標準邏輯 IC 市場 - COVID-19 的增長、趨勢、影響和預測 (2023-2028)

在預測期內，全球標準 IC 市場預計將以 3.2% 的複合年增長率增長。

據說市場是進化的而不是革命的。 因為最近沒有觀察到明顯的變化。 隨著半導體行業的小型化趨勢，現有架構和技術不斷發展。

主要亮點

• 標準邏輯 IC 是集成電路形式的邏輯門。 該 IC 封裝有用於電路中的引腳。 由於BiPolar技術和CMOS技術在製造工藝和架構上的差異，在工作電壓、響應時間、輸出形式等方面存在差異。 邏輯門的貢獻在電子設計和功率優化中是必不可少的。
• 通過改進陶瓷和塑料實現封裝解決方案的小型化在為特定用途選擇合適的邏輯 IC 方面發揮了重要作用。 7400 系列和 4000 系列是使用最廣泛的標準邏輯 IC。 設備的小型化，尤其是消費電子產品，一直是人們關注的焦點，並塑造了整個行業。
• 製造商強調使用新的和改進的邏輯 IC，它們具有更好的溫度監控和適應性，有望在汽車行業等行業提供全面服務。 例如，2021 年 11 月，三星電子宣布了三款用於下一代汽車的全新邏輯解決方案：Exynos Auto T5123、Exynos V7 和 S2VPS01。 S2VPS01 是一款電源管理 IC (PMIC)，可調節和整流車載信息娛樂性能的電源輸入。 該 IC 包括各種功能以防止惡劣的熱環境，例如過壓保護 (OVP) 和熱關斷 (TSD)。
• 在 COVID-19 疫情期間，對半導體設備的需求轉向消費電子產品和用於醫療保健設備的計算設備。 這影響了邏輯 IC 製造行業定制構建的正常需求週期。 排除這種影響，對標準 IC 解決方案的需求溫和而強勁，消費電子產品線彌補了受影響的工業應用。 後疫情時代，多個行業將復蘇，半導體需求將飆升，邏輯IC市場也將加速。

標準邏輯IC市場趨勢

汽車行業是最大的需求來源

• 汽車行業經常期待大規模的電氣化和發展。 智能連接技術和自主能力的引入正在推動對半導體封裝的需求。 這導致電路、MPU、傳感器的使用增加，以及標準邏輯 IC 的部署用於電源調節和整流。
• 提高安全性和舒適性的新時代技術正在積極增加半導體在乘用車中的使用。 為了滿足安全標準，例如安全氣囊、自動駕駛功能和電子穩定控制 (ESC) 程序，公司使用最好的邏輯 IC 之一，同時遵守嚴格的電路級法規。 例如，德州儀器 (TI) 等公司提供符合 AEC-Q100 標準的汽車邏輯設備。 該 IC 支持 5V 至 1.2V 的寬電源電壓範圍，以滿足任何汽車系統的要求，包括信息娛樂系統、車身控制模塊、汽車照明和高級駕駛員輔助系統 (ADAS)。
• IoT 服務和遠程訪問功能（例如地理圍欄、遠程信息處理、車隊管理系統、自動駕駛和半自動駕駛輔助、車載信息娛樂系統以及其他基於 SIM 卡的實用程序）將使汽車行業轉變為高密度通信應用.我領先 這導致越來越多地引入通信模塊和傳感器，以提供詳細的原理圖輸入參數以供進一步處理。 特別是在電動汽車中，模塊和傳感器廣泛使用邏輯 IC 來維持電氣安全標準和電源效率。
• 隨著世界向電動汽車 (EV) 過渡，對電氣參數的廣泛監管要求需要邏輯門 IC 來安全實施充電和放電技術。 汽車公司正在整個車輛、報廢部署階段和充電基礎設施中利用邏輯 IC 的潛在和寬電壓處理能力。 這些因素正在推動標準邏輯 IC 行業的創新和進步，以優化功耗、工作電壓和縮放特性。

亞太地區推動市場增長

• 我們在亞洲最大的製造基地包括中國大陸、台灣、韓國和日本。 廉價的熟練勞動力、有利的天氣條件、政府的激勵措施、強大的電力和水利基礎設施、交通和物流以及有吸引力的投資條件支持半導體製造業的發展。 這些行業是標準製造邏輯 IC 和存儲設備的主要貢獻者。
• 根據半導體行業協會 (SIA) 提供的 2021 年美國半導體行業狀況，全球半導體總製造能力的大約 75% 位於東亞。 當前運行的製造設備具有7nm及以下的尖端能力。 鑑於當前的市場環境，預計該地區的主導地位在預測期內將繼續上升。 如此高的發展速度背後是政府的激勵措施，與其他地區相比，可以顯著降低總體擁有成本 (TCO)。
• 據 SIA 稱，台灣公司在 80 年代末和 90 年代初建立了代工模式。 這些部門專門製造由其他地區的公司設計的芯片。 台灣現在擁有世界前五名代工廠中的兩個，佔世界總產能的20%。 與英特爾（美國）和三星（韓國）一起，台積電是能夠生產先進節點（10 納米及以下）邏輯芯片的三大公司之一。 這些先進的邏輯芯片將安裝在計算密集型設備中，例如個人電腦、數據中心/人工智能服務器和智能手機。 全球大部分頂級節點（5nm和7nm）產能都在台灣。
• 半導體製造所需材料的高度集成，例如光致抗蝕劑、矽晶片、包括封裝基板在內的化學品和特種氣體，也在決定邏輯 IC 製造的位置。 例如，蝕刻工藝需要 C4F6，並且可以比最接近的替代品快 30% 的速度完成工藝。 亞洲國家，尤其是台灣，已經看穿了這樣的事情。 為其他地區聚集這些資源以削弱亞洲的主導地位需要大量的投資和時間。

標準邏輯IC市場競爭者分析

標準邏輯 IC 市場的競爭是溫和的。 在這個市場上，製造商和客戶定期合作開發系統。 觀察到共享專業知識並利用新的邏輯門 IC 來提高操作和功率效率。 改進熱管理、系統響應時間和優化功耗是關鍵目標。

其他好處

• Excel 格式的市場預測 (ME) 表
• 三個月的分析師支持

內容

第1章介紹

• 調查假設和市場定義
• 調查範圍

第2章研究方法論

第 3 章執行摘要

第4章市場動態

• 市場概覽
• 產業吸引力 - 波特五力分析
  • 新進入者的威脅
  • 買家的議價能力
  • 供應商的議價能力
  • 替代品的威脅
  • 競爭公司之間的敵對關係
• 市場驅動力
  • 工業4.0推動邏輯IC普及
  • 半導體和電路的以應用為中心的要求
• 市場製約因素
  • 製造業高度依賴鑄造廠

第 5 章市場細分

• 按類型
  • 數字雙極
  • 電腦芯片
  • MOS門陣列
  • MOS 通用邏輯
  • MOS 標准單元
  • MOS顯示驅動
  • MOS觸摸屏控制器
• 通過申請
  • 溝通
  • 車載
  • 消費類電子產品
  • 工業
  • 醫療保健
  • 其他用途
• 區域信息
  • 北美
  • 歐洲
  • 亞太地區
  • 世界其他地區

第6章競爭格局

• 公司簡介
  • Diodes Incorporated
  • Texas Instruments Incorporated
  • Xilinx, Inc.
  • STMicroelectronics N.V
  • Toshiba Electronic Devices and Storage Corporation
  • ROHM Co., Ltd.
  • Microchip Technology Incorporated
  • NXP Semiconductors N.V.
  • ON Semiconductor Corporation
  • Samsung Electronics Company Ltd.
  • Intel Corporation

第7章 市場機會與今後動向

The global standard IC market is expected to witness a CAGR of 3.2% over the forecast period. The market is described as evolutionary instead of revolutionary because no drastic change has been observed lately. The pre-existing architectures and technologies continue to evolve with scaling-down trends in the semiconductor industry.

Key Highlights

• Standard logic ICs are logic gates in the form of integrated circuits. The ICs are packaged with pins meant for further use in circuitry. The different manufacturing processes and architectures of BiPolar and CMOS technologies provide the difference in operational voltages, response time, and output form. The contributions of logic gates in electronic design and power optimization are essential.
• The scaling down of packaging solutions driven by improvements in ceramics and plastics has played an integral role in choosing the appropriate logic IC for specific purposes. 7400 and 4000 series are among the most broadly used standard logic ICs. The constant focus on scaling down devices, especially consumer electronics, has shaped the industry.
• Manufacturers highlight the use of new and improved logic ICs with better temperature monitoring and adaptability, promising full service in industries like the automotive industry. For instance, in November 2021, Samsung Electronics introduced three new Logic solutions for the next generation of automobiles, including Exynos Auto T5123, Exynos V7, and S2VPS01. The S2VPS01 is a power management IC (PMIC) that regulates and rectifies electrical power input to in-vehicle infotainment performance. The IC is bundled with various features for protection from harsh thermal conditions, including over-voltage protection (OVP) and thermal shut down (TSD).
• The demand for semiconductor devices during the COVID-19 pandemic shifted towards consumer electronics and computing devices for healthcare equipment. This affected the regular demand cycle in the logic IC manufacturing industry for custom builds. Apart from the shift, the demand for standard IC solutions was moderate to steady, with the affected industrial applications compensated by the consumer electronics product lines. In the post-pandemic world, as several industries revive, the demand for semiconductors spikes, accelerating the logic IC market.

Standard Logic IC Market Trends

Automotive Industry to Generate the Maximum Demand

• The automotive industry is looking forward to wide-scale electrification and advancements regularly. The introduction of smart connected tech and autonomous features is driving the demand for the implementation of semiconductors. Hence, the increased use of circuitry, MPUs, and sensors directs the increased deployment of standard logic ICs for power regulation and rectification.
• The new-age technology catering to safety and modification of ride dynamics is aggressively increasing the use of semiconductors in passenger vehicles. To meet safety norms like airbags, autonomous features, electronic stability control (ESC) programs, and others, companies follow strict regulations on circuit level and use one of the best logic ICs available. For instance, companies like Texas Instruments (TI) offers automotive logic devices compliant with the AEC-Q100 standard. The ICs support a wide range of supply voltages, ranging between 5V and 1.2V, to meet the requirements of any automotive system, including infotainment systems, body control modules, automotive lighting, and advanced driver assistance systems (ADAS).
• IoT Services and remote access features like geofencing, telematics, fleet management systems, autonomous and semiautonomous driving assists, in-vehicle infotainment, and other SIM-based utilities are taking the automotive sector towards dense application of communication. This encourages the deployment of communication modules and more sensors to provide detailed schematic input parameters for further processing. The modules and sensors are extensively using logic ICs to maintain electrical safety standards and power efficiency, especially in electric vehicles.
• As the world is shifting toward Electric Vehicles (EVs), the requirement of extensive regulation of electrical parameters invites logic gate ICs for safer implementation of the charging and discharging technologies. Automotive companies utilize the potential and wide range of voltage handling capabilities of logic ICs through the vehicles' and final deployment stages and charging infrastructure. These factors drive the innovation and advancement in the standard logic IC industry to optimize power consumption, operating voltages, and scaling properties.

Asia Pacific Region to Drive the Market Growth

• Some of Asia's biggest manufacturing hubs include China, Taiwan, South Korea, and Japan. The availability of a cheaper skilled workforce, favorable weather conditions, government incentives, robust power, and water infrastructure, transportation and logistics, and attractive investment conditions help the semiconductor fabrication industries flourish. These industries contribute significantly to standard manufacturing logic ICs and storage devices.
• According to the 2021 State of the U.S. Semiconductor industry provided by the Semiconductor Industry Association (SIA), about 75% of the world's total semiconductor manufacturing capacity lies in East Asia. The currently operating manufacturing units have 7 nm and below leading-edge capabilities. The current market conditions promise the region's overall domination to continue rising over the forecast period. Major credit for this high rate of development goes to the significant government incentives that significantly bring down the Total Cost of Operation (TCO) compared to the alternate locations.
• According to SIA, Taiwanese firms founded the foundry model in the late 1980s and 1990s. These units specialized in manufacturing the chips designed by firms from other regions. Today Taiwan comprises two of the five largest foundries globally, hosting 20% of the total global capacity. TSMC is one of the three firms, along with Intel (US) and Samsung (South Korea), that can produce logic chips in advanced nodes (10 nanometers or below). These advanced logic chips are deployed in compute-intensive devices like PCs, data center/AI servers, and smartphones. Most of the world's capacity in the top nodes (5 and 7 nanometers) is located in Taiwan.
• The high concentration of the materials required for semiconductor manufacturing like photoresists, silicon wafers, chemicals including packaging substrates, or specialty gases also defines the location of manufacturing logic ICs. For instance, C4F6 is required for the etching process, enabling the process completion 30% faster than the closest alternative. Asian countries, especially Taiwan, have figured out such factors. It would take a notable amount of investment and time for the other regions to align such resources to disrupt the Asian dominance.

Standard Logic IC Market Competitor Analysis

The standard logic IC market is moderately competitive. The market witnesses regular collaboration among manufacturers and client companies to venture into developing systems. The industry observes sharing expertise, leveraging new advanced logic gate ICs, and boosting operational and power efficiency. Improved heat management, system response time, and power consumption optimization are some of the critical goals.'

• March 2022 - NXP Semiconductors and Hitachi Energy collaborated to fasten the adoption of silicon carbide (SiC) power semiconductor modules in e-mobility. The partnership aims to provide SiC MOSFET-based, more efficient, reliable, and functionally safe solutions. These solutions will be deployed for powertrain inverters, leveraging NXP's advanced, high-performance GD3160 isolated HV Gate Drivers and Hitachi Energy's RoadPak automotive SiC MOSFET power modules.
• May 2021 - Samsung electronics announced the allocation of KRW 171 Trillion in Logic Chip Buniesses by 2030. The plan displays an increase of KRW 38 Trillion compared to the one conveyed in April 2019. The company has also declared constructing a new production line in Pyeongtaek, Korea, expected to be completed by the 2022 second half. The plant will contribute to carrying out 5-nanometer logic semiconductors and 14-nanometer DRAM manufacturing processes, featuring Extreme Ultraviolet (EUV) lithography technology.

Additional Benefits:

• The market estimate (ME) sheet in Excel format
• 3 months of analyst support

TABLE OF CONTENTS

1 INTRODUCTION

• 1.1 Study Assumption & Market Definition
• 1.2 Scope of the Study

2 RESEARCH METHODOLOGY

3 EXECUTIVE SUMMARY

4 MARKET DYNAMICS

• 4.1 Market Overview
• 4.2 Industry Attractiveness - Porter's Five Forces Analysis
  • 4.2.1 Threat of New Entrants
  • 4.2.2 Bargaining Power of Buyers
  • 4.2.3 Bargaining Power of Suppliers
  • 4.2.4 Threat of Substitute Products
  • 4.2.5 Intensity of Competitive Rivalry
• 4.3 Market Drivers
  • 4.3.1 Industry 4.0 Driving the Deployment of Logic ICs
  • 4.3.2 Application-Centric Demands for Semiconductor and Circuitry
• 4.4 Market Restraints
  • 4.4.1 High Dependence on Foundries for Manufacturing

5 MARKET SEGMENTATION

• 5.1 By Type
  • 5.1.1 Digital Bipolar
  • 5.1.2 CMOS
  • 5.1.3 MOS Gate Arrays
  • 5.1.4 MOS General Purpose Logic
  • 5.1.5 MOS Standard Cells
  • 5.1.6 MOS Display Drives
  • 5.1.7 MOS Touch Screen Controllers
• 5.2 By Application
  • 5.2.1 Communication
  • 5.2.2 Automotive
  • 5.2.3 Consumer Electronics
  • 5.2.4 Industrial
  • 5.2.5 Healthcare
  • 5.2.6 Other Applications
• 5.3 By Geography
  • 5.3.1 North America
  • 5.3.2 Europe
  • 5.3.3 Asia-Pacific
  • 5.3.4 Rest of the World

6 COMPETITIVE LANDSCAPE

• 6.1 Company Profiles
  • 6.1.1 Diodes Incorporated
  • 6.1.2 Texas Instruments Incorporated
  • 6.1.3 Xilinx, Inc.
  • 6.1.4 STMicroelectronics N.V
  • 6.1.5 Toshiba Electronic Devices and Storage Corporation
  • 6.1.6 ROHM Co., Ltd.
  • 6.1.7 Microchip Technology Incorporated
  • 6.1.8 NXP Semiconductors N.V.
  • 6.1.9 ON Semiconductor Corporation
  • 6.1.10 Samsung Electronics Company Ltd.
  • 6.1.11 Intel Corporation

7 MARKET OPPORTUNITIES AND FUTURE TRENDS