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市場調查報告書
商品編碼
1534979

中國的體(區)域控制器·晶片產業(2024年)

Body (Zone) Domain Controller and Chip Industry Research Report, 2024
出版日期: | 出版商: ResearchInChina | 英文 360 Pages | 商品交期: 最快1-2個工作天內

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簡介目錄

整合化是降低車輛成本的最重要手段。身體領域內的功能整合非常普遍。 BCM、座椅、PEPS、TPMS、配電箱和網關等傳統功能傾向於集中控制。分區是整合跨域設計的自然結果，可以減少線束、降低車輛成本並提高效率。傳統的BCM（車身控制模組）正在演進為BDC（車身域控制器）和ZCU（區域控制單元）。

區域控制單元（ZCU）是基於BDC並依照實體區域連接到車輛的設備。目前主要整合了車輛控制單元（VCU）、熱管理系統（TMS）和車身控制模組（BCM）三大模組，支援區內電器三大功能，即配電、通訊閘道、標準允許I/O 控制。專區架構的核心價值在於，透過軟體和硬體的分離，實現電子電氣的高度整合連接和標準化的面向服務的接口，允許硬體平台的複用和更快的目標，從而實現高效的功能更新和迭代以及加速汽車智能化發展。

從主機廠規劃的中央運算+區域控制架構來看，ZCU目前已成定型，但量產進度卻相差甚遠。小鵬、廣汽、小米、一汽紅旗、奇瑞等都在量產最新車型的ZCU，蔚來、利達汽車、長城汽車、大眾、寶馬、沃爾沃等國外整車廠也計劃從2017年開始發布ZCU。從2024年到2026年。

長安汽車SDV架構：此架構由C2（中央電腦）+EDC（體驗電腦）組成的中央運算平台和三個VIU（車輛整合單元）組成。 C2提供高達508TOPS的運算能力，EDC提供2000GFLOPS的圖形運算能力，提供排序、集中、合理定位的整車運算能力。

長安汽車表示，隨著傳統BCM向BDC、VIU演進，整合化程度將逐步提升，整合範圍也將從傳統車身拓展至動力、底盤、熱管理等領域。隨著集成度的提高，I/O 的數量也會增加。從BCM到VIU，整合I/O數量從100多個增加到800多個，並且透過拆分為多個VIU，可以縮小單一控制器的尺寸。

ZCU整合控制功能，配備高效能MCU，消除MCU分散性。

在區域架構中，域網關演變成區域網關，ZCU負責區域資訊中心和網關的部分功能，負責區域內各子模組之間的通訊管理和資訊傳遞。區域架構將每個控制器視為由網關控制的區域，網關放置在它們負責的元件附近，每個區域網關連接到中央運算平台。

ATECH左右I/O核心VIU：VIU基於服務導向的架構（SOA），整合了傳統的BCM功能，以及空調熱管理、閘道器、車窗防夾功能。具有較高運算能力的網域控制器可作為CAN網關和乙太網路網關的角色。

在區域架構中，ZCU整合了多種ECU功能。通常需要多核心 MCU 來實現多種功能。多核心 MCU 允許每個核心執行單一功能。此外，ZCU的主控MCU要求更高的運算效能和儲存能力、豐富的CAN/LIN和高速汽車乙太網路通訊介面以及較低的功耗指標。

本報告提供中國的體(區)域控制器·晶片產業調查分析，提供１級供應商趨勢，及國內外的解決方案供應商等資訊。

目錄

第1章 體(區)域控制器概要

  • 車身控制功能的發展軌跡
  • BDC 的發展與演變
  • ZCU的主要特點
  • 主體（區域）網域控制站市場

第2章 １級供應商的體(區)域控制器的概要與趨勢

  • 一級供應商機構（區域）網域控制站摘要
  • 趨勢總結（一）：體（區）域控制器與配電功能整合
  • 趨勢總結（二）：主體（Zone）域整合網關
  • 趨勢總結（三）：車身（區域）域、電源域、底盤域整合

第3章 體(區)域控制器的晶片利用

  • MCU
  • MOSFET
  • HSD晶片
  • 通訊晶片

第4章 OEM的體(區)域控制器解決方案

  • 體(區)域控制器OEM的裝載
  • Tesla
  • Li Auto
  • NIO
  • Xpeng
  • Leapmotor
  • Neta
  • Xiaomi
  • AITO
  • Changan
  • GAC
  • SAIC
  • Great Wall Motor
  • BYD
  • Geely
  • Voyah
  • FAW Hongqi
  • BMW
  • Volvo
  • Volkswagen

第5章 國外的體(區)域控制器解決方案供應商

  • Aptiv
  • Marelli
  • Continental
  • UAES

第6章 中國的體(區)域控制器解決方案供應商

  • Jingwei Hirain
  • Steelmate
  • YF Tech
  • Nobo Automotive Technology
  • KEBODA
  • OFILM
  • ATECH
  • FMT
  • Rothwell
  • Linked Intelligent Technology
  • Desay SV
  • G-Pulse
簡介目錄
Product Code: XX011

Research on body (zone) domain controller: an edge tool to reduce vehicle costs, and enable hardware integration + software SOA.

Integration is the most important means to lower vehicle costs. Function integration within the body domain has become widespread. Traditional BCM, seat, PEPS, TPMS, power distribution box, gateway and other functions tend to be controlled in a centralized way. Zoning is the inevitable result of cross-domain integration design, which can reduce wiring harnesses and help reduce vehicle costs and improve efficiency. Traditional BCM (body control module) is evolving towards BDC (body domain controller) and ZCU (zone control unit).

Zone control unit (ZCU) is a device based on BDC and connected to the vehicle according to the physical zone. At present, it mainly integrates three modules, i.e., vehicle control unit (VCU), thermal management system (TMS), and body control module (BCM), and enables three functions of electrical appliances in the zone, i.e., power distribution, communication gateway and standard I/O control. The core value of zonal architecture is to create highly integrated electronic and electrical connections and standardized and service-oriented interfaces by separating software and hardware, realize hardware platform reuse and faster and more efficient function updates and iterations, and accelerate the development of vehicle intelligence.

Seen from the central computing + zone control architecture planned by OEMs, their ZCUs now have taken shape, but their progress in mass production varies greatly. Xpeng, GAC, Xiaomi, FAW Hongqi and Chery among others have mass-produced ZCUs for their latest models, while NIO, Neta Auto, Great Wall Motor and foreign OEMs like Volkswagen, BMW and Volvo will mass-produce ZCUs and install them in vehicles during 2024-2026.

Changan's SDV architecture: the architecture consists of a central computing platform composed of C2 (central computer) + EDC (experience computer), and three vehicle integration units (VIUs). Wherein, C2 delivers computing power of up to 508TOPS, and EDC offers graphics compute of 2000GFLOPS, realizing classified, centralized and reasonably arranged full-vehicle computing power.

According to Changan, as traditional BCM evolves into BDC and VIU, the integration level is gradually improved and the integration scope is also expanded from traditional body to power, chassis, thermal management and other domains. The higher integration level makes the number of I/Os increase. From BCM to VIU, the number of I/Os integrated has increased from 100+ to 800+, and the size of a single controller can be reduced by dividing it into several VIUs.

ZCU integrates control functions and is equipped with a high-performance MCU, eliminating scattered MCUs.

Under zonal architecture, the domain gateway will evolve into a zonal gateway, and ZCU will take on some functions of the zone information center and gateway and be responsible for communication management and information forwarding between submodules in the zone. The zonal architecture takes each controller as a zone controlled by a gateway which is placed near the components it takes charge of, and each zonal gateway is connected to the central computing platform.

ATECH's left and right I/O core VIUs: VIU is based on service-oriented architecture (SOA) and integrates air conditioning thermal management, gateway and window anti-pinch functions in addition to functions of traditional BCM. The domain controllers with relatively high computing power will take on the role of CAN gateway and Ethernet gateway.

In zonal architecture, a ZCU will integrate multiple ECU functions. A multi-core MCU is often required to implement multiple functions. In the multi-core MCU, each core can run a single function. In addition, the master MCU in the ZCU will require higher computing performance and storage capacity, rich CAN/LIN and high-speed vehicle Ethernet communication interfaces, and lower power consumption indicators.

E3650, the ZCU MCU product of SemiDrive: In April 2024, SemiDrive launched a new-generation ZCU product family, coveting I/O-rich ZCU, control-integrated ZCU and compute-intensive ZCU and targeting core application scenarios such as body control, and body + chassis + power cross-domain integration. Wherein, E3650 is SemiDrive's flagship chip product designed for new-generation cross-domain integrated control ZCU applications.

Based on ASIL-D functional safety level, SemiDrive E3650 includes 4 ARM Cortex R52+ high-performance lock-step multi-core clusters. In terms of storage, it integrates 16MB embedded non-volatile memory with large-capacity SRAM. As for information security, it integrates Xuanwu Ultra Secure Hardware Security Module (HSM), and complies with the information security standards of ISO 21434, Evita Full and above, better meeting the needs of vehicle models going overseas. It uses the SSDPE (Super Speed Data Packet Engine), a hardware communication acceleration engine which achieves zero data packet loss when all CAN-FDs work simultaneously, effectively reducing CPU load and improving communication throughput. For low-power body application scenarios, E3650 can use a proprietary wake-up detection engine and a low-power CPU to reduce the overall static power consumption.

Infineon AURIX TC4x: TC4x microcontroller is designed by Infineon for ZCU and HPC applications. To satisfy the requirements of ZCU architecture and realize the multi-ECU integration of ZCU, Infineon Aurix TC4x microcontroller gets upgraded in terms of functional safety, information security, high-speed internal communication routing and core. The MCU contains 6 TriCore 1.8 embedded cores, and the clock frequency of each core can reach up to 500MHz.

As intelligent driving booms, foundation models require higher computing power. To this end, Infineon integrates a PPU (Parallel Processing Unit) in TC4x products to implement models that require massive data processing or fast execution time, for example, signal filtering, algorithm processing and model predictive control. With higher computing efficiency, the PPU undertakes complex signal processing and mathematical operations such as AI, motor control, and zone control, for Tricore cores which are mainly used for control. After integrating the PPU coprocessor, TC4x boasts computing power of 8000DMIPS+72GFLOPS*1, of which the PPU contributes 72GFLOPS.

At present, Infineon's Aurix TC4x microcontroller has been used to develop multiple ZCUs, including ZCU platforms of Tier1s like Continental, G-Pulse Electronics and Marelli.

Marelli ZCU: In April 2024, Marelli announced a zone control unit (ZCU) based on Infineon's AURIX TC4x microcontroller. Placed in specific zones of the vehicle and manage various functions, the ZCU consolidates electronic control units (ECUs) from multiple domains - including lighting, body, audio, power distribution, propulsion, thermal management, chassis control, and vehicle diagnostics. These solutions, combined with service-oriented software and cloud virtualization, enable customization of key vehicle performance through customized application software and functions.

ZCU integrates power distribution function and realizes intelligent power distribution via e-Fuse.

Under zonal architecture, the power distribution mode of vehicles will change from traditional fuse box power distribution to ZCU power distribution. ZCU integrates the surrounding electronic systems according to the physical location, with the integrated functions including BCM, power, chassis, thermal management and gateway. For the working voltages of the connected sensors and actuators are inconsistent, ZCU needs to be responsible for power supply and power management of electrical appliances in the zone to improve power efficiency and safety.

ZCU power supply adopts hierarchical distribution.

Under zonal architecture, zonal power supply generally adopts a hierarchical distribution method: 1. Primary distribution network (backbone power supply network) that requires dual power supplies (redundant backup) to transmit power from the backbone network to ZCUs; 2. Secondary distribution network where ZCU is responsible for further transmitting power downward to the underlying controller.

G-Pulse Electronics' power distribution solution based on "1+1+N" architecture: the architecture is composed of 1 central computing unit, 1 intelligent power distribution unit, and 4 ZCUs. Wherein, the intelligent power distribution unit includes primary power distribution, and can act as a separate power distribution controller, or integrate with the front zone control unit (FZCU) to form a primary and secondary power distribution solution, thus saving a primary power distribution unit. ZCUs are based on Infineon Aurix TC4x family, with different configurations required for customers' vehicle models.

The front zone control unit (FZCU) in this solution integrates primary and secondary power distribution, front cabin thermal management and other functions. It is connected to two DCDC converters plus a battery for power redundancy. The primary power distribution provides a power distribution solution for the left/right/rear zone control unit through the front zone; the left/right/rear zone control unit each provide a secondary power distribution channel, and there is also a two-layer stacking board approach (1 distribution board + 1 control board) in the front zone, which allows for better centralization and better isolation and power distribution, including the thermal management and drive requirements of the front cabin.

Jingwei Hirain's physical ZCU: the ZCU meets ASIL B/D functional safety requirements, and integrates the signal acquisition and load drive of the new energy power domain, partial chassis domain, body comfort, and air conditioning thermal management control, as well as primary power distribution, secondary power distribution and zonal gateway functions. The hardware architecture is based on a multi-core MCU processor, deploys standard AUTOSAR CP software, and integrates electromechanical control algorithms such as power distribution algorithm, DC motor closed-loop control algorithm and anti-pinch algorithm, thermal protection algorithm, and authentication and localization algorithms for entry and startup.

ZCU realizes intelligent power distribution via e-Fuse.

ZCU will use e-Fuse (intelligent fuse module) to replace the traditional relay + fuse solution. e-Fuse is an integrated circuit that integrates MOSFET, drive, logic circuit, diagnosis and other modules on a single chip. It adopts a software protection strategy for circuit detection, diagnosis and OTA updates to achieve intelligent power distribution and energy-efficient scheduling, thereby reducing energy consumption and increasing cruising range.

UAES: UAES's ZCU uses e-Fuse for intelligent power distribution and supports fault diagnosis and fuse self-recovery. Jointly created by UAES and TE Connectivity, this local power distribution network management solution optimizes the matching of E-fuse and wiring harness design in intelligent power distribution scenarios. Through e-Fuse intelligent power distribution, it enables separate and directional power distribution control according to working requirements of ECUs. It can cut vehicle wiring harness length by 25%, optimize wiring harness path by 28%, and reduce the number of vehicle distribution circuits by 10%.

UAES' explorations in intelligent power distribution application in ZCU:

Case 1: When charging, cut off body-related radars to reduce power consumption and increase charging speed;

Case 2: In sentry mode (i.e., when a vehicle is in the parking state, once it is hit or moved, the exterior camera will record surroundings and notify the owner via mobile phone APP), cut off all controllers related to intelligent driving to save power and increase cruising range;

Case 3: When the system predicts thermal runaway risks, only retain the power consumption of safety-related components to lower the risks; in addition, upload the accessory data to allow customers to obtain power usage of most ECU controllers in different scenarios, optimizing overall power distribution of the vehicle.

ZCU software: Implement function call and platform-based portability via SOA, helping to cut costs.

As the I/O control center in a zone, ZCU not only integrates functions of individual body domain controllers such as air conditioning control, door control, and seat control, but will also gradually integrate more cross-domain function modules such as suspension control and radar interface in the future. Wherein, most of logical calculations of software will be moved up to the central computing platform, and ZCU will only be responsible for signal acquisition and hardware driver at the bottom layer, so that I/O can be extracted from the central computing platform, realizing separation of software and hardware and making it easier for OEMs to integrate functions across domains.

To reduce costs, ZCU needs to improve scalability and versatility, and use standardized hardware platforms to adapt to different vehicle configurations of various OEMs. ZCU also makes a gradual shift from signal-based services to service-based SOA design. This process requires ZCU to standardize interfaces, transform services, and manage packaging at the function level (body comfort, AC, chassis, HCU, etc.) to facilitate the central computing platform to flexibly call functions. Therefore, ZCU requires a highly integrated, standardized, and customizable design.

Continental: For software solutions for the body domain and actuators, Continental has launched the "Function as a Product" service, which can be quickly integrated into vehicle cross-domain products. For example, there are corresponding software kits for various body domain functions such as window lifting, trunk control, seat adjustment, seat heating, power doors, and exterior lighting control.

UAES USP 2.0 Developer Platform:The USP 2.0 platform can integrate nearly 20 independent ECUs through zonal architecture, increasing the communication rate from 2M to up to 1000M. On the USP2.0 platform, services that can be called have penetrated into fields of body control, energy management, motion control, thermal management, etc. Currently it has 951 basic functions, 126 atomic services and 105 basic services, and can provide 1,100+ vehicle APIs, 65 OTA APIs and 55 AI operators. These APIs and operators can help developers easily realize cross-domain application scenarios for vehicles.

Table of Contents

1 Overview of Body (Zone) Domain Controllers

  • 1.1 Development Path of Body Control Functions
    • 1.1.1 Development Path of Body Control Functions
    • 1.1.2 Advantages of Zone Control
    • 1.1.3 Architecture of Body (Zone) Domain Controllers
  • 1.2 Development and Evolution of BDCs
    • 1.2.1 Main Integrated Functions of BDCs
    • 1.2.2 Solutions of Integrating BDCs with Air Conditioning Systems
    • 1.2.3 Functional Integration of BDCs of Tier 1 Suppliers
    • 1.2.4 Hardware Architecture of Body (Zone) Domain Controllers
    • 1.2.5 Features of BDC Hardware Platforms (1): Output Control
    • 1.2.6 Features of BDC Hardware Platforms (2): Input Acquisition (1)
    • 1.2.7 Features of BDC Hardware Platforms (2): Input Acquisition (2)
    • 1.2.8 BDC Load Driver Chips:
    • 1.2.9 BDC Hardware Design Based on SemiDrive G9X (1)
    • 1.2.10 BDC Hardware Design Based on SemiDrive G9X (2)
    • 1.2.11 BDC Hardware Design Based on SemiDrive G9X (3)
    • 1.2.12 BDC Hardware Design Based on SemiDrive G9X (4)
    • 1.2.13 BDC Hardware Design Based on SemiDrive G9X (5)
  • 1.3 Main Functions of ZCUs
    • 1.3.1 Main Integrated Functions of ZCUs
    • 1.3.2 Functions of ZCUs (1): Zonal Power Supply Centers
    • 1.3.3 Functions of ZCUs (2): Zonal Information Centers
    • 1.3.4 Functions of ZCUs (3): Zonal Functions and Drive Centers
    • 1.3.5 ZCU Design Solutions
    • 1.3.6 Advantages of ZCUs (1)
    • 1.3.7 Advantages of ZCUs (2)
    • 1.3.8 Advantages of ZCUs (3)
  • 1.4 Body (Zone) Domain Controller Market
    • 1.4.1 Content-per-car Value of BDCs
    • 1.4.2 Penetration Rate of BDCs in Chinese Passenger Cars, 2023
    • 1.4.3 China's Passenger Car Body (Zone) Domain Controller Market Size, 2023-2027E
    • 1.4.4 OEM Market Share of Passenger Car BCM Suppliers in China, 2023

2 Summary and Trend of Body (Zone) Domain Controllers of Tier 1 Suppliers

  • 2.1 Summary of Body (Zone) Domain Controllers of Tier 1 Suppliers
    • 2.1.1 Summary of Body (Zone) Domain Controllers of Tier 1 Suppliers (1)
    • 2.1.2 Summary of Body (Zone) Domain Controllers of Tier 1 Suppliers (2)
    • 2.1.3 Summary of Body (Zone) Domain Controllers of Tier 1 Suppliers (3)
    • 2.1.4 Summary of Body (Zone) Domain Controllers of Tier 1 Suppliers (4)
    • 2.1.5 Summary of Body (Zone) Domain Controllers of Tier 1 Suppliers (5)
    • 2.1.6 Summary of Body (Zone) Domain Controllers of Tier 1 Suppliers (6)
    • 2.1.7 Summary of Body (Zone) Domain Controllers of Tier 1 Suppliers (7)
    • 2.1.8 Summary of Body (Zone) Domain Controllers of Tier 1 Suppliers (8)
    • 2.1.9 Summary of Body (Zone) Domain Controllers of Tier 1 Suppliers (9)
    • 2.1.10 Summary of Body (Zone) Domain Controllers of Tier 1 Suppliers (10)
  • 2.2 Summary of Trends (1): Integration of Body (Zone) Domain Controllers and Power Distribution Functions
    • 2.2.1 Intelligent power distribution boxes integrated with BCM Functions
      • 2.2.1.1 Summary of Intelligent Power Distribution Boxes Integrated with BCM Functions
      • 2.2.1.2 Solutions of Intelligent Power Distribution Boxes Integrated with BCM Functions (1)
      • 2.2.1.3 Solutions of Intelligent Power Distribution Boxes Integrated with BCM Functions (2)
      • 2.2.1.4 Solutions of Intelligent Power Distribution Boxes Integrated with BCM Functions (3)
      • 2.2.1.5 Integration of Intelligent Power Distribution Boxes and Some BCM Functions
      • 2.2.1.6 Intelligent Power Distribution Box Cost Analysis after Mass Production
    • 2.2.2 Integration of Intelligent Power Distribution Boxes and ZCUs
      • 2.2.2.1 ZCU Power Distribution and Intelligent Power Management
      • 2.2.2.2 Two Power Distribution Solutions for BDCs Based on Semiconductor Devices
      • 2.2.2.3 Power Distribution Modules in Zone Control Architecture
      • 2.2.2.4 ZCUs: Technical Advantages of Intelligent Power Distribution Technology
      • 2.2.2.5 Intelligent Power Distribution of ZCUs: e-Fuse
      • 2.2.2.6 Design of Combining PNC with E-FUSE in ZCUs (1)
      • 2.2.2.7 Design of Combining PNC with E-FUSE in ZCUs (2)
      • 2.2.2.8 ZCU Power Distribution Cases (1)
      • 2.2.2.9 ZCU Power Distribution Cases (2)
  • .......
      • 2.2.2.16 ZCU Power Distribution Cases (7)
    • 2.2.3 Load Power Supply of ZCUs: 12V -> 48V
      • 2.2.3.1 ZCUs Facilitate the Upgrade of Low-voltage Power Systems from 12V to 48V
      • 2.2.3.2 Tesla Designs the Transformer Module in ECU to Adapt to 48V Low-voltage Architecture
      • 2.2.3.3 Tesla Plans to Redesign All ECUs and Completely Cancel 12V Power Supply
      • 2.2.3.4 ZCU with 48V E-fuse (1)
      • 2.2.3.5 ZCU with 48V E-fuse (2)
      • 2.2.3.6 ZCU with 48V E-fuse (3)
  • 2.3 Summary of Trends (2): Body (Zone) Domain Integrated Gateways
    • 2.3.1 Summary of Products Integrating Body (Zone) Domain Controllers with Gateways (1)
    • 2.3.2 Summary of Products Integrating Body (Zone) Domain Controllers with Gateways (2)
    • 2.3.3 Summary of Products Integrating Body (Zone) Domain Controllers with Gateways (3)
    • 2.3.4 Cases of Integration between Body (Zone) Domain Controllers and Gateways (1)
    • 2.3.5 Cases of Integration between Body (Zone) Domain Controllers and Gateways (2)
    • 2.3.6 Cases of Integration between Body (Zone) Domain Controllers and Gateways (3)
    • 2.3.7 Cases of Integration between Body (Zone) Domain Controllers and Gateways (4)
    • 2.3.8 Cases of Integration between Body (Zone) Domain Controllers and Gateways (5)
    • 2.3.9 Application Cases of Integration between OEM Body (Zone) Domain Controllers and Gateways (1)
    • 2.3.10 Application Cases of Integration between OEM Body (Zone) Domain Controllers and Gateways (2)
    • 2.3.11 Application Cases of Integration between OEM Body (Zone) Domain Controllers and Gateways (3)
    • 2.3.12 Application Cases of Integration between OEM Body (Zone) Domain Controllers and Gateways (4)
  • 2.4 Summary of Trends (3): Integration of Body (Zone) Domain with Power Domain and Chassis Domain
    • 2.4.1 Summary of Cross-domain Fusion Products in the Body Domain (1)
    • 2.4.2 Summary of Cross-domain Fusion Products in the Body Domain (2)
    • 2.4.3 Cases of Body Domain Integrated Computing (1)
    • 2.4.4 Cases of Body Domain Integrated Computing (2)
    • 2.4.5 Cases of Body Domain Integrated Computing (3)

3 Chip Application of Body (Zone) Domain Controllers

  • 3.1 MCUs
    • 3.1.1 Summary of Body (Zone) Domain Controllers (MCUs) (1)
    • 3.1.2 Summary of Body (Zone) Domain Controllers (MCUs) (2)
    • 3.1.3 Summary of Body (Zone) Domain Controllers (MCUs) (3)
    • 3.1.4 Summary of Body (Zone) Domain Controllers (MCUs) (4)
    • 3.1.5 Summary of Body (Zone) Domain Controllers (MCUs) (5)
    • 3.1.6 Summary of Body (Zone) Domain Controllers (MCUs) (6)
    • 3.1.7 Summary of Body (Zone) Domain Controllers (MCUs) (7)
    • 3.1.8 Body (Zone) Domain Controllers (MCUs) (1)
  • .......
    • 3.1.15 Body (Zone) Domain Controllers (MCUs) (2)
    • 3.1.16 Application Cases of Body (Zone) Domain Controllers (MCUs) (1)
    • 3.1.17 Application Cases of Body (Zone) Domain Controllers (MCUs) (2)
  • ....
    • 3.1.24 Application Cases of Body (Zone) Domain Controllers (MCUs) (7)
    • 3.1.25 Tips for Choosing MCUs of ZCUs
    • 3.1.26 Localization in the Market of MCUs for Body (Zone) Domain Controllers
  • 3.2 MOSFET
    • 3.2.1 Summary of BCM MOSFETs (1)
    • 3.2.2 Summary of BCM MOSFETs (2)
    • 3.2.3 Body (Zone) Domain Controller MOSFET Solutions
    • 3.2.4 High Current Power Distribution Solutions: Driver Chip MOSFET Discrete Solutions
    • 3.2.5 ZCU MOSFET Solutions: Application of Onsemir SmartFET in ZCUs
    • 3.2.6 Onsemir SmartFET: Control and Driving Modes in ZCUs
    • 3.2.7 Application of Onsemi SmartFET: Three Applications of High-side SmartFETs
  • 3.3 HSD Chips
    • 3.3.1 Summary of Body (Zone) Domain Controller HSD Chips (1)
    • 3.3.2 Summary of Body (Zone) Domain Controller HSD Chips (2)
    • 3.3.3 HSD Chips Replace Relays and Fuses in BDCs
    • 3.3.4 Application Cases of Body (Zone) Domain Controller HSD Chips
    • 3.3.5 How to Use HSDs to Drive Headlights?
  • 3.4 Communication Chips
    • 3.4.1 Summary of Body (Zone) Domain Controller Communication Chips (1)
    • 3.4.2 Summary of Body (Zone) Domain Controller Communication Chips (2)
    • 3.4.3 ZCU Communication Chips (1)
  • .....
    • 3.4.8 ZCU Communication Chips (6)
    • 3.4.9 Network Communication Topology of ZCUs under Zonal Architecture

4 Body (Zone) Domain Controller Solutions of OEMs

  • 4.1 Body (Zone) Domain Controller Installation of OEMs
    • 4.1.1 Summary of Body (Zone) Domain Controller Installation of Domestic OEMs (1)
    • 4.1.2 Summary of Body (Zone) Domain Controller Installation of Domestic OEMs (2)
    • 4.1.3 Summary of Body (Zone) Domain Controller Installation of Domestic OEMs (3)
  • ......
    • 4.1.10 Summary of Body (Zone) Domain Controller Installation of Domestic OEMs (10)
    • 4.1.11 Summary of Body (Zone) Domain Controller Installation of Foreign OEMs (1)
    • 4.1.12 Summary of Body (Zone) Domain Controller Installation of Foreign OEMs (2)
  • 4.2 Tesla
    • 4.2.1 Division of Body Control Zone
    • 4.2.2 Body Domain Control Concept: Division by Location, Hardware Standardization and SDV
    • 4.2.3 Distribution of Body ZCUs: Model 3 as an Example
    • 4.2.4 Body Zone Control Design of Model 3 (First Generation)
    • 4.2.5 Technical Features of Body ZCUs of Model 3
    • 4.2.6 Future Trends of Body ZCUs
  • 4.3 Li Auto
    • 4.3.1 LEEA2.0: XCU Fusion (Power, Chassis, Body)
    • 4.3.2 LEEA3.0: CCU Realizes Multi-domain Integration
    • 4.3.3 LEEA3.0: ZCU
  • 4.4 NIO
    • 4.4.1 Evolution of EEA Technology Roadmap
    • 4.4.2 NT2.0: The Interconnected Central Gateway LION Integrates the Body Domain
    • 4.4.3 NT2.0: Body Control Function Architecture of 2023 ES8
    • 4.4.4 NT3.0: "Central Computing + ZCU" Architecture Topology
    • 4.4.5 NT3.0: ZCUs Adopt AMP Micro-core Architecture
  • 4.5 Xpeng
    • 4.5.1 Evolution of EEA Technology Roadmap
    • 4.5.2 X-EEA 3.0: Central Supercomputing (3 Computing Clusters) + Z-DCU)
    • 4.5.3 X-EEA 3.5: Left/Right Domain Controllers - Functional Integration (1)
    • 4.5.4 X-EEA 3.5: Left/Right Domain Controllers - Functional Integration (2)
    • 4.5.5 X-EEA 3.5: Left/Right Domain Controllers - Communication Architecture
    • 4.5.6 X-EEA 3.5: Lighting Electrical Architecture of Xpeng X9
  • 4.6 Leapmotor
    • 4.6.1 Evolution of EEA Technology Roadmap
    • 4.6.2 Four-Leaf Clover: ZCUs
  • 4.7 Neta
    • 4.7.1 Evolution of EEA Technology Roadmap
    • 4.7.2 Shanhai Platform 1.0: Integrated with Gateway Domain Control
    • 4.7.3 Shanhai Platform 1.0: Integrated with Central Domain Control
    • 4.7.4 Shanhai Platform 1.0: ZCUs
  • 4.8 Xiaomi
    • 4.8.1 SU7: E/E Architecture
    • 4.8.2 SU7: Location of ZCUs
    • 4.8.3 SU7: Functions of ZCUs
  • 4.9 AITO
    • 4.9.1 M9: E/E Architecture
    • 4.9.2 M9 Body Functions (1): Left ZCU VIU1
    • 4.9.3 M9 Body Functions (2): Right ZCU VIU2
    • 4.9.4 M9 Body Functions (3): Rear ZCU VIU3
  • 4.10 Changan
    • 4.10.1 Evolution of EEA Technology Roadmap
    • 4.10.2 Development Trend of BCM: BCM->BDC->VIU.
    • 4.10.3 EPA Platform: BDCs of Deepal SL03 and Avatr 11
    • 4.10.4 SDV Architecture: ZCUs Integrate BCM Functions
  • 4.11 GAC
    • 4.11.1 Evolution of EEA Technology Roadmap
    • 4.11.2 X-Soul Architecture: The Central Computing Unit
  • Is Controlled by BDCs
    • 4.11.3 X-Soul Architecture: GAC Central Computing Unit (BDC)
    • 4.11.4 X-Soul Architecture: GAC Central Computing Unit (Body Domain) MCU - NXP S32
    • 4.11.5 X-Soul Architecture: ZCUs
    • 4.11.6 X-Soul Architecture: ZCU ECU Functions of Hyper GT (1)
    • 4.11.7 X-Soul Architecture: ZCU ECU Functions of Hyper GT (2)
    • 4.11.8 X-Soul Architecture: ZCU ECU Functions of Hyper GT (3)
  • 4.12 SAIC
    • 4.12.1 Evolution of EEA Technology Roadmap
    • 4.12.2 Z-One 3.0: 2 Central Computing Units + 4 ZCUs
    • 4.12.3 Z-One 3.0: ZCUs
    • 4.12.4 Z-One 1.0: BDC of SAIC IM LS6/LS7
  • 4.13 Great Wall Motor
    • 4.13.1 Evolution of EEA Technology Roadmap
    • 4.13.2 GEEP 4.0: CCU
    • 4.13.3 GEEP 4.0: VIU
    • 4.13.4 GEEP 5.0: Central Brain + ZCUs
  • 4.14 BYD
    • 4.14.1 Evolution of EEA Technology Roadmap
    • 4.14.2 e3.0: Four Domains (Left/Right Body Domains, Intelligent Domain, Power Domain)
    • 4.14.3 e3.0: Integrated Left/Right BCMs
    • 4.14.4 Xuanji Architecture: Front/Rear Body (Zone) Domain Controllers
    • 4.14.5 DiSus Intelligent Body Control System for New Energy Vehicles
    • 4.14.6 e3.0: Body Control Domain Architecture of 2023 DENZA DM9
    • 4.14.7 e3.0: Overall Interfaces and Interaction of Left BDCs
    • 4.14.8 e3.0: Installation Positions of Seal's BCMs
    • 4.14.9 e3.0: Power Distribution Solutions of Seal's BCMs
    • 4.14.10 e3.0: Main Parts of Seal's BCMs
  • 4.15 Geely
    • 4.15.1 Geely: Evolution of EEA Technology Roadmap
    • 4.15.2 Evolution of ZEEKR EEA: EE 2.0 -> EE 3.0
    • 4.15.3 ZEEKR EEA 2.0: BDCs
    • 4.15.4 ZEEKR EEA 3.0: Central Supercomputing Platform (Integrated with BCMs)
    • 4.15.5 ZEEKR EEA 3.0: ZCUs
    • 4.15.6 ZEEKR EEA 3.0: Intelligent Power Distribution Design of ZCUs (1)
    • 4.15.7 ZEEKR EEA 3.0: Intelligent Power Distribution Design of ZCUs (2)
  • 4.16 Voyah
    • 4.16.1 Central Integrated Architecture: MegEngine Architecture
    • 4.16.2 MegEngine Architecture: OIB
    • 4.16.3 MegEngine Architecture: VIU
  • 4.17 FAW Hongqi
    • 4.17.1 Evolution of EEA Technology Roadmap
    • 4.17.2 FEEA2.0: BDCM
    • 4.17.3 FEEA3.0: Functions of Hongqi EH7's BCM (1) - Intelligent Vehicle Control Platform
    • 4.17.4 FEEA3.0: Functions of Hongqi EH7's BCM (2) - Front Intelligent ZCU
    • 4.17.5 FEEA3.0: Functions of Hongqi EH7's BCM (3) - Middle Intelligent ZCU
    • 4.17.6 FEEA3.0: Rear Intelligent ZCU
  • 4.18 BMW
    • 4.18.1 Evolution of Electronic BDCs (1)
    • 4.18.2 Evolution of Electronic BDCs (2)
    • 4.18.3 Next-generation E/E Architecture: BCM Functions and Gateways Are Integrated into ZCU1
    • 4.18.4 Gen 1 BDC Breakdown
    • 4.18.5 Gen 2 BDC Breakdown
    • 4.18.6 Gen 3 BDC Breakdown
    • 4.18.7 BCP Breakdown (1)
    • 4.18.8 BCP Breakdown (2)
    • 4.18.9 BCP Breakdown (3)
    • 4.18.10 BCP Breakdown (4)
    • 4.18.11 BCP Breakdown (5)
    • 4.18.12 BCP Breakdown (6)
    • 4.18.13 Thinking on the Control over Automotive Ambient Lights under Zonal Architecture
  • 4.19 Volvo
    • 4.19.1 Evolution of EEA Technology Roadmap
    • 4.19.2 CEM Evolution in Body Control Architectures
    • 4.19.3 Body Control: CEM
    • 4.19.4 SPA2: VIU Functions
    • 4.19.5 SPA2: VIU System Architecture
  • 4.20 Volkswagen
    • 4.20.1 Evolution of EEA Technology Roadmap
    • 4.20.2 Architecture of E3 1.1: Functional Partition
    • 4.20.3 Architecture of E3 1.1: ICAS1 Is Extended from BCM
    • 4.20.4 Architecture of E3 1.1: Internal Partition of ICAS1 (1): Functions of ? Diagnostic Controllers
    • 4.20.5 Architecture of E3 1.1: Internal Partition of ICAS1 (2): Functions of ? Performance Processors
    • 4.20.6 Architecture of E3 1.1: Block Diagram of ICAS1 Body Control Connection
    • 4.20.7 Architecture of E3 1.1: ICAS1 Body Control Network Architecture
    • 4.20.8 ICAS1 Body Control Function Implementation Logic (1)
    • 4.20.9 ICAS1 Body Control Function Implementation Logic (2)
    • 4.20.10 Architecture of E3 1.1: Lighting Control Logic
    • 4.20.14 Architecture of E3 1.2: HCP4 Is Responsible for Body Control Functions
    • 4.20.15 CEA: Develop Zonal Control+Quasi-Central Computing Architecture with Xpeng

5 Foreign Body (Zone) Domain Controller Solution Providers

  • 5.1 Aptiv
    • 5.1.1 Layout in Intelligent Connected Products
    • 5.1.2 Smart Vehicle Architecture (SVA)
    • 5.1.3 SVA: Five Computing Platforms
    • 5.1.4 BCMs: Products and Features
    • 5.1.5 CVCs
    • 5.1.6 PDCs
    • 5.1.7 Configuration Solution of PDC
  • 5.2 Marelli
    • 5.2.1 BCMs: Products and Features
    • 5.2.2 ZCUs
    • 5.2.3 Lighting Domain Controllers (1)
    • 5.2.4 Lighting Domain Controllers (2): Hardware Architecture
  • 5.3 Continental
    • 5.3.1 BCMs: Products and Features
    • 5.3.2 ZCUs
    • 5.3.3 Body HPC2 for Cross-domain Vehicle Control
    • 5.3.4 Body HPC
    • 5.3.5 Application Cases of Body HPC
    • 5.3.6 "Software Functions and Products" for Body Domain and Actuators
  • 5.4 UAES
    • 5.4.1 Intelligent Connected Business Layout and Product Supply Model
    • 5.4.2 BCMs: Products and Features
    • 5.4.3 Vehicle Computing Platform (VCP)
    • 5.4.4 ZECUs (1): Main Function Configuration
    • 5.4.5 ZECUs (2): Hardware
    • 5.4.6 ZECUs (3): Power Supply Design
    • 5.4.7 ZECUs (4): Intelligent Power Distribution Application
    • 5.4.8 BDU 8.1
    • 5.4.9 USP (1)
    • 5.4.10 USP (2)

6 Chinese Body (Zone) Domain Controller Solution Providers

  • 6.1 Jingwei Hirain
    • 6.1.1 Body Domain Product Layout
    • 6.1.2 BCMs: Products and Features
    • 6.1.3 CCP
    • 6.1.4 Physical ZCUs
    • 6.1.5 BDCU
  • 6.2 Steelmate
    • 6.2.1 Body Electronics Production Line
    • 6.2.2 BCMs: Products and Features
    • 6.2.3 ZCU&VIU
    • 6.2.4 BDC
  • 6.3 YF Tech
    • 6.3.1 BCMs: Products and Features
    • 6.3.2 BDCs (1)
    • 6.3.3 BDCs (2): Product Functions under the Functional Domain Architecture
    • 6.3.4 BDCs (3): ZCUs in the Central Computing Architecture
  • 6.4 Nobo Automotive Technology
    • 6.4.1 BCMs: Products and Features
    • 6.4.2 Gen 2 BDCs (1): CEM
    • 6.4.3 Gen 2 BDCs (2): Composition of CEM
  • 6.5 KEBODA
    • 6.5.1 Production Lines and Capacity of Automotive Electronic Products
    • 6.5.2 BCMs: Products and Features
    • 6.5.3 BDCs
  • 6.6 OFILM
    • 6.6.1 Body Electronic Business Layout
    • 6.6.2 BCMs: Products and Features
    • 6.6.3 Gen 5 BGMs
    • 6.6.4 Gen 5 BGMs: Software and Hardware
  • 6.7 ATECH
    • 6.7.1 Operation Architecture
    • 6.7.2 BCM Production Lines and Capacity
    • 6.7.3 BCMs: Products and Features
    • 6.7.4 VCC: Three-domain Integration
    • 6.7.5 Left and Right IO Core VIUs
    • 6.7.6 BDC
  • 6.8 FMT
    • 6.8.1 (Zone) Domain Controller Deployment
    • 6.8.2 BCMs: Products and Features
    • 6.8.3 CCU
  • 6.9 Rothwell
    • 6.9.1 BDC Development Plan
    • 6.9.2 Main Functions and Configuration of BDCs
    • 6.9.3 BCMs: Products and Features
    • 6.9.4 Four Platform-based BDCs
  • 6.10 Linked Intelligent Technology
    • 6.10.1 Automotive Electronics Product Layout and Customers
    • 6.10.2 BDC Production Bases and Capacity
    • 6.10.3 BCMs: Products and Features
    • 6.10.4 BDMs
  • 6.11 Desay SV
    • 6.11.1 BCMs: Products and Features
    • 6.11.2 BDCs
  • 6.12 G-Pulse
    • 6.12.1 BCMs: Products and Features
    • 6.12.2 ZCUs
    • 6.12.3 Architectural Design of Four Domains