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市場調查報告書

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1626573

全球先進封裝技術市場規模（按類型、垂直產業、區域範圍和預測）

Global Advanced Packaging Technologies Market Size By Type (3D Integrated Circuit, 2D Integrated Circuit), By Industrial Vertical (Automotive And Transport, Consumer Electronics), By Geographic Scope And Forecast

出版日期: 2024年10月29日 | 出版商:

Verified Market Research | 英文 202 Pages | 商品交期: 2-3個工作天內

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簡介目錄

先進封裝技術的市場規模及預測

2020 年先進封裝技術市場規模為 42.4 億美元，預計到 2028 年將達到 92.8 億美元，2021 年至 2028 年的複合年增長率為 10.29%。

先進封裝技術市場正在經歷顯著成長，因為它們比傳統封裝方法更有效率、功耗更低，並且根據電子設備的尺寸有充足的要求。物聯網的快速發展以及下一代行動晶片組對先進晶圓封裝技術日益增長的需求正在推動先進封裝技術市場的發展。此外，技術進步和研發活動的投資增加預計將推動市場成長。全球先進封裝技術市場報告對市場進行了全面的評估。它對關鍵細分市場、趨勢、市場推動因素、阻礙因素、競爭格局以及在市場中發揮關鍵作用的因素進行了全面分析。

先進封裝技術的全球市場定義

先進封裝是傳統電子封裝之前的元件的組合和互連。先進的封裝允許整合多個設備（電氣、機械和半導體）並將它們封裝為單一電子設備。與傳統電子封裝不同，先進封裝利用半導體製造設施的製程和技術。先進封裝技術是2.5D、3D-IC、晶圓級封裝等多種技術的結合。將積體電路封裝在外殼中有助於保護金屬零件免受腐蝕和物理損壞。

所採用的封裝技術取決於功耗、操作條件、可測量尺寸和成本等各種參數。這些技術廣泛應用於工業和汽車領域。先進封裝改變了半導體的生產方式並帶來了晶片設計的新範式。由於採用電子設計自動化程序的增多，代工廠越來越多地受益於先進封裝流程的自動化。先進封裝的開發是為了滿足各種要求，包括功率耗散、現場操作，以及最重要的成本。

各種消費性電子產品對高性能半導體的需求正在推動先進封裝技術市場的成長。這促使智慧型手機和其他行動裝置中使用的半導體的 3D 和 2.5D 封裝的需求增加。下一代半導體平台的採用正在加速先進封裝技術的使用。各大半導體封裝公司在過去幾年開發了許多創新的系統級晶片設計。得益於整合晶片製造節點的新型異質整合技術，晶片製造商能夠提出新的設計。

先進封裝技術全球市場概覽

先進封裝技術市場正在經歷顯著成長，因為它比傳統封裝方法更有效率、功耗更低、能夠滿足電子設備的尺寸要求。2.5D 和 3D 玻璃以及矽中介層等先進封裝晶片技術不斷推動晶片封裝技術的發展，以滿足尺寸、功耗、產量和成本的行業標準。對於前端代工廠和後端封裝供應商來說，這些將晶片粘合併整合到最終組裝中的新穎而獨特的步驟在沉積、蝕刻、光刻、檢查、分割和清潔方面帶來了新的課題。

物聯網的快速發展以及下一代行動晶片組對先進晶圓封裝技術日益增長的需求正在推動先進封裝技術市場的發展。此外，技術進步和研發活動的投資增加預計將推動市場成長。人工智慧在工業自動化領域的應用日益廣泛，可能會刺激對採用先進封裝製造的高階晶片的需求。光刻製造技術在先進封裝技術市場中越來越受歡迎。

此外，異質整合解決方案在包裝服務提供者中正在迅速發展。先進封裝技術市場受到新興市場中快速擴張的邏輯晶片產業所推動。近年來，晶圓製造服務供應商一直努力擴大其產品範圍，以滿足國際知名半導體製造商的需求。然而，設備發熱問題日益嚴重以及缺乏標準化是限制市場成長的主要因素之一，並可能在未來繼續阻礙先進封裝技術市場的擴張。

此外，新興經濟體對高性能設備的需求不斷增加、扇出型晶圓級封裝市場發展趨勢不斷上升以及新興經濟體包裝食品產業的擴張，可能會在 2021-2028 年的預測期內為先進封裝技術市場提供新的機會。這將使先進封裝解決方案供應商能夠更好地提供創新的扇出型封裝技術。此外，先進封裝技術市場的主要參與者也在擴大半導體生產線。

The market for advanced packaging technologies is witnessing tremendous growth owing to its efficiency over the conventional packaging method, less power consumption, and satisfactory requirement as per the size of electronic devices. The growing need for advanced wafer packaging techniques for fast expanding IoT and next-generation mobile chipsets is driving the Advanced Packaging Technologies Market. Furthermore, advancement in technologies and increasing investments in R&D activities are expected to drive the growth of the market. The Global Advanced Packaging Technologies Market report provides a holistic evaluation of the market. The report offers a comprehensive analysis of key segments, trends, drivers, restraints, competitive landscape, and factors that are playing a substantial role in the market.

Global Advanced Packaging Technologies Market Definition

Advanced packaging is the combination and interconnection of components before traditional electronic packaging. Advanced packaging allows multiple devices (electrical, mechanical, or semiconductor) to be integrated and packaged as a single electronic device. Unlike traditional electronic packaging, advanced packaging makes use of semiconductor fabrication facilities' processes and techniques. Advanced Packaging Technologies is a combination of various techniques such as 2.5D, 3D-IC, wafer-level packaging, and many others. It facilitates the integrated circuits, to enclose in the case which prevents the corrosion of the metallic parts and physical damage.

The packaging techniques used rely on various parameters such as power consumption, operating conditions, measurable size, and cost. These technologies are widely used in the industrial and automotive sectors. Advanced packaging has changed semiconductor production methods and brought up a new paradigm in chip design. Foundries have benefited more and more from the automation of advanced packaging processes, which has been aided by increased electronic design automation programs. Advanced packaging is being developed to fulfill the various conditions of power dissipation, field operation, and, most importantly, cost.

The need for high-performance semiconductors in a variety of consumer electronics has fueled the growth of the Advanced Packaging Technologies Market. The demand for 3D and 2.5D packaging in semiconductors used in smartphones and other mobile devices has risen as a result. The adoption of next-generation semiconductor platforms is accelerating the use of advanced packaging techniques. Key semiconductor packaging companies have developed lots of new innovative system-level chip designs during the last few years. Chipmakers have been able to come up with new designs because of new heterogeneous integration techniques for merging nodes in chip manufacturing.

Global Advanced Packaging Technologies Market Overview

The market for advanced packaging technologies is witnessing tremendous growth owing to its efficiency over the conventional packaging method, less power consumption, and satisfactory requirement as per the size of electronic devices. With more advanced packaging chip technologies such as 2.5D and 3D glass and silicon interposers, chip packaging technology that fulfills industry standards for size, power, yield, and cost continues to evolve. For both front-end foundries and back-end packaging vendors, these novel and unique procedures to link and integrate chips into final assemblies create new challenges in deposition, etch, lithography, inspection, singulation, and clean.

The growing need for advanced wafer packaging techniques for fast expanding IoT and next-generation mobile chipsets is driving the Advanced Packaging Technologies Market. Furthermore, advancement in technologies and increasing investments in R&D activities are expected to drive the growth of the market. The rising use of artificial intelligence in industrial automation will boost demand for high-end chips made with advanced packaging. Lithography fabrication technologies have gained popularity in the Advanced Packaging Technologies Market.

Additionally, among packaging service providers, heterogeneous integration solutions are growing rapidly. The Advanced Packaging Technologies Market is being boosted by a rapidly increasing logic chip industry in developing regions. Wafer manufacturing service providers have worked diligently over the last several years to increase their product offerings and meet the demands of internationally recognized semiconductor manufacturers. However, an increase in the problem of device heating and a lack of standardization are among the primary factors restraining market growth and will continue to provide a hindrance to the expansion of the Advanced Packaging Technologies Market.

Furthermore, demand for high-performance devices has increased in developing nations, additionally, in the forecast period of 2021-2028, the rise in developing trends of fan-out wafer-level packaging, as well as the expansion in the packaged food sector in emerging economies, would provide new opportunities for the Advanced Packaging Technologies Market. This will make it much easier for advanced packaging solution providers to deliver innovative fan-out packaging technologies. Semiconductor lines are also being expanded by major players in the Advanced Packaging Technologies Markett.

Global Advanced Packaging Technologies Market Segmentation Analysis

The Global Advanced Packaging Technologies Market is Segmented on the basis of Type, Industrial Vertical, And Geography.

Advanced Packaging Technologies Market, By Type

3D Integrated Circuit
2D Integrated Circuit
2.5D Integrated Circuit
Others

Based on Type, The market is classified into 3D Integrated Circuit, 2D Integrated Circuit, 2.5D Integrated Circuit, and Others. Three-Dimensional Integrated Circuit (3DIC) is a packaging technique that collects and layers homogeneous or heterogeneous dies vertically into Multi-Chip-Module (MCM) with Through-Silicon-Via (TSV). It's a mono- or multi-functional integration platform. Two, four, or eight memories might be combined in a single package. CPU, GPU, DRAM, and main-broad may all be into one chip package in the future. 3DIC is a high-bandwidth, small-form-factor, multi-function integration solution.

Advanced Packaging Technologies Market, By Industrial Vertical

Automotive & Transport
Consumer Electronics
Industrial
IT & Telecommunication
Others

Based on Industrial Vertical, The market is classified into Automotive & Transport, Consumer Electronics, Industrial, IT & Telecommunication, and Others. FOWLP (fan-out wafer-level packaging) has emerged as a promising technology for meeting the ever-increasing needs of consumer electronics. Specific features such as substrate-less packaging, lower thermal resistance, and higher performance due to shorter interconnect combined with direct IC connection through the use of thin-film metallization instead of standard wire bonds or flip-chip bumps, as well as more moderate parasitic effects, are significant advantages of this type of packaging.

Advanced Packaging Technologies Market, By Geography

North America
Europe
Asia Pacific
Rest of the world
On the basis of Geography, The Global Advanced Packaging Technologies Market is classified into North America, Europe, Asia Pacific, and the Rest of the world. In the Asia Pacific and North America, the global advanced packaging industry is producing significant revenue. A rapidly increasing semiconductor industry, particularly in the Asia Pacific, to meet a diverse range of customer demands for next-generation mobile devices. The IC industry has made tremendous progress in the region's key economies, raising income from the Asia Pacific Advanced Packaging Technologies Market.

Key Players

The "Global Advanced Packaging Technologies Market" study report will provide a valuable insight with an emphasis on global market including some of the major players such as Amkor Technology, STATS ChipPAC Pte. Ltd, ASE Group, Siliconware Precision Industries Co., Ltd., SSS MicroTec AG, Jiangsu Changjiang Electronics Technology Co. Ltd, Intel Corporation, IBM Corporation, Taiwan Semiconductor Manufacturing Company, Qualcomm Technologies, Inc.

Our market analysis also entails a section solely dedicated to such major players wherein our analysts provide an insight to the financial statements of all the major players, along with its product benchmarking and SWOT analysis. The competitive landscape section also includes key development strategies, market share and market ranking analysis of the above-mentioned players globally.

Key Developments

On July 2020, Amkor Technology outlined its efforts and achievements in creating and qualifying wire bond and flip-chip packaging for devices made using TSMC's advanced low-k process technology. Amkor has also worked with a number of clients to qualify low-k products and anticipates a volume ramp-up for low-k packages.

1 INTRODUCTION OF GLOBAL ADVANCED PACKAGING TECHNOLOGIES MARKET

1.1 Overview of the Market
1.2 Scope of Report
1.3 Assumptions

2 EXECUTIVE SUMMARY

3 RESEARCH METHODOLOGY OF VERIFIED MARKET RESEARCH

3.1 Data Mining
3.2 Validation
3.3 Primary Interviews
3.4 List of Data Sources

4 GLOBAL ADVANCED PACKAGING TECHNOLOGIES MARKET OUTLOOK

4.1 Overview
4.2 Market Dynamics
- 4.2.1 Drivers
- 4.2.2 Restraints
- 4.2.3 Opportunities
4.3 Porters Five Force Model
4.4 Value Chain Analysis

5 GLOBAL ADVANCED PACKAGING TECHNOLOGIES MARKET, BY TYPE

5.1 Overview
5.2 3D Integrated Circuit
5.3 2D Integrated Circuit
5.4 2.5D Integrated Circuit
5.5 Others

6 GLOBAL ADVANCED PACKAGING TECHNOLOGIES MARKET, BY INDUSTRIAL VERTICAL

6.1 Overview
6.2 Automotive & Transport
6.3 Consumer Electronics
6.4 Industrial
6.5 IT & Telecommunication
6.6 Others

7 GLOBAL ADVANCED PACKAGING TECHNOLOGIES MARKET, BY GEOGRAPHY

7.1 Overview
7.2 North America
- 7.2.1 U.S.
- 7.2.2 Canada
- 7.2.3 Mexico
7.3 Europe
- 7.3.1 Germany
- 7.3.2 U.K.
- 7.3.3 France
- 7.3.4 Rest of Europe
7.4 Asia Pacific
- 7.4.1 China
- 7.4.2 Japan
- 7.4.3 India
- 7.4.4 Rest of Asia Pacific
7.5 Rest of the World
- 7.5.1 Latin America
- 7.5.2 Middle East And Africa

8 GLOBAL ADVANCED PACKAGING TECHNOLOGIES MARKET COMPETITIVE LANDSCAPE

8.1 Overview
8.2 Company Market Ranking
8.3 Key Development Strategies

9 COMPANY PROFILES

9.1 Amkor Technology
- 9.1.1 Overview
- 9.1.2 Financial Performance
- 9.1.3 Product Outlook
- 9.1.4 Key Developments
9.2 STATS ChipPAC Pte. Ltd
- 9.2.1 Overview
- 9.2.2 Financial Performance
- 9.2.3 Product Outlook
- 9.2.4 Key Developments
9.3 Siliconware Precision Industries Co., Ltd.
- 9.3.1 Overview
- 9.3.2 Financial Performance
- 9.3.3 Product Outlook
- 9.3.4 Key Developments
9.4 SSS MicroTec AG
- 9.4.1 Overview
- 9.4.2 Financial Performance
- 9.4.3 Product Outlook
- 9.4.4 Key Developments
9.5 Jiangsu Changjiang Electronics Technology Co. Ltd
- 9.5.1 Overview
- 9.5.2 Financial Performance
- 9.5.3 Product Outlook
- 9.5.4 Key Developments
9.6 Intel Corporation
- 9.6.1 Overview
- 9.6.2 Financial Performance
- 9.6.3 Product Outlook
- 9.6.4 Key Developments
9.7 IBM Corporation
- 9.7.1 Overview
- 9.7.2 Financial Performance
- 9.7.3 Product Outlook
- 9.7.4 Key Developments
9.8 Qualcomm Technologies, Inc
- 9.8.1 Overview
- 9.8.2 Financial Performance
- 9.8.3 Product Outlook
- 9.8.4 Key Developments
9.9 Taiwan Semiconductor Manufacturing Company
- 9.9.1 Overview
- 9.9.2 Financial Performance
- 9.9.3 Product Outlook
- 9.9.4 Key Developments
9.10 ASE Group
- 9.10.1 Overview
- 9.10.2 Financial Performance
- 9.10.3 Product Outlook
- 9.10.4 Key Developments