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1496924

軟性印刷電路板(FPC) 市場：趨勢、機會與競爭分析 [2024-2030]

Flexible Printed Circuit Board Market: Trends, Opportunities and Competitive Analysis [2024-2030]
出版日期: | 出版商: Lucintel | 英文 197 Pages | 商品交期: 3個工作天內

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簡介目錄

軟性印刷電路板市場趨勢及預測

全球軟性印刷電路板（FPC）市場預計到 2030 年將達到 227 億美元，2024 年至 2030 年複合年成長率為 3.2%。該市場的主要驅動力是通訊業對 FPC 的需求不斷成長、連網型設備的成長以及汽車電子產品的進步。全球軟性印刷電路板(FPC) 市場的未來前景廣闊，在電腦/周邊設備、通訊、消費性電子、醫療、汽車、航太和國防工業領域存在機會。

軟性印刷電路板市場新趨勢

對產業動態有直接影響的新興趨勢包括電子產品的小型化以及對低損耗/高速印刷電路基板不斷成長的需求。

軟性印刷電路板市場洞察

  • Lucintel 預測，由於汽車和通訊業的需求不斷成長，多層技術仍將是最大的技術類型。由於智慧型手機和顯示器應用的需求不斷成長，預計軟硬複合基板領域將在預測期內實現最高成長。
  • 在智慧型手機、資料儲存、5G 技術和網路解決方案領域不斷成長的需求的支持下，通訊將繼續成為最大的最終用途產業。由於對可攜式、無線和更複雜的電子組件的需求不斷增加，預計醫療最終用途市場將在預測期內實現最高成長。
  • 由於汽車中 ADAS 和車輛安全功能的增加，以及家用電子電器和通訊產品的成長，亞太地區仍然是最大的市場，預計在預測期內將經歷最高的成長。此外，由於環境問題和法規的日益嚴格，電動車的使用不斷增加，預計也將推動該地區對 FPC 的需求。

常問問題

Q1.市場規模為：

A1. 到2030年，全球軟性印刷電路板市場預計將達到227億美元。

Q2.市場成長預測是多少：

A2. 2024年至2030年，軟性印刷電路板市場預計將以3.2%的複合年成長率成長。

Q3.影響市場成長的主要促進因素是：

A3. 該市場的主要驅動力是通訊業對 FPC 的需求增加、連網型設備的成長以及汽車電子產品的進步。

Q4.軟性印刷電路板的主要用途與最終產業有哪些？

A4.軟性印刷電路板市場的主要最終用途產業是通訊和電腦周邊設備。

Q5.軟性印刷電路板市場有哪些新趨勢？

A5. 對產業動態有直接影響的新興趨勢包括電子設備的小型化和對低損耗/高速印刷基板不斷成長的需求。

Q6.軟性印刷電路板的主要企業有哪些？

A6.軟性印刷電路板的主要企業如下：

  • Zhen Ding Technology Holding Limited（ZDT）
  • NOK Corporation
  • Sumitomo Electric
  • Flexium Interconnect Inc.
  • Fujikura Ltd.
  • Nitto Denko Corporation
  • Interflex
  • Samsung Electro-Mechanics
  • Daeduck GDS
  • Compeq Samtec Inc.

Q7.軟性印刷電路板的哪個技術領域將成為未來最大的技術領域？

A7.Lucintel 預測，由於汽車和通訊業的需求不斷成長，多層技術仍將是最大的技術類型。由於智慧型手機和顯示器應用的需求不斷成長，預計剛性-軟性基板領域將在預測期內實現最高成長。

Q8.：在軟性印刷電路板市場中，預計未來五年哪個地區的成長最快？

A8.亞太地區仍是最大的地區，預計未來五年將成長最快。

Q9. 可以客製化報告嗎？

A9. 是的，Lucintel 提供 10% 的客製化服務，無需額外付費。

目錄

第1章執行摘要

第2章 市場背景及分類

  • 簡介、背景、分類
  • 供應鏈
  • 產業促進因素與挑戰

第3章 2018-2030年市場趨勢及預測分析

  • 宏觀經濟趨勢（2018-2023）與預測（2024-2030）
  • 全球FPC市場趨勢（2018-2023）與預測（2024-2030）
  • 按最終用途產業分類的全球 FPC 市場
    • 電腦/周邊設備
    • 車
    • 通訊
      • 行動電話
      • 其他
    • 家用電器
    • 醫療保健
    • 軍事/航太
    • 其他
  • 按技術分類的全球 FPC 市場
    • 單面軟板
    • 雙面FPC
    • 多層軟板
    • 軟硬複合板
  • FPC市場按材料類型
    • 聚醯亞胺
    • 聚酯其他
  • FPC市場依原料應用
    • 聚醯亞胺薄膜
    • 聚酯及其他薄膜

第4章 2018-2030年區域市場趨勢及預測分析

  • 全球FPC市場按地區分類
  • 北美FPC市場
  • 歐洲FPC市場
  • 亞太FPC市場
  • 其他地區FPC市場

第5章 競爭分析

  • 產品系列分析
  • 市場佔有率分析
  • 業務整合
  • 地理範圍
  • 波特五力分析

第6章 成長機會與策略分析

  • 成長機會分析
    • 按最終用途產業分類的全球 FPC 市場成長機會
    • 全球 FPC 市場成長機會（按技術）
    • 按地區分類的全球 FPC 市場成長機會
  • 全球FPC市場新趨勢
  • 戰略分析
    • 新產品開發
    • 擴大全球FPC市場產能
    • 全球FPC產業併購

第7章主要企業概況

  • Zhen Ding Technology Holding Limited（ZDT）
  • NOK Corporation
  • Sumitomo Electric
  • Flexium Interconnect Inc.
  • Fujikura Ltd.
  • Nitto Denko Corporation
  • Interflex
  • Samsung Electro-Mechanics
  • Daeduck GDS
  • Compeq Samtec Inc .
簡介目錄

Flexible Printed Circuit Board Market Trends and Forecast

The future of the global flexible printed circuit board (FPC) market looks promising with opportunities in the computer/peripheral, telecommunication, consumer electronics, medical, automotive, and aerospace and defense industries.The global flexible printed circuit board (FPC) market is expected to reach an estimated $22.7 billion by 2030 with a CAGR of 3.2% from 2024 to 2030. The major drivers for this market are increasing demand for FPC in the telecommunication industry, growth in connected devices, and advancement in automotive electronics.

Emerging Trends in the Flexible Printed Circuit Board Market

Emerging trends, which have a direct impact on the dynamics of the industry, include miniaturization of electronic devices and growing demand for low loss/high speed PCBs.

A total of 122 figures / charts and 134 tables are provided in this 197-page report to help in your business decisions. Sample figures with insights are shown below.

Flexible Printed Circuit Board Market by Segment

The study includes trends and forecast for the global flexible printed circuit board (FPC) market by technology, end use industry, laminate material type, raw material usage, and region as follows:

By End Use Industry [$M and M Sqm shipment analysis for 2018 - 2030]:

  • Computers/Peripherals
  • Telecommunications
  • Consumer Electronics
  • Medical
  • Automotive
  • Aerospace and Defense
  • Others

By Technology [$M and M Sqm shipment analysis for 2018 - 2030]:

  • Single Layer
  • Double Layer
  • Multi- Layer
  • Rigid-Flex

By Laminate Material Type [$M and M Sqm shipment analysis for 2018 - 2030]:

  • Polyimide
  • Polyester and Others

By Raw Material Usage [$M and kilotons shipment analysis for 2018 - 2030]:

  • Polyimide Films
  • Polyester and Other Films

By Region [$M and M Sqm shipment analysis for 2018 - 2030]:

  • North America
    • United States
    • Canada
    • Mexico
  • Europe
    • Germany
    • France
    • UK
  • Asia Pacific
    • China
    • Japan
    • South Korea
    • India
    • Taiwan
  • Rest of the World

List of Flexible Printed Circuit Board Companies

Companies in the market compete on the basis of product quality offered. Major players in this market focus on expanding their manufacturing facilities, R&D investments, infrastructural development, and leverage integration opportunities across the value chain. With these strategies flexible PCB companies cater increasing demand, ensure competitive effectiveness, develop innovative products & technologies, reduce production costs, and expand their customer base. Some of the flexible PCB companies profiled in this report includes.

  • Zhen Ding Technology Holding Limited (ZDT)
  • NOK Corporation
  • Sumitomo Electric
  • Flexium Interconnect Inc.
  • Fujikura Ltd.
  • Nitto Denko Corporation
  • Interflex
  • Samsung Electro-Mechanics
  • Daeduck GDS
  • Compeq Samtec Inc

Flexible Printed Circuit Board Market Insight

  • Lucintel forecasts that multi-layer will remain the largest technology type due to increasing demand in the automotive and telecommunication industries. The rigid-flex substrate segment is expected to witness the highest growth during the forecast period due to growing demand for smartphone and display applications.
  • Telecommunication will remain the largest end use industry, supported by increasing demand for smartphones, data storage, 5G technology, and network solution sectors. The medical end use market is expected to witness the highest growth during the forecast period because it will witness increasing demand for portable, wireless, and more complex electronic assemblies.
  • Asia Pacific is expected to remain the largest market and witness the highest growth over the forecast period due to increasing ADAS and vehicle safety features in automotive and growth in consumer electronic devices and telecommunication products. Increasing usage of electric vehicles due to growing environmental concerns and regulations is also expected to drive the demand for FPC in this region.

Features of Flexible Printed Circuit Board Market

  • Market Size Estimates: Flexible printed circuit board market size estimation in terms of value ($M) and volume (million square meter)
  • Trend and Forecast Analysis: Market trends (2018-2023) and forecast (2024-2030) by various segments and regions.
  • Segmentation Analysis: Flexible printed circuit board market size by various segments, such as end use industry, technology, laminate material type, and raw material usage, in terms of value and volume.
  • Regional Analysis: Flexible printed circuit board market breakdown by North America, Europe, Asia Pacific, and the Rest of the World.
  • Growth Opportunities: Analysis on growth opportunities in various end use industries, technologies, laminate material types, and raw material usages, and regions, for the flexible printed circuit board market.
  • Strategic Analysis: This includes M&A, new product development, and competitive landscape for the flexible printed circuit board market.
  • Analysis of competitive intensity of the industry based on Porter's Five Forces model.

FAQ

Q1. What is the flexible printed circuit board market size?

Answer: The global flexible printed circuit board market is expected to reach an estimated $22.7 billion by 2030.

Q2. What is the growth forecast for flexible printed circuit board market?

Answer: The flexible printed circuit board market is expected to grow at a CAGR of 3.2% from 2024 to 2030.

Q3. What are the major drivers influencing the growth of the flexible printed circuit board market?

Answer: The major drivers for this market are increasing demand for FPC in the telecommunication industry, growth in connected devices, and advancement in automotive electronics.

Q4. What are the major applications or end use industries for flexible printed circuit board?

Answer: Telecommunication and computer ad peripherals are the major end use industries for flexible printed circuit board market.

Q5. What are the emerging trends in flexible printed circuit board market?

Answer: Emerging trends, which have a direct impact on the dynamics of the industry, include miniaturization of electronic devices and growing demand for low loss/high speed PCBs.

Q6. Who are the key flexible printed circuit board companies?

Answer: Some of the key flexible printed circuit board companies are as follows:

  • Zhen Ding Technology Holding Limited (ZDT)
  • NOK Corporation
  • Sumitomo Electric
  • Flexium Interconnect Inc.
  • Fujikura Ltd.
  • Nitto Denko Corporation
  • Interflex
  • Samsung Electro-Mechanics
  • Daeduck GDS
  • Compeq Samtec Inc.

Q7.Which flexible printed circuit board technology segment will be the largest in future?

Answer: Lucintel forecasts that multi-layer will remain the largest technology type due to increasing demand in the automotive and telecommunication industries. The rigid-flex substrate segment is expected to witness the highest growth during the forecast period due to growing demand for smartphone and display applications.

Q8: In flexible printed circuit board market, which region is expected to be the largest in next 5 years?

Answer: Asia Pacific is expected to remain the largest region and witness the highest growth over next 5 years.

Q9. Do we receive customization in this report?

Answer: Yes, Lucintel provides 10% Customization Without any Additional Cost.

This report answers following 11 key questions

  • Q.1 What are some of the most promising potential, high-growth opportunities for the global FPC market by end use industry (computers/peripherals, telecommunication, consumer electronics, medical, automotive, aerospace and defense, and others), technology (single layer, double layer, multi-layer and rigid flex), laminate material type (polyimide and polyester & others), laminate raw material usage (polyimide films and polyester & other films), and region (North America, Europe, Asia Pacific, and the Rest of the World)?
  • Q. 2 Which segments will grow at a faster pace and why?
  • Q.3 Which regions will grow at a faster pace and why?
  • Q.4 What are the key factors affecting market dynamics? What are the drivers and challenges of the market?
  • Q.5 What are the business risks and threats to the market?
  • Q.6 What are the emerging trends in this market and the reasons behind them?
  • Q.7 What are some changing demands of customers in the market?
  • Q.8 What are the new developments in the market? Which companies are leading these developments?
  • Q.9 Who are the major players in this market? What strategic initiatives are being implemented by key players for business growth?
  • Q.10 What are some of the competitive products and processes in this area and how big of a threat do they pose for loss of market share via material or product substitution?
  • Q.11 What M & A activities did take place in the last five years in this market?

Table of Contents

1. Executive Summary

2. Market Background and Classifications

  • 2.1: Introduction, Background, and Classifications
  • 2.2: Supply Chain
  • 2.3: Industry Drivers and Challenges

3. Market Trends and Forecast Analysis from 2018 to 2030

  • 3.1: Macroeconomic Trends (2018-2023) and Forecast (2024-2030)
  • 3.2: Global FPC Market Trends (2018-2023) and Forecast (2024-2030)
  • 3.3: Global FPC Market by End Use Industry
    • 3.3.1: Computers/Peripherals
    • 3.3.2: Automotive
    • 3.3.3: Telecommunications
      • 3.3.3.1: Mobile Phones
      • 3.3.3.2: Others
    • 3.3.4: Consumer Electronics
    • 3.3.5: Medical
    • 3.3.6: Military/Aerospace
    • 3.3.7: Others
  • 3.4: Global FPC Market by Technology
    • 3.4.1: Single-Sided FPC
    • 3.4.2: Double-Sided FPC
    • 3.4.3: Multi-Layer FPC
    • 3.4.4: Rigid-Flex FPC
  • 3.5: FPC Market by Material Type
    • 3.5.1: Polyimide
    • 3.5.2: Polyester and Others
  • 3.6: FPC Market by Raw Material Usage
    • 3.6.1: Polyimide Films
    • 3.6.2: Polyester and Other Films

4. Market Trends and Forecast Analysis by Region from 2018 to 2030

  • 4.1: Global FPC Market by Region
  • 4.2: North American FPC Market
    • 4.2.1: Market by End Use Industry
    • 4.2.2: Market by Technology
    • 4.2.3: The US FPC Market
    • 4.2.4: The Canadian FPC Market
    • 4.2.5: The Mexican FPC Market
  • 4.3: European FPC Market
    • 4.3.1: Market by End Use Industry
    • 4.3.2: Market by Technology
    • 4.3.3: German FPC Market
    • 4.3.4: United Kingdom FPC Market
    • 4.3.5: French FPC Market
  • 4.4: APAC FPC Market
    • 4.4.1: Market by End Use Industry
    • 4.4.2: Market by Technology
    • 4.4.3: Chinese FPC Market
    • 4.4.4: Japanese FPC Market
    • 4.4.5: Taiwanese FPC Market
    • 4.4.6: South Korean FPC Market
  • 4.5: ROW FPC Market
    • 4.5.1: Market by End Use Industry
    • 4.5.2: Market by Technology

5. Competitor Analysis

  • 5.1: Product Portfolio Analysis
  • 5.2: Market Share Analysis
  • 5.3: Operational Integration
  • 5.4: Geographical Reach
  • 5.5: Porter's Five Forces Analysis

6. Growth Opportunities and Strategic Analysis

  • 6.1: Growth Opportunity Analysis
    • 6.1.1: Growth Opportunities for the Global FPC Market by End Use Industry
    • 6.1.2: Growth Opportunities for the Global FPC Market by Technology
    • 6.1.3: Growth Opportunities for the Global FPC Market by Region
  • 6.2: Emerging Trends in the Global FPC Market
  • 6.3: Strategic Analysis
    • 6.3.1: New Product Development
    • 6.3.2: Capacity Expansion of the Global FPC Market
    • 6.3.3: Mergers and Acquisitions in the Global FPC Industry

7. Company Profiles of Leading Players

  • 7.1: Zhen Ding Technology Holding Limited (ZDT)
  • 7.2: NOK Corporation
  • 7.3: Sumitomo Electric
  • 7.4: Flexium Interconnect Inc.
  • 7.5: Fujikura Ltd.
  • 7.6: Nitto Denko Corporation
  • 7.7: Interflex
  • 7.8: Samsung Electro-Mechanics
  • 7.9: Daeduck GDS
  • 7.10: Compeq Samtec Inc .