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市場調查報告書
商品編碼
1642009

原子層沉積設備-市場佔有率分析、產業趨勢與統計、成長預測（2025-2030 年）

Atomic Layer Deposition Equipment - Market Share Analysis, Industry Trends & Statistics, Growth Forecasts (2025 - 2030)
出版日期: | 出版商: Mordor Intelligence | 英文 120 Pages | 商品交期: 2-3個工作天內

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簡介目錄

原子層沉積設備市場規模預計在 2025 年為 107.3 億美元，預計到 2030 年將達到 235.5 億美元，預測期內（2025-2030 年）的複合年成長率為 17.02%。

原子層沉積設備-市場-IMG1

推動全球原子層沉積市場擴張的主要因素之一是全球電子和半導體解決方案的採用日益增加。

關鍵亮點

  • 採用新材料和設計來提高晶片產量正在推動對原子層沉積解決方案的需求。小型化趨勢正受到世界各地工業的青睞。因此，對小型電子設備和機器的需求日益成長。
  • 據思科稱，到 2030 年，約有 5,000 億台設備將連接到網際網路。每台機器都包含收集資料、與環境互動並透過網路通訊的感測器。這些應用需要小型化的儲存設備和積體電路。越來越多的連網設備產生的資料量也不斷增加，增加了對儲存設備的需求，從而推動了市場成長。
  • 在半導體產業中，CMOS 處理器、儲存設備、MEMS 和感測器中使用的高介電常數薄膜經常使用 ALD 技術生產。 ALD 技術用於在燃料電池和其他需要耐腐蝕和耐磨的應用中創建功能性和保護性塗層。在下一代設備的開發中，它們也被用於塗覆高長寬比結構，例如奈米線和奈米管。
  • 隨著眾多創新和節能技術的發展，對輕便便攜設備的需求正在迅速成長。原子層沉積技術在矽晶片的製造上有著廣泛的應用。原子層沉積市場的成長預計將受到電子設備需求不斷成長的推動。
  • 此外，機器人和製造自動化的不斷增加的使用預計將增加半導體銷售並推動 ALD 技術市場的發展。工業自動化目前正在改變幾乎所有重要製造業的性質。工業 4.0 標準的採用以及協作機器人、AR/VR 和 AI 在資料分析方面的日益使用預計將使 ALD 市場受益。
  • 此外，ALD 薄膜層可用於微電子領域，對奈米級電晶體的相鄰組件進行電屏蔽。 ALD 特別擅長將精確的奈米級塗層應用於複雜的3D表面。例如，它們類似於製造現代電腦處理器所使用的矽晶片上蝕刻的深而窄的凹槽。因此，世界各地的研究人員都渴望為未來幾代半導體裝置創造新的薄膜 ALD 材料。
  • 預計預測期內，研發所需的高額投資將抑制全球原子層沉積市場的成長。由於該方法耗時，ALD 被認為是一個主要的限制因素。

原子層沉積設備的市場趨勢

半導體和電子產業推動市場成長

  • 預計半導體和電子產業的需求將成為原子層沉積技術的主要驅動力。預計半導體產業將對該技術的發展產生直接影響，而電子產業的擴張將促進該技術的發展。因此，對原子層沉積設備的需求正在上升
  • 由於晶片短缺，製造商宣布擴大全球晶圓廠產能，原子層沉積 (ALD)參與企業正準備利用新的成長機會。最近，300 毫米 ALD 平台得到了改進，以滿足超莫耳 (MtM) 設備、MEMS、感測器、電源和射頻設備以及光電應用的要求。在此之前，200mm ALD 平台是為了滿足市場需求而設計的。隨著晶圓產量不斷上升，ALD 解決方案預計將擴大並加入 MtM 設備市場。
  • ALD 因沉積高介電常數氧化物材料而成為半導體產業的焦點。例如，我們以 ALD 形成的 HfO2 取代熱生長的 SiO2 作為傳統金屬氧化物半導體場效電晶體中的閘極絕緣材料。近年來，需要使用 ALD 的應用數量顯著增加。
  • 電子行業存在週期性的起伏。電子業的短期至中期前景光明。愛立信的行動報告預測，到2024年，行動用戶數將達到約89億，行動寬頻用戶數將達到84億，獨立行動用戶數將達到62億。這有望加速 ALD 技術的發展。
  • 預計預測期內家用電子電器和微電子產品銷售的成長將推動半導體積體電路的需求。半導體積體電路需求的增加可能會提高半導體裝置製造商的製造能力，從而增加對原子層沉積設備的需求。
  • 下一代半導體裝置的製造需要在低溫（400°C）下在高長寬比比奈米結構上沉積高度保形（>95％）的SiO2、SiNx 和 SiC 薄膜。原子層沉積正日益取代半導體製造中的化學沉積方法，從而促進此類 Si 基電介質薄膜的開發。 ALD 沉積的 SiO2 薄膜已被用於半導體裝置的製造。
  • 射頻和電力電子的擴展進一步推動了 ALD 技術的進步。惡劣的環境條件會損壞和腐蝕活性零件，導致過早失效。這些環境條件包括高​​溫、氧氣、紫外線、鹽和濕氣。原子層沉積 (ALD) 顯著提高了這些組件的性能和可靠性。

亞太地區可望實現最高成長

  • 亞太地區仍然是電子產業擴張的最重要地區。亞太地區是電子產業OEM的中心。此外，越南等新興經濟體正在大力投資該產業，從而導致不同地區的國家之間形成了良性競爭。此外，台灣和中國等成熟地區繼續大力投資研發，使其在推動市場成長的技術創新方面保持領先一步。
  • 原子層沉積通常用於太陽能電池和設備中的三防膠。在這方面，預計整個預測期內太陽能電池設備需求的不斷成長以及各個地區太陽能電池行業的興起將推動目標市場的發展。此外，亞太地區各國政府不斷進行各種投資以擴大太陽能產業，這推動了對 ADL 解決方案的需求。
  • 汽車是另一個在製造過程中使用 ALD 裝置和系統的重要領域。汽車行業是薄膜的另一個主要用戶，因為它們幾乎應用於該行業的每個方面。例如，薄膜可以減小各種組件的尺寸並延長其使用壽命。在汽車領域，薄膜塗層可用於節省成本和保護環境。這是透過減輕常用結構元件的重量、提高其使用壽命以及提高奈米材料的製造品質來實現的。
  • 亞洲是一些全球最大汽車製造商的所在地，包括本田、豐田、三菱、日產、現代、塔塔汽車和瑪魯蒂，而中國、印度、日本和韓國等國家則是亞洲汽車產業的強國。除了這些OEM之外，許多零件製造商和汽車配件製造商也使用 ALD 設備和機械來滿足其製造需求。
  • 半導體裝置製造的一個重要方法是原子層沉積，這是一種依賴氣相化學過程的薄膜沉積過程。該地區的參與企業正在大力投資研發項目，以提高產出效率並引領全球最快的市場擴張。

原子層沉積設備產業概況

原子層沉積設備市場呈現細分化，有多家參與企業在市場上運作。市場參與企業正在採取合併、收購和夥伴關係等策略來獲得市場佔有率。

  • 2023 年 11 月 - 牛津儀器等離子技術贏得多家市場領先的日本代工廠的大量訂單，用於製造 GaN HEMT 裝置的等離子增強原子層沉積 (ALD) 和原子層蝕刻 (ALE)。該系統將支援高成長的GaN電力電子和高頻市場，其中消費快速充電和資料中心應用處於電力電子市場的最前沿，5G/6G通訊應用處於高頻市場。
  • 2023 年 9 月 - Sky Water Technology 宣布將為客戶提供用於原子層沉積 (ALD) 的新型半導體製程工具 Applied Picosun MorpherTM。許多設備（例如感測器和新儲存技術）都需要能夠在矽晶片上均勻沉積的薄層。

其他福利

  • Excel 格式的市場預測 (ME) 表
  • 3 個月的分析師支持

目錄

第 1 章 簡介

  • 研究假設和市場定義
  • 研究範圍

第2章調查方法

第3章執行摘要

第4章 市場洞察

  • 市場概況
  • 產業吸引力-波特五力模型
    • 供應商的議價能力
    • 消費者議價能力
    • 新進入者的威脅
    • 替代品的威脅
    • 競爭對手之間的競爭
  • 產業價值鏈分析
  • 技術簡介：與其他沉積技術的比較、ALD 從記憶體到邏輯 MPU 應用的演變、ALD 技術類型的定性分析
  • COVID-19 工業影響評估

第5章 市場動態

  • 市場促進因素
    • 微電子和消費性電子產品的需求不斷成長
    • 運算和儲存技術的進步
  • 市場問題
    • 高效的沉積試劑和材料，但會增加成本

第6章 市場細分

  • 按應用
    • 半導體和電子（包括計算領域、資料中心和消費性電子）
    • 醫療和生物醫學應用
    • 車
    • 其他
  • 按地區
    • 美洲
    • 歐洲、中東和非洲
    • 亞洲
    • 澳洲和紐西蘭

第7章 競爭格局

  • 公司簡介
    • Applied Materials Inc.
    • Lam Research Corporation
    • Entegris Inc.
    • Veeco Instruments Inc.
    • Oxford Instruments PLC
    • Beneq Oy
    • Picosun Oy
    • ASM International
    • Tokyo Electron Limited
    • Kurt J. Lesker Company

第8章投資分析

第9章 市場機會與未來趨勢

簡介目錄
Product Code: 65283

The Atomic Layer Deposition Equipment Market size is estimated at USD 10.73 billion in 2025, and is expected to reach USD 23.55 billion by 2030, at a CAGR of 17.02% during the forecast period (2025-2030).

Atomic Layer Deposition Equipment - Market - IMG1

One of the key factors propelling the expansion of the worldwide atomic layer deposition market is the increasing adoption of electronics and semiconductor solutions across the globe.

Key Highlights

  • Using novel materials and designs for improved chip production drives demand for atomic layer deposition solutions. The trend toward miniaturization is being embraced by industries all around the world. As a result, there is currently a higher need for tiny electronics and machinery.
  • According to Cisco, around 500 billion devices will be connected to the Internet by 2030. Each machine includes sensors that collect data, interact with the environment, and communicate over a network. These applications need miniaturized storage devices and ICs. The increasing amount of data generated from the growing number of connected devices has increased the demand for storage devices, thereby driving market growth.
  • High-k dielectric films used in CMOS processors, memory devices, MEMS, and sensors are frequently produced using ALD in the semiconductor industry. For the creation of functional and protective coatings in fuel cells and other applications needing corrosion or wear resistance, ALD technologies are used. For the development of next-generation devices, they are also utilized to coat high aspect ratio structures like nanowires and nanotubes.
  • Due to the development of a large number of innovation and energy efficient technologies, demand for lightweight portable devices has increased rapidly. For the production of silicon chips, atomic layer deposition technology is widely used. In the end, the growth of the atomic layer deposition market is expected to be driven by increasing demand for electronic devices.
  • Additionally, it is anticipated that greater robot use and manufacturing automation will promote the market for ALD technology by increasing semiconductor sales. Industrial automation is currently transforming the nature of practically all significant production industries. The adoption of Industry 4.0 standards and the increasing use of collaborative robotics, AR/VR, and AI for data analysis are anticipated to benefit the ALD market.
  • Moreover, the ALD thin layer may be utilized in microelectronics to shield neighboring components in nanoscale transistors electrically. ALD is particularly adept at creating accurate, nanoscale coatings on intricate, 3D surfaces; such as the deep, narrow trenches etched into silicon wafers used to make modern computer processors. This has inspired researchers worldwide to create novel thin film ALD materials for upcoming semiconductor device generations.
  • Over the projected period, a high investment required for research and development is anticipated to restrain the growth of the worldwide atomic layer deposition market. ALD is recognized to have significant limitations due to its slow approach.

Atomic Layer Deposition Equipment Market Trends

Semiconductors and Electronics Industry to Drive the Market Growth

  • The demand from the semiconductor and electronics industries is anticipated to be the primary driver of atomic layer deposition technology. While the semiconductor industry is expected to impact the technology's development directly, any electronics industry expansion will contribute to its advancement. Consequently, atomic layer deposition equipment is growing in demand.
  • After the global fab capacity expansions that manufacturers announced as a result of the chip shortfall, Atomic Layer Deposition (ALD) players are prepared to take advantage of a new growth opportunity. Recently, 300mm ALD platforms have improved to satisfy the requirement of More-than-Moore (MtM) devices and applications for MEMS, sensors, power and RF devices, and photonics. Previously, 200mm ALD platforms were designed to fulfill the market's needs. Now that wafer production has increased in volume, it is anticipated that ALD solutions will expand and join the MtM devices market.
  • ALD rose to prominence in the semiconductor industry due to its use for depositing high-permittivity oxide materials. For example, thermally grown SiO2 was swapped out for HfO2 formed by ALD as the gate dielectric material in conventional metal oxide semiconductor field effect transistors. The number of applications requiring the usage of ALD has significantly increased in recent years.
  • The electronics sector has ups and downs in cycles. The short- to medium-term outlook for the electronic industry is positive. By 2024, there will be around 8.9 billion mobile subscriptions, 8.4 billion mobile broadband subscriptions, and 6.2 billion unique mobile users, predicts the Ericsson Mobility Report. This is anticipated to accelerate the development of ALD technology.
  • During the projection period, growth in the sales of consumer electronics and microelectronics is anticipated to drive up demand for semiconductor ICs. The increased demand for semiconductor ICs will raise the manufacturing capabilities of semiconductor device producers, which might increase demand for the atomic layer deposition equipment market.
  • Next-generation semiconductor device production necessitates the deposition of highly conformal (great than 95%) SiO2, SiNx, and SiC films on high aspect-ratio nanostructures at low temperatures (400 °C). Atomic layer deposition is replacing chemical vapor deposition in semiconductor manufacturing, allowing for the development of these Si-based dielectric films. ALD-deposited SiO2 films are already utilized in the production of semiconductor devices.
  • The expansion of RF and power electronics further aids the advancement of ALD technology. Extreme environmental conditions can damage and corrode active components, leading to early failure. These conditions include high temperatures, oxygen, ultraviolet radiation, salinity, and moisture. The performance and dependability of these components can be significantly increased for the same reason, thanks to atomic layer deposition (ALD).

Asia Pacific Expected to Witness the Highest Growth Rate

  • The Asia Pacific continues to be the most critical region for the proliferation of the electronics industry. The Asia Pacific has become a hub of OEMs in the electronics industry. Moreover, emerging economies like Vietnam have invested heavily in this industry, leading to healthy competition among various regional countries. Moreover, established hubs like Taiwan and China continue to invest heavily in R&D, enabling them to stay ahead of the curve in innovations that drive market growth.
  • Atomic layer deposition is commonly utilized in solar cells and devices for conformal coatings. In light of this, the target market is anticipated to develop throughout the projected period due to the increase in demand for solar devices and the rise in the solar industry across various regional countries. Additionally, governments in the APAC region are constantly establishing various investments to increase their solar industry, which drives the demand for ADL solutions.
  • The automobile is another significant sector that uses ALD units and Systems for its manufacturing. Automobile industries are another primary user of thin film, as it is used in practically every aspect of the industry. For example, the thin film can reduce the size and enhance the life of various parts. Thin coatings are used in the automotive sector to save money and the environment. This is done by reducing the weight of commonly used construction elements, enhancing their service life, and, as a result, improving the manufacturing quality of nanomaterials.
  • Asia is the home of some of the biggest manufacturers of automobiles in the world, such as Honda, Toyota, Mitsubishi, Nissan, Hyundai, TATA Motors, Maruti, etc., with countries like China and India, Japan, and South Korea being the powerhouse of Asian Automobile Sector. Apart from these OEMs, many parts and automobile accessories suppliers also find usage for ALD units and equipment for their manufacturing requirements.
  • A critical approach in producing semiconductor devices is atomic layer deposition, a thin-film deposition process that relies on the use of a gas-phase chemical process. The market's players in this region are heavily investing in research and development programs to improve their outcomes' efficiency and lead the fastest market expansion worldwide.

Atomic Layer Deposition Equipment Industry Overview

The Atomic Layer Deposition Equipment Market is fragmented, as several players are operating in the market. Players in the market adopt strategies like mergers, acquisitions, and partnerships to capture market share.

  • November 2023 - Oxford Instruments Plasma Technology announces significant order placements for plasma atomic layer deposition (ALD) and atomic layer etch (ALE) for GaN HEMT device production from several market-leading Japanese foundries. The systems will support high-growth GaN power electronics and radio frequency markets, with consumer fast-charging and datacentre applications at the forefront for power electronics, and 5G/6G communication applications for the radio frequency market.
  • September 2023 - Sky water technology announced it will provide customers a new semiconductor processing tool for Applied Picosun MorpherTM, atomic layer deposition (ALD) . The thin layers that can be deposited uniformly across the entire silicon wafer are required by a number of devices, such as sensors and emerging memory technology.

Additional Benefits:

  • The market estimate (ME) sheet in Excel format
  • 3 months of analyst support

TABLE OF CONTENTS

1 INTRODUCTION

  • 1.1 Study Assumptions and Market Definition
  • 1.2 Scope of the Study

2 RESEARCH METHODOLOGY

3 EXECUTIVE SUMMARY

4 MARKET INSIGHTS

  • 4.1 Market Overview
  • 4.2 Industry Attractiveness - Porter Five Forces
    • 4.2.1 Bargaining Power of Suppliers
    • 4.2.2 Bargaining Power of Consumers
    • 4.2.3 Threat of New Entrants
    • 4.2.4 Threat of Substitute
    • 4.2.5 Intensity of Competitive Rivalry
  • 4.3 Industry Value Chain Analysis
  • 4.4 Technology Snapshot : Comparison with other deposition technologies and evolution of ALD from Applications in Memory to Application in Logic MPUs and Qualitative analysis regarding type of ALD technologies
  • 4.5 Assessment of COVID-19 Impact on the Industry

5 MARKET DYNAMICS

  • 5.1 Market Drivers
    • 5.1.1 Increase in demand of Microelectronics and Consumer Electronics
    • 5.1.2 Advancement in Computing and Storage Technologies
  • 5.2 Market Challenegs
    • 5.2.1 Higher Associated costs due to Effective Deposition Reactants and Materials

6 MARKET SEGMENTATION

  • 6.1 By Application
    • 6.1.1 Semiconductor and Electronics (includes Computing Sector, Data Centres, and Consumer Electronics)
    • 6.1.2 Healthcare and Biomedical Applications
    • 6.1.3 Automotive
    • 6.1.4 Other Applications
  • 6.2 By Geography
    • 6.2.1 Americas
    • 6.2.2 Europe, Middle East and Africa
    • 6.2.3 Asia
    • 6.2.4 Australia and New Zealand

7 COMPETITIVE LANDSCAPE

  • 7.1 Company Profiles
    • 7.1.1 Applied Materials Inc.
    • 7.1.2 Lam Research Corporation
    • 7.1.3 Entegris Inc.
    • 7.1.4 Veeco Instruments Inc.
    • 7.1.5 Oxford Instruments PLC
    • 7.1.6 Beneq Oy
    • 7.1.7 Picosun Oy
    • 7.1.8 ASM International
    • 7.1.9 Tokyo Electron Limited
    • 7.1.10 Kurt J. Lesker Company

8 INVESTMENT ANALYSIS

9 MARKET OPPORTUNITIES AND FUTURE TRENDS