市場調查報告書
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1403357
無鉛氮回流焊爐的全球市場至2030年的預測:按類型、最終用戶和地區分析Lead-Free Nitrogen Reflow Soldering Oven Market Forecasts to 2030 - Global Analysis By Type, End User and By Geography |
根據 Stratistics MRC 的資料,預測期內全球無鉛氮回流焊爐市場將以 3.5%的年複合成長率成長。
無鉛氮氣回流焊爐是電子製造所使用的專用設備。其目的是在受控氮氣氣氛中使用無鉛焊接方法將表面黏著技術元件焊接到印刷電路基板(PCB)上。透過使用傳統含鉛焊料的更安全替代品,該技術符合環境法,並消除了與鉛暴露相關的健康危害。這些烤箱可確保精確的溫度曲線,使元件的回流焊接更加容易。
根據《世界人口評論》,中國出口了價值約 2.72 兆美元的商品和服務,仍然是世界上最大的出口國。該國主要出口電腦、智慧型手機、廣播設備、積體電路和商用機器零件等電子設備和機械。
製造智慧型手機、電腦、汽車電子和物聯網設備等電子設備的產業需要精密可靠的焊接設備。無鉛氮氣回流焊接浴在確保電路基板焊接元件的完整性方面發揮著非常重要的作用。隨著電子設備的不斷發展,包括小型化和複雜化的趨勢,對先進焊接解決方案的需求不斷增加。此外,由環境法規推動的無鉛焊料的轉變進一步增加了對這些專用烤箱的需求,使它們成為現代電子製造流程中的重要工具。
無鉛氮氣回流焊爐具有巨大的持續成本,包括能源消耗、氮氣供應和維護。這些先進的烘箱通常需要連續供應氮氣,消耗額外的資源並增加營運費用。此外,維持精確溫度控制的能源集中特性也增加了整體營運成本。因此,這是市場需求的主要障礙。
需要電子元件具有嚴格可靠性標準的行業通常需要精密焊接解決方案。無鉛氮氣回流焊爐提供受控氣氛,以最大限度地減少氧化並確保關鍵任務系統所需的準確焊點。在這些安全性和可靠性非常重要的行業中,對可靠的電子設備的需求很高,這使得這些專用烤箱成為不可或缺的工具。此外,為這些高可靠性應用提供服務的製造商有機會滿足嚴格的品質要求,擴大其市場佔有率,並將自己打造為可靠且技術先進的焊接解決方案的提供者。
由於特定要求或技術偏好,某些行業可能無法輕易採用無鉛焊接方法或專用焊接設備。擁有成熟焊接過程或在利基市場營運的行業可能不願意過渡到新技術。此外,優先考慮成本效益而不是滿足嚴格的環境法規的行業可能會選擇替代的傳統焊接解決方案。這種有限的採用帶來了挑戰,並阻礙了希望進入這些行業的製造商的市場。
由於供應鏈挑戰、工業活動減少和市場不確定性,疫情最初導致市場混亂和放緩。然而,電子產業的某些部分,特別是與通訊設備、計算設備和醫療用電子設備相關的領域,由於遠端工作的轉變和醫療保健需求的增加,需求有所增加,這可能對焊爐市場產生了正面影響。因此,隨著各行業應對情勢變化並開始恢復生產業務,經濟正逐步復甦。
據估計,氣相爐區隔佔最大佔有率。這些烤箱採用獨特的焊接過程,利用氣相介質,通常使用具有特定沸騰特性的特殊流體。氣相爐具有精確的溫度分佈、出色的傳熱以及有效焊接複雜組件的能力等優點。此外,這些烤箱因其能夠實現精確的溫度控制,減少焊接缺陷並提供高效且一致的焊接結果而脫穎而出,使其成為該行業專業且有價值的領域的重要組成部分。
預計電子製造領域在預測期內將出現良好成長。無鉛氮氣回流焊爐可確保精確且環保的元件焊接,在電子製造中發揮非常重要的作用。該烤箱透過保持受控溫度,減少焊接缺陷並遵守無鉛焊接標準,有助於生產高品質的電子設備。此外,它在電子製造中的應用強調了其在生產可靠且技術先進的電子產品同時滿足環境法規方面的重要性。
在估計期間,亞太地區佔據最大的市場佔有率。對家用電子電器、汽車電子、通訊和其他電子產品的需求不斷成長推動亞太地區焊接設備市場的成長。亞太地區的一些國家是電子產品的主要製造地,吸引對現代焊接設備的投資,以確保更高的生產品質並符合國際標準。此外,電子元件的小型化、製造業採用工業 4.0 以及對缺陷最少的高品質焊接的需求等趨勢推動無鉛氮氣回流焊爐市場。
由於技術進步和嚴格的環境法規,預計北美在預測期內將出現盈利成長。無鉛焊接設備市場,包括氮基回流焊爐,是由對高品質、環保焊接解決方案的需求所推動的。焊接技術的創新,無鉛標準的遵守以及電子組裝中精確溫度控制的需求等因素促進了北美無鉛氮氣回流焊爐市場的崛起。
According to Stratistics MRC, the Global Lead-Free Nitrogen Reflow Soldering Oven Market is growing at a CAGR of 3.5% during the forecast period. The Lead-Free Reflow Soldering Oven is a specialised piece of equipment used in electronics manufacturing. Its purpose is to use a lead-free soldering method in a regulated nitrogen atmosphere to solder surface-mounted components onto printed circuit boards (PCBs). By using safer substitutes for conventional lead-based solders, this technique complies with environmental laws and removes the health hazards related to lead exposure. Accurate temperature profiles are ensured by these ovens, which makes it easier to reflow solder components.
According to the World Population Review, with an estimated export of US$ 2.72 trillion worth of goods and services, China remained the world's largest export. The country mostly exports electronic equipment and machinery such as computers, smart phones, broadcast equipment, integrated circuits, and office machine parts.
Industries producing electronic devices, such as smart phones, computers, automotive electronics, and IoT gadgets, require precise and reliable soldering equipment. Lead-free nitrogen reflow soldering ovens play a pivotal role in ensuring the integrity of soldered components on circuit boards. With the continuous evolution of electronic devices, including the trend towards miniaturisation and higher complexity, the need for sophisticated soldering solutions rises. Moreover, the shift toward lead-free soldering, driven by environmental regulations, further amplifies the demand for these specialized ovens, establishing them as indispensable tools in modern electronics manufacturing processes.
Lead-Free Nitrogen Reflow Soldering Ovens demand substantial ongoing expenses, including energy consumption, nitrogen supply, and maintenance. These advanced ovens often require a continuous supply of nitrogen, consuming additional resources and increasing operational expenditure. Also, the energy-intensive nature of maintaining precise temperature control adds to the overall operational costs. Thus, it acts as a significant barrier to market demand.
Industries requiring electronic components with stringent reliability standards often necessitate precision soldering solutions. Lead-Free Nitrogen Reflow Soldering ovens offer controlled atmospheres, minimising oxidation and ensuring precise soldering joints crucial for mission-critical systems. The demand for dependable electronics in these sectors, where safety and reliability are paramount, positions these specialised ovens as essential tools. Moreover, manufacturers catering to these high-reliability applications have the opportunity to meet the stringent quality requirements, expand their market presence, and establish themselves as providers of reliable and technologically advanced soldering solutions.
Some industries, due to their specific requirements or technological preferences, may not readily embrace lead-free soldering methods or specialised soldering equipment. Industries with established soldering processes or those operating in niche markets may exhibit reluctance to transition to new technologies. Also, industries that prioritise cost-effectiveness over compliance with stringent environmental regulations might opt for alternative, more conventional soldering solutions. This limited adoption creates a challenge for manufacturers aiming to penetrate these industries, hindering the market.
The pandemic initially caused disruptions and a slowdown in the market due to supply chain challenges, reduced industrial activities, and market uncertainties. However, certain segments within the electronics industry, particularly those related to telecommunication equipment, computing devices, and medical electronics, experienced increased demand due to the shift to remote work and increased healthcare needs, which might have positively impacted the market for soldering ovens. This has led to a gradual recovery as industries adapted to the evolving circumstances and began restoring their manufacturing operations.
The vapour-phase oven segment is estimated to hold the largest share. These ovens employ a unique soldering process utilising a vapour-phase medium, typically a special fluid with specific boiling properties. Vapour-phase ovens offer advantages such as precise temperature profiles, excellent thermal transfer, and the ability to solder complex assemblies efficiently. Moreover, these ovens are stand out for their ability to achieve precise temperature control, mitigate soldering defects, and offer efficient and consistent soldering results, making them a specialised and valuable segment in the industry.
The Electronics Manufacturing segment is anticipated to have lucrative growth during the forecast period. Lead-Free Nitrogen Reflow Soldering ovens play a pivotal role in electronic manufacturing by ensuring precise and environmentally compliant soldering of components. The ovens contribute to the production of high-quality electronic devices by maintaining controlled temperatures, reducing soldering defects, and adhering to lead-free soldering standards. Moreover, their application in electronics manufacturing underscores their significance in producing reliable and technologically advanced electronic products while meeting environmental regulations.
Asia Pacific commanded the largest market share during the extrapolated period. The increasing demand for consumer electronics, automotive electronics, telecommunications, and other electronic products has driven the growth of the soldering equipment market in the APAC region. Several countries in the APAC region serve as major manufacturing hubs for electronics, attracting investments in modern soldering equipment to ensure higher production quality and compliance with international standards. Moreover, trends such as miniaturization of electronic components, the adoption of Industry 4.0 practices in manufacturing, and the demand for high-quality soldering with minimal defects drive the market for Lead-Free Nitrogen Reflow Soldering Ovens.
North America is expected to witness profitable growth over the projection period, owing to technological advancements and stringent environmental regulations. The market for lead-free soldering equipment, including reflow soldering ovens utilizing nitrogen, is driven by the demand for high-quality, environmentally friendly soldering solutions. Factors such as innovation in soldering technology, compliance with lead-free standards, and the need for precise temperature control in electronics assembly contribute to the prominence of the Lead-Free Nitrogen Reflow Soldering Oven market in North America.
Some of the key players in the Lead-Free Nitrogen Reflow Soldering Oven Market include Rehm Thermal Systems, Kurtz Ersa, BTU International, Heller Industries, Tamura Corporation, Vitronics Soltec, JT Automation Equipment Co., Ltd., Seho Systems GmbH, JUKI, SEHO Systems, Shenzhen JT Automation, Dongguan Folungwin Automatic Equipment, SMT Wertheim and Senju Metal Industry Co (SMIC).
In June 2023, Kurtz Ersa Inc., a leading supplier of electronics production equipment, is pleased to unveil the new Auto Scavenger Module, a valuable extension for the Ersa HR 600 XL rework platform. Designed to enhance the efficiency and effectiveness of non-contact removal of residual solder from circuit boards, this module represents a significant advancement in rework technology.
In March 2022, Kurtz Ersa Inc., a leading supplier of electronics production equipment, is pleased to announce that it has released the new EXOS 10/26 convection reflow soldering system with a vacuum chamber of 600 mm to handle PCBs with a maximum length of 600 mm.