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1431743

先進封裝：市場佔有率分析、產業趨勢與統計、成長預測（2024-2029）

Advanced Packaging - Market Share Analysis, Industry Trends & Statistics, Growth Forecasts (2024 - 2029)
出版日期: | 出版商: Mordor Intelligence | 英文 126 Pages | 商品交期: 2-3個工作天內

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簡介目錄

先進封裝市場規模預計到2024年為326.4億美元，預計到2029年將達到450億美元，在預測期內（2024-2029年）複合年成長率為6.63%。

先進封裝市場

主要亮點

  • 先進封裝是指在傳統積體電路封裝之前整合和互連元件。電氣、機械和半導體元件等多個裝置可以整合並封裝為一個電子裝置。與傳統的積體電路封裝不同，先進封裝採用在半導體製造設施中執行的製程和技術。它介於製造和傳統封裝之間，包括 3D IC、2.5D IC、扇出晶圓級封裝和系統級封裝等多種技術。
  • 先進封裝可以透過在封裝內整合多個晶片來實現更高的性能。使用穿透矽通孔、內插器、橋樑和簡單電線等因素連接這些晶片可以提高訊號速度並減少驅動這些訊號所需的能量。此外，先進的封裝允許混合在不同製程節點開發的組件。
  • 3D整合、異質整合等先進封裝技術可顯著提高積體電路和記憶體晶片的效能。這些技術可以提高功能密度、互連密度以及針對特定應用的記憶體客製化。例如，記憶體整合整合設備製造商（IDM）可以使用3D堆疊技術來提高記憶體晶片效能並為特定客戶客製化記憶體。
  • 此外，先進的封裝技術使電子元件能夠在不影響性能的情況下小型化。在先進封裝中，模擬工具和多物理場方法用於評估和確保設計的熱可靠性和訊號完整性。透過在設計早期識別潛在的封裝問題，積體電路設計人員可以在原型設計之前進行修改以提高可靠性。
  • 全球金融危機和危機後市場環境導致的法規結構變化對先進封裝市場產生了重大影響。為了保持市場競爭力，OSAT 正在活性化併購活動。隨著主要企業之間不同程度的整合，這種趨勢可能會在未來幾年持續下去。
  • 晶片製造商已經在努力應對日益增加的複雜性、隨著莫耳定律的維護變得更加困難和昂貴而導致未來設計藍圖的丟失，以及不斷變化的標準和不同規則集的新市場的湧入。因此，整合很可能會持續下去。收購可能會對現有技術的產品支援和服務產生重大影響。這在設備預期運行 10 到 20 年左右的市場中尤其麻煩。預計這將抑制市場成長。
  • 全球COVID-19疫情對市場的影響是巨大的，多國政府實施的遏制措施等各種遏制措施對半導體產業的供應鏈產生了重大影響。因此，所研究的市場經歷了放緩，尤其是在早期階段。然而，由於世界各國政府已經認知到半導體產業的重要性及其在經濟復甦中的作用，並正在獎勵在地採購和支持，因此半導體產業預計將在預測期內復甦。

先進封裝市場趨勢

嵌入式晶粒顯示出顯著的成長率

  • 全球嵌入式晶片封裝技術的成長主要受到5G網路技術和家用電子電器需求不斷成長的推動。許多家用電子電器，例如智慧型手機、筆記型電腦、平板電腦和掌上遊戲機，都包含多個嵌入式晶片，以提供更好的使用者介面和增強的整體性能。在智慧型手機、穿戴式裝置和其他家用電子電器中，這些晶片主要用於DC-DC轉換器、電力電子電路和相機電路。
  • 此外，由於架構中嵌入了5G，汽車智慧視訊監控系統中使用的嵌入式設備具有更快的回應時間。此外，電路的小型化是微電子裝置的迫切需求。嵌入式晶片封裝因其在高頻下卓越的電氣性能而成為新興微波應用的一項有前景的技術。隨著電子設備變得越來越小並考慮到方便用戶使用性，對緊湊電子電路的需求不斷增加。嵌入式晶片封裝技術可滿足此需求，該技術具有增強電子電路功能和效率、減小尺寸、訊號電感和功率電感、提高可靠性以及增加訊號密度等優點。
  • 5G 網路的日益普及預計將支持受訪市場的開拓。例如，愛立信表示，預計2019年至2028年全球5G用戶數將大幅增加，分別從超過1,200萬增加到超過45億。按地區分類，預計合約數量增幅最大的是東南亞、東北亞、尼泊爾、印度和不丹。
  • 5G技術的部署也需要緊湊、高效的設備來適應複雜的通訊系統。晶圓級晶片級封裝 (WLCSP) 和扇出封裝等先進封裝解決方案可實現更小的外形尺寸、低耗電量和增強的溫度控管，使其適用於 5G 設備。
  • 此外，採用晶粒嵌入式解決方案的 3D 封裝作為下一代設備的整合工具正在贏得消費者的關注，並且可能成為未來的主要趨勢。因此，預計將在預測期內推動市場。

亞太地區預計將出現強勁成長

  • 由於領先的半導體製造商的存在、快速的工業化和巨大的消費性電子市場，亞太地區預計將成為半導體封裝市場的主導者。該地區以其半導體的大批量生產以及消費性電子、汽車和通訊等多種行業採用先進封裝技術而聞名。這些因素預計將推動亞太地區半導體封裝市場的成長，並為市場相關人員創造利潤豐厚的機會。
  • 中國有一個非常雄心勃勃的半導體議程，並有 1500 億美元的巨額資金支持。該國正在發展國內積體電路產業，以增加晶片產量。由香港、中國和台灣組成的大中華區是一個地緣政治熱點。美國之間持續的貿易戰進一步加劇了該地區的緊張局勢，該地區是所有主要工藝技術的所在地，促使多家中國公司投資半導體產業。
  • 例如，2023年9月，中國宣布計劃推出一個新的國有投資基金，為半導體產業籌集約400億美元。 2022年12月，中國宣布承諾提供超過1兆元（1,430億美元）支持半導體產業。該舉措是實現晶片生產自給自足的重要一步，也是對美國旨在阻礙中國技術進步的行動的回應。預計在預測期內，對包裝服務的需求將大幅增加。
  • 在私人企業的投資方面，中國一直走在許多此類公告的前列，特別是在封裝技術的發展方面，使其成為所有致力於擴大半導體產業的國家和地區的主要競爭對手。例如，2023年8月，國家自然科學基金委員會（NSFC）宣布將投資640萬美元用於30個chiplet計劃。
  • 此外，2023年8月，台積電宣布，在全球需求不斷成長的情況下，將投資900億新台幣在台灣建造先進晶片封裝工廠。此外，美光科技於 2023 年 6 月宣布將斥資數百萬美元在中國建造工廠，儘管中國政府剛認為其產品存在安全風險。美光錶示，未來幾年將升級位於西安的晶片封裝工廠，投資總額達 43 億元人民幣（略高於 6 億美元）。

先進封裝產業概況

先進封裝市場正處於日月光、台積電、Amkor Technology、Intel Corporation、JCIVE Group等主要企業向半固體過渡的局面。

2023 年 7 月，Amkor Technology 廣泛展示了其在使用台積電先進的低 k 製程技術製造的設備的引線鍵合和覆晶構裝開發和檢驗方面的努力和成就。 Amkor 已與多個客戶合作進行 Low-k 產品認證，並計劃在今年稍後實現 Low-k 封裝銷量的大幅成長。

2022 年 11 月，英特爾公司開始在檳城建造新的半導體組裝和測試設施。該工廠由位於峇六拜自由工業區內的兩棟建築（第4 號工廠和第5 號工廠）組成，總面積為982,000 平方英尺，預計於2025 年竣工，將為當地市場創造2,700 個就業機會。

其他福利

  • Excel 格式的市場預測 (ME) 表
  • 3 個月的分析師支持

目錄

第1章簡介

  • 研究假設和市場定義
  • 調查範圍

第2章調查方法

第3章執行摘要

第4章市場洞察

  • 市場概況
  • 產業價值鏈分析
  • 產業吸引力－波特五力分析
    • 新進入者的威脅
    • 買方議價能力
    • 供應商的議價能力
    • 替代品的威脅
    • 競爭公司之間敵對關係的強度
  • 評估 COVID-19 和宏觀經濟趨勢對產業的影響

第5章市場動態

  • 市場促進因素
    • 電子產品先進架構的成長趨勢
    • 政府政策及新興國家政策利多
  • 市場限制因素
    • 市場整合影響整體盈利

第6章市場區隔

  • 按封裝平台
    • 覆晶
    • 嵌入式晶粒
    • Fi-WLP
    • Fo-WLP
    • 2.5D/3D
  • 按地區
    • 北美洲
    • 歐洲
    • 亞太地區
    • 世界其他地區

第7章 競爭形勢

  • 公司簡介
    • Amkor Technology Inc.
    • Taiwan Semiconductor Manufacturing Company Limited
    • Advanced Semiconductor Engineering Inc.
    • Intel Corporation
    • JCET Group Co. Ltd
    • Chipbond Technology Corporation
    • Samsung Electronics Co. Ltd
    • Universal Instruments Corporation
    • ChipMOS Technologies Inc.
    • Brewer Science Inc.

第8章投資分析

第9章 市場機會及未來趨勢

簡介目錄
Product Code: 48278

The Advanced Packaging Market size is estimated at USD 32.64 billion in 2024, and is expected to reach USD 45 billion by 2029, growing at a CAGR of 6.63% during the forecast period (2024-2029).

Advanced Packaging - Market

Key Highlights

  • Advanced packaging refers to the aggregation and interconnection of components before traditional integrated circuit packaging. It allows multiple devices, such as electrical, mechanical, or semiconductor components, to be merged and packaged as a single electronic device. Unlike traditional integrated circuit packaging, advanced packaging employs processes and techniques that are performed at semiconductor fabrication facilities. It sits in between fabrication and traditional packaging, and it includes various technologies like 3D ICs, 2.5D ICs, fan-out wafer-level packaging, system-in-package, etc.
  • Advanced packaging can achieve performance gains through the integration of multiple chips in a package. By connecting these chips using fatter, such as through-silicon vias, interposers, bridges, or simple wires, the speed of signals can be increased, and the amount of energy required to drive those signals can be reduced. Additionally, advanced packaging allows for the mixing of components developed at different process nodes.
  • Advanced packaging techniques, such as 3D integration and heterogenous integration, can significantly improve the performance of integrated circuits and memory chips. These techniques allow for increased feature density, interconnect density, and customization of memory for specific applications. For instance, memory-integrated device manufacturers (IDMs) can use 3D stacking technology to enhance performance in memory chips and customize memory for specific clients.
  • Advanced packaging techniques also enable the reduction of the size of electronic components without compromising their performance. Simulation tools and Multiphysics approaches are used in advanced packaging to assess and ensure the thermal reliability and signal integrity of designs. By identifying potential packaging problems early in the design phase, integrated circuit designers can make modifications to improve reliability before prototyping.
  • The experience of the global financial crisis changes to regulatory frameworks and the post-crisis market environment has had a significant impact on the advanced packaging market. To remain competitive in the market, OSATs are increasing their M&A activities. This will continue throughout the coming years, with various levels of consolidation among the major players.
  • The consolidation will increase as chipmakers are already grappling with the increasing complexity, the loss of a roadmap for future designs as Moore's Law is becoming more difficult and expensive to sustain, and a flood of new markets with evolving standards and different sets of rules. Acquisitions can have a big impact on product support and servicing of the existing technology. This is particularly troublesome for markets in which the devices are expected to function for about 10 to 20 years. This is expected to restrain the growth of the market.
  • The notable impact of the global outbreak of COVID-19 was observed on the market as various containment measures taken by governments across multiple countries, such as the implementation of lockdowns, significantly impacted the supply chain of the semiconductor industry. As a result, a slowdown was witnessed in the studied market, especially during the initial phase. However, with several governments around the world recognizing the importance of the semiconductor industry and its role in economic recovery and incentivizing local sourcing and support, the industry was anticipated to recover during the forecast period.

Advanced Packaging Market Trends

Embedded Die to Witness Significant Growth Rate

  • The growth of global embedded die packaging technology is majorly driven by the increasing demand for 5G network technology and consumer electronics. Numerous consumer electronic devices, such as smartphones, laptops, tablets, and portable gaming consoles, incorporate several embedded chips to provide a better user interface and enhanced overall performance. In smartphones, wearable devices, and other consumer electronic appliances, these chips are used primarily in DC-DC converters, power electronic circuitry, and camera circuits.
  • Moreover, due to the incorporation of 5G into their architecture, embedded devices used in smart video surveillance systems of automobiles give rapid response times. There is also a critical need for circuit miniaturization in microelectronic devices. Embedded die packaging is a promising technology for emerging microwave applications, owing to its excellent electrical performance at high frequencies. With the reduction in size of electronic devices for ease of access for users, the demand for compact electronic circuitry is on the rise. This demand is met by embedded die packaging technology, which offers advantages such as increased functionality and efficiency of the electronic circuit; reduced size, signal inductance, and power inductance; improved reliability; and higher signal density.
  • The increasing adoption of 5G networks would augment the development of the studied market. For instance, according to Ericsson, 5G subscriptions are forecasted to increase drastically worldwide from 2019 to 2028, from over 12 million to over 4.5 billion subscriptions, respectively. Southeast Asia, Northeast Asia, Nepal, India, and Bhutan are expected to have the most subscriptions by region.
  • Also, the rollout of 5G technology requires compact and efficient devices to accommodate complex communication systems. Advanced packaging solutions like Wafer Level Chip Scale Package (WLCSP) and fan-out packaging enable smaller form factors, lower power consumption, and enhanced thermal management, making them suitable for 5G devices.
  • Furthermore, 3D packaging with embedded die solutions is gaining attention among consumers as an integration tool for next-generation devices, which is likely to become a key trend in the future. Hence, it is anticipated to drive the market over the forecast period.

Asia Pacific is Expected to Witness Significant Growth Rate

  • The Asia Pacific region is anticipated to emerge as a dominant player in the semiconductor packaging market, owing to the presence of major semiconductor manufacturers, rapid industrialization, and a vast consumer electronics market. The region is renowned for its high-volume production of semiconductors and the adoption of advanced packaging technologies across diverse industries, such as consumer electronics, automotive, and telecommunications. These factors are expected to fuel the growth of the semiconductor packaging market in the Asia Pacific region, thereby presenting lucrative opportunities for market players.
  • China has a highly ambitious semiconductor agenda, supported by a substantial funding of USD 150 billion. The nation is developing its domestic IC industry to increase its chip production. The Greater China region, comprising Hong Kong, China, and Taiwan, is a significant geopolitical hotspot. The ongoing US-China trade war has further intensified tensions in this area, which houses all the leading process technology, prompting several Chinese firms to invest in their semiconductor industry.
  • For instance, in September 2023, China announced its plans to launch a new state-backed investment fund to raise about USD 40 billion for its semiconductor sector. In December 2022, China announced its commitment to a support package exceeding YUAN 1 trillion (USD 143 billion) for its semiconductor industry. This initiative is a crucial step towards achieving self-sufficiency in chip production and is a response to U.S. actions aimed at hindering China's technological progress. The demand for packaging services is anticipated to rise considerably over the forecasted period, owing to the region's intensified efforts to enhance domestic chip manufacturing.
  • Regarding investments from private players, the country has been at the forefront for many such announcements, especially toward evolving packaging technologies, thus presenting it as a major competitor for all national geographies working towards expanding its semiconductor industry. For instance, in August 2023, the National Natural Science Foundation of China (NSFC) announced an investment of USD 6.4 million in 30 Chiplet projects, now considered the next big advanced packaging technology.
  • Moreover, in August 2023, Taiwan Semiconductor Manufacturing Company (TSMC) announced investing 90 billion New Taiwan dollars to build an advanced chip packaging plant in Taiwan amid booming global demand. Additionally, Micron stated in June 2023 that it would spend millions of dollars on a factory in China despite the Chinese government having just deemed its goods a security risk. Over the coming years, Micron stated it will upgrade its chip packaging factory in Xi'an with investments totaling YUAN 4.3 billion (slightly over USD 600 million).

Advanced Packaging Industry Overview

The Advanced Packaging Market had a semi-consolidated landscape with key players like Advanced Semiconductor Engineering Inc., Taiwan Semiconductor Manufacturing Company Limited, Amkor Technology, Intel Corporation, and JCET Group Co. Ltd. A significant shift was noted as numerous IC manufacturers transitioned to sub-advanced packaging, spurring market demand and heightening competition.

In July 2023, Amkor Technology extensively detailed its efforts and achievements in developing and validating wire bond and flip chip packaging for devices manufactured using TSMC's advanced low-k process technologies. Collaborating with multiple clients on low-k product qualification, Amkor aimed for a substantial volume ramp-up in low-k packages during the latter half of the year.

In November 2022, Intel Corporation commenced work on a new semiconductor assembly and testing facility in Penang. Comprising two buildings (Plants 4 and 5) totaling 982,000 square feet within the Bayan Lepas Free Industrial Zone, this facility, expected to be finalized by 2025, was anticipated to generate 2,700 job opportunities within the local market.

Additional Benefits:

  • The market estimate (ME) sheet in Excel format
  • 3 months of analyst support

TABLE OF CONTENTS

1 INTRODUCTION

  • 1.1 Study Assumptions and Market Definition
  • 1.2 Scope of the Study

2 RESEARCH METHODOLOGY

3 EXECUTIVE SUMMARY

4 MARKET INSIGHTS

  • 4.1 Market Overview
  • 4.2 Industry Value Chain Analysis
  • 4.3 Industry Attractiveness - Porter's Five Forces Analysis
    • 4.3.1 Threat of New Entrants
    • 4.3.2 Bargaining Power of Buyers
    • 4.3.3 Bargaining Power of Suppliers
    • 4.3.4 Threat of Substitute Products
    • 4.3.5 Intensity of Competitive Rivalry
  • 4.4 Assessment of the Impact of COVID-19 and Macro Economic Trends on the Industry

5 MARKET DYNAMICS

  • 5.1 Market Drivers
    • 5.1.1 Increasing Trend of Advanced Architecture in Electronic Products
    • 5.1.2 Favorable Government Policies and Regulations in Developing Countries
  • 5.2 Market Restraints
    • 5.2.1 Market Consolidation affecting Overall Profitability

6 MARKET SEGMENTATION

  • 6.1 By Packaging Platform
    • 6.1.1 Flip Chip
    • 6.1.2 Embedded Die
    • 6.1.3 Fi-WLP
    • 6.1.4 Fo-WLP
    • 6.1.5 2.5D/3D
  • 6.2 By Geography
    • 6.2.1 North America
    • 6.2.2 Europe
    • 6.2.3 Asia-Pacific
    • 6.2.4 Rest of the World

7 COMPETITIVE LANDSCAPE

  • 7.1 Company Profiles
    • 7.1.1 Amkor Technology Inc.
    • 7.1.2 Taiwan Semiconductor Manufacturing Company Limited
    • 7.1.3 Advanced Semiconductor Engineering Inc.
    • 7.1.4 Intel Corporation
    • 7.1.5 JCET Group Co. Ltd
    • 7.1.6 Chipbond Technology Corporation
    • 7.1.7 Samsung Electronics Co. Ltd
    • 7.1.8 Universal Instruments Corporation
    • 7.1.9 ChipMOS Technologies Inc.
    • 7.1.10 Brewer Science Inc.

8 INVESTMENT ANALYSIS

9 MARKET OPPORTUNITIES AND FUTURE TRENDS