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1439048

封裝樹脂市場 - 2018-2028 年全球產業規模、佔有率、趨勢、機會和預測,按樹脂類型、最終用戶、地區和競爭細分

Encapsulation Resins Market - Global Industry Size, Share, Trends, Opportunity, and Forecast, 2018-2028 Segmented By Resin Type, By End User, By Region and Competition

出版日期: | 出版商: TechSci Research | 英文 188 Pages | 商品交期: 2-3個工作天內

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簡介目錄

2022 年全球封裝樹脂市場估值為 41.7 億美元,預計在預測期內將強勁成長,到 2028 年複合CAGR為3.65%。封裝樹脂也稱為灌封樹脂或鑄造樹脂,是廣泛使用的特殊配方材料用於各種行業,為電子元件或設備提供保護和絕緣。這些樹脂經過專門設計,可形成保護層,保護封裝組件免受濕氣、灰塵、化學物質和物理損壞。封裝樹脂具有優異的電絕緣性能,可有效防止短路和觸電。

市場概況
預測期 2024-2028
2022 年市場規模 41.7億美元
2028 年市場規模 51.4億美元
2023-2028 年CAGR 3.65%
成長最快的細分市場 環氧樹脂
最大的市場 亞太地區

通常,封裝樹脂是熱固性聚合物,例如環氧樹脂或聚氨酯。這些聚合物經過固化過程,形成堅固耐用的保護層。這種保護塗層顯著提高了封裝組件的使用壽命和可靠性,使其成為汽車、航空航太、電子和電信等要求嚴苛的應用和環境的理想選擇。

除了在各行業中廣泛使用之外,封裝樹脂在感測器設備中也有廣泛的應用。這些樹脂在保護敏感電子元件和感測設備方面發揮著至關重要的作用。它們提供的主要優勢之一是環境保護。感測器通常在惡劣的條件下運行,經歷溫度波動、濕度、化學暴露和機械應力。封裝樹脂可作為屏障,保護這些精密零件免受外部因素的影響。

此外,許多感測器依靠電訊號進行操作。具有高介電強度的封裝樹脂是優良的電絕緣體,可有效防止短路並最大限度地減少訊號干擾。除了電氣保護之外,封裝樹脂主要用於保護電子產品和設備免受物理衝擊、腐蝕性氣體、化學物質、熱量和灰塵以及其他潛在危險的影響。這些樹脂可用於包裝單一組件或整個單元,確保在嚴苛的環境中提供全面的保護。

透過使用封裝樹脂,即使在充滿挑戰的工作條件下,各行業也可以確保其電子元件和設備的使用壽命、可靠性和性能。

主要市場促進因素

汽車產業對封裝樹脂的需求不斷成長

目錄

第 1 章:產品概述

第 2 章:研究方法

第 3 章:執行摘要

第 4 章:COVID-19 對全球封裝樹脂市場的影響

第 5 章:全球封裝樹脂市場展望

  • 市場規模及預測
    • 按價值
  • 市佔率及預測
    • 依樹脂類型(環氧樹脂、聚氨酯樹脂、矽樹脂、其他)
    • 依最終用戶(汽車、消費性電子產品、工業、電信、其他)
    • 按地區
    • 按公司分類 (2022)
  • 市場地圖

第 6 章:亞太地區封裝樹脂市場展望

  • 市場規模及預測
    • 按價值
  • 市佔率及預測
    • 依樹脂類型
    • 按最終用戶
    • 按國家/地區
  • 亞太地區:國家分析
    • 中國
    • 印度
    • 澳洲
    • 日本
    • 韓國

第 7 章:歐洲封裝樹脂市場展望

  • 市場規模及預測
    • 按價值
  • 市佔率及預測
    • 依樹脂類型
    • 按最終用戶
    • 按國家/地區
  • 歐洲:國家分析
    • 法國
    • 德國
    • 西班牙
    • 義大利
    • 英國

第 8 章:北美封裝樹脂市場展望

  • 市場規模及預測
    • 按價值
  • 市佔率及預測
    • 依樹脂類型
    • 按最終用戶
    • 按國家/地區
  • 北美:國家分析
    • 美國
    • 墨西哥
    • 加拿大

第 9 章:南美洲封裝樹脂市場展望

  • 市場規模及預測
    • 按價值
  • 市佔率及預測
    • 依樹脂類型
    • 按最終用戶
    • 按國家/地區
  • 南美洲:國家分析
    • 巴西
    • 阿根廷
    • 哥倫比亞

第 10 章:中東和非洲封裝樹脂市場展望

  • 市場規模及預測
    • 按價值
  • 市佔率及預測
    • 依樹脂類型
    • 按最終用戶
    • 按國家/地區
  • MEA:國家分析
    • 南非
    • 沙烏地阿拉伯
    • 阿拉伯聯合大公國

第 11 章:市場動態

  • 促進要素
  • 挑戰

第 12 章:市場趨勢與發展

  • 最近的發展
  • 產品發布
  • 併購

第 13 章:全球封裝樹脂市場:SWOT 分析

第 14 章:波特的五力分析

  • 產業競爭
  • 新進入者的潛力
  • 供應商的力量
  • 客戶的力量
  • 替代產品的威脅

第 15 章:大環境分析

第16章:競爭格局

  • Henkel AG
  • Hitachi Chemical Industries Co., Ltd.
  • Huntsman International LLC
  • HB Fuller Company
  • Acc Silicones Ltd
  • BASF SE
  • The Dow Chemical Company
  • Fuji Chemical Industry Co Ltd
  • Shin-Etsu Chemical Co Ltd.
  • Robnor ResinLab Ltd

第 17 章:策略建議

第18章調查會社について,免責事項

簡介目錄
Product Code: 20781

Global Encapsulation Resins Market was valued at USD4.17 billion in 2022 and is anticipated to project robust growth in the forecast period with a CAGR of 3.65% through 2028. Encapsulation resins, also known as potting resins or casting resins, are specially formulated materials widely utilized in various industries to provide protection and insulation to electronic components or devices. These resins are specifically designed to create a protective layer that shields the packaged components from moisture, dust, chemicals, and physical damage. With their excellent electrical insulation properties, encapsulation resins effectively prevent short circuits and electric shocks.

Market Overview
Forecast Period2024-2028
Market Size 2022USD 4.17 Billion
Market Size 2028USD 5.14 Billion
CAGR 2023-20283.65%
Fastest Growing SegmentEpoxy Resins
Largest MarketAsia Pacific

Typically, encapsulating resins are thermosetting polymers such as epoxy or polyurethane. These polymers undergo a curing process to form a strong and durable protective layer. This protective coating significantly enhances the lifespan and reliability of the packaged components, making them ideal for demanding applications and environments, including automotive, aerospace, electronics, and telecommunications.

In addition to their widespread use in various industries, encapsulating resins also find extensive application in sensor devices. These resins play a crucial role in safeguarding sensitive electronic components and sensing devices. One of the key advantages they offer is environmental protection. Sensors often operate in harsh conditions, experiencing temperature fluctuations, humidity, chemical exposure, and mechanical stress. The encapsulation resin acts as a barrier, shielding these delicate parts from external factors.

Furthermore, many sensors rely on electrical signals for their operation. Encapsulation resins with high dielectric strength serve as excellent electrical insulators, effectively preventing short circuits and minimizing signal interference. Apart from electrical protection, encapsulation resins are primarily employed to shield electronic products and equipment from physical shocks, corrosive gases, chemicals, heat, and dust, among other potential hazards. These resins can be used for packaging individual components or entire units, ensuring comprehensive protection in demanding environments.

By utilizing encapsulating resins, industries can ensure the longevity, reliability, and performance of their electronic components and devices, even in challenging operating conditions.

Key Market Drivers

Growing Demand of Encapsulation Resins in Automotive Industry

Encapsulation resins play a crucial role in the automotive industry's electronic systems by providing a protective layer for sensitive components. These resins are specifically designed to encapsulate and safeguard electronic parts, including sensors, microcontrollers, and power modules, against harsh operating conditions. By offering excellent thermal conductivity, electrical insulation, and environmental resistance, encapsulation resins ensure the optimal performance and longevity of these components, making them highly desirable for use in vehicles.

The demand for encapsulation resins has been further amplified by the growing prevalence of electric vehicles (EVs) and hybrid electric vehicles (HEVs). As these vehicles require high-performance electronic systems, such as battery management systems and power control units, the need for reliable encapsulation resins becomes even more critical. These resins not only protect the sensitive electronics from external factors but also contribute to the overall functionality and safety of the vehicle.

The automotive industry is currently experiencing a rapid transformation driven by technological advancements, such as autonomous driving, connected cars, and electrification. These innovations necessitate the integration of sophisticated electronics into vehicles, which in turn require robust protection from various environmental factors like vibration, moisture, dust, and temperature fluctuations. Encapsulation resins serve as a vital solution to meet these challenges, ensuring the reliability and durability of electronic components in the modern automotive landscape.

Furthermore, the advent of autonomous vehicles has led to a substantial increase in the number of sensors and electronic components per vehicle. Each of these components necessitates proper encapsulation for long-term protection and functionality, further driving up the demand for encapsulation resins in the automotive industry.

In addition to technological advancements, government regulations worldwide are also pushing automakers towards producing cleaner and more efficient vehicles. The shift towards electrification has resulted in a surge in the production of EVs and HEVs, which inherently require a higher number of electronic components compared to conventional vehicles. To ensure the longevity and reliability of these components, encapsulation resins are indispensable, thus fueling the demand for their usage in the automotive sector.

In summary, encapsulation resins play a fundamental role in protecting and enhancing the performance of electronic components in the automotive industry. With their ability to withstand harsh conditions, provide thermal conductivity, and ensure electrical insulation, encapsulation resins are indispensable in the face of technological advancements, the rise of EVs and HEVs, and the increasing focus on cleaner and more efficient vehicles.

Growing Demand of Encapsulation Resins in Electronic Industry

Encapsulation resins play a crucial role in the electronics industry, providing essential protection for delicate electronic components against various environmental factors like moisture, dust, and temperature fluctuations. These resins not only safeguard the components but also offer excellent electrical insulation and thermal conductivity, ensuring optimal performance of electronic devices.

In a wide range of electronic applications, including printed circuit boards, semiconductors, sensors, and transistors, encapsulation resins serve as a shield, preventing physical damage and chemical corrosion. This extends the lifespan and enhances the reliability of these components.

The ever-evolving landscape of the electronics industry, driven by rapid technological advancements, has led to an exponential surge in the demand for encapsulation resins. With the rise of the Internet of Things (IoT), artificial intelligence (AI), and 5G technology, electronic devices have become increasingly complex and miniaturized. The intricate circuits and components in these devices require robust protection, precisely what encapsulation resins offer.

Furthermore, the growing trend towards smart homes and cities, where interconnected electronic devices and sensors are powering the way we live, has further intensified the need for reliable encapsulation solutions. This surge in demand for encapsulation resins is driven by the desire to ensure the longevity and performance of these devices in a connected ecosystem.

The booming consumer electronics sector is another significant driver of the encapsulation resins market. The proliferation of smartphones, tablets, wearable devices, and home entertainment systems has significantly increased the demand for encapsulation resins. These devices are often exposed to harsh environments and heavy usage, which necessitates high-quality encapsulation to ensure their durability and optimal performance.

Key Market Challenges

Volatility in Price of Raw Materials

Encapsulation resins, which are commonly used in various industries, are primarily composed of raw materials such as epoxy resins, silicones, and polyurethanes. These raw materials serve as the building blocks for the production of encapsulation resins, and their prices can exhibit significant volatility due to various factors.

One of the key drivers of price volatility in encapsulation resin raw materials is the supply-demand dynamics. Fluctuations in the availability of these materials can result from a range of factors, including changes in production capacities, market demand, and inventory levels. When demand outpaces supply, prices can rise, while oversupply can lead to price decreases.

Geopolitical events also play a crucial role in raw material price volatility. Disruptions in the global supply chain caused by natural disasters, political instability, or trade disputes can have a direct impact on the availability and cost of raw materials. For example, conflicts in oil-producing regions can cause crude oil prices to spike, affecting the cost of petroleum-based raw materials like polyurethanes.

Moreover, changes in energy prices can significantly influence the cost of raw materials used in encapsulation resins. Fluctuations in energy markets, driven by factors such as production levels, renewable energy adoption, and geopolitical tensions, can directly impact the prices of raw materials like epoxy resins and silicones.

In addition to supply-demand dynamics and geopolitical events, regulatory factors also contribute to the price volatility of encapsulation resin raw materials. Environmental regulations, for instance, can impose restrictions on the production and disposal of certain raw materials, leading to additional costs that are eventually passed on to customers.

Currency fluctuations further add to the complexity of raw material price volatility. As raw materials are often traded in global markets, changes in exchange rates can affect the purchasing power of manufacturers and impact the cost of importing or exporting raw materials.

Key Market Trends

Rising Advancements in Formulation

Encapsulation resins are widely used in various industries such as electronics, automotive, and telecommunications, primarily because of their exceptional ability to protect delicate components from environmental stressors. As these sectors continue to evolve and advance, the demand for more advanced encapsulation resins is also on the rise.

In recent years, there has been a noticeable shift towards the development of new formulations that further enhance the properties of encapsulation resins. These advancements focus on improving crucial aspects such as thermal conductivity, electrical insulation, and environmental resistance, all of which play a vital role in ensuring the optimal performance of encapsulated components.

The semiconductor industry, in particular, is experiencing significant benefits from these formulation advancements. With the increasing complexity of semiconductor devices, the need for high-performance encapsulation resins has become paramount. Enhanced formulations offer improved protection for semiconductors, guaranteeing their longevity and reliability.

Furthermore, the chip encapsulation resin market is poised for substantial growth, driven by the constantly rising demand for electronic devices. Advanced formulations provide even better protection for electronic components, safeguarding them against physical damage and chemical corrosion.

Another noteworthy trend in the encapsulation resins market is the increasing demand for sustainable and environmentally friendly resins. Manufacturers are placing greater emphasis on developing formulations that minimize environmental impact without compromising performance. This trend aligns with the growing global consciousness about environmental sustainability and the push for greener manufacturing practices.

Segmental Insights

Resin Type Insights

Based on the category of resin type, the epoxy resins segment emerged as the dominant player in the global market for encapsulation resins in 2022. Epoxy resins have been widely used in a range of applications for many years, thanks to their exceptional properties. These resins exhibit low shrinkage upon curing, making them highly desirable. Additionally, they possess toughness, superior chemical resistance, and hardness, making them suitable for various industrial uses.

One of the key advantages of epoxy resins is their ease of application. They offer a low coefficient of thermal expansion, which ensures dimensional stability even under extreme temperature variations. Furthermore, they provide excellent protection against harsh chemicals and humidity, making them ideal for demanding environments.

When used as an encapsulation material in electronic applications, epoxy resin demonstrates excellent dielectric properties, thermal conductivity, mechanical strength, and electrical insulation strength. These properties contribute to the reliable and efficient performance of electronic devices.

Moreover, epoxy resin is considered a cost-effective solution for encapsulation, offering superior adhesion to a wide range of substrates. This versatility makes it a preferred choice in various industries, including electronics, automotive, aerospace, and more.

End User Insights

The consumer electronics segment is projected to experience rapid growth during the forecast period. Epoxy, polyurethane, and silicone resins are widely used in encapsulation and potting in a range of electrical and electronics applications. These versatile resins play a crucial role in protecting electrical components and devices from harsh environmental conditions, ensuring their longevity and reliability. Moreover, they offer a robust defense against security threats such as tampering, safeguarding sensitive electronic components.

Encapsulation can be applied to various electrical applications, including integrated circuits (ICs), capacitors, and diodes. The process provides numerous benefits, including low shrinkage upon curing, flexibility, and a strain relief system for wire leads, effectively minimizing the risk of wire breakage. These advantages contribute to the overall durability and performance of the encapsulated components.

With the ever-changing and evolving electrical and electronics industry, driven by the demand for emerging e-mobility and the development of small yet powerful devices, the need for innovative resins continues to rise. The growing market for electrical and electronics applications creates a significant demand for advanced encapsulation resins that can meet the evolving requirements of the industry.

Regional Insights

Asia Pacific emerged as the dominant player in the Global Encapsulation Resins Market in 2022, holding the largest market share in terms of value. The impressive growth of encapsulation resins in the Asia Pacific region can be primarily attributed to the surge in demand for these resins across a wide range of electronics applications. These applications include components, devices, printed circuit boards, photonic integrated circuits, sensor assemblies, transformers, cables, and many others. The region boasts a notable presence of electrical and electronics players, which, combined with the remarkable growth of the industry over the years, further fuels the market expansion.

Moreover, the increasing adoption of encapsulation resins in various electronics devices, as well as their utilization in the automotive, aerospace, and building and construction sectors, significantly contributes to the rising demand for encapsulation resins in the Asia Pacific region. This trend is expected to continue in the coming years, driving further growth in the market.

Key Market Players

Henkel AG

Hitachi Chemical Industries Co., Ltd.

Huntsman International LLC

H.B. Fuller Company

Acc Silicones Ltd

BASF SE

The Dow Chemical Company

Fuji Chemical Industry Co Ltd

Shin-Etsu Chemical Co Ltd.

Robnor ResinLab Ltd

Report Scope:

In this report, the Global Encapsulation Resins Market has been segmented into the following categories, in addition to the industry trends which have also been detailed below:

Global Encapsulation Resins Market, By Resin Type:

  • Epoxy Resins
  • Polyurethane Resins
  • Silicone Resins
  • Others

Global Encapsulation Resins Market, By End User:

  • Automotive
  • Consumer Electronics
  • Industrial
  • Telecommunication
  • Others

Global Encapsulation Resins Market, By Region:

  • North America
  • United States
  • Canada
  • Mexico
  • Europe
  • France
  • United Kingdom
  • Italy
  • Germany
  • Spain
  • Asia-Pacific
  • China
  • India
  • Japan
  • Australia
  • South Korea
  • South America
  • Brazil
  • Argentina
  • Colombia
  • Middle East & Africa
  • South Africa
  • Saudi Arabia
  • UAE

Competitive Landscape

  • Company Profiles: Detailed analysis of the major companies present in the Global Encapsulation Resins Market.

Available Customizations:

  • Global Encapsulation Resins Market report with the given market data, Tech Sci Research offers customizations according to a company's specific needs. The following customization options are available for the report:

Company Information

  • Detailed analysis and profiling of additional market players (up to five).

Table of Contents

1. Product Overview

  • 1.1. Market Definition
  • 1.2. Scope of the Market
    • 1.2.1. Markets Covered
    • 1.2.2. Years Considered for Study
    • 1.2.3. Key Market Segmentations

2. Research Methodology

  • 2.1. Objective of the Study
  • 2.2. Baseline Methodology
  • 2.3. Key Industry Partners
  • 2.4. Major Association and Secondary Sources
  • 2.5. Forecasting Methodology
  • 2.6. Data Triangulation & Validation
  • 2.7. Assumptions and Limitations

3. Executive Summary

  • 3.1. Overview of the Market
  • 3.2. Overview of Key Market Segmentations
  • 3.3. Overview of Key Market Players
  • 3.4. Overview of Key Regions/Countries
  • 3.5. Overview of Market Drivers, Challenges, Trends

4. Impact of COVID-19 on Global Encapsulation Resins Market

5. Global Encapsulation Resins Market Outlook

  • 5.1. Market Size & Forecast
    • 5.1.1. By Value
  • 5.2. Market Share & Forecast
    • 5.2.1. By Resin Type (Epoxy Resins, Polyurethane Resins, Silicone Resins, Others)
    • 5.2.2. By End User (Automotive, Consumer Electronics, Industrial, Telecommunication, Others)
    • 5.2.3. By Region
    • 5.2.4. By Company (2022)
  • 5.3. Market Map

6. Asia Pacific Encapsulation Resins Market Outlook

  • 6.1. Market Size & Forecast
    • 6.1.1. By Value
  • 6.2. Market Share & Forecast
    • 6.2.1. By Resin Type
    • 6.2.2. By End User
    • 6.2.3. By Country
  • 6.3. Asia Pacific: Country Analysis
    • 6.3.1. China Encapsulation Resins Market Outlook
      • 6.3.1.1. Market Size & Forecast
        • 6.3.1.1.1. By Value
      • 6.3.1.2. Market Share & Forecast
        • 6.3.1.2.1. By Resin Type
        • 6.3.1.2.2. By End User
    • 6.3.2. India Encapsulation Resins Market Outlook
      • 6.3.2.1. Market Size & Forecast
        • 6.3.2.1.1. By Value
      • 6.3.2.2. Market Share & Forecast
        • 6.3.2.2.1. By Resin Type
        • 6.3.2.2.2. By End User
    • 6.3.3. Australia Encapsulation Resins Market Outlook
      • 6.3.3.1. Market Size & Forecast
        • 6.3.3.1.1. By Value
      • 6.3.3.2. Market Share & Forecast
        • 6.3.3.2.1. By Resin Type
        • 6.3.3.2.2. By End User
    • 6.3.4. Japan Encapsulation Resins Market Outlook
      • 6.3.4.1. Market Size & Forecast
        • 6.3.4.1.1. By Value
      • 6.3.4.2. Market Share & Forecast
        • 6.3.4.2.1. By Resin Type
        • 6.3.4.2.2. By End User
    • 6.3.5. South Korea Encapsulation Resins Market Outlook
      • 6.3.5.1. Market Size & Forecast
        • 6.3.5.1.1. By Value
      • 6.3.5.2. Market Share & Forecast
        • 6.3.5.2.1. By Resin Type
        • 6.3.5.2.2. By End User

7. Europe Encapsulation Resins Market Outlook

  • 7.1. Market Size & Forecast
    • 7.1.1. By Value
  • 7.2. Market Share & Forecast
    • 7.2.1. By Resin Type
    • 7.2.2. By End User
    • 7.2.3. By Country
  • 7.3. Europe: Country Analysis
    • 7.3.1. France Encapsulation Resins Market Outlook
      • 7.3.1.1. Market Size & Forecast
        • 7.3.1.1.1. By Value
      • 7.3.1.2. Market Share & Forecast
        • 7.3.1.2.1. By Resin Type
        • 7.3.1.2.2. By End User
    • 7.3.2. Germany Encapsulation Resins Market Outlook
      • 7.3.2.1. Market Size & Forecast
        • 7.3.2.1.1. By Value
      • 7.3.2.2. Market Share & Forecast
        • 7.3.2.2.1. By Resin Type
        • 7.3.2.2.2. By End User
    • 7.3.3. Spain Encapsulation Resins Market Outlook
      • 7.3.3.1. Market Size & Forecast
        • 7.3.3.1.1. By Value
      • 7.3.3.2. Market Share & Forecast
        • 7.3.3.2.1. By Resin Type
        • 7.3.3.2.2. By End User
    • 7.3.4. Italy Encapsulation Resins Market Outlook
      • 7.3.4.1. Market Size & Forecast
        • 7.3.4.1.1. By Value
      • 7.3.4.2. Market Share & Forecast
        • 7.3.4.2.1. By Resin Type
        • 7.3.4.2.2. By End User
    • 7.3.5. United Kingdom Encapsulation Resins Market Outlook
      • 7.3.5.1. Market Size & Forecast
        • 7.3.5.1.1. By Value
      • 7.3.5.2. Market Share & Forecast
        • 7.3.5.2.1. By Resin Type
        • 7.3.5.2.2. By End User

8. North America Encapsulation Resins Market Outlook

  • 8.1. Market Size & Forecast
    • 8.1.1. By Value
  • 8.2. Market Share & Forecast
    • 8.2.1. By Resin Type
    • 8.2.2. By End User
    • 8.2.3. By Country
  • 8.3. North America: Country Analysis
    • 8.3.1. United States Encapsulation Resins Market Outlook
      • 8.3.1.1. Market Size & Forecast
        • 8.3.1.1.1. By Value
      • 8.3.1.2. Market Share & Forecast
        • 8.3.1.2.1. By Resin Type
        • 8.3.1.2.2. By End User
    • 8.3.2. Mexico Encapsulation Resins Market Outlook
      • 8.3.2.1. Market Size & Forecast
        • 8.3.2.1.1. By Value
      • 8.3.2.2. Market Share & Forecast
        • 8.3.2.2.1. By Resin Type
        • 8.3.2.2.2. By End User
    • 8.3.3. Canada Encapsulation Resins Market Outlook
      • 8.3.3.1. Market Size & Forecast
        • 8.3.3.1.1. By Value
      • 8.3.3.2. Market Share & Forecast
        • 8.3.3.2.1. By Resin Type
        • 8.3.3.2.2. By End User

9. South America Encapsulation Resins Market Outlook

  • 9.1. Market Size & Forecast
    • 9.1.1. By Value
  • 9.2. Market Share & Forecast
    • 9.2.1. By Resin Type
    • 9.2.2. By End User
    • 9.2.3. By Country
  • 9.3. South America: Country Analysis
    • 9.3.1. Brazil Encapsulation Resins Market Outlook
      • 9.3.1.1. Market Size & Forecast
        • 9.3.1.1.1. By Value
      • 9.3.1.2. Market Share & Forecast
        • 9.3.1.2.1. By Resin Type
        • 9.3.1.2.2. By End User
    • 9.3.2. Argentina Encapsulation Resins Market Outlook
      • 9.3.2.1. Market Size & Forecast
        • 9.3.2.1.1. By Value
      • 9.3.2.2. Market Share & Forecast
        • 9.3.2.2.1. By Resin Type
        • 9.3.2.2.2. By End User
    • 9.3.3. Colombia Encapsulation Resins Market Outlook
      • 9.3.3.1. Market Size & Forecast
        • 9.3.3.1.1. By Value
      • 9.3.3.2. Market Share & Forecast
        • 9.3.3.2.1. By Resin Type
        • 9.3.3.2.2. By End User

10. Middle East and Africa Encapsulation Resins Market Outlook

  • 10.1. Market Size & Forecast
    • 10.1.1. By Value
  • 10.2. Market Share & Forecast
    • 10.2.1. By Resin Type
    • 10.2.2. By End User
    • 10.2.3. By Country
  • 10.3. MEA: Country Analysis
    • 10.3.1. South Africa Encapsulation Resins Market Outlook
      • 10.3.1.1. Market Size & Forecast
        • 10.3.1.1.1. By Value
      • 10.3.1.2. Market Share & Forecast
        • 10.3.1.2.1. By Resin Type
        • 10.3.1.2.2. By End User
    • 10.3.2. Saudi Arabia Encapsulation Resins Market Outlook
      • 10.3.2.1. Market Size & Forecast
        • 10.3.2.1.1. By Value
      • 10.3.2.2. Market Share & Forecast
        • 10.3.2.2.1. By Resin Type
        • 10.3.2.2.2. By End User
    • 10.3.3. UAE Encapsulation Resins Market Outlook
      • 10.3.3.1. Market Size & Forecast
        • 10.3.3.1.1. By Value
      • 10.3.3.2. Market Share & Forecast
        • 10.3.3.2.1. By Resin Type
        • 10.3.3.2.2. By End User

11. Market Dynamics

  • 11.1. Drivers
  • 11.2. Challenges

12. Market Trends & Developments

  • 12.1. Recent Developments
  • 12.2. Product Launches
  • 12.3. Mergers & Acquisitions

13. Global Encapsulation Resins Market: SWOT Analysis

14. Porter's Five Forces Analysis

  • 14.1. Competition in the Industry
  • 14.2. Potential of New Entrants
  • 14.3. Power of Suppliers
  • 14.4. Power of Customers
  • 14.5. Threat of Substitute Product

15. PESTLE Analysis

16. Competitive Landscape

  • 16.1. Henkel AG
    • 16.1.1. Business Overview
    • 16.1.2. Company Snapshot
    • 16.1.3. Products & Services
    • 16.1.4. Financials (As Reported)
    • 16.1.5. Recent Developments
  • 16.2. Hitachi Chemical Industries Co., Ltd.
  • 16.3. Huntsman International LLC
  • 16.4. H.B. Fuller Company
  • 16.5. Acc Silicones Ltd
  • 16.6. BASF SE
  • 16.7. The Dow Chemical Company
  • 16.8. Fuji Chemical Industry Co Ltd
  • 16.9. Shin-Etsu Chemical Co Ltd.
  • 16.10. Robnor ResinLab Ltd

17. Strategic Recommendations

18. About Us & Disclaimer