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市場調查報告書
商品編碼
1628941

半導體晶圓清洗設備市場規模、佔有率、成長分析,依設備類型、晶圓尺寸、技術、營運模式、地區 - 產業預測,2025-2032

Semiconductor Wafer Cleaning Equipment Market Size, Share, Growth Analysis, By Equipment Type, By Wafer Size, By Technology, By Operation Mode, By Region - Industry Forecast 2025-2032

出版日期: | 出版商: SkyQuest | 英文 221 Pages | 商品交期: 3-5個工作天內

價格
簡介目錄

2023年全球半導體晶圓清洗設備市場規模將為101億美元,預測期內(2025-2032年)複合年成長率為10.4%,從2024年的111.5億美元成長到2032年的246.1億美元,預計將成長。

由於電子、汽車和其他領域對半導體的需求不斷增加,全球半導體晶圓清洗設備市場預計將持續成長。由於技術的進步和生產率的提高,以及濕式清洗、乾式清洗和等離子清洗等先進清洗技術的廣泛採用,預計市場的有利軌跡將持續下去。然而,障礙包括高昂的初始投資成本、嚴格的法律規範以及需要持續創新以跟上快速發展的半導體技術的步伐。此外,COVID-19 的爆發擾亂了供應鏈和製造流程,暫時影響了市場成長。如果這些挑戰得到解決,該行業將能夠在未來幾年發揮其成長潛力。

目錄

介紹

  • 研究目的
  • 調查範圍
  • 定義

調查方法

  • 資訊採購
  • 二手資料和主要資料方法
  • 市場規模預測
  • 市場假設與限制

執行摘要

  • 全球市場展望
  • 供需趨勢分析
  • 按細分市場的機會分析

市場動態及展望

  • 市場概況
  • 市場規模
  • 市場動態
    • 促進因素和機遇
    • 抑制因素和挑戰
  • 波特的分析

主要市場考察

  • 關鍵成功因素
  • 競爭程度
  • 主要投資機會
  • 市場生態系統
  • 市場吸引力指數(2024年)
  • PESTEL分析
  • 總體經濟指標
  • 價值鏈分析
  • 價格分析
  • 案例研究
  • 技術進步
  • 監管環境
  • Start-Ups分析
  • 專利分析
  • 貿易分析

按設備類型分類的半導體晶圓清洗設備市場規模

  • 市場概況
  • 單晶圓噴塗系統
  • 單晶圓低溫系統
  • 批量浸泡式清洗系統
  • 批量噴淋清洗系統
  • 洗滌器

半導體晶圓清洗設備市場規模:以晶圓尺寸分類

  • 市場概況
  • 150毫米
  • 200毫米
  • 300毫米
  • 450毫米

半導體晶圓清洗設備市場規模:依技術分類

  • 市場概況
  • 濕式化學清洗
  • 蝕刻清洗
  • 正面朝上清潔

半導體晶圓清洗設備市場規模:依營運模式分類

  • 市場概況
  • 自動的
  • 半自動
  • 手動的

半導體晶圓清洗設備市場規模:依應用分類

  • 市場概況
  • MEMS(微電子機械系統)
  • CIS(CMOS 影像感測器)
  • 記憶
  • 射頻裝置
  • LED
  • 內插器
  • 邏輯

半導體晶圓清洗設備市場規模

  • 北美洲
    • 美國
    • 加拿大
  • 歐洲
    • 德國
    • 西班牙
    • 法國
    • 英國
    • 義大利
    • 其他歐洲國家地區
  • 亞太地區
    • 中國
    • 印度
    • 日本
    • 韓國
    • 其他亞太地區
  • 拉丁美洲
    • 巴西
    • 其他拉丁美洲地區
  • 中東/非洲
    • 海灣合作理事會國家
    • 南非
    • 其他中東/非洲

競爭資訊

  • 前5名企業對比
  • 主要企業市場定位(2024年)
  • 主要市場參與者所採取的策略
  • 近期市場趨勢
  • 公司市場佔有率分析(2024年)
  • 主要企業簡介
    • 公司簡介
    • 產品系列分析
    • 按細分市場分類的佔有率分析
    • 收益與前一年同期比較(2022-2024)

主要企業簡介

  • Tokyo Electron Limited(Japan)
  • Lam Research Corporation(US)
  • SCREEN Holdings Co., Ltd.(Japan)
  • KLA Corporation(US)
  • Hitachi High-Tech Corporation(Japan)
  • Semes Co., Ltd.(South Korea)
  • Shibaura Mechatronics Corporation(Japan)
  • Entegris, Inc.(US)
  • Modutek Corporation(US)
  • PVA TePla AG(Germany)
  • Veeco Instruments Inc.(US)
  • Ultratech, Inc.(US)
  • Axus Technology(US)
  • Meyer Burger Technology AG(Switzerland)
  • Rudolph Technologies, Inc.(US)
  • EV Group(Austria)
  • Mattson Technology, Inc.(US)
  • Akrion Systems LLC(US)
  • SUSS MicroTec SE(Germany)

結論和建議

簡介目錄
Product Code: SQMIG45N2103

Global Semiconductor Wafer Cleaning Equipment Market size was valued at USD 10.1 billion in 2023 and is poised to grow from USD 11.15 billion in 2024 to USD 24.61 billion by 2032, growing at a CAGR of 10.4% during the forecast period (2025-2032).

The global semiconductor wafer cleaning equipment market is poised for continued growth, fueled by increasing semiconductor demand across electronics, automotive, and other sectors. With technological advancements and rising production rates, the market's positive trajectory is expected to persist as advanced cleaning techniques, including wet cleaning, dry cleaning, and plasma cleaning, become more widely adopted. However, challenges such as high initial investment costs, stringent regulatory frameworks, and the ongoing need for innovation to align with rapidly evolving semiconductor technologies present hurdles. Additionally, the COVID-19 pandemic has created disruptions in supply chains and manufacturing processes, temporarily affecting market growth. As these challenges are addressed, the sector is likely to capitalize on its growth potential in the coming years.

Top-down and bottom-up approaches were used to estimate and validate the size of the Global Semiconductor Wafer Cleaning Equipment market and to estimate the size of various other dependent submarkets. The research methodology used to estimate the market size includes the following details: The key players in the market were identified through secondary research, and their market shares in the respective regions were determined through primary and secondary research. This entire procedure includes the study of the annual and financial reports of the top market players and extensive interviews for key insights from industry leaders such as CEOs, VPs, directors, and marketing executives. All percentage shares split, and breakdowns were determined using secondary sources and verified through Primary sources. All possible parameters that affect the markets covered in this research study have been accounted for, viewed in extensive detail, verified through primary research, and analyzed to get the final quantitative and qualitative data.

Global Semiconductor Wafer Cleaning Equipment Market Segmental Analysis

Global Semiconductor Wafer Cleaning Equipment Market is segmented by Equipment Type, Wafer Size, Technology, Operation Mode, Application and region. Based on Equipment Type, the market is segmented into Single Wafer Spray System, Single Wafer Cryogenic System, Batch Immersion Cleaning System, Batch Spray Cleaning System and Scrubber. Based on Wafer Size, the market is segmented into 150 mm, 200 mm, 300 mm and 450 mm. Based on Technology, the market is segmented into Wet Chemistry-Based Cleaning, Etch Cleaning and Front Side Up Cleaning. Based on Operation Mode, the market is segmented into Automatic, Semi-Automatic and Manual. Based on Application, the market is segmented into MEMS (Micro-Electro-Mechanical Systems), CIS (CMOS Image Sensors), Memory, RF Device, LED, Interposer and Logic. Based on region, the market is segmented into North America, Europe, Asia Pacific, Latin America and Middle East & Africa.

Driver of the Global Semiconductor Wafer Cleaning Equipment Market

The Global Semiconductor Wafer Cleaning Equipment market is significantly influenced by the increasing adoption of advanced packaging technologies. Innovations like 3D IC integration, wafer-level packaging, and fan-out wafer-level packaging (FOWLP) create a heightened demand for specialized cleaning equipment tailored to these processes. These state-of-the-art packaging techniques necessitate meticulous cleaning of wafer surfaces and interfaces to guarantee optimal adhesion, bonding, and reliability of stacked dies and interconnect structures. Consequently, wafer-cleaning equipment must effectively address the distinctive challenges posed by these advanced packaging methodologies, ultimately driving growth and development within the semiconductor wafer cleaning equipment market.

Restraints in the Global Semiconductor Wafer Cleaning Equipment Market

The Global Semiconductor Wafer Cleaning Equipment market faces notable constraints, primarily due to the substantial costs associated with installation and upkeep. Advanced wafer cleaning systems, designed to meet the rigorous cleanliness standards essential in contemporary semiconductor manufacturing, necessitate a hefty capital investment. These elevated initial expenses can deter semiconductor manufacturers from adopting such technologies, particularly affecting small and medium-sized enterprises that often operate within limited financial parameters. Consequently, the financial burden imposed by the acquisition, installation, and ongoing maintenance of these essential cleaning systems can hinder their ability to compete effectively in an increasingly demanding market landscape.

Market Trends of the Global Semiconductor Wafer Cleaning Equipment Market

The Global Semiconductor Wafer Cleaning Equipment market is experiencing a robust growth trajectory, fueled by the accelerated miniaturization of semiconductor devices. As consumer preferences shift towards compact, powerful electronics, the demand for impeccable wafer cleanliness intensifies. Miniaturization leads to decreased feature sizes and heightened device densities, where even minute contaminants can significantly affect performance and yield. Consequently, the reliance on advanced wafer-cleaning solutions is paramount for preserving the integrity and functionality of these high-density devices. This rising necessity among manufacturers to enhance production efficiency and product reliability signals a promising outlook for the semiconductor wafer cleaning equipment sector.

Table of Contents

Introduction

  • Objectives of the Study
  • Scope of the Report
  • Definitions

Research Methodology

  • Information Procurement
  • Secondary & Primary Data Methods
  • Market Size Estimation
  • Market Assumptions & Limitations

Executive Summary

  • Global Market Outlook
  • Supply & Demand Trend Analysis
  • Segmental Opportunity Analysis

Market Dynamics & Outlook

  • Market Overview
  • Market Size
  • Market Dynamics
    • Drivers & Opportunities
    • Restraints & Challenges
  • Porters Analysis
    • Competitive rivalry
    • Threat of substitute
    • Bargaining power of buyers
    • Threat of new entrants
    • Bargaining power of suppliers

Key Market Insights

  • Key Success Factors
  • Degree of Competition
  • Top Investment Pockets
  • Market Ecosystem
  • Market Attractiveness Index, 2024
  • PESTEL Analysis
  • Macro-Economic Indicators
  • Value Chain Analysis
  • Pricing Analysis
  • Case Studies
  • Technology Advancement
  • Regulatory Landscape
  • Startup Analysis
  • Patent Analysis
  • Trade Analysis

Global Semiconductor Wafer Cleaning Equipment Market Size by Equipment Type & CAGR (2025-2032)

  • Market Overview
  • Single Wafer Spray System
  • Single Wafer Cryogenic System
  • Batch Immersion Cleaning System
  • Batch Spray Cleaning System
  • Scrubber

Global Semiconductor Wafer Cleaning Equipment Market Size by Wafer Size & CAGR (2025-2032)

  • Market Overview
  • 150 mm
  • 200 mm
  • 300 mm
  • 450 mm

Global Semiconductor Wafer Cleaning Equipment Market Size by Technology & CAGR (2025-2032)

  • Market Overview
  • Wet Chemistry-Based Cleaning
  • Etch Cleaning
  • Front Side Up Cleaning

Global Semiconductor Wafer Cleaning Equipment Market Size by Operation Mode & CAGR (2025-2032)

  • Market Overview
  • Automatic
  • Semi-Automatic
  • Manual

Global Semiconductor Wafer Cleaning Equipment Market Size by Application & CAGR (2025-2032)

  • Market Overview
  • MEMS (Micro-Electro-Mechanical Systems)
  • CIS (CMOS Image Sensors)
  • Memory
  • RF Device
  • LED
  • Interposer
  • Logic

Global Semiconductor Wafer Cleaning Equipment Market Size & CAGR (2025-2032)

  • North America (Equipment Type, Wafer Size, Technology, Operation Mode, Application)
    • US
    • Canada
  • Europe (Equipment Type, Wafer Size, Technology, Operation Mode, Application)
    • Germany
    • Spain
    • France
    • UK
    • Italy
    • Rest of Europe
  • Asia Pacific (Equipment Type, Wafer Size, Technology, Operation Mode, Application)
    • China
    • India
    • Japan
    • South Korea
    • Rest of Asia-Pacific
  • Latin America (Equipment Type, Wafer Size, Technology, Operation Mode, Application)
    • Brazil
    • Rest of Latin America
  • Middle East & Africa (Equipment Type, Wafer Size, Technology, Operation Mode, Application)
    • GCC Countries
    • South Africa
    • Rest of Middle East & Africa

Competitive Intelligence

  • Top 5 Player Comparison
  • Market Positioning of Key Players, 2024
  • Strategies Adopted by Key Market Players
  • Recent Developments in the Market
  • Company Market Share Analysis, 2024
  • Company Profiles of All Key Players
    • Company Details
    • Product Portfolio Analysis
    • Company's Segmental Share Analysis
    • Revenue Y-O-Y Comparison (2022-2024)

Key Company Profiles

  • Tokyo Electron Limited (Japan)
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments
  • Lam Research Corporation (US)
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments
  • SCREEN Holdings Co., Ltd. (Japan)
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments
  • KLA Corporation (US)
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments
  • Hitachi High-Tech Corporation (Japan)
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments
  • Semes Co., Ltd. (South Korea)
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments
  • Shibaura Mechatronics Corporation (Japan)
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments
  • Entegris, Inc. (US)
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments
  • Modutek Corporation (US)
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments
  • PVA TePla AG (Germany)
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments
  • Veeco Instruments Inc. (US)
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments
  • Ultratech, Inc. (US)
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments
  • Axus Technology (US)
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments
  • Meyer Burger Technology AG (Switzerland)
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments
  • Rudolph Technologies, Inc. (US)
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments
  • EV Group (Austria)
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments
  • Mattson Technology, Inc. (US)
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments
  • Akrion Systems LLC (US)
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments
  • SUSS MicroTec SE (Germany)
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments

Conclusion & Recommendations