先進封裝市場機會、成長動力、產業趨勢分析及 2025-2034 年預測

Advanced Packaging Market Opportunity, Growth Drivers, Industry Trend Analysis, and Forecast 2025-2034

出版日期: 2025年02月21日 | 出版商:

Global Market Insights Inc. | 英文 190 Pages | 商品交期: 2-3個工作天內

價格

簡介目錄

2024 年全球先進封裝市場規模達到 385 億美元，預計 2025 年至 2034 年期間將以 11.5% 的強勁複合年成長率成長。這一成長得益於電子元件日益小型化以及人工智慧在多個行業的廣泛應用。隨著對緊湊、高性能設備的需求不斷成長，先進的封裝解決方案對於增強功能和效率變得不可或缺。半導體製造商正在利用尖端封裝技術來最佳化電源管理、熱性能和整體可靠性，使電子設備能夠以更高的效率和耐用性運作。對下一代半導體解決方案的日益重視，已將先進封裝定位為消費性電子、汽車、醫療保健、航太和工業應用等領域技術發展的基石。

技術進步正在重塑半導體產業，推動先進封裝方法的創新。人工智慧驅動的應用和高效能運算的日益融合促使半導體製造商開發支援快速資料處理和增強連接性的高效封裝解決方案。 5G、物聯網 (IoT) 和自動化技術的投資不斷增加，進一步推動了對先進半導體封裝的需求，這在提高設備壽命、散熱和能源效率方面發揮著至關重要的作用。隨著各行各業優先考慮性能最佳化，對客製化、特定應用的包裝解決方案的需求持續成長，從而增強了行業上升的趨勢。

市場範圍
起始年份	2024
預測年份	2025-2034
起始值	385億美元
預測值	1114億美元
複合年成長率	11.5%

市場依封裝類型分為覆晶、扇入晶圓級封裝、嵌入式晶片、扇出和 2.5D/3D 技術。基於覆晶的先進封裝由於其能夠提供高密度互連而佔據了該領域的主導地位，到 2023 年其市場規模將達到 240 億美元。該技術涉及翻轉晶片並使用焊料凸塊將其直接連接到基板，從而有效地最小化訊號路徑長度和電阻。覆晶封裝廣泛應用於需要增強訊號完整性、降低功耗和提高效能的行動裝置和高性能電子元件。先進半導體封裝解決方案在各種應用中的不斷採用正在加速該領域的成長。

按應用分類，先進封裝市場涵蓋消費性電子、汽車、工業、醫療保健、航太和國防等產業。汽車領域在 2024 年佔據了 11.1% 的市場佔有率，因為先進封裝解決方案的整合對於最佳化電子控制單元的功率效率和訊號傳輸起著至關重要的作用。人工智慧驅動的運算進步正在徹底改變汽車技術，實現即時決策，增強感測器整合，並提高車輛性能。隨著對電動和自動駕駛汽車的需求不斷增加，先進的封裝解決方案對於確保可靠的電子控制系統和卓越的車輛效率變得至關重要。

在政府強力推動、旨在鞏固美國在半導體和先進封裝技術領域領導地位的舉措的推動下，美國先進封裝市場規模預計在 2024 年達到 102 億美元。對國內製造和供應鏈彈性的重視正在推動市場擴張，並增加對下一代包裝解決方案的投資。主要半導體製造商和研究機構的存在正在加速技術進步，鞏固該國作為全球半導體創新中心的地位。政府支持的激勵措施和戰略合作正在進一步加強該行業，確保全球半導體市場的長期成長和競爭力。

產業生態系統分析
- 影響價值鏈的因素
- 利潤率分析
- 中斷
- 未來展望
- 製造商
- 經銷商
供應商格局
利潤率分析
重要新聞和舉措
監管格局
衝擊力
- 成長動力
  - 消費性電子產品對先進、微型半導體元件的需求不斷成長
  - 5G技術的滲透
  - 汽車電子產品日益複雜
  - 物聯網和人工智慧技術在全球的興起
  - 2.5D/3D技術的發展
- 產業陷阱與挑戰
  - 成本高、複雜度高
  - 熱管理面臨的挑戰
成長潛力分析
波特的分析
PESTEL分析

第4章：競爭格局

介紹
公司市佔率分析
競爭定位矩陣
戰略展望矩陣

第5章：市場估計與預測：依包裝類型，2021-2034

主要趨勢
覆晶
扇入晶圓級封裝（WLP）
嵌入式晶片
扇出
2.5D/3D

第6章：市場估計與預測：按應用，2021-2034

主要趨勢
消費性電子產品
汽車
工業的
衛生保健
航太與國防
其他

第7章：市場估計與預測：按地區，2021-2034

主要趨勢
北美洲
- 美國
- 加拿大
歐洲
- 英國
- 德國
- 法國
- 義大利
- 西班牙
- 俄羅斯
亞太地區
- 中國
- 印度
- 日本
- 韓國
- 澳洲
拉丁美洲
- 巴西
- 墨西哥
MEA
- 南非
- 沙烏地阿拉伯
- 阿拉伯聯合大公國

第8章：公司簡介

Amkor Technology
ASE Group
China Wafer Level CSP Co., Ltd.
Chipbond Technology Corporation
ChipMOS Technologies Inc.
Greatek Electronics Inc.
JCET Group Co., Ltd.
Powertech Technology Inc.
Sanmina Corporation
Taiwan Semiconductor Manufacturing Company Limited (TSMC)
Tongfu Mikcroelectronics Co. Ltd.
UTAC

簡介目錄

Product Code: 4831

The Global Advanced Packaging Market reached USD 38.5 billion in 2024 and is expected to grow at a robust CAGR of 11.5% from 2025 to 2034. This growth is fueled by the increasing miniaturization of electronic components and the widespread adoption of artificial intelligence across multiple industries. As the demand for compact, high-performance devices accelerates, advanced packaging solutions are becoming indispensable for enhancing functionality and efficiency. Semiconductor manufacturers are leveraging cutting-edge packaging technologies to optimize power management, thermal performance, and overall reliability, enabling electronic devices to operate with greater efficiency and durability. The growing emphasis on next-generation semiconductor solutions has positioned advanced packaging as a cornerstone of technological evolution across sectors such as consumer electronics, automotive, healthcare, aerospace, and industrial applications.

Technological advancements are reshaping the semiconductor industry, driving innovations in advanced packaging methodologies. The increasing integration of AI-driven applications and high-performance computing is prompting semiconductor manufacturers to develop highly efficient packaging solutions that support rapid data processing and enhanced connectivity. Rising investments in 5G, Internet of Things (IoT), and autonomous technologies are further propelling the demand for advanced semiconductor packaging, which plays a crucial role in improving device longevity, heat dissipation, and energy efficiency. As industries prioritize performance optimization, the need for customized, application-specific packaging solutions continues to grow, reinforcing the industry's upward trajectory.

Market Scope
Start Year	2024
Forecast Year	2025-2034
Start Value	$38.5 billion
Forecast Value	$111.4 billion
CAGR	11.5%

The market is segmented by packaging type into flip-chip, fan-in wafer-level packaging, embedded-die, fan-out, and 2.5D/3D technologies. Flip-chip-based advanced packaging dominated the segment, accounting for USD 24 billion in 2023, due to its ability to provide high-density interconnections. This technique involves flipping the chip and connecting it directly to the substrate using solder bumps, effectively minimizing signal path length and resistance. Flip-chip packaging is extensively utilized in mobile devices and high-performance electronic components that require enhanced signal integrity, reduced power consumption, and improved performance. The continuous adoption of advanced semiconductor packaging solutions across various applications is accelerating growth in this segment.

By application, the advanced packaging market spans consumer electronics, automotive, industrial, healthcare, aerospace & defense, and other industries. The automotive segment accounted for an 11.1% market share in 2024, as the integration of advanced packaging solutions plays a crucial role in optimizing power efficiency and signal transmission in electronic control units. AI-driven computing advancements are revolutionizing automotive technologies, enabling real-time decision-making, enhancing sensor integration, and improving vehicle performance. With increasing demand for electric and autonomous vehicles, advanced packaging solutions are becoming essential for ensuring reliable electronic control systems and superior vehicle efficiency.

The US advanced packaging market reached USD 10.2 billion in 2024, driven by strong government initiatives aimed at reinforcing the nation's leadership in semiconductor and advanced packaging technologies. The emphasis on domestic manufacturing and supply chain resilience is fueling market expansion with increased investments in next-generation packaging solutions. The presence of key semiconductor manufacturers and research institutions is accelerating technological advancements, solidifying the country's status as a global hub for semiconductor innovation. Government-backed incentives and strategic collaborations are further strengthening the industry, ensuring long-term growth and competitiveness in the global semiconductor market.

Chapter 1 Methodology & Scope

1.1 Market scope & definitions
1.2 Base estimates & calculations
1.3 Forecast calculations
1.4 Data sources
- 1.4.1 Primary
- 1.4.2 Secondary
  - 1.4.2.1 Paid sources
  - 1.4.2.2 Public sources

Chapter 2 Executive Summary

2.1 Industry synopsis, 2021-2034

Chapter 3 Industry Insights

3.1 Industry ecosystem analysis
- 3.1.1 Factor affecting the value chain
- 3.1.2 Profit margin analysis
- 3.1.3 Disruptions
- 3.1.4 Future outlook
- 3.1.5 Manufacturers
- 3.1.6 Distributors
3.2 Supplier landscape
3.3 Profit margin analysis
3.4 Key news & initiatives
3.5 Regulatory landscape
3.6 Impact forces
- 3.6.1 Growth drivers
  - 3.6.1.1 Rising demand for advanced and miniaturized semiconductor components in consumer electronics
  - 3.6.1.2 Penetration of 5G technology
  - 3.6.1.3 Increasing complexities of automotive electronics
  - 3.6.1.4 Rising global trend toward IoT and AI technologies
  - 3.6.1.5 Development of 2.5D/3D technology
- 3.6.2 Industry pitfalls & challenges
  - 3.6.2.1 High cost and complexity
  - 3.6.2.2 Challenges in thermal management
3.7 Growth potential analysis
3.8 Porter's analysis
3.9 PESTEL analysis

Chapter 4 Competitive Landscape, 2024

4.1 Introduction
4.2 Company market share analysis
4.3 Competitive positioning matrix
4.4 Strategic outlook matrix

Chapter 5 Market Estimates & Forecast, By Packaging Type, 2021-2034 (USD Million & Unit)

5.1 Key trends
5.2 Flip-chip
5.3 Fan-in Wafer Level Packaging (WLP)
5.4 Embedded-die
5.5 Fan-out
5.6 2.5D/3D

Chapter 6 Market Estimates & Forecast, By Application, 2021-2034 (USD Million & Unit)

6.1 Key trends
6.2 Consumer electronics
6.3 Automotive
6.4 Industrial
6.5 Healthcare
6.6 Aerospace & defense
6.7 Others

Chapter 7 Market Estimates & Forecast, By Region, 2021-2034 (USD Million & Unit)

7.1 Key trends
7.2 North America
- 7.2.1 U.S.
- 7.2.2 Canada
7.3 Europe
- 7.3.1 UK
- 7.3.2 Germany
- 7.3.3 France
- 7.3.4 Italy
- 7.3.5 Spain
- 7.3.6 Russia
7.4 Asia Pacific
- 7.4.1 China
- 7.4.2 India
- 7.4.3 Japan
- 7.4.4 South Korea
- 7.4.5 Australia
7.5 Latin America
- 7.5.1 Brazil
- 7.5.2 Mexico
7.6 MEA
- 7.6.1 South Africa
- 7.6.2 Saudi Arabia
- 7.6.3 UAE