市場調查報告書
商品編碼
1525916
全球先進封裝市場:按類型、最終用戶和地區進行預測(截至 2030 年)Global Advanced Packaging Market Research Report Information by Type, by End-user, and by Region -Forecast Till 2030 |
預計先進封裝市場規模在預測期內將以 5.6% 的複合年增長率成長,到 2023 年將達到 353.367 億美元。
推動先進封裝市場的主要因素是電子產業的爆炸性擴張以及對各種消費性電子產品(如穿戴式裝置、筆記型電腦、桌上型電腦、智慧型手機和小型電子產品)日益增長的需求。
區域展望
預計2022年亞太地區將佔最大佔有率,2030年將成長至365.2858億美元。該地區的市場佔有率很大,因為該地區有如此多的半導體製造工廠。該地區的製造商正在擴大產能,以滿足無晶圓廠供應商不斷增長的需求,而中國正在整合其電路板製造業務。
由於多種原因,北美先進封裝市場也大幅擴張。首先,該市場直接受到消費性電子產品需求成長的影響。人們越來越多地使用電子產品進行通訊、休閒和工作相關任務,需要適合這些設備複雜而小型設計的先進封裝解決方案。由於對優質晶片的需求不斷增加,市場也不斷擴大。
歐洲先進封裝市場的成長是由快速擴張所推動的,特別是在智慧型手機、電子產品和物聯網需求不斷增長的推動下的晶圓級封裝。為了滿足這種不斷增長的需求,先進封裝供應商正在積極開發程序和計劃,以降低先進封裝的總成本並確保最大的營運效率。
該報告調查了全球先進封裝市場,並提供了市場的定義和概述,分析了影響市場成長和市場機會的因素、市場規模的趨勢和預測,以及按各個細分市場、地區和主要國家進行的細分。
Global Advanced Packaging Market Research Report Information by Type (Flip Chip Scale Package, Flip Chip Ball Grid Array, Wafer Level Chip Scale Packaging, 5D/3D, Fan Out Wafer-level Packaging and Others), by End-user (Consumer Electronics, Healthcare, Industrial, Aerospace and Defense, Automotive and Other), and by Region (North America, Europe, Asia Pacific, South America, and Middle East & Africa) -Forecast Till 2030
In 2023, the advanced packaging market was estimated to be worth USD 35,336.7 million. Over the course of the projection period, the Advanced Packaging industry is expected to increase at a compound annual growth rate (CAGR) of 5.6%. The collection and linking of Types prior to conventional integrated circuit packaging is known as advanced packaging. Multiple devices can be combined and packed as a single electrical device thanks to advanced packaging. The industrial segment that deals with creating, designing, and producing sophisticated and novel packaging solutions for a range of products is known as the advanced packaging market. Modern packaging methods are used to improve the performance, usefulness, and dependability of packaged items while guaranteeing its preservation, protection, and appearance. The increased need for embedded die packaging can also be attributed to the increasing downsizing of devices and the increasing use of micro-electromechanical systems (MEMS) in manufacturing. Although the technology has been available for some time, its low yields and high costs have restricted its applicability to specialized fields.
As technology develops, producers are moving toward producing small electronic devices for a variety of markets, including consumer electronics, healthcare, automotive, and semiconductor IC manufacture.
The main factors driving the Advanced Packaging Market are the electronics industry's explosive expansion and the rising demand for a range of consumer electronics, including wearables, laptops, desktops, smartphones, and tiny gadgets.
The Flip Chip Scale Package, Flip Chip Ball Grid Array, Wafer Level Chip Scale Packaging, 5D/3D, Fan Out Wafer-level Packaging, and Others are the segments of the Advanced Packaging Market based on type.
The Advanced Packaging Market has been divided into Consumer Electronics, Healthcare, Industrial, Aerospace and Defense, Automotive, and Other segments based on the end-user.
Regional Perspectives
The Asia-Pacific region is predicted to account for the largest share in 2022 and grow to USD 36,528.58 million by 2030. Because there are so many semiconductor production facilities in the Asia-Pacific region, the market share is substantial in that area. In order to fulfill the increased demand from fabless suppliers, manufacturers in this region are expanding their production capacity, and China is attempting to consolidate its substrate manufacturing business.
For several reasons, the advanced packaging market in North America is expanding significantly. First, the market is directly impacted by the growing demand for consumer electronics. People are using electronic gadgets more and more for communication, leisure, and work-related tasks, which means that sophisticated packaging solutions are required to fit the intricate and small designs of these devices. The market is also expanding due to the rising demand for premium chips.
The rapid expansion of the advanced packaging market, especially in wafer level packaging, driven by the rising demand for smartphones, electronics, and the Internet of Things (IoT), is responsible for the growth of the Europe Advanced Packaging Market. Providers of advanced packaging are actively creating procedures and plans to lower the total cost of advanced packaging and guarantee maximum operational effectiveness to satisfy this expanding demand.
South America's market for innovative packaging materials is expanding gradually due to a number of factors. The need for improved packaging solutions is being driven by the rising demand for sophisticated electronic gadgets like wearables, tablets, and smartphones. Advanced packaging technologies enable the production of semiconductor chips that are more compact, powerful, and energy-efficient-all necessary for these devices.
The market for advanced packaging semiconductor materials is expanding significantly in the Middle East and Africa (MEA) region. In order to enable more performance and usefulness in electronic devices, advanced packaging refers to the compact and efficient integration and encapsulation of semiconductor chips.
Principal Players
Amkor Technology Inc., ASE Technology Holding Co. Ltd., China Wafer Level CSP Co. Ltd., ChipMOS Technologies Inc., FlipChip International LLC, HANA Micron Inc., Jiangsu Changjiang Electronics Technology Co. Ltd., King Yuan Electronics Corp., Nepes Corporation, Powertech Technology Inc., and numerous other notable businesses are among those that lead the advanced packaging market.