3D IC 封裝市場 - COVID-19 的增長、趨勢、影響和預測 (2023-2028)

全球 3D IC 封裝市場預計在預測期內 (2022-2027) 的複合年增長率為 16.8%。

人工智能、物聯網、5G 和高性能計算等先進技術的採用增加了對 3D IC 的需求，這些 IC 可提供增強的性能和帶寬以及低延遲。 因此，在預測期內，對 3D IC 封裝的需求將出現顯著增長。

主要亮點

• 微電子和半導體行業的趨勢正在推動需要更高性能、更高功能和更低功耗的垂直堆疊集成電路 (IC) 以滿足電子設備的要求。作為一種現實的解決方案，它正在引起人們的關注實現了。 聯網設備、平板電腦和智能手機等電子產品正迅速需要先進的架構，以提高能效、性能並實現短信和通話以外的功能。 這些因素有望推動 3D IC 封裝市場的增長。
• 隨著半導體應用的擴展，CMOS 縮放速度放緩和成本上升迫使該行業依賴 IC 封裝發展。 3D堆疊技術已成為滿足機器學習、人工智能和數據中心等應用性能需求的有利解決方案。 因此，對高性能計算應用不斷增長的需求將在預測期內推動 3D-TSV（矽通孔）市場。
• 此外，電子設備的持續小型化預計也將成為市場增長的推動力。 平板電腦、智能手機和遊戲機對先進架構的需求不斷增長，以及先進晶圓級封裝技術在傳感器和 MEMS 中的使用激增，將□□在預測期內為 3D IC 封裝市場帶來增長前景。 根據 WSTS 的數據，2021 年半導體 IC 市場的收入將達到 4630 億美元，預計到 2022 年將增長 10% 以上，達到 5109.6 億美元。
• COVID-19 大流行對各個行業產生了重大影響，同時推動了全球先進醫療設備和設備的發展。 大流行爆發後，各種醫療設備製造商已宣布增加幾種新設備和設備的產量。 隨著 3D IC 封裝在醫療和保健行業的廣泛應用中使用，製造活動的增加預計對 3D IC 封裝的需求將會增加。
• 但是，半導體 IC 設計的高初始投資和日益複雜預計會限制市場發展。

3D IC 封裝市場趨勢

IT 和電信有望顯著增長

• 3D IC 封裝是半導體製造和設計不可或缺的一部分。 在宏觀層面，它直接影響性能、功耗和成本，在微觀層面，它直接影響每個芯片的基本功能。
• 對 5G 基礎設施、物聯網連接的投資不斷增加以及數據中心服務器和網絡設備數量的增加是推動 IT 和電信行業 3D IC 封裝增長的因素。 例如，KT、LG Uplus 和 SK Telecom 等韓國移動運營商已同意到 2022 年共投資 25.7 萬億韓元，以支持全國的 5G 基礎設施建設。 這筆額外投資將側重於提高包括首爾在內的六個城市的 5G 質量。
• 數據中心的擴張為接受調查的 3D IC 封裝供應商提供了增長機會。 據思科系統稱，2021年全球數據中心存儲的大數據量預計將達到403艾字節，其中美國占據很大份額。 到 2021 年，超大規模數據中心將從 2015 年的 259 個增加到 700 個。
• 此外，物聯網市場的擴張和對無線技術需求的激增（其中更小的佔地面積和更高的效率至關重要）預計將推動 3D IC 封裝市場的發展。 據愛立信稱，廣域物聯網設備將從 2021 年的 21 億增加到 2027 年的 52 億。

亞太地區有望實現強勁增長

• 亞太地區是一些最大的半導體芯片製造商和公司的所在地，包括台積電、中芯國際、聯電和韓國三星。 一家主要的台灣芯片代工廠正與一家日本供應商聯手，共同爭奪至關重要的 3 納米芯片市場的領先地位。 例如，2021年2月，台積電宣布計劃在日本科技城築波設立研發中心，與日本供應商合作開發3D IC封裝材料。
• 2021 年 5 月，日本經濟產業省及其下屬產業技術綜合研究所宣布約 20 家日本公司將與台積電日本 3D IC 研發中心合作。
• 亞太地區在 3D IC 封裝市場中也佔有很大份額。 這是由於該地區存在大量半導體製造業務，以及三星電子、東芝公司、日月光集團和聯合微電子公司等大型市場參與者的存在。
• 亞太地區以其蓬勃發展的汽車行業而聞名。 此外，5G 技術在汽車行業的日益商業化將為在研究市場運營的供應商提供新的收入來源。 基於 5G NR 的 C-V2X 的出現有望為自動駕駛汽車提供獨特的功能。 因此，它可以推動對更高級別的自主性和可預測性以及車輛中其他 ADAS 傳感器技術的需求。
• 此外，該地區的市場參與者正在關注可以為 3D 封裝工具開闢新可能性的下一代芯片技術。 例如，日本工具製造商 Disco 專注於 3D 芯片封裝，將集成電路堆疊在幾乎透明的薄矽晶圓上。 隨著摩爾定律接近其物理極限，芯片製造商正在尋找新的設計和材料來提高下一代硬件的性能。 預計這種趨勢將促進該地區的增長。
• 在智能設備和互聯世界的當前場景中，客戶要求下一代設備更緊湊、功能更豐富、性能更好且功耗更低。 這推動了對具有成本效益的高性能 IC 的需求。 例如，STAR 的微電子實驗室與領先的半導體製造商合作開發具有成本效益的 3D 晶圓級集成電路封裝解決方案。 該公司推出了 Chip-on-Wafer Consortium II 和 Cost-effective Interposer Consortium，以推廣用於大規模生產的芯片封裝解決方案。 這個以行業為中心的聯盟將解決晶圓級封裝中的關鍵挑戰，以保持較低的總體製造成本，從而加快下一代電子產品的上市時間。

3D IC封裝市場競爭者分析

由於 Amkor Technology Inc.、ASE Group 和 Siliconware Precision Industries (SPIL) 等重要參與者的存在，全球 3D IC 封裝市場呈現碎片化。 市場參與者必須不斷創新，提供領先和全面的產品，以保持相關性。

• 2021 年 5 月：英特爾計劃投資 35 億美元改造其 Rio Rancho 工廠，將這個龐大的工廠（美國三大製造基地之一）的員工人數增加 35% 以上。 它正在擴大其在新墨西哥州的業務，以製造基於 Foreveros 3D 封裝技術的新一代芯片，這可能有助於該公司重新獲得其在半導體行業的領導地位。

其他福利。

• Excel 格式的市場預測 (ME) 表
• 三個月的分析師支持

內容

第一章介紹

• 研究假設和市場定義
• 調查範圍

第二章研究方法論

第 3 章執行摘要

第 4 章市場洞察

• 市場概覽
• 產業吸引力 - 波特五力分析
  • 新進入者的威脅
  • 買方/消費者議價能力
  • 供應商的議價能力
  • 替代品的威脅
  • 競爭公司之間的敵對關係
• 價值鏈分析
• 評估 COVID-19 對市場的影響

第 5 章市場動態

• 市場驅動力
  • 擴展電子產品中的高級架構
  • 電子設備的小型化
• 市場挑戰/限制
  • 半導體 IC 設計的初始投資高且複雜

第 6 章市場細分

• 包裝技術
  • 3D 晶圓級芯片級封裝
  • 3D TSV
• 最終用戶行業
  • 消費類電子產品
  • 航空航天與國防
  • 醫療設備
  • 通訊/電信
  • 汽車
  • 其他
• 按地區
  • 北美
  • 歐洲
  • 亞太地區
  • 拉丁美洲
  • 中東

第七章競爭格局

• 公司簡介
  • Taiwan Semiconductor Manufacturing Company Limited
  • Samsung Electronics Co., Ltd.
  • ASE Group
  • Amkor Technology
  • Intel Corporation
  • Siliconware Precision Industries Co. Ltd（SPIL）
  • GlobalFoundries
  • Invensas
  • Powertech Technology Inc.

第8章 投資分析

第9章 市場未來性

The Global 3D IC Packaging Market is expected to register a CAGR of 16.8% during the forecast period (2022-2027). The growing adoption of advanced technologies such as AI, IoT, 5G, and high-performance computing is escalating the demand for 3D ICs, which deliver enhanced performance and bandwidth with lower latency. As such, the demand for 3D IC packaging will register significant growth over the forecast period.

Key Highlights

• The growing microelectronics and semiconductor industry is developing a trend for vertically stacked integrated circuits (ICs), emerging as a viable solution for providing high performance, increased functionality, and reducing power consumption to fulfill electronic device requirements. The surging need for advanced architecture in electronic products such as connected devices, tablets, and smartphones to increase their energy efficiency and performance to do more than just texting and calling. Such factors are expected to bolster the growth of the 3D IC packaging market.
• As a result of the growing semiconductor applications, the slowdown in CMOS scaling and escalating costs have forced the industry to depend on packaging advancements for ICs. 3D stacking technologies have emerged as lucrative solutions that meet the required performance of applications such as machine learning, AI, and data centers. Therefore, the growing need for high-performance computing applications drives the 3D-TSV (Through Silicon Via) market over the forecast period.
• The increasing miniaturization of electronics devices is also anticipated to drive market growth. Growing demand for advanced architecture in tablets, smartphones, and gaming devices, along with surging usage of advanced wafer-level packaging technologies in sensors and MEMS, is expected to provide growth prospects for the 3D IC packaging market during the forecast period. According to WSTS, the IC market for semiconductors reached USD 463 billion in revenue in 2021 and is expected to grow by over 10% to USD 510.96 billion in 2022.
• The COVID-19 pandemic has significantly impacted various industries and has simultaneously propelled the development of advanced medical equipment and devices across the globe. Various medical equipment manufacturing companies announced to increase in the production of several new equipment and devices post the pandemic outbreak. As the applications of 3D IC packaging are numerous within the medical and healthcare industry, the increased manufacturing initiatives are expected to boost the demand for 3D IC packaging.
• However, the high Initial Investment and Increasing Complexity of Semiconductor IC Designs are expected to restrain the evolution of the market.

3D IC Packaging Market Trends

IT & Telecommunication is Expected to Witness Significant Growth

• 3D IC Packaging is an essential part of semiconductor manufacturing and design. It directly affects performance, power, and cost on a macro level and the basic functionality of all chips on a micro level.
• The increasing investment in 5G infrastructure and the growing number of data center servers coupled with IoT connections and networking devices are the factors propelling the growth of 3D IC packaging in the IT and telecommunication sector. For instance, mobile operators in Korea such as KT, LG Uplus, and SK Telecom agreed to invest a total of KRW 25.7 trillion through 2022 to support 5G infrastructure across the country. The additional investment is focused on enhancing the 5G quality in Seoul and six other cities.
• The expansion of data centers provides a growth opportunity for the vendors in the 3D IC packaging studied. According to Cisco Systems, the amount of big data in data center storage global is anticipated to reach 403 exabytes in 2021, with a significant share in the US. Hyperscale data centers reached 700 in 2021, compared to 259 in 2015.
• Moreover, the growing IoT market and surging demand for wireless technologies, wherein reduced footprint and enhanced efficiency are critical, are expected to develop the market for 3D IC packaging. According to Ericson, wide-area IoT devices will reach 5.2 billion by 2027 from 2.1 billion in 2021.

Asia-Pacific is Expected to Witness Significant Growth Rate

• Asia Pacific is home to some of the biggest semiconductor chip manufacturers and companies like TSMC, SMIC, UMC, and South Korea's Samsung. Taiwan's leading chip foundry is teaming up with Japanese suppliers in the race to lead the crucial 3-nanometer chip market. For instance, in February 2021, TSMC announced that the company plans to establish an R&D center in Japan's science city of Tsukuba to develop 3D IC packaging materials in cooperation with its Japanese suppliers.
• Also, in May 2021, Japan's Ministry of Economy, Trade, and Industry and its subsidiary, the National Institute of Advanced Industrial Science and Technology, announced that approximately 20 Japanese companies would work with TSMC Japan's 3D IC R&D Center.
• The Asia Pacific region also holds a significant share in the 3D IC packaging market due to a considerable number of semiconductor manufacturing operations happening in the region, along with the presence of major market players such as Samsung Electronics Co., Ltd., Toshiba Corp, ASE Group, and United Microelectronics Corp. among others.
• The Asia Pacific region is known for its robust Automotive manufacturing capabilities. Moreover, the growing commercialization of 5G technology in the automotive industry will provide a new revenue stream for the vendors operating in the studied market. The advent of 5G NR-based C-V2X is anticipated to offer unique capabilities for the autonomous vehicle. Thus, it can propel the need for higher levels of autonomy and predictability and other ADAS sensor technologies in the vehicle.
• Additionally, market players in the region are forcing on Next-gen chip technology, which could unlock new potential with 3D packaging tools. For instance, Japanese tool-making company Disco focuses on 3D chip packaging by stacking integrated circuits on silicon wafers of near-transparent thinness. As Moore's Law nears its physical limits, chipmakers seek new designs and materials to get better performance out of next-generation hardware. Such trends are expected to propel growth in the region.
• In the current scenario of smart devices and the connected world, customers demand next-generation devices that are more compact, multi-functional, offer better performance, and consume less power. This has propelled the demand for cost-efficient and high-performance IC. For instance, STAR's Institute of Microelectronics has partnered with leading semiconductor companies to develop cost-effective 3D wafer-level integrated circuit packaging solutions. The company has launched chip-on-wafer consortium II and the cost-effective Interposer consortium to advance chip packaging solutions for high-volume manufacturing. The industry-focused consortium will address key challenges in wafer-level packaging to low overall manufacturing costs to accelerate time-to-market for next-generation electronics devices.

3D IC Packaging Market Competitor Analysis

The Global 3D IC Packaging Market is fragmented due to the presence of significant players such as Amkor Technology Inc., ASE Group, and Siliconware Precision Industries Co. Ltd (SPIL), among others. The market players must constantly innovate advanced and comprehensive products to stay relevant.

• In May 2021: Intel plans to invest USD 3.5 billion to upgrade its Rio Rancho plant and increase its headcount by more than 35% at the sprawling complex, one of its three largest US manufacturing hubs. It is expanding its New Mexico operations to manufacture new generations of chips based on its Foveros 3D packaging technology, which could aid the company's attempts to regain its leadership status in the semiconductor industry.

Additional Benefits:

• The market estimate (ME) sheet in Excel format
• 3 months of analyst support

TABLE OF CONTENTS

1 INTRODUCTION

• 1.1 Study Assumptions and Market Definition
• 1.2 Scope of the Study

2 RESEARCH METHODOLOGY

3 EXECUTIVE SUMMARY

4 MARKET INSIGHT

• 4.1 Market Overview
• 4.2 Industry Attractiveness - Porter's Five Forces Analysis
  • 4.2.1 Threat of New Entrants
  • 4.2.2 Bargaining Power of Buyers/Consumers
  • 4.2.3 Bargaining Power of Suppliers
  • 4.2.4 Threat of Substitute Products
  • 4.2.5 Intensity of Competitive Rivalry
• 4.3 Value Chain Analysis
• 4.4 Assessment of the Impact of COVID-19 on the Market

5 MARKET DYNAMICS

• 5.1 Market Drivers
  • 5.1.1 Growing Advanced Architecture in Electronic Products
  • 5.1.2 Miniaturization of Electronics Devices
• 5.2 Market Challenges/Restrains
  • 5.2.1 High Initial Investment and Increasing Complexity of Semiconductor IC Designs

6 MARKET SEGMENTATION

• 6.1 Packaging Technology
  • 6.1.1 3D wafer-level chip-scale packaging
  • 6.1.2 3D TSV
• 6.2 End-User Industry
  • 6.2.1 Consumer electronics
  • 6.2.2 Aerospace and Defense
  • 6.2.3 Medical Devices
  • 6.2.4 Communications and Telecom
  • 6.2.5 Automotive
  • 6.2.6 Others
• 6.3 Geography
  • 6.3.1 North America
  • 6.3.2 Europe
  • 6.3.3 Asia-Pacific
  • 6.3.4 Latin America
  • 6.3.5 Middle-East

7 COMPETITIVE LANDSCAPE

• 7.1 Company Profiles
  • 7.1.1 Taiwan Semiconductor Manufacturing Company Limited
  • 7.1.2 Samsung Electronics Co., Ltd.
  • 7.1.3 ASE Group
  • 7.1.4 Amkor Technology
  • 7.1.5 Intel Corporation
  • 7.1.6 Siliconware Precision Industries Co. Ltd (SPIL)
  • 7.1.7 GlobalFoundries
  • 7.1.8 Invensas
  • 7.1.9 Powertech Technology Inc.

8 INVESTMENT ANALYSIS

9 FUTURE OF THE MARKET