市場調查報告書
商品編碼
1397907
全球柔性印刷電路板 (FPCB) 市場評估:按類型、材料、產業、地區、機會、預測(2016-2030 年)Flexible Printed Circuit Board Market Assessment, By Type, By Material, By Industry, By Region, Opportunities and Forecast, 2016-2030F |
全球柔性印刷電路板 (FPCB) 市場規模將從 2022 年的 155.8 億美元增至 2030 年的 355.9 億美元,在 2023-2030 年預測期內複合年增長率為 10.8%。成長預期。 市場正在迅速擴張。 這種擴張主要是由於重要的消費性電子、汽車和醫療產業的需求增加。 設備小型化、重量輕和技術進步的趨勢正在增加對 FPCB 的需求,因為 FPCB 具有靈活性、節省空間的設計和改進的電氣性能。 此外,柔性顯示器、物聯網設備和電動車等技術的發展正在推動市場發展。 由於柔性電路的不斷進步和接受度的不斷提高,FPCB 市場在未來幾年可能會保持上升趨勢。
由於其固有的優勢,2023 年電子製造前景預計柔性 PCB 的採用將顯著激增。 隨著人們對通貨膨脹、勞動力成本和零件短缺的擔憂日益加劇,PCB 的靈活性已成為一項戰略資產。 產業研究表明,全球不確定性正在推動多品種、小批量生產的趨勢,這與柔性印刷電路板 (FPCB) 的多功能性是一致的。 隨著公司探索回流選項,柔性印刷電路板的適應性和空間效率正在幫助建立有彈性和高效的供應鏈。 此外,對永續電子產品不斷增長的需求與柔性印刷電路板的環保特性相匹配,有助於減少環境足跡。
穿戴式裝置趨勢將大大促進市場成長,並在未來一段時間內為製造商提供利潤豐厚的機會。 隨著穿戴式裝置在健康和健身、智慧手錶和醫療設備等多個行業中不斷普及,對靈活、輕巧的電子元件的需求不斷增長。 FPCB 是柔性混合電子 (FHE) 的關鍵技術,可實現穿戴式裝置所需的可彎曲和緊湊設計。
FPCB 市場的製造商可以利用這一趨勢,根據可穿戴技術的獨特需求調整生產能力。 客製化、小型化和提高耐用性對於穿戴式 FPCB 至關重要。 隨著穿戴式裝置市場的擴大,FPCB 製造商有機會滿足創新設計要求,並能夠無縫整合到各種穿戴式應用中。 與 Tapecon 等經驗豐富的 FHE 製造合作夥伴的早期合作可以增強 FPCB 的開發和可擴展性,使製造商能夠在這個充滿活力且不斷增長的市場中保持領先地位。
對環保和永續電子產品的日益重視是柔性印刷電路板需求增加的主要原因。 FPCB 透過消除材料浪費和減少能源消耗來支持這一環保趨勢。 其靈活、輕巧的設計可以精確利用材料並消除製造過程中的浪費。 此外,FPCB 製造通常採用節能方法,以滿足永續發展目標。 隨著環境法規和消費者偏好優先考慮綠色技術,FPCB 因其能夠為更環保和永續的電子產品做出貢獻而變得比傳統剛性 PCB 更受青睞。 這清楚地表明FPCB在促進電子產業的環保實踐方面可以發揮至關重要的作用。
高密度互連技術對於塑造市場至關重要,並將在未來一段時間內為製造商提供重要機會。 HDI PCB 具有更高的互連密度,並使用雷射鑽孔微孔、堆疊孔、交錯孔和焊盤內孔陣列等先進功能。 高密度互連技術使電路板變得更小,使其成為空間受限應用的理想選擇,尤其是快速成長的穿戴式裝置和可攜式電子產品。
HDI FPCB易於在一側放置許多元件,改善訊號傳輸,適合射頻電路等高頻應用。 隨著消費者偏好轉向更小、功能更強大的設備,利用HDI 技術的製造商可以滿足這些需求,提高成本效率、提高性能,並在動態柔性印刷電路板(FPCB) 市場中的競爭中獲得動力保障。
本報告研究和分析了全球柔性印刷電路板 (FPCB) 市場,提供市場規模和預測、市場動態以及主要參與者的現狀和前景。
Global flexible printed circuit board market size was valued at USD 15.58 billion in 2022, expected to reach USD 35.59 billion in 2030, with a CAGR of 10.8% for the forecast period between 2023 and 2030. The flexible printed circuit board market is expanding rapidly. This expansion is driven mostly by rising demand in important consumer electronics, automotive, and healthcare sectors. The trend toward smaller, lighter, and more technologically advanced devices has raised the demand for FPCBs due to their flexibility, space-saving design, and enhanced electrical performance. Furthermore, developing technologies like flexible displays, IoT devices, and electric cars propel the market forward. The FPCB market will likely maintain its rising trend in the coming years, owing to continued advancements and increased acceptance of flexible circuitry.
The electronics manufacturing landscape 2023 sees a notable surge in adopting flexible PCBs, driven by their intrinsic advantages. Amid rising concerns over inflation, labor costs, and component shortages, the flexibility of PCBs has become a strategic asset. According to industry studies, the trend towards high-mix, low-volume production, amplified by global uncertainties, aligns with the versatility of flexible printed circuit boards. As companies explore reshoring options, flexible printed circuit boards' adaptability and space efficiency contribute to establishing resilient and efficient supply chains. Moreover, the growing demand for sustainable electronics aligns with the eco-friendly attributes of flexible printed circuit boards, contributing to a reduced environmental footprint.
For instance, in April 2021, Siemens introduced PCBflow, a revolutionary cloud-based solution fostering secure collaboration between PCB designers and manufacturers. The pioneering software, driven by Valor NPI, accelerates the design-to-manufacturing transition, providing swift design for manufacturability analysis and handling over 1000 DFM checks. It enhances communication and optimizes designs for seamless integration.
The trend in wearables significantly contributes to the growth of the flexible printed circuit board market, presenting lucrative opportunities for manufacturers in the upcoming period. As wearables continue to gain popularity in various industries, including health and fitness, smartwatches, and medical devices, the demand for flexible and lightweight electronic components rises. FPCBs, a key technology in flexible hybrid electronics (FHE), enable the bendable and compact designs required for wearable devices.
Manufacturers in the FPCB market can capitalize on this trend by aligning their production capabilities with the specific needs of wearable technology. Customization, miniaturization, and increased durability are essential for FPCBs catering to wearables. As the wearables market expands, FPCB manufacturers have the opportunity to innovate and address evolving design requirements, ensuring seamless integration into a wide range of wearable applications. Early collaboration with experienced FHE manufacturing partners, like Tapecon, can enhance the development and scalability of FPCBs, allowing manufacturers to stay at the forefront of this dynamic and growing market.
The growing emphasis on eco-friendly and sustainable electronics is a key driver behind the increasing demand for flexible printed circuit boards. FPCBs support this environmentally conscious trend by mitigating material waste and reducing energy consumption. Their flexible, lightweight design allows for precise material utilization, eliminating unnecessary waste in the production process. Furthermore, FPCB manufacturing often employs energy-efficient methods, aligning with sustainability objectives. As environmental regulations and consumer preferences prioritize green technologies, FPCBs are becoming preferred over traditional rigid PCBs for their ability to contribute to more environmentally responsible and sustainable electronic products. It underscores their crucial role in advancing eco-friendly practices in the electronics industry.
For example, in November 2023, Elephantech secured USD 26.23 million in Series D financing, totaling USD 67.26 billion since inception. The funds will amplify mass production of P-Flex, an eco-friendly PCB, bolster global sales, and advance metal inkjet printing tech.
High-density interconnect technology is pivotal in shaping the landscape of the flexible printed circuit board market, offering manufacturers significant opportunities in the upcoming period. HDI PCBs, characterized by enhanced wiring density, use advanced features such as laser drilled microvias, stacked vias, staggered vias, and via-in-pad arrangements. High-density interconnect technology allows for more compact and smaller circuit boards, making it an ideal choice for applications with space constraints, particularly in the rapidly growing market of wearables and portable electronic devices.
HDI FPCBs facilitate the placement of more components on a single side, improving signal transmission and making them suitable for high-frequency applications like RF circuits. As consumer preferences shift towards smaller and more powerful devices, manufacturers leveraging HDI technology can meet these demands, ensuring cost-effectiveness, improved performance, and a competitive edge in dynamic flexible printed circuit board market.
Study reveals that Asia-Pacific commands a substantial portion of the global flexible printed circuit board market, propelled by robust electronics manufacturing ecosystems in countries like China, Japan, and South Korea. The region benefits from extensive technological infrastructure, skilled workforce, and significant investments in research and development. Furthermore, the substantial presence of major electronic device manufacturers amplifies the demand for FPCBs. This dominance is emphasized by the region's efficient large-scale production of FPCBs, establishing it as a pivotal player in global market.
For instance, in June 2023, Japan accelerated semiconductor industry efforts with a potential JSR Corp buyout, TSMC's USD 7 billion chip plant, Micron's USD 3.5 billion investment, and Samsung's chip line. The state-backed fund supports growth plans.
Globally, governments are actively supporting the growth of the flexible printed circuit board market. Their policies encourage innovation, expand manufacturing capabilities, and provide incentives for research and development, all of which contribute to building a strong, flexible printed circuit board ecosystem. Particularly in Asia, governments are offering tax benefits and infrastructure support to attract global electronics assembly leaders. Efforts are underway to stabilize tariffs and create an investor-friendly climate, ultimately boosting the competitiveness of flexible printed circuit board manufacturers globally. These initiatives are part of a broader strategy to establish countries as key players in the global electronics supply chain, emphasizing adaptability and innovation.
For instance, in December 2022, The Ministry of Environment, Forest, and Climate Change in India emphasized the formalization and regulation of the e-waste recycling sector. The E-Waste (Management) Rules, 2016, and the newly notified E-Waste (Management) Rules, 2022, introduce Extended Producer Responsibility (EPR) and set recycling targets, including the inclusion of 106 Electronic and Electrical Equipment (EEE) items. The rules aim to enhance environmental sustainability and safety in the dismantling and recycling e-waste, providing a comprehensive framework for flexible printed circuit board disposal and management.
The flexible printed circuit board market experienced a dual impact from COVID-19. Initially, the pandemic fueled demand for flexible printed circuit boards in the medical electronics sector owing to the increased need for medical devices. However, disruptions in global supply chain and trade tensions between the United States and China reduced demand for flexible PCBs, notably in Apple's supply chain. As the world transitions to the post-pandemic landscape, the FPCB market is anticipated to rebound, with an ongoing focus on medical applications and the rising demand for IoT devices and HDI technology.
The Russia-Ukraine war has impacted the flexible printed circuit board market, revealing challenges in controlling technology diversion. As sanctions aim to restrict semiconductor exports to Russia, reports indicate Western semiconductors still appear in Russian weapons, raising concerns about illicit purchases and counterfeiting. The complexity of global supply chains, dual-use issues, and the longevity of chip use pose significant challenges. Efforts to control technology flow face hurdles, emphasizing the need for collaborative action. The war underscores the importance of addressing the broad range of challenges to prevent unintended applications of FPCBs in military systems, highlighting the industry's commitment to compliance.
Industry leaders like Siemens Aktiengesellschaft, Fujikura Printed Circuits Ltd., Sumitomo Electric Group, Nitto Denko Corporation, and Flexible Circuit Technologies, Inc., play a crucial role. These companies shape the market with their advanced technologies and wide market presence. The demand for FPCBs is rising, especially in consumer electronics and automotive areas. The market looks promising, with expectations of continued growth. Collaboration, technology advancements, and strategic partnerships among these key players are anticipated to drive innovation and meet the changing needs of the flexible printed circuit boards market.
In October 2023, Cicor's acquisition of STS Defence enhanced its position in high-reliability electronics for aerospace and defense. The integration of STS Defence's capabilities strengthens Cicor's ability to provide innovative solutions, contributing to its competitiveness in flexible printed circuit board market.
All segments will be provided for all regions and countries covered:
Companies mentioned above DO NOT hold any order as per market share and can be changed as per information available during research work.