查看購物車
  • Simplified Chinese
  • English
  • Japanese
  • Korean
封面
市場調查報告書
商品編碼
1539296

電子基板層級底部填充·封裝木材市場:全球產業分析，規模，佔有率，成長，趨勢，預測，2024年～2033年

Electronic Board Level Underfill And Encapsulation Material Market: Global Industry Analysis, Size, Share, Growth, Trends, and Forecast, 2024-2033
出版日期: | 出版商: Persistence Market Research | 英文 278 Pages | 商品交期: 2-5個工作天內

價格
簡介目錄

Persistence Market Research最近發布了一份關於全球電子板級底部填充和密封劑市場的詳細報告。該報告對市場驅動因素、趨勢、機會和課題等關鍵市場動態進行了全面分析，提供了對市場結構的深入見解。

主要的洞察

  • 電子板級底部填充劑和封裝劑的市場規模（2024 年）：3.431 億美元
  • 市場預測金額（2033 年）：5.263 億美元
  • 全球市場成長率（2024-2033 年複合年增長率）：4.9%

電子板級底部填充/密封劑市場 - 研究範圍

電子板級底部填充和密封劑市場包括各種用於保護電子組件和元件（尤其是板級電子組件和元件）免受濕氣、灰塵和熱循環等環境壓力影響的材料。這些材料透過提供機械支撐、減少應力和防止污染物，在提高電子設備的可靠性和使用壽命方面發揮關鍵作用。該市場服務於多個領域，包括汽車電子、消費電子、工業電子和通訊。對電子小型化的需求不斷增長、半導體封裝的進步以及電子產品在各行業中的應用不斷擴大，推動了成長。

推動市場成長的因素：

有幾個關鍵因素推動全球電子板級底部填充和密封劑市場的發展。對微型電子設備的需求不斷增長，特別是在消費性電子和汽車領域，推動了對先進底部填充和封裝材料的需求。倒裝晶片技術和球柵陣列 (BGA) 技術等半導體封裝技術的進步，需要更先進的材料來承受與這些技術相關的增加的熱應力和機械應力，這進一步加速了市場的擴張。此外，5G 技術和物聯網 (IoT) 趨勢的興起正在推動對高性能電子材料的需求，這些材料可以確保設備在多樣化和苛刻環境中的可靠性。加強研發活動，以及引入具有改進的熱性能和機械性能的新材料，透過提供更強大的保護電子組件的解決方案來促進市場成長。

市場限制因素：

儘管成長前景廣闊，但電子板級底部填充和密封劑市場面臨著先進材料的高成本和應用工藝的複雜性相關的課題。保形塗層等替代材料的可用性可能會阻礙市場成長。此外，電子產品進一步小型化的持續推動要求材料開發人員創建滿足更小、更複雜設備嚴格要求的解決方案。解決這些問題需要持續投資研發，以改善材料性能、降低應用成本並提高底部填充和封裝解決方案的可靠性。

市場機會：

先進電子設備的日益普及以及惡劣環境中對可靠防護材料的需求不斷增加，正在為該市場創造重大機會。開發具有更高導熱性、更低熱膨脹係數和改進機械性能的新材料，滿足了對耐用、有效的底部填充和封裝解決方案日益增長的需求。汽車和工業電子領域的擴張為市場成長提供了新的管道，使企業能夠進入對強大、可靠的電子產品需求不斷增長的新興市場。戰略合作夥伴關係、新技術投資和採用環保材料對於利用新機會和維持市場領先地位至關重要。

本報告解決的關鍵問題

  • 推動電子基板級底部填充和密封劑市場全球成長的關鍵因素有哪些？
  • 在各個電子領域中引領採用的底部填充材料和封裝材料的類型和用途是什麼？
  • 技術進步如何影響電子板級底部填充劑和封裝劑市場的競爭格局？
  • 誰是電子板級底部填充劑和封裝劑市場的主要參與者？ 他們採取什麼策略來保持競爭力？
  • 全球電子板級底部填充和封裝材料市場的新趨勢和未來前景是什麼？

目錄

第1章 摘要整理

第2章 市場概要

  • 市場範圍/分類
  • 市場定義/範圍/限制

第3章 主要市場趨勢

  • 影響市場的主要趨勢
  • 產品革新/開發趨勢

第4章 主要成功因素

  • 產品的採用/使用情形分析
  • 產品的USP/特徵
  • 策略性推銷策略

第5章 全球市場的需求分析

  • 過去的市場數量(噸)分析，2019年～2023年
  • 現在及未來市場數量(噸)預測，2024年～2033年
  • 與前一年同期比較成長趨勢分析

第6章 全球市場 - 價格分析

  • 各地區價格分析:各產品類型
  • 價格的明細
    • 廠商層級的價格設定
    • 分銷商層級的價格設定
  • 世界平均價格分析基準

第7章 全球市場的需求(金額或規模，一百萬美元)分析

  • 過去的市場金額(一百萬美元)分析，2019年～2023年
  • 現在及未來市場金額(一百萬美元)預測，2024年～2033年
    • 與前一年同期比較成長趨勢分析
    • 絕對額的機會分析

第8章 市場背景

  • 宏觀經濟要素
  • 預測要素 - 相關性及影響
  • 價值鏈
  • 市場參與企業一覽
  • 全球供給 vs 需求方案
  • 生產流程概要
  • 適用的主要法規
  • COVID-19危機的影響
  • 市場動態

第9章 全球市場分析:各產品類型

  • 簡介/主要調查結果
  • 過去的市場規模(一百萬美元)和數量分析:各產品類型，2019年～2023年
  • 現在及未來市場規模(一百萬美元)和數量分析與預測:各產品類型，2024年～2033年
    • 底部填充
    • Gob-top封裝
  • 市場魅力分析:各產品類型

第10章 全球市場分析:各材料類型

  • 簡介/主要調查結果
  • 過去的市場規模(一百萬美元)和數量分析:各材料類型，2019年～2023年
  • 現在及未來市場規模(一百萬美元)和數量分析與預測:各材料類型，2024年～2033年
    • 石英/矽
    • 氧化鋁為基礎的
    • 環氧樹脂為基礎的
    • 胺甲酸乙酯為基礎的
    • 丙烯為基礎的
    • 其他
  • 市場魅力分析:各材料類型

第11章 全球市場分析:各面板類型

  • 簡介/主要調查結果
  • 過去的市場規模(一百萬美元)和數量分析:各面板類型，2019年～2023年
  • 現在及未來市場規模(一百萬美元)和數量分析與預測:各面板類型，2024年～2033年
    • CSP(晶片級封裝)
    • BGA(球柵陣列)
    • 覆晶
  • 市場魅力分析:各面板類型

第12章 全球市場分析:各地區

  • 簡介
  • 過去的市場規模(一百萬美元)和數量分析:各地區，2019年～2023年
  • 目前市場規模(一百萬美元)和數量分析與預測:各地區，2024年～2033年
    • 北美
    • 南美
    • 歐洲
    • 南亞·太平洋
    • 東亞
    • 中東·非洲
  • 市場魅力分析:各地區

第13章 北美市場分析

第14章 南美市場分析

第15章 歐洲市場分析

第16章 南亞·太平洋市場分析

第17章 東亞市場分析

第18章 中東·非洲市場分析

第19章 主要國家的市場分析

  • 簡介
  • 美國市場分析
  • 加拿大市場分析
  • 墨西哥市場分析
  • 巴西市場分析
  • 德國市場分析
  • 義大利市場分析
  • 法國市場分析
  • 英國市場分析
  • 西班牙市場分析
  • 荷比盧三國市場分析
  • 俄羅斯市場分析
  • 中國市場分析
  • 日本市場分析
  • 韓國市場分析
  • 印度市場分析
  • 東南亞國家聯盟市場分析
  • 澳洲·紐西蘭分析
  • 波灣合作理事會各國市場分析
  • 土耳其市場分析

第20章 市場結構分析

  • 市場分析:各企業層級
  • 市場集中
  • 主要企業的市場佔有率分析
  • 市場影響分析

第21章 競爭分析

  • 競爭儀表板
  • 競爭基準
  • 競爭的詳細資訊
    • Henkel AG and Co. KGaA
    • Namics Corporation
    • AI Technology, Inc.
    • Protavic International
    • HB Fuller Company
    • ASE Group
    • Hitachi Chemical Co., Ltd.
    • Indium Corporation
    • Zymet
    • YINCAE Advanced Materials, LLC
    • LORD Corporation
    • Sanyu Rec Co., Ltd.
    • The Dow Chemical Company
    • Epoxy Technology, Inc.
    • Panasonic Corporation
    • Dymax Corporation
    • ELANTAS GmbH

第22章 所使用的前提條件與縮寫

第23章 調查手法

簡介目錄
Product Code: PMRREP19783

Persistence Market Research has recently published an extensive report on the global Electronic Board Level Underfill and Encapsulation Material Market. This report offers a comprehensive analysis of the key market dynamics, including drivers, trends, opportunities, and challenges, providing deep insights into the market structure.

Key Insights:

  • Electronic Board Level Underfill and Encapsulation Material Market Size (2024E): USD 343.1 Mn
  • Projected Market Value (2033F): USD 526.3 Mn
  • Global Market Growth Rate (CAGR 2024 to 2033): 4.9%

Electronic Board Level Underfill and Encapsulation Material Market - Report Scope:

The Electronic Board Level Underfill and Encapsulation Material Market encompasses a variety of materials used to protect electronic assemblies and components, especially at the board level, from environmental stressors such as moisture, dust, and thermal cycles. These materials play a critical role in enhancing the reliability and longevity of electronic devices by providing mechanical support, reducing stress, and protecting against contaminants. The market serves diverse segments, including automotive electronics, consumer electronics, industrial electronics, and telecommunications. Growth is driven by increasing demand for miniaturization in electronics, advancements in semiconductor packaging, and the expanding application of electronics in various industries.

Market Growth Drivers:

Several key factors are driving the global Electronic Board Level Underfill and Encapsulation Material Market. The rising demand for miniaturized electronic devices, particularly in the consumer electronics and automotive sectors, boosts the need for advanced underfill and encapsulation materials. Technological advancements in semiconductor packaging, such as flip-chip and ball grid array (BGA) technologies, further fuel the market's expansion by requiring more sophisticated materials that can withstand the increased thermal and mechanical stresses associated with these technologies. Additionally, the growing trend towards 5G technology and the Internet of Things (IoT) drives the demand for high-performance electronic materials that can ensure device reliability in diverse and demanding environments. Enhanced research and development activities, along with the introduction of new materials with improved thermal and mechanical properties, contribute to market growth by offering more robust solutions for electronic assembly protection.

Market Restraints:

Despite promising growth prospects, the Electronic Board Level Underfill and Encapsulation Material Market faces challenges related to the high costs of advanced materials and the complexity of the application processes. Market growth can be hindered by the availability of alternative materials, such as conformal coatings, which may be preferred by some manufacturers due to their lower cost and ease of application. Additionally, the continuous push for further miniaturization in electronics poses challenges for material developers to create solutions that can meet the stringent requirements of smaller and more complex devices. Addressing these issues requires ongoing investment in research and development to improve material properties, reduce application costs, and enhance the reliability of underfill and encapsulation solutions.

Market Opportunities:

The market presents significant opportunities driven by the increasing adoption of advanced electronic devices and the rising demand for reliable protection materials in harsh environments. The development of new materials with enhanced thermal conductivity, lower coefficients of thermal expansion, and improved mechanical properties caters to the growing need for more durable and effective underfill and encapsulation solutions. The expansion of the automotive and industrial electronics sectors provides new channels for market growth, allowing companies to tap into emerging markets where the demand for rugged and reliable electronics is on the rise. Strategic partnerships, investments in new technologies, and the introduction of environmentally friendly materials are essential for capitalizing on emerging opportunities and maintaining market leadership.

Key Questions Answered in the Report:

  • What are the primary factors driving the growth of the Electronic Board Level Underfill and Encapsulation Material Market globally?
  • Which types and applications of underfill and encapsulation materials are leading the adoption in various electronic segments?
  • How are technological advancements influencing the competitive landscape of the Electronic Board Level Underfill and Encapsulation Material Market?
  • Who are the key players in the Electronic Board Level Underfill and Encapsulation Material Market, and what strategies are they employing to stay competitive?
  • What are the emerging trends and future prospects in the global Electronic Board Level Underfill and Encapsulation Material Market?

Competitive Intelligence and Business Strategy:

Leading players in the global Electronic Board Level Underfill and Encapsulation Material Market, including Henkel AG & Co. KGaA, NAMICS Corporation, and H.B. Fuller, focus on innovation, product differentiation, and strategic collaborations to gain a competitive edge. These companies invest in R&D to develop advanced underfill and encapsulation materials and explore new applications across various electronic sectors. Collaborations with semiconductor manufacturers, research organizations, and industry stakeholders facilitate market access and promote new material adoption. Emphasis on high-performance products, environmentally sustainable solutions, and comprehensive marketing strategies fosters market growth and enhances brand loyalty in the evolving Electronic Board Level Underfill and Encapsulation Material Market landscape.

Key Companies Profiled:

  • Henkel AG and Co. KGaA
  • Namics Corporation
  • AI Technology, Inc.
  • Protavic International
  • H.B. Fuller Company
  • ASE Group
  • Hitachi Chemical Co., Ltd.
  • Indium Corporation
  • Zymet
  • YINCAE Advanced Materials, LLC
  • LORD Corporation
  • Sanyu Rec Co., Ltd.
  • The Dow Chemical Company
  • Epoxy Technology, Inc.
  • Panasonic Corporation
  • Dymax Corporation
  • ELANTAS GmbH

Electronic Board Level Underfill and Encapsulation Material Market Industry Segmentation

By Product Type

  • Underfills
  • Gob Top Encapsulations

By Material Type

  • Quartz/Silicone
  • Alumina Based
  • Epoxy Based
  • Urethane Based
  • Acrylic Based
  • Others

By Board Type

  • CSP (Chip Scale Package)
  • BGA (Ball Grid array)
  • Flip Chips

By Region

  • North America
  • Latin America
  • Europe
  • East Asia
  • South Asia Pacific
  • Middle East and Africa (MEA)

Table of Contents

1. Executive Summary

  • 1.1. Global Market Outlook
  • 1.2. Demand Side Trends
  • 1.3. Supply Side Trends
  • 1.4. Analysis and Recommendations

2. Market Overview

  • 2.1. Market Coverage / Taxonomy
  • 2.2. Market Definition / Scope / Limitations

3. Key Market Trends

  • 3.1. Key Trends Impacting the Market
  • 3.2. Product Innovation / Development Trends

4. Key Success Factors

  • 4.1. Product Adoption / Usage Analysis
  • 4.2. Product USPs / Features
  • 4.3. Strategic Promotional Strategies

5. Global Market Demand Analysis 2019-2023 and Forecast, 2024-2033

  • 5.1. Historical Market Volume (Tons) Analysis, 2019-2023
  • 5.2. Current and Future Market Volume (Tons) Projections, 2024-2033
  • 5.3. Y-o-Y Growth Trend Analysis

6. Global Market - Pricing Analysis

  • 6.1. Regional Pricing Analysis By Product Type
  • 6.2. Pricing Break-up
    • 6.2.1. Manufacturer Level Pricing
    • 6.2.2. Distributor Level Pricing
  • 6.3. Global Average Pricing Analysis Benchmark

7. Global Market Demand (in Value or Size in US$ Mn) Analysis 2019-2023 and Forecast, 2024-2033

  • 7.1. Historical Market Value (US$ Mn) Analysis, 2019-2023
  • 7.2. Current and Future Market Value (US$ Mn) Projections, 2024-2033
    • 7.2.1. Y-o-Y Growth Trend Analysis
    • 7.2.2. Absolute $ Opportunity Analysis

8. Market Background

  • 8.1. Macro-Economic Factors
    • 8.1.1. Global GDP Growth Overview
    • 8.1.2. Global Semiconductor and Electronics Sector Overview
    • 8.1.3. Other Key Macro-economic Factors
  • 8.2. Forecast Factors - Relevance and Impact
    • 8.2.1. Global Urbanization Growth Outlook
    • 8.2.2. Raw Material Prices
    • 8.2.3. Regulatory Impact Outlook
    • 8.2.4. Application Growth Outlook
    • 8.2.5. Other Key Forecast Factors
  • 8.3. Value Chain
  • 8.4. List of Market Participants
  • 8.5. Global Supply vs Demand Scenario
  • 8.6. Production Process Overview
  • 8.7. Key Applicable Regulations
  • 8.8. Impact of COVID - 19 Crisis
    • 8.8.1. Current Statistics
    • 8.8.2. World Economy / Cluster Projections
    • 8.8.3. Potential of Impact by Taxonomy
    • 8.8.4. Impact on Market Size
    • 8.8.5. Recovery Scenarios
  • 8.9. Market Dynamics
    • 8.9.1. Drivers
    • 8.9.2. Restraints
    • 8.9.3. Opportunity Analysis

9. Global Market Analysis 2019-2023 and Forecast 2024-2033, by Product Type

  • 9.1. Introduction / Key Findings
  • 9.2. Historical Market Size (US$ Mn) and Volume Analysis By Product Type, 2019-2023
  • 9.3. Current and Future Market Size (US$ Mn) and Volume Analysis and Forecast By Product Type, 2024-2033
    • 9.3.1. Underfills
      • 9.3.1.1. Capillary
      • 9.3.1.2. Edge Bonds
    • 9.3.2. Gob Top Encapsulations
  • 9.4. Market Attractiveness Analysis By Product Type

10. Global Market Analysis 2019-2023 and Forecast 2024-2033, By Material Type

  • 10.1. Introduction / Key Findings
  • 10.2. Historical Market Size (US$ Mn) and Volume Analysis By Material Type, 2019-2023
  • 10.3. Current and Future Market Size (US$ Mn) and Volume Analysis and Forecast By Material Type, 2024-2033
    • 10.3.1. Quartz/Silicone
    • 10.3.2. Alumina Based
    • 10.3.3. Epoxy Based
    • 10.3.4. Urethane Based
    • 10.3.5. Acrylic Based
    • 10.3.6. Others
  • 10.4. Market Attractiveness Analysis By Material Type

11. Global Market Analysis 2019-2023 and Forecast 2024-2033, By Board Type

  • 11.1. Introduction / Key Findings
  • 11.2. Historical Market Size (US$ Mn) and Volume Analysis By Board Type, 2019-2023
  • 11.3. Current and Future Market Size (US$ Mn) and Volume Analysis and Forecast By Board Type, 2024-2033
    • 11.3.1. CSP (Chip Scale Package
    • 11.3.2. BGA (Ball Grid array)
    • 11.3.3. Flip Chips
  • 11.4. Market Attractiveness Analysis By Board Type

12. Global Market Analysis 2019-2023 and Forecast 2024-2033, by Region

  • 12.1. Introduction
  • 12.2. Historical Market Size (US$ Mn) and Volume Analysis By Region, 2019-2023
  • 12.3. Current Market Size (US$ Mn) and Volume Analysis and Forecast By Region, 2024-2033
    • 12.3.1. North America
    • 12.3.2. Latin America
    • 12.3.3. Europe
    • 12.3.4. South Asia and Pacific
    • 12.3.5. East Asia
    • 12.3.6. Middle East and Africa
  • 12.4. Market Attractiveness Analysis By Region

13. North America Market Analysis 2019-2023 and Forecast 2024-2033

  • 13.1. Introduction
  • 13.2. Pricing Analysis
  • 13.3. Historical Market Size (US$ Mn) and Volume Trend Analysis By Market Taxonomy, 2019-2023
  • 13.4. Market Size (US$ Mn) and Volume Forecast By Market Taxonomy, 2024-2033
    • 13.4.1. By Country
      • 13.4.1.1. U.S.
      • 13.4.1.2. Canada
    • 13.4.2. By Product Type
    • 13.4.3. By Material Type
    • 13.4.4. By Board Type
  • 13.5. Market Attractiveness Analysis
    • 13.5.1. By Country
    • 13.5.2. By Product Type
    • 13.5.3. By Material Type
    • 13.5.4. By Board Type
  • 13.6. Market Trends
  • 13.7. Key Market Participants - Intensity Mapping
  • 13.8. Drivers and Restraints - Impact Analysis

14. Latin America Market Analysis 2019-2023 and Forecast 2024-2033

  • 14.1. Introduction
  • 14.2. Pricing Analysis
  • 14.3. Historical Market Size (US$ Mn) and Volume Trend Analysis By Market Taxonomy, 2019-2023
  • 14.4. Market Size (US$ Mn) and Volume Forecast By Market Taxonomy, 2024-2033
    • 14.4.1. By Country
      • 14.4.1.1. Brazil
      • 14.4.1.2. Mexico
      • 14.4.1.3. Rest of Latin America
    • 14.4.2. By Product Type
    • 14.4.3. By Material Type
    • 14.4.4. By Board Type
  • 14.5. Market Attractiveness Analysis
    • 14.5.1. By Country
    • 14.5.2. By Product Type
    • 14.5.3. By Material Type
    • 14.5.4. By Board Type
  • 14.6. Market Trends
  • 14.7. Key Market Participants - Intensity Mapping
  • 14.8. Drivers and Restraints - Impact Analysis

15. Europe Market Analysis 2019-2023 and Forecast 2024-2033

  • 15.1. Introduction
  • 15.2. Pricing Analysis
  • 15.3. Historical Market Size (US$ Mn) and Volume Trend Analysis By Market Taxonomy, 2019-2023
  • 15.4. Market Size (US$ Mn) and Volume Forecast By Market Taxonomy, 2024-2033
    • 15.4.1. By Country
      • 15.4.1.1. Germany
      • 15.4.1.2. Italy
      • 15.4.1.3. France
      • 15.4.1.4. U.K.
      • 15.4.1.5. Spain
      • 15.4.1.6. BENELUX
      • 15.4.1.7. Russia
      • 15.4.1.8. Rest of Europe
    • 15.4.2. By Product Type
    • 15.4.3. By Material Type
    • 15.4.4. By Board Type
  • 15.5. Market Attractiveness Analysis
    • 15.5.1. By Country
    • 15.5.2. By Product Type
    • 15.5.3. By Material Type
    • 15.5.4. By Board Type
  • 15.6. Market Trends
  • 15.7. Key Market Participants - Intensity Mapping
  • 15.8. Drivers and Restraints - Impact Analysis

16. South Asia and Pacific Market Analysis 2019-2023 and Forecast 2024-2033

  • 16.1. Introduction
  • 16.2. Pricing Analysis
  • 16.3. Historical Market Size (US$ Mn) and Volume Trend Analysis By Market Taxonomy, 2019-2023
  • 16.4. Market Size (US$ Mn) and Volume Forecast By Market Taxonomy, 2024-2033
    • 16.4.1. By Country
      • 16.4.1.1. India
      • 16.4.1.2. Association of Southeast Asian Nations
      • 16.4.1.3. Australia and New Zealand
      • 16.4.1.4. Rest of South Asia and Pacific
    • 16.4.2. By Product Type
    • 16.4.3. By Material Type
    • 16.4.4. By Board Type
  • 16.5. Market Attractiveness Analysis
    • 16.5.1. By Country
    • 16.5.2. By Product Type
    • 16.5.3. By Material Type
    • 16.5.4. By Board Type
  • 16.6. Market Trends
  • 16.7. Key Market Participants - Intensity Mapping
  • 16.8. Drivers and Restraints - Impact Analysis

17. East Asia Market Analysis 2019-2023 and Forecast 2024-2033

  • 17.1. Introduction
  • 17.2. Pricing Analysis
  • 17.3. Historical Market Size (US$ Mn) and Volume Trend Analysis By Market Taxonomy, 2019-2023
  • 17.4. Market Size (US$ Mn) and Volume Forecast By Market Taxonomy, 2024-2033
    • 17.4.1. By Country
      • 17.4.1.1. China
      • 17.4.1.2. Japan
      • 17.4.1.3. South Korea
    • 17.4.2. By Product Type
    • 17.4.3. By Material Type
    • 17.4.4. By Board Type
  • 17.5. Market Attractiveness Analysis
    • 17.5.1. By Country
    • 17.5.2. By Product Type
    • 17.5.3. By Material Type
    • 17.5.4. By Board Type
  • 17.6. Market Trends
  • 17.7. Key Market Participants - Intensity Mapping
  • 17.8. Drivers and Restraints - Impact Analysis

18. Middle East and Africa Market Analysis 2019-2023 and Forecast 2024-2033

  • 18.1. Introduction
  • 18.2. Pricing Analysis
  • 18.3. Historical Market Size (US$ Mn) and Volume Trend Analysis By Market Taxonomy, 2019-2023
  • 18.4. Market Size (US$ Mn) and Volume Forecast By Market Taxonomy, 2024-2033
    • 18.4.1. By Country
      • 18.4.1.1. Gulf Corporation Council Countries
      • 18.4.1.2. Turkey
      • 18.4.1.3. Northern Africa
      • 18.4.1.4. South Africa
      • 18.4.1.5. Rest of Middle East and Africa
    • 18.4.2. By Product Type
    • 18.4.3. By Material Type
    • 18.4.4. By Board Type
  • 18.5. Market Attractiveness Analysis
    • 18.5.1. By Country
    • 18.5.2. By Product Type
    • 18.5.3. By Material Type
    • 18.5.4. By Board Type
  • 18.6. Market Trends
  • 18.7. Key Market Participants - Intensity Mapping
  • 18.8. Drivers and Restraints - Impact Analysis

19. Key Countries Market Analysis

  • 19.1. Introduction
    • 19.1.1. Market Value Proportion Analysis, By Key Countries
    • 19.1.2. Global Vs. Country Growth Comparison
  • 19.2. U.S. Market Analysis
    • 19.2.1. By Product Type
    • 19.2.2. By Material Type
    • 19.2.3. By Board Type
  • 19.3. Canada Market Analysis
    • 19.3.1. By Product Type
    • 19.3.2. By Material Type
    • 19.3.3. By Board Type
  • 19.4. Mexico Market Analysis
    • 19.4.1. By Product Type
    • 19.4.2. By Material Type
    • 19.4.3. By Board Type
  • 19.5. Brazil Market Analysis
    • 19.5.1. By Product Type
    • 19.5.2. By Material Type
    • 19.5.3. By Board Type
  • 19.6. Germany Market Analysis
    • 19.6.1. By Product Type
    • 19.6.2. By Material Type
    • 19.6.3. By Board Type
  • 19.7. Italy Market Analysis
    • 19.7.1. By Product Type
    • 19.7.2. By Material Type
    • 19.7.3. By Board Type
  • 19.8. France Market Analysis
    • 19.8.1. By Product Type
    • 19.8.2. By Material Type
    • 19.8.3. By Board Type
  • 19.9. U.K. Market Analysis
    • 19.9.1. By Product Type
    • 19.9.2. By Material Type
    • 19.9.3. By Board Type
  • 19.10. Spain Market Analysis
    • 19.10.1. By Product Type
    • 19.10.2. By Material Type
    • 19.10.3. By Board Type
  • 19.11. BENELUX Market Analysis
    • 19.11.1. By Product Type
    • 19.11.2. By Material Type
    • 19.11.3. By Board Type
  • 19.12. Russia Market Analysis
    • 19.12.1. By Product Type
    • 19.12.2. By Material Type
    • 19.12.3. By Board Type
  • 19.13. China Market Analysis
    • 19.13.1. By Product Type
    • 19.13.2. By Material Type
    • 19.13.3. By Board Type
  • 19.14. Japan Market Analysis
    • 19.14.1. By Product Type
    • 19.14.2. By Material Type
    • 19.14.3. By Board Type
  • 19.15. South Korea Market Analysis
    • 19.15.1. By Product Type
    • 19.15.2. By Material Type
    • 19.15.3. By Board Type
  • 19.16. India Market Analysis
    • 19.16.1. By Product Type
    • 19.16.2. By Material Type
    • 19.16.3. By Board Type
  • 19.17. Association of Southeast Asian Nations Market Analysis
    • 19.17.1. By Product Type
    • 19.17.2. By Material Type
    • 19.17.3. By Board Type
  • 19.18. Australia and New Zealand Analysis
    • 19.18.1. By Product Type
    • 19.18.2. By Material Type
    • 19.18.3. By Board Type
  • 19.19. Gulf Corporation Council Countries Market Analysis
    • 19.19.1. By Product Type
    • 19.19.2. By Material Type
    • 19.19.3. By Board Type
  • 19.20. Turkey Market Analysis
    • 19.20.1. By Product Type
    • 19.20.2. By Material Type
    • 19.20.3. By Board Type

20. Market Structure Analysis

  • 20.1. Market Analysis by Tier of Companies
  • 20.2. Market Concentration
  • 20.3. Market Share Analysis of Top Players
  • 20.4. Market Presence Analysis
    • 20.4.1. By Regional footprint of Players
    • 20.4.2. Product foot print by Players

21. Competition Analysis

  • 21.1. Competition Dashboard
  • 21.2. Competition Benchmarking
  • 21.3. Competition Deep Dive
    • 21.3.1. Henkel AG and Co. KGaA
      • 21.3.1.1. Overview
      • 21.3.1.2. Product Portfolio
      • 21.3.1.3. Key Financials
      • 21.3.1.4. Recent Developments
      • 21.3.1.5. Strategy Overview
        • 21.3.1.5.1. Marketing Strategy
        • 21.3.1.5.2. Product Strategy
    • 21.3.2. Namics Corporation
      • 21.3.2.1. Overview
      • 21.3.2.2. Product Portfolio
      • 21.3.2.3. Key Financials
      • 21.3.2.4. Recent Developments
      • 21.3.2.5. Strategy Overview
        • 21.3.2.5.1. Marketing Strategy
        • 21.3.2.5.2. Product Strategy
    • 21.3.3. AI Technology, Inc.
      • 21.3.3.1. Overview
      • 21.3.3.2. Product Portfolio
      • 21.3.3.3. Key Financials
      • 21.3.3.4. Recent Developments
      • 21.3.3.5. Strategy Overview
        • 21.3.3.5.1. Marketing Strategy
        • 21.3.3.5.2. Product Strategy
    • 21.3.4. Protavic International
      • 21.3.4.1. Overview
      • 21.3.4.2. Product Portfolio
      • 21.3.4.3. Key Financials
      • 21.3.4.4. Recent Developments
      • 21.3.4.5. Strategy Overview
        • 21.3.4.5.1. Marketing Strategy
        • 21.3.4.5.2. Product Strategy
    • 21.3.5. H.B. Fuller Company
      • 21.3.5.1. Overview
      • 21.3.5.2. Product Portfolio
      • 21.3.5.3. Key Financials
      • 21.3.5.4. Recent Developments
      • 21.3.5.5. Strategy Overview
        • 21.3.5.5.1. Marketing Strategy
        • 21.3.5.5.2. Product Strategy
    • 21.3.6. ASE Group
      • 21.3.6.1. Overview
      • 21.3.6.2. Product Portfolio
      • 21.3.6.3. Key Financials
      • 21.3.6.4. Recent Developments
      • 21.3.6.5. Strategy Overview
        • 21.3.6.5.1. Marketing Strategy
        • 21.3.6.5.2. Product Strategy
    • 21.3.7. Hitachi Chemical Co., Ltd.
      • 21.3.7.1. Overview
      • 21.3.7.2. Product Portfolio
      • 21.3.7.3. Key Financials
      • 21.3.7.4. Recent Developments
      • 21.3.7.5. Strategy Overview
        • 21.3.7.5.1. Marketing Strategy
        • 21.3.7.5.2. Product Strategy
    • 21.3.8. Indium Corporation
      • 21.3.8.1. Overview
      • 21.3.8.2. Product Portfolio
      • 21.3.8.3. Key Financials
      • 21.3.8.4. Recent Developments
      • 21.3.8.5. Strategy Overview
        • 21.3.8.5.1. Marketing Strategy
        • 21.3.8.5.2. Product Strategy
    • 21.3.9. Zymet
      • 21.3.9.1. Overview
      • 21.3.9.2. Product Portfolio
      • 21.3.9.3. Key Financials
      • 21.3.9.4. Recent Developments
      • 21.3.9.5. Strategy Overview
        • 21.3.9.5.1. Marketing Strategy
        • 21.3.9.5.2. Product Strategy
    • 21.3.10. YINCAE Advanced Materials, LLC
      • 21.3.10.1. Overview
      • 21.3.10.2. Product Portfolio
      • 21.3.10.3. Key Financials
      • 21.3.10.4. Recent Developments
      • 21.3.10.5. Strategy Overview
        • 21.3.10.5.1. Marketing Strategy
        • 21.3.10.5.2. Product Strategy
    • 21.3.11. LORD Corporation
      • 21.3.11.1. Overview
      • 21.3.11.2. Product Portfolio
      • 21.3.11.3. Key Financials
      • 21.3.11.4. Recent Developments
      • 21.3.11.5. Strategy Overview
        • 21.3.11.5.1. Marketing Strategy
        • 21.3.11.5.2. Product Strategy
    • 21.3.12. Sanyu Rec Co., Ltd.
      • 21.3.12.1. Overview
      • 21.3.12.2. Product Portfolio
      • 21.3.12.3. Key Financials
      • 21.3.12.4. Recent Developments
      • 21.3.12.5. Strategy Overview
        • 21.3.12.5.1. Marketing Strategy
        • 21.3.12.5.2. Product Strategy
    • 21.3.13. The Dow Chemical Company
      • 21.3.13.1. Overview
      • 21.3.13.2. Product Portfolio
      • 21.3.13.3. Key Financials
      • 21.3.13.4. Recent Developments
      • 21.3.13.5. Strategy Overview
        • 21.3.13.5.1. Marketing Strategy
        • 21.3.13.5.2. Product Strategy
    • 21.3.14. Epoxy Technology, Inc.
      • 21.3.14.1. Overview
      • 21.3.14.2. Product Portfolio
      • 21.3.14.3. Key Financials
      • 21.3.14.4. Recent Developments
      • 21.3.14.5. Strategy Overview
        • 21.3.14.5.1. Marketing Strategy
        • 21.3.14.5.2. Product Strategy
    • 21.3.15. Panasonic Corporation
      • 21.3.15.1. Overview
      • 21.3.15.2. Product Portfolio
      • 21.3.15.3. Key Financials
      • 21.3.15.4. Recent Developments
      • 21.3.15.5. Strategy Overview
        • 21.3.15.5.1. Marketing Strategy
        • 21.3.15.5.2. Product Strategy
    • 21.3.16. Dymax Corporation
      • 21.3.16.1. Overview
      • 21.3.16.2. Product Portfolio
      • 21.3.16.3. Key Financials
      • 21.3.16.4. Recent Developments
      • 21.3.16.5. Strategy Overview
        • 21.3.16.5.1. Marketing Strategy
        • 21.3.16.5.2. Product Strategy
    • 21.3.17. ELANTAS GmbH
      • 21.3.17.1. Overview
      • 21.3.17.2. Product Portfolio
      • 21.3.17.3. Key Financials
      • 21.3.17.4. Recent Developments
      • 21.3.17.5. Strategy Overview
        • 21.3.17.5.1. Marketing Strategy
        • 21.3.17.5.2. Product Strategy

22. Assumptions and Acronyms Used

23. Research Methodology