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市場調查報告書

商品編碼

1549787

全球無線連接晶片組市場：市場佔有率分析、產業趨勢/統計、成長預測（2024-2029）

Wireless Connectivity Chipset - Market Share Analysis, Industry Trends & Statistics, Growth Forecasts (2024 - 2029)

出版日期: 2024年09月02日 | 出版商:

Mordor Intelligence | 英文 153 Pages | 商品交期: 2-3個工作天內

價格

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簡介目錄

全球無線連接晶片組市場規模預計到 2024 年為 85.2 億美元，2029 年達到 127.2 億美元，在預測期內（2024-2029 年）複合年成長率為 8.36%。

主要亮點

隨著高速網路的普及，連網型設備和智慧家庭應用的採用不斷增加，特別是在歐洲、北美和亞太地區等地區。主要解決方案包括語音助理、智慧恆溫器、智慧照明、安全攝影機和智慧家電。
此外，聯發科技於 2024 年 5 月宣布推出兩款新晶片組，可提供強大的效能並支援跨多個產業的最新 AI 增強功能。其中包括用於高階 Chromebook 的 Kompanio 838 SoC 和用於 4K 高階智慧型電視和顯示器的 Pentonic 800 SoC。該公司公佈了人工智慧、汽車、物聯網、電視、Chromebook 和無線連接等產品類型的重大進展。
例如，中國成立了IMT-2030（6G）推進組，以加速6G技術的研發。預計6G商用將於2030年前後在全球開始。中國率先支持5G商用，為6G發展提供了堅實基礎。
增加多個設備（如在物聯網中）會增加網路的表面積，並在此過程中增加潛在的攻擊向量。即使連接到網路的單一不安全設備也可能成為對網路進行主動攻擊的閘道器。
根據經濟合作暨發展組織(OECD) 的一項研究，到 2025 年，擁有電腦的家庭數量預計將增加到 12.6247 億。擁有至少一台電腦的家庭稱為電腦戶。電腦普及率的顯著提高為市場公司擴大其 Wi-Fi 晶片組產品系列、擴大其在各個地區的業務並增加市場佔有率創造了機會。
市場上的各個公司正在開發新產品以保持競爭力，這可能會進一步推動市場成長。例如，Wi-Fi 7技術的早期先驅聯發科於2023年11月發布了最新產品Filogic 860和Filogic 360，鞏固了其市場領導的地位。這些新增功能顯著擴展了聯發科的尖端產品線，重點關注最新的連接技術，以實現卓越的性能和堅定的可靠性。
Filogic 860 晶片組配備雙頻網路基地台和先進的網路處理器，專為企業網路基地台、服務供應商閘道器、網狀節點以及各種零售和物聯網路由器應用而客製化。另一方面，Filogic 360 在單一晶片中提供 Wi-Fi 7 2x2 功能和雙藍牙 5.4 無線電。該設計專門為邊緣設備、串流媒體設備和各種消費性電子產品帶來下一代 Wi-Fi 7 連接。
開發和製造先進 Wi-Fi 晶片組的高成本給市場帶來了重大挑戰。製造這些晶片組所需的先進且昂貴的技術增加了最終產品的成本，並可能阻礙採用，特別是在對價格敏感的消費者中。
新冠肺炎 (COVID-19) 疫情後，人們開始更加重視採用協作工具，同時選擇數位模式進行相關會議和討論。此外，5G 的新使用案例，例如支持學校教育和增加在家工作的需要，預計將推動 5G 投資。此外，許多職場正在採用混合工作模式，部署 5G 連線可以增強連接性。儘管供應鏈短缺導致供應中斷，但此類案例仍積極推動市場發展。

無線連接晶片組市場趨勢

Wi-Fi獨立機佔最大市場佔有率

Wi-Fi 網路技術的進步使用戶能夠體驗更快、更低延遲的通訊。這促進了資料密集型服務和應用程式的使用。 Wi-Fi 網路承載的資料量顯著增加主要是由客戶對視訊和業務的需求以及消費者向雲端服務的遷移所推動的。這項因素預計將增加對高速、高容量網路的無線 5G 連線的需求。
現代世界的網路普及率正在不斷提高。根據通訊的數據，截至 2023 年，全球網路使用者數量預計將達到 54 億，高於前一年的 51 億。這一比例相當於世界人口的 67%。
根據 Snapchat 的報告，到 2025 年，全球約 75% 的人口和幾乎所有智慧型手機用戶都將頻繁使用 AR 技術，預計將有超過 15 億人是千禧世代。根據GSMA中國行動經濟預測，到2025年，中國將擁有約3.4億智慧型手機連接，滲透率達到十分之九，其中中國當地15億，香港1230萬，預計銷量將達到190萬台。有2570萬台。
2024年2月，韓國公司Stage該公司計劃投資 4.62 億美元（6,128 億韓元）建設 6,000 個基地台，並在韓國各地部署 28GHz 5G 網路。
根據愛立信的行動報告，到 2026 年，北美智慧型手機的平均每月行動資料使用量預計將達到 49GB。精通智慧型手機的消費者、豐富的視訊應用程式和大容量資料方案正在推動流量成長。雖然每部智慧型手機的流量可能在短期內穩定成長，但從長遠來看，採用 AR 和 VR 的身臨其境型消費者 5G 連結預計將推動更高的成長率。
憑藉低延遲，它可以提供快速、無故障、無延遲的虛擬實境和擴增實境影像。行動連線由小型基地台基礎設施提供支持，可增強 5G 無線訊號密度並改善穿過混凝土建築物和牆壁的移動。小型基地台天線還增強了無線連接並支援同一網路上同時連接更多設備。預計這些發展將推動市場。

亞太地區預計將成為成長最快的市場

5G在亞太地區的到來加速了用於高速網路連接的無線連接晶片組的部署。日本政府已批准在全國 208,000 個交通號誌上安裝 5G基地台。地方政府和通訊業者分擔使用紅綠燈進行5G部署的成本。這將導致在更短的時間內部署更多解決方案，並更快地覆蓋整個國家的 5G 連線。
Biju等多家印度跨國教育科技公司向學生提供平板電腦作為其教育課程的一部分，並透過數位方法和傳統教學方法教育學生。市場上公司的這些努力將進一步推動平板電腦、智慧型手機和其他消費性電子產品的需求，並預計將在預測期內推動該地區平板電腦市場的無線連接晶片組的發展。
亞太地區對網路服務的需求不斷成長預計也將推動無線連接晶片組在該地區的採用。印度總理表示，5G網路服務在印度的推出預計將為印度帶來新的經濟可能性和社會效益。
此外，中國在5G發展方面處於全球領先地位。全國已建成5G基地台超過254萬個，擁有5G智慧型手機的人數超過5.75億。中國也計劃到2025年投資1.2兆元人民幣（1742億美元）用於5G網路建設。對穩定 5G 網路不斷成長的需求正在加速小型基地台解決方案在該國的部署。
隨著5G智慧型手機變得越來越容易取得且負擔得起，以及智慧型手機在大都會圈和農村地區的普及率迅速提高，5G用戶數量預計將迅速增加，到2023年終，同一地區的5G用戶數量將增加預計數量將達到5000萬左右。
2023年2月，新加坡網路營運商M1和StarHub結盟，名為Antina。兩家公司已延長與諾基亞的協議，以改善全國室內和室外 5G 覆蓋範圍。諾基亞已經安裝了名為 ASiR（空中尺度室內無線電）和 MIMO（多重輸入、多重輸出）的小型基地台解決頻寬，以自適應天線覆蓋新建築。

無線連接晶片組產業概覽

無線連接晶片組市場較為分散，參與者眾多，包括博通公司、高通公司、聯發科公司、英特爾公司和德州儀器公司。此外，公司還透過推出新產品、擴展業務以及進行策略性合併、聯盟和收購來擴大市場佔有率。

2023 年 6 月：Broadcom 發布第二代 Wi-Fi 7 晶片組。 BCM6765住宅Wi-Fi 7網路基地台晶片、BCM47722 企業 Wi-Fi 7網路基地台晶片，具有雙 IoT 無線電，支援藍牙低功耗 (BLE)、Zigbee、Thread 和 Matter通訊協定操作，適用於行動裝置設計的BCM4390 低功耗Wi-Fi 7 ，藍牙，802.15.4複合晶片。 BCM47722 企業 Wi-Fi 7網路基地台SoC 規格支援無線連線。
2023 年 4 月：德克薩斯) 宣布推出其 SimpleLink 系列 Wi-Fi 6伴同性積體電路 (IC) 的最新產品。這些 IC 旨在幫助設計人員實現穩健、安全和高效的 Wi-Fi 連接，特別適合在高密度或高達 105 度C 的高溫環境中的應用。 TI CC33xx 系列中的首款產品在一個 IC 中同時支援 Wi-Fi 6 和藍牙低功耗 5.3。

其他好處：

Excel 格式的市場預測 (ME) 表
3 個月分析師支持

公司簡介
- Broadcom Inc.
- Qualcomm Incorporated
- Mediatek Inc.
- Intel Corporation
- Texas Instruments Incorporated
- STMicroelectronics NV
- NXP Semiconductors NV
- On Semiconductor Corporation
- Infineon Technologies AG
- Microchip Technology Inc.
- Qorvo Inc.
- Skyworks Solutions Inc.
- Hisilicon Technologies Co. Ltd
- Tsinghua Unigroup Co. Ltd（unisoc（Shanghai）Technologies Co. Ltd）

第8章供應商市場佔有率分析

第9章投資分析

第10章市場的未來

簡介目錄

Product Code: 92355

The Wireless Connectivity Chipset Market size is estimated at USD 8.52 billion in 2024, and is expected to reach USD 12.72 billion by 2029, growing at a CAGR of 8.36% during the forecast period (2024-2029).

Key Highlights

With the growing penetration of high-speed internet, the adoption of connected devices and smart home applications is increasing, especially in regions such as Europe, North America, and Asia-Pacific. Some major solutions include voice assistants, smart thermostats, smart lighting, security cameras, and smart appliances.
Further, in May 2024, MediaTek announced the debut of two new chipsets with powerful performance and support for the latest AI enhancements across multiple verticals. These included the Kompanio 838 SoC for premium Chromebooks and the Pentonic 800 SoC for 4K premium smart TVs and displays. The company highlighted major developments in product categories such as AI, automotive, IoT, TVs, Chromebooks, and wireless connectivity.
For instance, the IMT-2030 (6G) Promotion Group was formed in China to speed up the R&D of 6G technology. Around 2030, the world is anticipated to witness the commercialization of 6G. China is leading the charge in supporting the commercialization of 5G, which will provide a solid basis for developing 6G.
Adding several devices, such as in IoT, increases the surface area of a network, creating more potential attack vectors in the process. Even a single unsecured device connected to a network may serve as a point of entry for an active attack on the network.
According to the Organisation for Economic Co-operation and Development survey, by 2025, the number of households with computers is anticipated to increase to 1,262.47 million. Homes with at least one computer are referred to as computer households. Such a massive boost in computer adoption will create an opportunity for the market players to expand their Wi-Fi chipset product portfolio, expand their presence in different regions, and advance their market share.
Various players in the market are developing new products to stay competitive, which may further propel market growth. For instance, in November 2023, MediaTek, an early pioneer in Wi-Fi 7 technology, solidified its position as a market leader with the launch of its latest offerings, the Filogic 860 and Filogic 360. These additions significantly expanded MediaTek's cutting-edge product line, emphasizing the latest connectivity technologies for superior performance and unwavering reliability.
The Filogic 860 chipsets, featuring a dual-band access point and an advanced network processor, are tailored for enterprise access points, service provider gateways, mesh nodes, and various retail and IoT router applications. On the other hand, the Filogic 360 facilitates Wi-Fi 7 2x2 capabilities and dual Bluetooth 5.4 radios in a single chip. This design is specifically crafted to bring next-gen Wi-Fi 7 connectivity to edge and streaming devices, as well as a wide range of consumer electronics.
High costs associated with developing and producing advanced Wi-Fi chipsets pose a significant challenge in the market. The sophisticated and expensive technology needed for manufacturing these chipsets inflates the final product's cost, potentially hindering adoption, especially among price-sensitive consumers.
Post-COVID-19, there was a shift to opting for digital modes for relevant meetings and discussions while focusing more on adopting collaborative tools. Furthermore, emerging use cases for 5G, including the need to support increasing numbers of individuals schooling and working from home, are expected to drive 5G investment. In addition, many workplaces have adopted a hybrid model of working, for which 5G connections can be deployed for better connectivity. Such cases have positively driven the market despite the disruptions caused due to shortages in the supply chain.

Wireless Connectivity Chipset Market Trends

Wi-Fi Standalone Holds the Maximum Share of the Market

The evolution of Wi-Fi network technology allows users to experience faster speeds and lower latency. It boosted the use of data-heavy services and applications. The significant rise in the volume of data carried by Wi-Fi networks has been primarily driven by customer demand for video and business and consumer moves to cloud services. This factor is expected to drive the need for a wireless 5G connection with fast and high-capacity networks.
Internet penetration has scaled up in the modern world. According to the International Telecommunication Union, as of 2023, the estimated number of internet users worldwide was 5.4 billion, up from 5.1 billion in the previous year. This share represented 67% of the global population.
According to a report from Snapchat, by 2025, around 75% of the global population and almost all smartphone users will be frequent AR technology users, out of which more than 1.5 billion are anticipated to be millennials. According to GSMA's Mobile Economy China, China will add around 340 million smartphone connections by 2025, with adoption rising to 9 in 10 connections, 1.5 billion in Mainland China, 12.3 million in Hong Kong, 1.9 million in Macao, and 25.7 million in Taiwan.
In February 2024, Stage X, a South Korean company, announced that it was awarded a spectrum that will enable it to be the nation's fourth mobile carrier and planned to launch nationwide mobile network services in the first half of 2025. The company invested USD 462 million (KRW 612.8 billion) to deploy its 28 GHz 5G network across South Korea with a plan to build 6,000 base stations; it also involved the mandated installation standard for the 28 GHz frequency network.
According to Ericsson's Mobility Report, the monthly average usage of mobile data in North America is expected to reach 49 GB per month for smartphones in 2026. A smartphone-savvy consumer base, video-rich applications, and large data plans will drive traffic growth. While there may be robust growth in traffic per smartphone in the near term, the adoption of immersive consumer 5G connections utilizing AR and VR is expected to lead to an even better growth rate in the long term.
Lower latency is also poised to enable high-speed virtual and augmented reality video without glitches or delays. Mobile connectivity can be strengthened with small cell infrastructure, densifying 5G wireless signals and improving their movement through concrete buildings and walls. Small-cell antennas will also enhance wireless connection, supporting more devices on the same network simultaneously. Such developments are expected to drive the market.

Asia-Pacific is Expected to be the Fastest-growing Market

The advent of 5G in the Asia-Pacific region accelerated wireless connectivity chipset deployment for high-speed network connectivity. Japan's government granted permission to install 5G base stations on 208,000 traffic lights across the country. Local administrations and operators shared the costs of using the traffic lights for 5G deployments. This will help with more solution deployment in less time, thereby circulating 5G connectivity faster throughout the country.
Various Indian multinational educational technology companies, such as Byju's, provide their students with a tablet as a part of their educational curriculum to educate the students via digital methods along with the traditional methods of teaching. Such initiatives by the companies in the market are expected to promote further the demand for tablets, smartphones, and other consumer electronics in the market, thereby driving the market for wireless connectivity chipsets for tablets in the region during the forecast period.
The increasing demand for internet services in the Asia-Pacific region is also expected to promote the adoption of wireless connectivity chipsets in the region. As per the prime minister of India, the launch of 5G internet services in India is expected to bring new economic possibilities and societal benefits to the nation.
In addition, China is leading 5G development on a worldwide scale. More than 2.54 million 5G base stations have been built nationwide, and more than 575 million people now own 5G smartphones. The country further plans to invest CNY 1.2 trillion (USD 174.2 billion) in 5G network construction by 2025. This growing demand for a 5G stable network is accelerating the deployment of small-cell solutions in the country.
Due to the increasing availability and affordability of 5G smartphones and the rapid adoption of smartphones in metropolitan and rural areas, 5G subscriptions are expected to rapidly increase to reach approximately 50 million in the region by the end of 2023.
In February 2023, Network operators M1 and StarHub in Singapore formed an alliance named Antina. They extended their contract with Nokia to improve indoor and outdoor 5G coverage nationwide. To provide a better 5G user experience with high bandwidth, breakneck speeds, and minimal latency, Nokia will install its small cell solution called airscale indoor radio (ASiR), covering new buildings with multiple input, multiple outputs (MIMO) adaptive antennas.

Wireless Connectivity Chipset Industry Overview

The wireless connectivity chipset market is fragmented, with many players like Broadcom Inc., Qualcomm Incorporated, Mediatek Inc., Intel Corporation, and Texas Instruments Incorporated. The companies are also increasing their market presence by introducing new products, expanding their operations, and entering strategic mergers, partnerships, and acquisitions.

June 2023: Broadcom unveiled its second-generation Wi-Fi 7 chipsets: the BCM6765 residential Wi-Fi 7 access point chip, the BCM47722 enterprise Wi-Fi 7 access point chip with dual IoT radios that support operation for Bluetooth Low Energy (BLE), Zigbee, Thread, and Matter protocols, and the BCM4390 low-power Wi-Fi 7, Bluetooth, and 802.15.4 combo chip designed for use in mobile devices. BCM47722 enterprise Wi-Fi 7 access point SoC specifications allow wireless connectivity.
April 2023: Texas Instruments unveiled its latest SimpleLink family, a line of Wi-Fi 6 companion integrated circuits (ICs). These ICs are designed to empower designers to create robust, secure, and efficient Wi-Fi connections, particularly for applications in high-density or high-temperature settings, reaching up to 105 °C. The initial offerings from TI's CC33xx family cater to both Wi-Fi 6 and Bluetooth Low Energy 5.3, all within a single IC.

Additional Benefits:

The market estimate (ME) sheet in Excel format
3 months of analyst support

1 INTRODUCTION

1.1 Study Assumptions and Market Definition
1.2 Scope of the Study

2 RESEARCH METHODOLOGY

3 EXECUTIVE SUMMARY

4 MARKET INSIGHTS

4.1 Market Overview
4.2 Industry Attractiveness - Porter's Five Forces Analysis
- 4.2.1 Bargaining Power of Suppliers
- 4.2.2 Bargaining Power of Buyers
- 4.2.3 Threat of New Entrants
- 4.2.4 Threat of Substitutes
- 4.2.5 Degree of Competition
4.3 Assessment of the Impact of Macroeconomic Trends on the Market

5 MARKET DYNAMICS

5.1 Market Drivers
- 5.1.1 Increased Demand for Connected Homes Through Home Automation
- 5.1.2 Increasing Internet Penetration into Homes and Enterprises
5.2 Market Challenges
- 5.2.1 Issues Related to Security and Privacy of Data and Connectivity of Devices and Interoperability
- 5.2.2 Slow Demand for Some Mobile Handset Types

6 MARKET SEGMENTATION

6.1 By Type
- 6.1.1 Wi-Fi Standalone
- 6.1.2 Bluetooth Standalone
- 6.1.3 Wifi and Bluetooth Combo
- 6.1.4 Low-power Wireless IC
6.2 By End-user Application
- 6.2.1 Consumer
- 6.2.2 Enterprise
- 6.2.3 Mobile Handsets
- 6.2.4 Automotive
- 6.2.5 Industrial
- 6.2.6 Other End-user Applications
6.3 By Geography
- 6.3.1 North America
- 6.3.2 Europe
- 6.3.3 Asia
- 6.3.4 Australia and New Zealand
- 6.3.5 Latin America
- 6.3.6 Middle East and Africa

7 COMPETITIVE LANDSCAPE

7.1 Company Profiles
- 7.1.1 Broadcom Inc.
- 7.1.2 Qualcomm Incorporated
- 7.1.3 Mediatek Inc.
- 7.1.4 Intel Corporation
- 7.1.5 Texas Instruments Incorporated
- 7.1.6 STMicroelectronics NV
- 7.1.7 NXP Semiconductors NV
- 7.1.8 On Semiconductor Corporation
- 7.1.9 Infineon Technologies AG
- 7.1.10 Microchip Technology Inc.
- 7.1.11 Qorvo Inc.
- 7.1.12 Skyworks Solutions Inc.
- 7.1.13 Hisilicon Technologies Co. Ltd
- 7.1.14 Tsinghua Unigroup Co. Ltd (unisoc (Shanghai) Technologies Co. Ltd