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1694629

中國的汽車用微控制器單位(MCU)產業(2025年)

Automotive Microcontroller Unit (MCU) Industry Report, 2025

出版日期: 2025年03月20日 | 出版商:

ResearchInChina | 英文 470 Pages | 商品交期: 最快1-2個工作天內

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簡介目錄

智慧汽車控制用中高階MCU已成為國產產品取代國外產品的重要焦點。

隨著軟體定義汽車、智慧化、電動化的發展趨勢，智慧汽車控制領域對高性能、高可靠的汽車MCU的需求日益增長。預計2027年中國乘用車 "準中央+區域" 架構滲透率將達到16.3%，其中 "中央+區域" 架構滲透率將達到14.3%，將大幅拉動中高階汽車MCU需求。

目前，汽車MCU的製程節點主要在40nm以上，且已成熟。隨著EEA的發展，一些先進的汽車MCU產品可能會採用28/22nm工藝，甚至更先進的16/18nm工藝。

智慧型汽車控制中高階MCU主要搭載在區域控制單元（ZCU）、中央域控制單元（XCU）、自動駕駛、動力/底盤域控制單元、中央運算單元（CCU）等。應用場景包括電動輔助轉向系統、電子穩定控制系統、懸吊系統、防鎖死煞車系統、安全氣囊系統、新能源汽車逆變器、電池管理系統等。英飛凌、瑞薩等公司已憑藉涵蓋16至28nm製程節點的TC4x和RH850系列，在自動駕駛和動力/底盤領域佔據高階市場。

同時，一些中國晶片廠商也逐漸取得技術突破，在智慧汽車控制的中高階MCU領域具備取代國外廠商的能力。

芯馳科技：2022年4月，芯馳科技推出了高性能MCU產品E3系列。此晶片及金鑰分組軟體通過ISO 26262 ASIL D功能安全產品認證及中國II類加密認證，硬體安全模組支援高等級資訊安全。 E3系列目前廣泛應用於區域控制、車身控制、電力驅動、電池管理系統（BMS）、智慧底盤、ADAS等核心領域，並整合了關鍵汽車應用領域的量產經驗。出貨量已達數百萬台，並實現40餘款主力車型量產。

芯海科技：2024年，我們推出了符合AEC-Q100 2級標準的32位通用汽車MCU CS32F036Q。

C*Core技術：CCFC2003PT、CCFC2006PT系列晶片是引擎控制MCU的替代產品。

同芯微：ASIL-D認證THA6系列進軍電源領域市場。

2024年，芯馳科技將以下一代區域控制單元（ZCU）為核心，進一步完善E3系列產品陣容，並針對Zone EEA核心應用場景，推出車身控制、車身+底盤+動力跨域融合、超級動力域控制等ZCU協同解決方案。以 CPU/NVM 和可用的 GPIO 作為水平軸和垂直軸，該產品組合包括 E3119、E3620B、E3650 和 E3800。

其中，面向智慧控制的旗艦MCU產品E3650，專為區域控制單元（ZCU）、域控制單元（DCU）等應用場景設計。

本報告對中國汽車微控制器（MCU）行業進行了分析，提供了市場規模、設計趨勢、應用場景、國內外供應商等資訊。

In the trends towards software-defined vehicles, intelligence, and electrification, the intelligent vehicle control sector has higher requirements for high-performance, high-reliability automotive MCUs. It is estimated that in 2027, the penetration rate of "quasi-central + zonal" architecture in China's passenger cars will hit 16.3%, and that of "central + zonal" architecture will reach 14.3%, giving a big boost to the demand for mid-to-high-end automotive MCUs.

Currently, automotive MCU process nodes are primarily at 40nm and above, and mature. With the evolution of EEA, some advanced automotive MCU products will increasingly adopt 28/22nm process or even more advanced 16/18nm.

Mid-to-high-end MCUs for intelligent vehicle control are mainly deployed in zone control units (ZCU), central domain control units (XCU), autonomous driving and power/chassis domain control units, and central computing units (CCU). Application scenarios include electric power steering systems, electronic stability control systems, suspension systems, anti-lock braking systems, airbag systems, new energy vehicle inverters, and battery management systems. Companies like Infineon and Renesas dominate the high-end markets of autonomous driving and power/chassis domains with TC4x and RH850 series, which already cover 16-28nm process nodes.

Meanwhile, some Chinese chip vendors have gradually made technological breakthroughs and had the ability to replace their foreign peers in mid-to-high-end MCUs for intelligent vehicle control:

SemiDrive: In April 2022, SemiDrive launched its high-performance MCU product, the E3 Series. The chips and key grouped software have passed ISO 26262 ASIL D functional safety product certification and China's Class II cryptographic certification, with hardware security modules supporting high-level information security. The E3 Series is now widely used in core areas such as zone control, body control, electric drive, battery management system (BMS), intelligent chassis, and ADAS, and incorporates mass-production experience in critical vehicle applications. With shipments up to millions of units, it has been mass-produced for over 40 mainstream vehicle models.

Chipsea: In 2024, it launched CS32F036Q, a 32-bit general-purpose automotive MCU compliant with AEC-Q100 Grade 2.

C*Core Technology: CCFC2003PT and CCFC2006PT series chips have been an alternative to engine control MCUs.

Tongxin Micro: The THA6 series, ASIL-D certified, has entered the power domain market.

In 2024, SemiDrive further improved its E3 series product lineup, focusing on the next-generation zone control units (ZCU), and introduced a ZCU cooperative solution targeting core application scenarios in zonal EEA, including body control, body + chassis + power cross-domain integration, and super power domain control. Using CPU/NVM and available GPIO as transverse and longitudinal axes, this portfolio includes the E3119, E3620B, E3650, and E3800.

First Tier: E3119/E3118/E3119-IOE

IO and IO-rich products capable of supporting development of entry-level ZCUs for traditional gateways, body control, and anti-pinch applications.

Compact packaging, supporting SMP and FOTA, and 10x CANFD and 1x Gbit, with up to 326 IOs, and also paired with second- or third-tier products.

Second Tier: E3620B

Primarily used for advanced integrated ZCUs, enabling further integration of power and chassis domains, and also paired with first- or third-tier products.

Hardware-level communication engine SSDPE and multi-channel Gbit transmission capacity.

Third Tier: E3650

Balance computing power, storage, high functionality, low power consumption, low communication latency, and ring network capabilities, making it the preferred choice in 48V domain controller platforms. It can also be paired with first-tier products.

Feature a multi-core high-compute cluster, the largest number of available GPIOs on the market, leading virtualized mass-production experience, hardware-level communication engine SSDPE, and multi-channel Gbit transmission capacity.

Fourth Tier: E3800

Super power domain integration, featuring more scenario-specific acceleration co-processors and more advanced high-speed interfaces.

Among them, the flagship MCU product for intelligent control, E3650, is specifically designed for application scenarios such as zone control units (ZCU) and domain control units (DCU).

Nearly a 40% surge in computing power, and a 30% expansion in storage capacity: It adopts the latest ARM Cortex R52+ high-performance lockstep multi-core cluster, with main frequency up to 600MHz, the highest in its class, and packs the largest storage capacity in the same tier.

30% more available peripherals and GPIOs: It integrates multiple peripheral BOM devices and is configured with the largest number of available GPIOs on the market, significantly reducing various peripheral IO expansion chips required for the system.

50% improvement in low-power performance: It features a built-in hardware communication acceleration engine that offloads communication task processing in domain control, reducing packet loss and latency while significantly lowering the load on the main CPU.

Ceiling-level information security protection: It integrates the SemiDrive Xuanwu Ultra-Secure HSM (Hardware Security Module), and supports OEMs' customized and complex encryption/decryption algorithms. It complies with ISO 21434, Evita Full, and higher information security standards, and meets both domestic and overseas high-level security standards.

Additionally, E3650 has been specifically optimized for virtualization (Hypervisor) support on MCU systems, offering a production-ready virtual solution to help OEMs achieve efficient business isolation and code integration. E3650 not only covers four core application scenarios of intelligent driving/intelligent cockpit, power domain control, VMC chassis domain control, and zone control unit, but also reduces BOM costs by nearly 60% (varying by system design) thanks to its higher integration level. Currently, E3650 has officially begun customer sampling and has been designated by multiple leading OEMs.

RISC-V architecture is bringing new opportunities in automotive MCU market, and Chinese players work to build an independent, controllable supply chain.

Core architectures for automotive MCUs are relatively diverse. Mainstream ARM architecture-based processors currently dominate the global market in intelligent cockpits, vehicle entertainment, and ADAS, but their percentage in body domain controller, chassis, and powertrain applications is relatively small, where Power PC and Infineon TriCore architectures prevail.

With the rise of the new open-source RISC-V architecture, Chinese and foreign IP suppliers have launched over a dozen series of automotive-grade IPs, covering general-purpose, high-performance MCUs and security chip IPs, and basically meeting current demand for automotive control chips. On this basis, chip vendors are now developing high-performance RISC-V chips for body, powertrain, and chassis applications.

In 2023, Qualcomm, NXP, Bosch, Infineon, and Nordic Semiconductor jointly invested in a company aimed at advancing the adoption of RISC-V. The company will be a single source to enable compatible RISC-V based products, provide reference architectures, and help establish solutions widely used in the industry. Initial application focus will be automotive.

In 2024, Renesas announced R9A02G021, the industry's first general-purpose 32-bit RISC-V-based microcontroller (MCU), designed to withstand harsh conditions. Consuming extremely low power in standby, it provides 128KB of fast flash memory, 16KB of SRAM memory and 4KB of flash memory for data storage.

In 2025, Infineon plans to introduce RISC-V into the automotive MCU market, launch a new family under its AURIX brand, and accelerate ecosystem establishment via a virtual prototype.

RISC-V is an open, reduced instruction set computer (RISC)-based instruction set architecture (ISA) designed to serve as a general-purpose computer architecture. Embracing an open-source design philosophy, RISC-V allows anyone to view, use, modify, and distribute its design. The goal is to provide a flexible, scalable, and high-performance computer architecture suitable for a wide range of applications. Key benefits include low development threshold, low licensing costs, high software portability, independent controllability, and flexibility and customization capabilities for proprietary chips.

To be applied in automotive electronics, the following conditions must be met:

Safety and Reliability: RISC-V implementation must comply with stringent industry safety standards, such as ISO 26262 functional safety certification, to be considered for critical applications.

Ecosystem and Support: The availability of a robust and mature ecosystem (including tools, software, and support) has a big impact on the adoption of RISC-V in the automotive sector.

Industry Acceptance: OEMs and Tier1 suppliers transitioning to RISC-V in hardware and software system design may require extensive testing, verification, and assurances of long-term support.

Cost and Licensing: With open-source nature, RISC-V remains superior in licensing costs, but its overall system cost (including development, integration, and support) should remain competitive.

China is striving to develop RISC-V architecture MCUs. Companies like HPMicro, Nanjing Cercis Semiconductor, Wuhan Binary Semiconductor, Chipext, and ESWIN Computing are facilitating the deployment of RISC-V-based MCUs in vehicles and expanding the application areas.

HPMicro: Andes Technology, Jingwei HiRain, and HPMicro have collaborated to integrate the AndesCore(TM) RISC-V processor series, HPMicro's full range of HPM6200 products, and Jingwei HiRain's Vehicle OS software platform solution to jointly build a RISC-V ecosystem in automotive chips. HPMicro has completed ISO 9001 quality management certification and ISO 26262 ASIL D functional safety management system certification. The full HPM6200 product line has passed AEC-Q100 Grade 1 certification, with an operating temperature range of -40°C to 125°C.

Cercis Semiconductor: The Cercis M100 achieves a CoreMark score of up to 2.42 (CPU performance), actual benchmark results of up to 2.42 Coremark/MHz, and quicker overall response. It meets automotive ASIL-B requirements, supports Chinese cryptographic standards (SM2/3/4) with its hardware security module (HSM), and complies with the ISO 21434 cybersecurity standard. Great Wall Motor plans to widely adopt the chip in its multiple vehicle models, expected to be no less than 2.5 million units over the next five years.

1 Definition and Overview of Automotive Microcontroller Units (MCUs)

1.1 Definition of Automotive MCUs
Definition of Automotive MCUs
Structure of Automotive MCUs
Classification of Automotive MCUs
Applications of Automotive MCUs
Demand Structure of Automotive MCUs by Application
Status Quo of Automotive MCUs
Development Trends of Automotive MCUs
Automotive MCU Production Primarily Relies on OEM
Performance Comparison between Automotive MCUs in Automotive and Industry Fields
Yield Rate of Automotive MCUs
1.2 Market Size
MCU Usage Per Vehicle
Price of Automotive MCUs
Global Automotive MCU Market Size, 2024-2028E
China Passenger Car MCU Market Size, 2022-2028E
Demand Structure of Automotive MCUs by Application
China's Domestic Automotive MCUs Applied Are Primarily Mid-to-Low-End Products
1.3 Competitive Pattern
Global Automotive MCU Market Competitive Pattern 1
Global Automotive MCU Market Competitive Pattern 2
Automotive MCU Market Player 1: Traditional Automotive Chip Vendors (1)
Automotive MCU Market Player 1: Traditional Automotive Chip Vendors (2)
Automotive MCU Market Player 1: Traditional Automotive Chip Vendors (3)
Automotive MCU Market Player 2: OEMs
Product Line Layout of Major Automotive MCU Vendors (1)
Product Line Layout of Major Automotive MCU Vendors (2)
Product Line Layout of Major Automotive MCU Vendors (3)
Benchmarking between Chinese and Foreign Automotive MCU Products (1)
Benchmarking between Chinese and Foreign Automotive MCU Products (2)
1.4 Development Process and Costs of Automotive MCUs
MCU Development Process
Total Development Cost of Automotive MCUs
Development Cost Structure of Automotive MCUs
Breakdown of Automotive MCU Development Costs

2 Automotive Microcontroller Unit (MCU) Industry Trends

2.1 MCU Design Trend 1
Statistics on Automotive MCU Models Integrating AI Compute
Key Performance Improvements in Automotive MCUs with AI Compute
Summary of Some Application Cases of Automotive MCUs with AI Compute
2.2 MCU Design Trend 2
Layout of Major MCU Vendors in Graphics Processing Capabilities
Cross-border Layout of MCUs and MPUs
Cases of MCUs with Graphics Processing Capabilities (1)
Cases of MCUs with Graphics Processing Capabilities (2)
Cases of MCU and MPU Integration
2.3 MCU Design Trend 3
Comparison of Flash Execution Efficiency between MCUs with Real-Time Control
Statistics on Automotive MCU Models with Real-Time Control Performance
New Automotive MCU Products with Real-Time Control Performance (1)
New Automotive MCU Products with Real-Time Control Performance (2)
New Automotive MCU Products with Real-Time Control Performance (3)
2.4 MCU Design Trend 4
Layout of MCU Vendors in New Storage Technologies
New Storage Technology Cases of MCU Vendors (1)
New Storage Technology Cases of MCU Vendors (2)
2.5 MCU Design Trend 5
Definition of Automotive MCU Cores
Localization of Automotive MCU Instruction Sets
Diversification of Automotive MCU Cores
Statistics on Cores Adopted by Chinese and Foreign MCU Vendors (1)
Statistics on Cores Adopted by Chinese and Foreign MCU Vendors (2)
Statistics on Main Power and Chassis Domain MCU Cores and Developers (1)
Statistics on Main Power and Chassis Domain MCU Cores and Developers (2)
Core Structure in Intelligent Cockpit and Driving Assistance Domains
Instruction Set Demand Pattern in Power and Chassis Domain MCUs
Automotive MCU Core 1 (1)
Automotive MCU Core 1 (2)
Automotive MCU Core 2
Automotive MCU Core 3
Automotive MCU Core 4 (1)
Automotive MCU Core 4 (2)
Automotive MCU Core 5
Comparison of CPU IP Cores between MCUs (Licensed/Open-Source Instruction Sets)
Comparison of CPU IP Cores between MCUs (Self-developed Instruction Sets)
Automotive MCU Core Development Trend 1
Automotive MCU Core Development Trend 2
Automotive MCU Core Development Trend 3
Automotive MCU Core Development Trend 4
Comparison of Multi-Core, Heterogeneous, Memory, and High-Frequency Performance between International Mainstream Automotive MCUs
2.6 MCU Design Trend 6
Automotive RISC-V IP
Products and Certifications of Overseas and Chinese Automotive RISC-V IP Suppliers (1)
Products and Certifications of Overseas and Chinese Automotive RISC-V IP Suppliers (2)
Automotive Product Layout of RISC-V Chip Vendors: Global
Automotive Product Layout of RISC-V Chip Vendors: Chinese (1)
Automotive Product Layout of RISC-V Chip Vendors: Chinese (2)
Automotive Product Layout of RISC-V Chip Vendors: Chinese (3)
RISC-V Development Ecosystem Has Gradually Getten Enriched
Key Factors for RISC-V's Penetration into the Automotive Industry
Europe Heavily Invests in RISC-V to Produce Independent and Controllable HPC AI Chips
Global RISC-V Market Revenue, 2030E
2.7 MCU Manufacturing Trend 7
Process Nodes and Foundry Layout of Automotive MCU Vendors (1)
Process Nodes and Foundry Layout of Automotive MCU Vendors (2)
Automotive MCU Process Technology Evolves Toward Advanced Process
Gap in Process Technology Between Chinese and Foreign Automotive MCUs
Advanced Process Layout of Mainstream Automotive MCU Vendors
Status Quo of MCU Process Technology of Different Wafer Fabs
MCU Process Layout of Different Wafer Fabs (1)
MCU Process Layout of Different Wafer Fabs (2)
MCU Production Bases of Different Wafer Fabs