抗噪能力。

此外，絕緣基板提供的隔離提高了基於SOI的IC的抗輻射性和抗噪性，使其適合在汽車和飛機等惡劣環境中使用。

市場趨勢：

推動矽晶絕緣體市場成長的關鍵因素是5G技術的日益普及，特別是在新興經濟體。不斷成長的網際網路普及是 5G 技術投資興起的關鍵因素，預計將進一步增加對新介面和組件技術的需求，並對絕緣體上矽 (SOI) 需求產生積極影響。

新興經濟體尤其正在投資家庭自動化，並擴大採用智慧和連接型家電，進一步擴大市場成長機會。然而，替代技術的可用性預計將阻礙未來幾年的市場成長。

市場促進因素：

  • 5G 技術的更多採用預計將推動市場成長。

網路普及的提高加上無線技術的快速進步預計將在預測期內推動市場成長。全球網路用戶數量的增加導致服務供應商增加投資以開發更快、更先進的服務，以便透過提供更好的服務並獲得相對於其他供應商的優勢來滿足使用者需求。

預計 5G 技術的出現將在預測期內進一步推動市場成長。此外，5G 預計將以更高的頻率運行，從而能夠採用新的介面和組件技術。

  • 主要市場參與企業的進入預計將提振市場。

主要市場參與企業以研發投資、產品發布、聯盟和擴張投資等形式進入進一步表明了未來幾年的市場成長潛力。例如，2021年11月，Soitec收購了先進技術公司NOVASiC，以強化其SiC晶圓技術。此外，2022 年 7 月，義法半導體和 GlobalFoundries 宣布簽署合作備忘錄，在法國克羅爾建立 300 毫米製造工廠，用於 FD-SOI 製造。

  • RF-SOI市場預計將快速成長

絕緣體矽市場依產品分為 RF-SOI、PD-SOI、FD-SOI、Power SOI 等。由於家用電子電器領域和網路應用的需求不斷成長，特別是提高毫米波和 5G 等技術的能力，預計 RF-SOI 市場將在預測期內成長。

部分耗盡 (PD-SOI) 矽晶圓支援微處理器的製造和開發，由於其在各種電子和半導體應用中的使用不斷增加，其使用量也不斷增加。

此外，FD-SOI 領域正在見證各種最終用戶產業對先進和強化裝置的需求，以滿足各種超低功耗應用，例如支援電子產業發展的 FDSOI MOSFET 和多閘極 MOSFET。重要佔有率。

預計亞太地區將佔據市場主要佔有率

依地區分類，矽晶絕緣體市場分為北美、南美、歐洲、中東和非洲、亞太地區。亞太地區在基線估計中佔很大佔有率，由於該地區智慧型手機和通訊製造投資增加，預計該地區將快速成長。同時，美國政府對促進國內製造業的日益重視預計將推動該國市場的成長，而歐洲市場預計將在預測期內穩步成長。

隨著主要智慧型手機製造商開始實施 5G 技術，亞太地區 RF-SOI 市場預計將快速成長。 2020 年 2 月，東芝電子元件及儲存裝置公司推出了 TaRF11，這是最新一代 RF-SOI，專門針對 5G 行動裝置中的射頻開關和低噪音放大器進行了最佳化。

主要進展：

  • 2023 年 3 月，為 MEMS、感測器、射頻和功率裝置製造提供先進矽晶圓的行業領導者 Okmetic 宣布推出具有無平台 SOI 功能的 200 毫米鍵合絕緣體上矽 BSOI 和 E-SOI(R) 晶圓宣布可用性。
  • 2022 年 9 月，Guerrilla RF, Inc. 推出了新型 GRF6402 數位步進衰減器 (DSA)。在收到樣品準備和策略客戶群的積極檢驗後，該公司準備推進其首款絕緣體上矽 (SOI) 產品的批量生產。這對 Guerrilla RF, Inc. (GRF) 來說是一個重要的里程碑，擴大了該公司目前的產品組合，將來自業界領先的半導體晶圓代工廠的尖端矽納入其中。

目錄

第1章簡介

  • 市場概況
  • 市場定義
  • 調查範圍
  • 市場區隔
  • 貨幣
  • 先決條件
  • 基準年和預測年時間表
  • 相關利益者的主要利益

第2章調查方法

  • 研究設計
  • 調查過程

第3章執行摘要

  • 主要發現
  • 分析師觀點

第4章市場動態

  • 市場促進因素
  • 市場限制因素
  • 波特五力分析
  • 產業價值鏈分析
  • 分析師觀點

第5章絕緣體上矽 (SOI) 市場：以晶圓尺寸分類

  • 介紹
  • 200mm以下
  • 200mm
  • 300mm

第6章絕緣體上矽 (SOI) 市場：依技術分類

  • 介紹
  • 智慧剪切
  • 黏合
  • 層轉移

第 7 章絕緣體上矽 (SOI) 市場：依產品

  • 介紹
  • RF-SOI
  • PD-SOI
  • FD-SOI
  • Power-SOI
  • 其他

第 8 章絕緣體上矽 (SOI) 市場：依最終用戶產業分類

  • 介紹
  • 家用電器
  • 車
  • 通訊
  • 軍事和國防
  • 其他

第9章絕緣體上矽（SOI）市場：依地區

  • 介紹
  • 北美洲
    • 按晶圓尺寸
    • 依技術
    • 依產品
    • 按最終用戶產業
    • 按國家/地區
  • 南美洲
    • 按晶圓尺寸
    • 依技術
    • 依產品
    • 按最終用戶產業
    • 按國家/地區
  • 歐洲
    • 按晶圓尺寸
    • 依技術
    • 依產品
    • 按最終用戶產業
    • 按國家/地區
  • 中東/非洲
    • 按晶圓尺寸
    • 依技術
    • 依產品
    • 按最終用戶產業
    • 按國家/地區
  • 亞太地區
    • 按晶圓尺寸
    • 依技術
    • 依產品
    • 按最終用戶產業
    • 按國家/地區

第10章競爭環境及分析

  • 主要企業及策略分析
  • 市場佔有率分析
  • 合併、收購、協議和合作
  • 競爭對手儀表板

第11章 公司簡介

  • SOITEC
  • Sumco Corporation
  • GlobalFoundries
  • STMicroelectronics
  • NXP Semiconductor
  • Shin-Etsu Chemical Co., Ltd.
  • Qorvo, Inc.
  • Shanghai Simgui Technology Co., Ltd.
簡介目錄
Product Code: KSI061611941

The silicon-on-insulator (SOI) market is evaluated at US$1,353.442 million for the year 2022 and is projected to grow at a CAGR of 19.80% to reach a market size of US$4,595.902 million by the year 2029.

Integrated circuit (IC) performance and efficiency are improved by the novel semiconductor fabrication process known as silicon-on-insulator (SOI) technology. A thin layer of silicon, known as the active layer, is formed on top of an insulating substrate in silicon oxide (SiO2) or sapphire technology. The insulating layer separates the active silicon layer from the substrate electrically in this "sandwich" structure created via fabrication. Compared to conventional bulk silicon substrates, this separation lowers parasitic capacitance and enhances IC speed, power efficiency, and noise immunity.

Additionally, SOI-based ICs' radiation hardness and noise immunity are improved by the isolation offered by the insulating substrate, which qualifies them for use in hostile environments like those found in automobiles and aircraft.

MARKET TRENDS:

The major factors driving the silicon on insulator market growth include the rising incorporation of 5G technology, majorly in the developing economies of the globe. The growing internet penetration has been a major factor in the budding investments in 5G technology, which is anticipated to further augment the demand for new interface and component technologies, thereby positively impacting the demand for silicon-on-insulators (SOI).

The expanding adoption of SOI wafers across the consumer electronics industry is also projected to be one of the important factors driving the market growth, as the adoption of smart appliances and connected appliances, along with investments in home automation, especially in the developed economies, is further widening the opportunities for the market growth. However, the availability of substitute technology is anticipated to hamper the market's growth in the coming years.

MARKET DRIVERS:

  • The rising incorporation of 5G technology is anticipated to drive the market's growth.

The growing internet penetration coupled with rapid advancements in wireless technology is expected to propel the market growth during the forecast period. The growing number of internet users globally is further leading to budding investments by the service providers for the development of faster and more advanced services to meet the requirements of the users by providing better services and gaining an advantage over other providers.

The emergence of 5G technology is further expected to drive the growth of the market during the projected period. Moreover, 5G is expected to operate on much higher frequencies, which is further anticipated to enable the adoption of new interface and component technologies.

  • Participation of key market players is predicted to boost the market.

The participation of key market players in the form of R&D investments, product launches, partnerships, and expansion investments further shows the potential for the market to grow in the coming years. For instance, in November 2021, Soitec acquired the advanced technology company, NOVASiC to enhance its SiC wafer technology. Further, in July 2022, STMicroelectronics and GlobalFoundries announced the signing of a memorandum of understanding according to which, the market giants would set up a 300mm manufacturing facility in Crolles, France for the production of FD-SOI.

  • The RF-SOI market is projected to grow rapidly

By product, the silicon in the insulator market is segmented as RF-SOI, PD-SOI, FD-SOI, power SOI, and others. The RF-SOI market is expected to grow during the forecast period due to rising demand from the consumer electronics sector and networking applications to improve the capabilities of technologies such as mmWave and 5G, among others.

The growing usage of silicon wafers in PD-SOI (Partially depleted) to support the fabrication and development of microprocessors, due to the rising usage in different electronics and semiconductor applications.

In addition, the FD-SOI segment is expected to hold a significant share over the forecast period owing to the burgeoning demand for advanced and enhanced devices from various end-user industries for catering to the various ultra-low-power applications such as FDSOI MOSFETS and multi-gate MOSFETS to aid in the development of the electronics industry.

Asia-Pacific is estimated to hold a significant share of the market

By geography, the silicon on insulator market is segmented into North America, South America, Europe, the Middle East and Africa, and Asia Pacific. Asia-Pacific is estimated to hold a significant share in the base year and is anticipated to grow at a rapid pace as a result of rising investment in smartphone and telecommunication manufacturing in the region. Simultaneously, the growing focus by the government of the United States to promote domestic manufacturing is anticipated to drive the market's growth in the country, while the European market is projected to grow at a steady pace during the forecast period.

The RF-SOI market in Asia-Pacific is projected to grow at a rapid rate as major smartphone manufacturers start incorporating 5G technology. Toshiba Electronic Device & Storage Corporation launched "TaRF11" in February 2020, its latest generation of RF-SOI that has been specifically optimized for RF switches and low-noise amplifiers in 5G mobile devices.

Key Developments:

  • In March 2023, for its 200 mm Bonded Silicon-On-Insulator BSOI and E-SOI(R) wafers, Okmetic, the industry leader in advanced silicon wafer supply for the production of MEMS, sensor, RF, and power devices, has announced the availability of Terrace Free SOI capabilities.
  • In September 2022, the new GRF6402 digital step attenuator (DSA) was launched by Guerrilla RF, Inc. The company is prepared to proceed the production with mass-producing its first silicon-on-insulator (SOI) product after sampling and receiving positive validation from its strategic customer base. This is a significant milestone for Guerrilla RF (GRF), as it signifies the expansion of its current portfolio to now include cutting-edge silicon from one of the top semiconductor foundries in the business.

Segmentation:

By Wafer Size

  • Less than 200mm
  • 200mm
  • 300mm

By Technology

  • Smart Cut
  • Bonding
  • Layer Transfer

By Product

  • RF-SOI
  • PD-SOI
  • FD-SOI
  • Power-SOI
  • Others

By End-User Industry

  • Consumer Electronics
  • Automotive
  • Telecommunication
  • Military and Defense
  • Others

By Geography

  • North America
  • USA
  • Canada
  • Mexico
  • South America
  • Brazil
  • Argentina
  • Others
  • Europe
  • United Kingdom
  • Germany
  • France
  • Spain
  • Others
  • Middle East and Africa
  • Saudi Arabia
  • UAE
  • Israel
  • Others
  • Asia Pacific
  • China
  • Japan
  • India
  • South Korea
  • Taiwan
  • Thailand
  • Indonesia
  • Others

TABLE OF CONTENTS

1. INTRODUCTION

  • 1.1. Market Overview
  • 1.2. Market Definition
  • 1.3. Scope of the Study
  • 1.4. Market Segmentation
  • 1.5. Currency
  • 1.6. Assumptions
  • 1.7. Base, and Forecast Years Timeline
  • 1.8. Key Benefits for the stakeholder

2. RESEARCH METHODOLOGY

  • 2.1. Research Design
  • 2.2. Research Processes

3. EXECUTIVE SUMMARY

  • 3.1. Key Findings
  • 3.2. Analyst View

4. MARKET DYNAMICS

  • 4.1. Market Drivers
  • 4.2. Market Restraints
  • 4.3. Porter's Five Forces Analysis
    • 4.3.1. Bargaining Power of Suppliers
    • 4.3.2. Bargaining Power of Buyers
    • 4.3.3. Threat of New Entrants
    • 4.3.4. Threat of Substitutes
    • 4.3.5. Competitive Rivalry in the Industry
  • 4.4. Industry Value Chain Analysis
  • 4.5. Analyst View

5. SILICON ON INSULATOR (SOI) MARKET, BY WAFER SIZE

  • 5.1. Introduction
  • 5.2. Less than 200mm
    • 5.2.1. Market Trends and Opportunities
    • 5.2.2. Growth Prospects
    • 5.2.3. Geographic Lucrativeness
  • 5.3. 200 mm
    • 5.3.1. Market Trends and Opportunities
    • 5.3.2. Growth Prospects
    • 5.3.3. Geographic Lucrativeness
  • 5.4. 300 mm
    • 5.4.1. Market Trends and Opportunities
    • 5.4.2. Growth Prospects
    • 5.4.3. Geographic Lucrativeness

6. SILICON ON INSULATOR (SOI) MARKET, BY TECHNOLOGY

  • 6.1. Introduction
  • 6.2. Smart Cut
    • 6.2.1. Market Trends and Opportunities
    • 6.2.2. Growth Prospects
    • 6.2.3. Geographic Lucrativeness
  • 6.3. Bonding
    • 6.3.1. Market Trends and Opportunities
    • 6.3.2. Growth Prospects
    • 6.3.3. Geographic Lucrativeness
  • 6.4. Layer Transfer
    • 6.4.1. Market Trends and Opportunities
    • 6.4.2. Growth Prospects
    • 6.4.3. Geographic Lucrativeness

7. SILICON ON INSULATOR (SOI) MARKET, BY PRODUCT

  • 7.1. Introduction
  • 7.2. RF-SOI
    • 7.2.1. Market Trends and Opportunities
    • 7.2.2. Growth Prospects
    • 7.2.3. Geographic Lucrativeness
  • 7.3. PD-SOI
    • 7.3.1. Market Trends and Opportunities
    • 7.3.2. Growth Prospects
    • 7.3.3. Geographic Lucrativeness
  • 7.4. FD-SOI
    • 7.4.1. Market Trends and Opportunities
    • 7.4.2. Growth Prospects
    • 7.4.3. Geographic Lucrativeness
  • 7.5. Power-SOI
    • 7.5.1. Market Trends and Opportunities
    • 7.5.2. Growth Prospects
    • 7.5.3. Geographic Lucrativeness
  • 7.6. Others
    • 7.6.1. Market Trends and Opportunities
    • 7.6.2. Growth Prospects
    • 7.6.3. Geographic Lucrativeness

8. SILICON ON INSULATOR (SOI) MARKET, BY END-USER INDUSTRY

  • 8.1. Introduction
  • 8.2. Consumer Electronics
    • 8.2.1. Market Trends and Opportunities
    • 8.2.2. Growth Prospects
    • 8.2.3. Geographic Lucrativeness
  • 8.3. Automotive
    • 8.3.1. Market Trends and Opportunities
    • 8.3.2. Growth Prospects
    • 8.3.3. Geographic Lucrativeness
  • 8.4. Telecommunication
    • 8.4.1. Market Trends and Opportunities
    • 8.4.2. Growth Prospects
    • 8.4.3. Geographic Lucrativeness
  • 8.5. Military and Defense
    • 8.5.1. Market Trends and Opportunities
    • 8.5.2. Growth Prospects
    • 8.5.3. Geographic Lucrativeness
  • 8.6. Others
    • 8.6.1. Market Trends and Opportunities
    • 8.6.2. Growth Prospects
    • 8.6.3. Geographic Lucrativeness

9. SILICON ON INSULATOR (SOI) MARKET, BY GEOGRAPHY

  • 9.1. Introduction
  • 9.2. North America
    • 9.2.1. By Wafer Size
    • 9.2.2. By Technology
    • 9.2.3. By Product
    • 9.2.4. By End-User Industry
    • 9.2.5. By Country
      • 9.2.5.1. USA
        • 9.2.5.1.1. Market Trends and Opportunities
        • 9.2.5.1.2. Growth Prospects
      • 9.2.5.2. Canada
        • 9.2.5.2.1. Market Trends and Opportunities
        • 9.2.5.2.2. Growth Prospects
      • 9.2.5.3. Mexico
        • 9.2.5.3.1. Market Trends and Opportunities
        • 9.2.5.3.2. Growth Prospects
  • 9.3. South America
    • 9.3.1. By Wafer Size
    • 9.3.2. By Technology
    • 9.3.3. By Product
    • 9.3.4. By End-User Industry
    • 9.3.5. By Country
      • 9.3.5.1. Brazil
        • 9.3.5.1.1. Market Trends and Opportunities
        • 9.3.5.1.2. Growth Prospects
      • 9.3.5.2. Argentina
        • 9.3.5.2.1. Market Trends and Opportunities
        • 9.3.5.2.2. Growth Prospects
      • 9.3.5.3. Others
        • 9.3.5.3.1. Market Trends and Opportunities
        • 9.3.5.3.2. Growth Prospects
  • 9.4. Europe
    • 9.4.1. By Wafer Size
    • 9.4.2. By Technology
    • 9.4.3. By Product
    • 9.4.4. By End-User Industry
    • 9.4.5. By Country
      • 9.4.5.1. United Kingdom
        • 9.4.5.1.1. Market Trends and Opportunities
        • 9.4.5.1.2. Growth Prospects
      • 9.4.5.2. Germany
        • 9.4.5.2.1. Market Trends and Opportunities
        • 9.4.5.2.2. Growth Prospects
      • 9.4.5.3. France
        • 9.4.5.3.1. Market Trends and Opportunities
        • 9.4.5.3.2. Growth Prospects
      • 9.4.5.4. Spain
        • 9.4.5.4.1. Market Trends and Opportunities
        • 9.4.5.4.2. Growth Prospects
      • 9.4.5.5. Others
        • 9.4.5.5.1. Market Trends and Opportunities
        • 9.4.5.5.2. Growth Prospects
  • 9.5. Middle East and Africa
    • 9.5.1. By Wafer Size
    • 9.5.2. By Technology
    • 9.5.3. By Product
    • 9.5.4. By End-User Industry
    • 9.5.5. By Country
      • 9.5.5.1. Saudi Arabia
        • 9.5.5.1.1. Market Trends and Opportunities
        • 9.5.5.1.2. Growth Prospects
      • 9.5.5.2. UAE
        • 9.5.5.2.1. Market Trends and Opportunities
        • 9.5.5.2.2. Growth Prospects
      • 9.5.5.3. Israel
        • 9.5.5.3.1. Market Trends and Opportunities
        • 9.5.5.3.2. Growth Prospects
      • 9.5.5.4. Others
        • 9.5.5.4.1. Market Trends and Opportunities
        • 9.5.5.4.2. Growth Prospects
  • 9.6. Asia Pacific
    • 9.6.1. By Wafer Size
    • 9.6.2. By Technology
    • 9.6.3. By Product
    • 9.6.4. By End-User Industry
    • 9.6.5. By Country
      • 9.6.5.1. China
        • 9.6.5.1.1. Market Trends and Opportunities
        • 9.6.5.1.2. Growth Prospects
      • 9.6.5.2. Japan
        • 9.6.5.2.1. Market Trends and Opportunities
        • 9.6.5.2.2. Growth Prospects
      • 9.6.5.3. India
        • 9.6.5.3.1. Market Trends and Opportunities
        • 9.6.5.3.2. Growth Prospects
      • 9.6.5.4. South Korea
        • 9.6.5.4.1. Market Trends and Opportunities
        • 9.6.5.4.2. Growth Prospects
      • 9.6.5.5. Taiwan
        • 9.6.5.5.1. Market Trends and Opportunities
        • 9.6.5.5.2. Growth Prospects
      • 9.6.5.6. Thailand
        • 9.6.5.6.1. Market Trends and Opportunities
        • 9.6.5.6.2. Growth Prospects
      • 9.6.5.7. Indonesia
        • 9.6.5.7.1. Market Trends and Opportunities
        • 9.6.5.7.2. Growth Prospects
      • 9.6.5.8. Others
        • 9.6.5.8.1. Market Trends and Opportunities
        • 9.6.5.8.2. Growth Prospects

10. COMPETITIVE ENVIRONMENT AND ANALYSIS

  • 10.1. Major Players and Strategy Analysis
  • 10.2. Market Share Analysis
  • 10.3. Mergers, Acquisitions, Agreements, and Collaborations
  • 10.4. Competitive Dashboard

11. COMPANY PROFILES

  • 11.1. SOITEC
  • 11.2. Sumco Corporation
  • 11.3. GlobalFoundries
  • 11.4. STMicroelectronics
  • 11.5. NXP Semiconductor
  • 11.6. Shin- Etsu Chemical Co., Ltd.
  • 11.7. Qorvo, Inc.
  • 11.8. Shanghai Simgui Technology Co., Ltd.