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1489419

到 2030 年中介層和扇出晶圓層次電子構裝市場預測：全球封裝類型、裝置類型、技術、最終用戶和地區

Interposer and Fan-out Wafer Level Packaging Market Forecasts to 2030 - Global Packaging Type (2.5D and 3D), Device Type, Technology, End User and By Geography
出版日期: | 出版商: Stratistics Market Research Consulting | 英文 200+ Pages | 商品交期: 2-3個工作天內

價格

根據 Stratistics MRC 的數據，2023 年全球中介層和扇出晶圓層次電子構裝市場規模將達到 311 億美元，預計在預測期內將以 14.3% 的複合年成長率成長，到 2030 年達到 793 億美元。到過。

中介層和扇出晶圓層次電子構裝(FOWLP) 是先進的半導體封裝技術。中介層技術將矽或玻璃基板放置在積體電路之間，從而實現高密度連接和異質整合。另一方面，FOWLP 重新分配從晶片外圍到封裝表面的連接，從而提高性能並實現小型化。 FOWLP 有助於將多個晶片整合到一個封裝中，從而能夠開發更小、更強大的電子設備，例如智慧型手機、穿戴式裝置和物聯網設備，並促進半導體產業的創新。

對先進封裝技術的需求不斷成長

中介層和 FOWLP 可實現半導體元件的小型化和整合，從而實現更小的外形尺寸和更高的裝置密度。這對於穿戴式裝置、物聯網裝置和行動裝置等空間敏感型應用至關重要。與傳統封裝方法相比，這些封裝技術提高了電氣和熱性能。更短的互連、減少的寄生和改善的散熱提高了裝置性能、功率效率和可靠性，推動市場成長。

複雜的晶圓級工藝

複雜的晶圓級製程通常需要對專用設備和基礎設施進行大量投資。製造商可能需要投資先進的製造設備和工具來處理複雜的工藝，例如線路重布(RDL)、穿透矽通孔(TSV) 和細間距互連。這些初始成本可能令人望而卻步，尤其是對於小型或現金短缺的公司而言，並且可能會阻礙市場成長。

擴大異質集群的採用

異質整合使半導體公司能夠開發具有獨特功能和性能的創新產品。透過將多種功能整合到一個封裝中，製造商可以滿足消費性電子、汽車、醫療保健和物聯網等行業的廣泛應用。這個不斷擴大的市場機會正在推動針對異質整合要求客製化的內插器和 FOWLP 技術的需求。

有限的生態系統

狹窄的生態系統意味著關鍵零件、材料和製造設備依賴有限數量的供應商。供應鏈中斷，例如供不應求或單一供應商的品質問題，可能會嚴重影響生產計劃和產品可用性。半導體公司在尋找替代供應商和降低供應鏈風險方面面臨挑戰，這可能會影響他們滿足市場需求和客戶期望的能力。

COVID-19 的影響

封鎖措施和旅行限制影響了製造業務，導致供不應求和出貨延誤。家用電子電器和汽車等關鍵行業的需求不確定性進一步影響了市場成長，而疫情加速了數位轉型，遠距工作、線上教育和醫療保健應用對半導體設備的需求增加。

MEMS/感測器產業預計在預測期內規模最大

隨著 MEMS 感測器在半導體封裝中的整合推動小型化，實現更小的外形尺寸和增強的功能，MEMS/感測器領域預計將出現良好的成長。中介層和 FOWLP 技術促進了 MEMS 裝置與其他半導體元件的整合，從而實現異質整合和系統級最佳化。這種整合提高了汽車、消費性電子、物聯網和醫療保健領域基於 MEMS 的應用的效能、可靠性和成本效率。

消費性電子產業預計在預測期內複合年成長率最高

家用電子電器產業預計在預測期內複合年成長率最高。隨著消費者對更小、更輕和更高性能設備的需求不斷增加，半導體製造商正在轉向採用中介層和 FOWLP 等先進封裝解決方案來滿足這些需求。這些技術可實現更高水準的整合、改進的溫度控管和更高的電氣性能，這對於智慧型手機、平板電腦、穿戴式裝置和智慧家居設備等家用電子電器至關重要。

佔比最大的地區：

亞太地區預計將在預測期內佔據最大的市場佔有率，因為該地區是世界上一些最大的消費性電子市場的所在地，包括中國、日本、韓國和印度。對智慧型手機、平板電腦、穿戴式裝置和其他消費性電子產品不斷成長的需求正在推動內插器和 FOWLP 等先進封裝技術的採用，以滿足更小外形尺寸、更高性能和更高能源效率的要求。

複合年成長率最高的地區：

預計北美在預測期內的複合年成長率最高，因為它是全球專門從事半導體封裝及相關技術的研究機構、大學和研發中心的所在地。這些機構與產業合作夥伴合作進行前沿研究、開發創新解決方案並培訓下一代半導體專業人員。學術界和工業界之間的協同效應將推動技術進步並加速北美內插器和 FOWLP 技術的商業化。

免費客製化服務：

訂閱此報告的客戶可以存取以下免費自訂選項之一：

  • 公司簡介
    • 其他市場參與者的綜合分析（最多 3 家公司）
    • 主要企業SWOT分析（最多3家企業）
  • 區域分割
    • 根據客戶興趣對主要國家的市場估計、預測和複合年成長率（註：基於可行性檢查）
  • 競爭基準化分析
    • 根據產品系列、地理分佈和策略聯盟對主要企業基準化分析

目錄

第1章執行摘要

第2章 前言

  • 概述
  • 相關利益者
  • 調查範圍
  • 調查方法
    • 資料探勘
    • 資料分析
    • 資料檢驗
    • 研究途徑
  • 研究資訊來源
    • 主要研究資訊來源
    • 二次研究資訊來源
    • 先決條件

第3章市場趨勢分析

  • 促進因素
  • 抑制因素
  • 機會
  • 威脅
  • 技術分析
  • 最終用戶分析
  • 新興市場
  • COVID-19 的影響

第4章波特五力分析

  • 供應商的議價能力
  • 買方議價能力
  • 替代品的威脅
  • 新進入者的威脅
  • 競爭公司之間的敵對關係

第5章全球中介層與扇出晶圓層次電子構裝市場：依封裝類型

  • 2.5D
  • 3D

第6章全球中介層與扇出晶圓層次電子構裝市場：依元件類型

  • 成像和光電
  • 關於LED
  • 邏輯積體電路
  • MEMS/感測器
  • 儲存裝置
  • 其他設備類型

第7章全球中介層與扇出晶圓層次電子構裝市場：依技術分類

  • 內插器
  • 扇出晶圓級封裝 (FOWLP)
  • 穿透矽通孔

第8章全球中介層與扇出晶圓層次電子構裝市場：依最終用戶分類

  • 家用電器
  • 通訊
  • 車
  • 軍事和航太
  • 智慧科技
  • 醫療設備
  • 其他最終用戶

第9章全球中介層與扇出晶圓層次電子構裝市場：依地區

  • 北美洲
    • 美國
    • 加拿大
    • 墨西哥
  • 歐洲
    • 德國
    • 英國
    • 義大利
    • 法國
    • 西班牙
    • 其他歐洲國家
  • 亞太地區
    • 日本
    • 中國
    • 印度
    • 澳洲
    • 紐西蘭
    • 韓國
    • 其他亞太地區
  • 南美洲
    • 阿根廷
    • 巴西
    • 智利
    • 南美洲其他地區
  • 中東/非洲
    • 沙烏地阿拉伯
    • 阿拉伯聯合大公國
    • 卡達
    • 南非
    • 其他中東和非洲

第10章 主要進展

  • 合約、夥伴關係、協作和合資企業
  • 收購和合併
  • 新產品發布
  • 業務擴展
  • 其他關鍵策略

第11章 公司概況

  • Advanced MICRO DEVICES, Inc
  • Amkor Technology
  • ASE Technology Holding Co., Ltd.
  • DAI Nippon Printing CO., LTD.
  • DECA Technologies
  • Dupont
  • Global Foundries Inc
  • JCET Group LTD.
  • Nexlogic Technologies INC.
  • Powertech Technology Inc.
  • RENA Technologies GMBH
  • Samsung
  • SAMTEC
  • SK Hynix Inc.
  • SPTS Technologies Ltd.
  • Teledyne Digital Imaging Inc.
  • Toshiba Electronic Devices & Storage Corporation
  • United Microelectronics Corporation
Product Code: SMRC26205

According to Stratistics MRC, the Global Interposer and Fan-out Wafer Level Packaging Market is accounted for $31.1 billion in 2023 and is expected to reach $79.3 billion by 2030 growing at a CAGR of 14.3% during the forecast period. Interposer and Fan-out Wafer Level Packaging (FOWLP) are advanced semiconductor packaging techniques. Interposer technology involves placing a silicon or glass substrate between integrated circuits, enabling high-density connections and heterogeneous integration. FOWLP, on the other hand, redistributes connections from the chip's periphery to the package's surface, enhancing performance and miniaturization. They facilitate the integration of multiple chips into a single package, enabling the development of smaller, more powerful electronic devices such as smartphones, wearables, and IoT devices, driving innovation in the semiconductor industry.

Market Dynamics:

Driver:

Increasing demand for advanced packaging technologies

Interposer and FOWLP enable the miniaturization and integration of semiconductor components, leading to smaller form factors and higher device density. This is crucial for applications where space is a premium, such as wearables, IoT devices, and mobile devices. These packaging technologies provide enhanced electrical and thermal performance compared to traditional packaging methods. They offer shorter interconnects reduced parasitics, and better heat dissipation, resulting in improved device performance, power efficiency, and reliability boosting the growth of the market.

Restraint:

Complex wafer-level processes

Complex wafer-level processes often require significant investment in specialized equipment and infrastructure. Manufacturers may need to invest in advanced fabrication facilities and tools to handle intricate processes such as redistribution layers (RDLs), through-silicon vias (TSVs), and fine pitch interconnects. These upfront costs can be prohibitive for some companies, particularly smaller players or those with limited financial resources, thus hindering market growth.

Opportunity:

Growing adoption of heterogeneous integration

Heterogeneous integration allows semiconductor companies to develop innovative products with unique features and capabilities. By integrating diverse functionalities into a single package, manufacturers can address a broader range of applications across various industries, including consumer electronics, automotive, healthcare, and IoT. This expanded market opportunity fuels the demand for interposer and FOWLP technologies tailored to heterogeneous integration requirements.

Threat:

Limited ecosystem

A narrow ecosystem may result in dependencies on a limited number of suppliers for critical components, materials, and manufacturing equipment. Supply chain disruptions, such as shortages or quality issues from a single source, can significantly impact production schedules and product availability. Semiconductor companies may face challenges in securing alternative suppliers or mitigating supply chain risks, affecting their ability to meet market demand and customer expectations.

Covid-19 Impact

Lockdown measures and travel restrictions affected manufacturing operations, leading to supply shortages and shipment delays. Uncertainty in demand from key industries like consumer electronics and automotive further impacted market growth, however, the pandemic also accelerated digital transformation, increasing demand for semiconductor devices for remote work, online education, and healthcare applications.

The MEMS/sensors segment is expected to be the largest during the forecast period

The MEMS/sensors segment is estimated to have a lucrative growth, due to integration of MEMS sensors within semiconductor packages drives miniaturization, enabling smaller form factors and enhanced functionality. Interposer and FOWLP technologies facilitate the integration of MEMS devices with other semiconductor components, enabling heterogeneous integration and system-level optimization. This integration enhances the performance, reliability, and cost-effectiveness of MEMS-based applications in automotive, consumer electronics, IoT, and healthcare sectors.

The consumer electronics segment is expected to have the highest CAGR during the forecast period

The consumer electronics segment is anticipated to witness the highest CAGR growth during the forecast period, as consumer demand for smaller, lighter, and more powerful devices increases, semiconductor manufacturers turn to advanced packaging solutions like interposer and FOWLP to meet these requirements. These technologies enable higher levels of integration, improved thermal management, and enhanced electrical performance, crucial for consumer electronics such as smartphones, tablets, wearables, and smart home devices.

Region with largest share:

Asia Pacific is projected to hold the largest market share during the forecast period owing to the Asia Pacific region which is home to some of the world's largest consumer electronics markets, including China, Japan, South Korea, and India. The increasing demand for smartphones, tablets, wearables, and other consumer electronics drives the adoption of advanced packaging technologies like interposer and FOWLP to meet the requirements of smaller form factors, higher performance, and improved energy efficiency.

Region with highest CAGR:

North America is projected to have the highest CAGR over the forecast period, as North America hosts world-class research institutions, universities, and R&D centers specializing in semiconductor packaging and related technologies. These institutions collaborate with industry partners to conduct cutting-edge research, develop innovative solutions, and train the next generation of semiconductor professionals. The synergy between academia and industry fosters technological advancements and accelerates the commercialization of interposer and FOWLP technologies in North America.

Key players in the market

Some of the key players in the Interposer and Fan-out Wafer Level Packaging Market include Advanced MICRO DEVICES, Inc, Amkor Technology, ASE Technology Holding Co., Ltd., DAI Nippon Printing CO., LTD., DECA Technologies, Dupont, Global Foundries Inc, JCET Group LTD., Nexlogic Technologies INC., Powertech Technology Inc., RENA Technologies GMBH, Samsung, SAMTEC, SK Hynix Inc., SPTS Technologies Ltd., Teledyne Digital Imaging Inc., Toshiba Electronic Devices & Storage Corporation and United Microelectronics Corporation

Key Developments:

In April 2024, Infineon and Amkor Deepen Partnership and Strengthen European Supply Chain for Semiconductor Solutions. Both companies have agreed on operating a dedicated packaging and test center at Amkor's manufacturing site in Porto.

In March 2024, DuPont and Menatek Defense Technologies announced that they have entered into an agreement related to the global bearing market. This collaboration between the two companies involves NAZ Bearings(R), an innovative bearing that is self-lubricating and maintenance free.

In April 2024, Teledyne DALSA, a Teledyne Technologies company announced a radiometric version of its MicroCalibir(TM) Long Wave Infrared (LWIR) compact camera platform that delivers accurate temperature measurements of +/-2°C or +/-2%.

Packaging Types Covered:

  • 2.5D
  • 3D

Device Types Covered:

  • Imaging & Optoelectronics
  • LEDs
  • Logic Ics
  • MEMS/Sensors
  • Memory Devices
  • Other Device Types

Technologies Covered:

  • Interposer
  • Fan-Out Wafer-Level Packaging (FOWLP)
  • Through Silicon Vias

End Users Covered:

  • Consumer Electronics
  • Telecommunication
  • Automotive
  • Military and Aerospace
  • Smart Technologies
  • Medical devices
  • Other End Users

Regions Covered:

  • North America
    • US
    • Canada
    • Mexico
  • Europe
    • Germany
    • UK
    • Italy
    • France
    • Spain
    • Rest of Europe
  • Asia Pacific
    • Japan
    • China
    • India
    • Australia
    • New Zealand
    • South Korea
    • Rest of Asia Pacific
  • South America
    • Argentina
    • Brazil
    • Chile
    • Rest of South America
  • Middle East & Africa
    • Saudi Arabia
    • UAE
    • Qatar
    • South Africa
    • Rest of Middle East & Africa

What our report offers:

  • Market share assessments for the regional and country-level segments
  • Strategic recommendations for the new entrants
  • Covers Market data for the years 2021, 2022, 2023, 2026, and 2030
  • Market Trends (Drivers, Constraints, Opportunities, Threats, Challenges, Investment Opportunities, and recommendations)
  • Strategic recommendations in key business segments based on the market estimations
  • Competitive landscaping mapping the key common trends
  • Company profiling with detailed strategies, financials, and recent developments
  • Supply chain trends mapping the latest technological advancements

Free Customization Offerings:

All the customers of this report will be entitled to receive one of the following free customization options:

  • Company Profiling
    • Comprehensive profiling of additional market players (up to 3)
    • SWOT Analysis of key players (up to 3)
  • Regional Segmentation
    • Market estimations, Forecasts and CAGR of any prominent country as per the client's interest (Note: Depends on feasibility check)
  • Competitive Benchmarking
    • Benchmarking of key players based on product portfolio, geographical presence, and strategic alliances

Table of Contents

1 Executive Summary

2 Preface

  • 2.1 Abstract
  • 2.2 Stake Holders
  • 2.3 Research Scope
  • 2.4 Research Methodology
    • 2.4.1 Data Mining
    • 2.4.2 Data Analysis
    • 2.4.3 Data Validation
    • 2.4.4 Research Approach
  • 2.5 Research Sources
    • 2.5.1 Primary Research Sources
    • 2.5.2 Secondary Research Sources
    • 2.5.3 Assumptions

3 Market Trend Analysis

  • 3.1 Introduction
  • 3.2 Drivers
  • 3.3 Restraints
  • 3.4 Opportunities
  • 3.5 Threats
  • 3.6 Technology Analysis
  • 3.7 End User Analysis
  • 3.8 Emerging Markets
  • 3.9 Impact of Covid-19

4 Porters Five Force Analysis

  • 4.1 Bargaining power of suppliers
  • 4.2 Bargaining power of buyers
  • 4.3 Threat of substitutes
  • 4.4 Threat of new entrants
  • 4.5 Competitive rivalry

5 Global Interposer and Fan-out Wafer Level Packaging Market, By Packaging Type

  • 5.1 Introduction
  • 5.2 2.5D
  • 5.3 3D

6 Global Interposer and Fan-out Wafer Level Packaging Market, By Device Type

  • 6.1 Introduction
  • 6.2 Imaging & Optoelectronics
  • 6.3 LEDs
  • 6.4 Logic Ics
  • 6.5 MEMS/Sensors
  • 6.6 Memory Devices
  • 6.7 Other Device Types

7 Global Interposer and Fan-out Wafer Level Packaging Market, By Technology

  • 7.1 Introduction
  • 7.2 Interposer
  • 7.3 Fan-Out Wafer-Level Packaging (FOWLP)
  • 7.4 Through Silicon Vias

8 Global Interposer and Fan-out Wafer Level Packaging Market, By End User

  • 8.1 Introduction
  • 8.2 Consumer Electronics
  • 8.3 Telecommunication
  • 8.4 Automotive
  • 8.5 Military and Aerospace
  • 8.6 Smart Technologies
  • 8.7 Medical devices
  • 8.8 Other End Users

9 Global Interposer and Fan-out Wafer Level Packaging Market, By Geography

  • 9.1 Introduction
  • 9.2 North America
    • 9.2.1 US
    • 9.2.2 Canada
    • 9.2.3 Mexico
  • 9.3 Europe
    • 9.3.1 Germany
    • 9.3.2 UK
    • 9.3.3 Italy
    • 9.3.4 France
    • 9.3.5 Spain
    • 9.3.6 Rest of Europe
  • 9.4 Asia Pacific
    • 9.4.1 Japan
    • 9.4.2 China
    • 9.4.3 India
    • 9.4.4 Australia
    • 9.4.5 New Zealand
    • 9.4.6 South Korea
    • 9.4.7 Rest of Asia Pacific
  • 9.5 South America
    • 9.5.1 Argentina
    • 9.5.2 Brazil
    • 9.5.3 Chile
    • 9.5.4 Rest of South America
  • 9.6 Middle East & Africa
    • 9.6.1 Saudi Arabia
    • 9.6.2 UAE
    • 9.6.3 Qatar
    • 9.6.4 South Africa
    • 9.6.5 Rest of Middle East & Africa

10 Key Developments

  • 10.1 Agreements, Partnerships, Collaborations and Joint Ventures
  • 10.2 Acquisitions & Mergers
  • 10.3 New Product Launch
  • 10.4 Expansions
  • 10.5 Other Key Strategies

11 Company Profiling

  • 11.1 Advanced MICRO DEVICES, Inc
  • 11.2 Amkor Technology
  • 11.3 ASE Technology Holding Co., Ltd.
  • 11.4 DAI Nippon Printing CO., LTD.
  • 11.5 DECA Technologies
  • 11.6 Dupont
  • 11.7 Global Foundries Inc
  • 11.8 JCET Group LTD.
  • 11.9 Nexlogic Technologies INC.
  • 11.10 Powertech Technology Inc.
  • 11.11 RENA Technologies GMBH
  • 11.12 Samsung
  • 11.13 SAMTEC
  • 11.14 SK Hynix Inc.
  • 11.15 SPTS Technologies Ltd.
  • 11.16 Teledyne Digital Imaging Inc.
  • 11.17 Toshiba Electronic Devices & Storage Corporation
  • 11.18 United Microelectronics Corporation

List of Tables

  • Table 1 Global Interposer and Fan-out Wafer Level Packaging Market Outlook, By Region (2021-2030) ($MN)
  • Table 2 Global Interposer and Fan-out Wafer Level Packaging Market Outlook, By Packaging Type (2021-2030) ($MN)
  • Table 3 Global Interposer and Fan-out Wafer Level Packaging Market Outlook, By 2.5D (2021-2030) ($MN)
  • Table 4 Global Interposer and Fan-out Wafer Level Packaging Market Outlook, By 3D (2021-2030) ($MN)
  • Table 5 Global Interposer and Fan-out Wafer Level Packaging Market Outlook, By Device Type (2021-2030) ($MN)
  • Table 6 Global Interposer and Fan-out Wafer Level Packaging Market Outlook, By Imaging & Optoelectronics (2021-2030) ($MN)
  • Table 7 Global Interposer and Fan-out Wafer Level Packaging Market Outlook, By LEDs (2021-2030) ($MN)
  • Table 8 Global Interposer and Fan-out Wafer Level Packaging Market Outlook, By Logic Ics (2021-2030) ($MN)
  • Table 9 Global Interposer and Fan-out Wafer Level Packaging Market Outlook, By MEMS/Sensors (2021-2030) ($MN)
  • Table 10 Global Interposer and Fan-out Wafer Level Packaging Market Outlook, By Memory Devices (2021-2030) ($MN)
  • Table 11 Global Interposer and Fan-out Wafer Level Packaging Market Outlook, By Other Device Types (2021-2030) ($MN)
  • Table 12 Global Interposer and Fan-out Wafer Level Packaging Market Outlook, By Technology (2021-2030) ($MN)
  • Table 13 Global Interposer and Fan-out Wafer Level Packaging Market Outlook, By Interposer (2021-2030) ($MN)
  • Table 14 Global Interposer and Fan-out Wafer Level Packaging Market Outlook, By Fan-Out Wafer-Level Packaging (FOWLP) (2021-2030) ($MN)
  • Table 15 Global Interposer and Fan-out Wafer Level Packaging Market Outlook, By Through Silicon Vias (2021-2030) ($MN)
  • Table 16 Global Interposer and Fan-out Wafer Level Packaging Market Outlook, By End User (2021-2030) ($MN)
  • Table 17 Global Interposer and Fan-out Wafer Level Packaging Market Outlook, By Consumer Electronics (2021-2030) ($MN)
  • Table 18 Global Interposer and Fan-out Wafer Level Packaging Market Outlook, By Telecommunication (2021-2030) ($MN)
  • Table 19 Global Interposer and Fan-out Wafer Level Packaging Market Outlook, By Automotive (2021-2030) ($MN)
  • Table 20 Global Interposer and Fan-out Wafer Level Packaging Market Outlook, By Military and Aerospace (2021-2030) ($MN)
  • Table 21 Global Interposer and Fan-out Wafer Level Packaging Market Outlook, By Smart Technologies (2021-2030) ($MN)
  • Table 22 Global Interposer and Fan-out Wafer Level Packaging Market Outlook, By Medical devices (2021-2030) ($MN)
  • Table 23 Global Interposer and Fan-out Wafer Level Packaging Market Outlook, By Other End Users (2021-2030) ($MN)
  • Table 24 North America Interposer and Fan-out Wafer Level Packaging Market Outlook, By Country (2021-2030) ($MN)
  • Table 25 North America Interposer and Fan-out Wafer Level Packaging Market Outlook, By Packaging Type (2021-2030) ($MN)
  • Table 26 North America Interposer and Fan-out Wafer Level Packaging Market Outlook, By 2.5D (2021-2030) ($MN)
  • Table 27 North America Interposer and Fan-out Wafer Level Packaging Market Outlook, By 3D (2021-2030) ($MN)
  • Table 28 North America Interposer and Fan-out Wafer Level Packaging Market Outlook, By Device Type (2021-2030) ($MN)
  • Table 29 North America Interposer and Fan-out Wafer Level Packaging Market Outlook, By Imaging & Optoelectronics (2021-2030) ($MN)
  • Table 30 North America Interposer and Fan-out Wafer Level Packaging Market Outlook, By LEDs (2021-2030) ($MN)
  • Table 31 North America Interposer and Fan-out Wafer Level Packaging Market Outlook, By Logic Ics (2021-2030) ($MN)
  • Table 32 North America Interposer and Fan-out Wafer Level Packaging Market Outlook, By MEMS/Sensors (2021-2030) ($MN)
  • Table 33 North America Interposer and Fan-out Wafer Level Packaging Market Outlook, By Memory Devices (2021-2030) ($MN)
  • Table 34 North America Interposer and Fan-out Wafer Level Packaging Market Outlook, By Other Device Types (2021-2030) ($MN)
  • Table 35 North America Interposer and Fan-out Wafer Level Packaging Market Outlook, By Technology (2021-2030) ($MN)
  • Table 36 North America Interposer and Fan-out Wafer Level Packaging Market Outlook, By Interposer (2021-2030) ($MN)
  • Table 37 North America Interposer and Fan-out Wafer Level Packaging Market Outlook, By Fan-Out Wafer-Level Packaging (FOWLP) (2021-2030) ($MN)
  • Table 38 North America Interposer and Fan-out Wafer Level Packaging Market Outlook, By Through Silicon Vias (2021-2030) ($MN)
  • Table 39 North America Interposer and Fan-out Wafer Level Packaging Market Outlook, By End User (2021-2030) ($MN)
  • Table 40 North America Interposer and Fan-out Wafer Level Packaging Market Outlook, By Consumer Electronics (2021-2030) ($MN)
  • Table 41 North America Interposer and Fan-out Wafer Level Packaging Market Outlook, By Telecommunication (2021-2030) ($MN)
  • Table 42 North America Interposer and Fan-out Wafer Level Packaging Market Outlook, By Automotive (2021-2030) ($MN)
  • Table 43 North America Interposer and Fan-out Wafer Level Packaging Market Outlook, By Military and Aerospace (2021-2030) ($MN)
  • Table 44 North America Interposer and Fan-out Wafer Level Packaging Market Outlook, By Smart Technologies (2021-2030) ($MN)
  • Table 45 North America Interposer and Fan-out Wafer Level Packaging Market Outlook, By Medical devices (2021-2030) ($MN)
  • Table 46 North America Interposer and Fan-out Wafer Level Packaging Market Outlook, By Other End Users (2021-2030) ($MN)
  • Table 47 Europe Interposer and Fan-out Wafer Level Packaging Market Outlook, By Country (2021-2030) ($MN)
  • Table 48 Europe Interposer and Fan-out Wafer Level Packaging Market Outlook, By Packaging Type (2021-2030) ($MN)
  • Table 49 Europe Interposer and Fan-out Wafer Level Packaging Market Outlook, By 2.5D (2021-2030) ($MN)
  • Table 50 Europe Interposer and Fan-out Wafer Level Packaging Market Outlook, By 3D (2021-2030) ($MN)
  • Table 51 Europe Interposer and Fan-out Wafer Level Packaging Market Outlook, By Device Type (2021-2030) ($MN)
  • Table 52 Europe Interposer and Fan-out Wafer Level Packaging Market Outlook, By Imaging & Optoelectronics (2021-2030) ($MN)
  • Table 53 Europe Interposer and Fan-out Wafer Level Packaging Market Outlook, By LEDs (2021-2030) ($MN)
  • Table 54 Europe Interposer and Fan-out Wafer Level Packaging Market Outlook, By Logic Ics (2021-2030) ($MN)
  • Table 55 Europe Interposer and Fan-out Wafer Level Packaging Market Outlook, By MEMS/Sensors (2021-2030) ($MN)
  • Table 56 Europe Interposer and Fan-out Wafer Level Packaging Market Outlook, By Memory Devices (2021-2030) ($MN)
  • Table 57 Europe Interposer and Fan-out Wafer Level Packaging Market Outlook, By Other Device Types (2021-2030) ($MN)
  • Table 58 Europe Interposer and Fan-out Wafer Level Packaging Market Outlook, By Technology (2021-2030) ($MN)
  • Table 59 Europe Interposer and Fan-out Wafer Level Packaging Market Outlook, By Interposer (2021-2030) ($MN)
  • Table 60 Europe Interposer and Fan-out Wafer Level Packaging Market Outlook, By Fan-Out Wafer-Level Packaging (FOWLP) (2021-2030) ($MN)
  • Table 61 Europe Interposer and Fan-out Wafer Level Packaging Market Outlook, By Through Silicon Vias (2021-2030) ($MN)
  • Table 62 Europe Interposer and Fan-out Wafer Level Packaging Market Outlook, By End User (2021-2030) ($MN)
  • Table 63 Europe Interposer and Fan-out Wafer Level Packaging Market Outlook, By Consumer Electronics (2021-2030) ($MN)
  • Table 64 Europe Interposer and Fan-out Wafer Level Packaging Market Outlook, By Telecommunication (2021-2030) ($MN)
  • Table 65 Europe Interposer and Fan-out Wafer Level Packaging Market Outlook, By Automotive (2021-2030) ($MN)
  • Table 66 Europe Interposer and Fan-out Wafer Level Packaging Market Outlook, By Military and Aerospace (2021-2030) ($MN)
  • Table 67 Europe Interposer and Fan-out Wafer Level Packaging Market Outlook, By Smart Technologies (2021-2030) ($MN)
  • Table 68 Europe Interposer and Fan-out Wafer Level Packaging Market Outlook, By Medical devices (2021-2030) ($MN)
  • Table 69 Europe Interposer and Fan-out Wafer Level Packaging Market Outlook, By Other End Users (2021-2030) ($MN)
  • Table 70 Asia Pacific Interposer and Fan-out Wafer Level Packaging Market Outlook, By Country (2021-2030) ($MN)
  • Table 71 Asia Pacific Interposer and Fan-out Wafer Level Packaging Market Outlook, By Packaging Type (2021-2030) ($MN)
  • Table 72 Asia Pacific Interposer and Fan-out Wafer Level Packaging Market Outlook, By 2.5D (2021-2030) ($MN)
  • Table 73 Asia Pacific Interposer and Fan-out Wafer Level Packaging Market Outlook, By 3D (2021-2030) ($MN)
  • Table 74 Asia Pacific Interposer and Fan-out Wafer Level Packaging Market Outlook, By Device Type (2021-2030) ($MN)
  • Table 75 Asia Pacific Interposer and Fan-out Wafer Level Packaging Market Outlook, By Imaging & Optoelectronics (2021-2030) ($MN)
  • Table 76 Asia Pacific Interposer and Fan-out Wafer Level Packaging Market Outlook, By LEDs (2021-2030) ($MN)
  • Table 77 Asia Pacific Interposer and Fan-out Wafer Level Packaging Market Outlook, By Logic Ics (2021-2030) ($MN)
  • Table 78 Asia Pacific Interposer and Fan-out Wafer Level Packaging Market Outlook, By MEMS/Sensors (2021-2030) ($MN)
  • Table 79 Asia Pacific Interposer and Fan-out Wafer Level Packaging Market Outlook, By Memory Devices (2021-2030) ($MN)
  • Table 80 Asia Pacific Interposer and Fan-out Wafer Level Packaging Market Outlook, By Other Device Types (2021-2030) ($MN)
  • Table 81 Asia Pacific Interposer and Fan-out Wafer Level Packaging Market Outlook, By Technology (2021-2030) ($MN)
  • Table 82 Asia Pacific Interposer and Fan-out Wafer Level Packaging Market Outlook, By Interposer (2021-2030) ($MN)
  • Table 83 Asia Pacific Interposer and Fan-out Wafer Level Packaging Market Outlook, By Fan-Out Wafer-Level Packaging (FOWLP) (2021-2030) ($MN)
  • Table 84 Asia Pacific Interposer and Fan-out Wafer Level Packaging Market Outlook, By Through Silicon Vias (2021-2030) ($MN)
  • Table 85 Asia Pacific Interposer and Fan-out Wafer Level Packaging Market Outlook, By End User (2021-2030) ($MN)
  • Table 86 Asia Pacific Interposer and Fan-out Wafer Level Packaging Market Outlook, By Consumer Electronics (2021-2030) ($MN)
  • Table 87 Asia Pacific Interposer and Fan-out Wafer Level Packaging Market Outlook, By Telecommunication (2021-2030) ($MN)
  • Table 88 Asia Pacific Interposer and Fan-out Wafer Level Packaging Market Outlook, By Automotive (2021-2030) ($MN)
  • Table 89 Asia Pacific Interposer and Fan-out Wafer Level Packaging Market Outlook, By Military and Aerospace (2021-2030) ($MN)
  • Table 90 Asia Pacific Interposer and Fan-out Wafer Level Packaging Market Outlook, By Smart Technologies (2021-2030) ($MN)
  • Table 91 Asia Pacific Interposer and Fan-out Wafer Level Packaging Market Outlook, By Medical devices (2021-2030) ($MN)
  • Table 92 Asia Pacific Interposer and Fan-out Wafer Level Packaging Market Outlook, By Other End Users (2021-2030) ($MN)
  • Table 93 South America Interposer and Fan-out Wafer Level Packaging Market Outlook, By Country (2021-2030) ($MN)
  • Table 94 South America Interposer and Fan-out Wafer Level Packaging Market Outlook, By Packaging Type (2021-2030) ($MN)
  • Table 95 South America Interposer and Fan-out Wafer Level Packaging Market Outlook, By 2.5D (2021-2030) ($MN)
  • Table 96 South America Interposer and Fan-out Wafer Level Packaging Market Outlook, By 3D (2021-2030) ($MN)
  • Table 97 South America Interposer and Fan-out Wafer Level Packaging Market Outlook, By Device Type (2021-2030) ($MN)
  • Table 98 South America Interposer and Fan-out Wafer Level Packaging Market Outlook, By Imaging & Optoelectronics (2021-2030) ($MN)
  • Table 99 South America Interposer and Fan-out Wafer Level Packaging Market Outlook, By LEDs (2021-2030) ($MN)
  • Table 100 South America Interposer and Fan-out Wafer Level Packaging Market Outlook, By Logic Ics (2021-2030) ($MN)
  • Table 101 South America Interposer and Fan-out Wafer Level Packaging Market Outlook, By MEMS/Sensors (2021-2030) ($MN)
  • Table 102 South America Interposer and Fan-out Wafer Level Packaging Market Outlook, By Memory Devices (2021-2030) ($MN)
  • Table 103 South America Interposer and Fan-out Wafer Level Packaging Market Outlook, By Other Device Types (2021-2030) ($MN)
  • Table 104 South America Interposer and Fan-out Wafer Level Packaging Market Outlook, By Technology (2021-2030) ($MN)
  • Table 105 South America Interposer and Fan-out Wafer Level Packaging Market Outlook, By Interposer (2021-2030) ($MN)
  • Table 106 South America Interposer and Fan-out Wafer Level Packaging Market Outlook, By Fan-Out Wafer-Level Packaging (FOWLP) (2021-2030) ($MN)
  • Table 107 South America Interposer and Fan-out Wafer Level Packaging Market Outlook, By Through Silicon Vias (2021-2030) ($MN)
  • Table 108 South America Interposer and Fan-out Wafer Level Packaging Market Outlook, By End User (2021-2030) ($MN)
  • Table 109 South America Interposer and Fan-out Wafer Level Packaging Market Outlook, By Consumer Electronics (2021-2030) ($MN)
  • Table 110 South America Interposer and Fan-out Wafer Level Packaging Market Outlook, By Telecommunication (2021-2030) ($MN)
  • Table 111 South America Interposer and Fan-out Wafer Level Packaging Market Outlook, By Automotive (2021-2030) ($MN)
  • Table 112 South America Interposer and Fan-out Wafer Level Packaging Market Outlook, By Military and Aerospace (2021-2030) ($MN)
  • Table 113 South America Interposer and Fan-out Wafer Level Packaging Market Outlook, By Smart Technologies (2021-2030) ($MN)
  • Table 114 South America Interposer and Fan-out Wafer Level Packaging Market Outlook, By Medical devices (2021-2030) ($MN)
  • Table 115 South America Interposer and Fan-out Wafer Level Packaging Market Outlook, By Other End Users (2021-2030) ($MN)
  • Table 116 Middle East & Africa Interposer and Fan-out Wafer Level Packaging Market Outlook, By Country (2021-2030) ($MN)
  • Table 117 Middle East & Africa Interposer and Fan-out Wafer Level Packaging Market Outlook, By Packaging Type (2021-2030) ($MN)
  • Table 118 Middle East & Africa Interposer and Fan-out Wafer Level Packaging Market Outlook, By 2.5D (2021-2030) ($MN)
  • Table 119 Middle East & Africa Interposer and Fan-out Wafer Level Packaging Market Outlook, By 3D (2021-2030) ($MN)
  • Table 120 Middle East & Africa Interposer and Fan-out Wafer Level Packaging Market Outlook, By Device Type (2021-2030) ($MN)
  • Table 121 Middle East & Africa Interposer and Fan-out Wafer Level Packaging Market Outlook, By Imaging & Optoelectronics (2021-2030) ($MN)
  • Table 122 Middle East & Africa Interposer and Fan-out Wafer Level Packaging Market Outlook, By LEDs (2021-2030) ($MN)
  • Table 123 Middle East & Africa Interposer and Fan-out Wafer Level Packaging Market Outlook, By Logic Ics (2021-2030) ($MN)
  • Table 124 Middle East & Africa Interposer and Fan-out Wafer Level Packaging Market Outlook, By MEMS/Sensors (2021-2030) ($MN)
  • Table 125 Middle East & Africa Interposer and Fan-out Wafer Level Packaging Market Outlook, By Memory Devices (2021-2030) ($MN)
  • Table 126 Middle East & Africa Interposer and Fan-out Wafer Level Packaging Market Outlook, By Other Device Types (2021-2030) ($MN)
  • Table 127 Middle East & Africa Interposer and Fan-out Wafer Level Packaging Market Outlook, By Technology (2021-2030) ($MN)
  • Table 128 Middle East & Africa Interposer and Fan-out Wafer Level Packaging Market Outlook, By Interposer (2021-2030) ($MN)
  • Table 129 Middle East & Africa Interposer and Fan-out Wafer Level Packaging Market Outlook, By Fan-Out Wafer-Level Packaging (FOWLP) (2021-2030) ($MN)
  • Table 130 Middle East & Africa Interposer and Fan-out Wafer Level Packaging Market Outlook, By Through Silicon Vias (2021-2030) ($MN)
  • Table 131 Middle East & Africa Interposer and Fan-out Wafer Level Packaging Market Outlook, By End User (2021-2030) ($MN)
  • Table 132 Middle East & Africa Interposer and Fan-out Wafer Level Packaging Market Outlook, By Consumer Electronics (2021-2030) ($MN)
  • Table 133 Middle East & Africa Interposer and Fan-out Wafer Level Packaging Market Outlook, By Telecommunication (2021-2030) ($MN)
  • Table 134 Middle East & Africa Interposer and Fan-out Wafer Level Packaging Market Outlook, By Automotive (2021-2030) ($MN)
  • Table 135 Middle East & Africa Interposer and Fan-out Wafer Level Packaging Market Outlook, By Military and Aerospace (2021-2030) ($MN)
  • Table 136 Middle East & Africa Interposer and Fan-out Wafer Level Packaging Market Outlook, By Smart Technologies (2021-2030) ($MN)
  • Table 137 Middle East & Africa Interposer and Fan-out Wafer Level Packaging Market Outlook, By Medical devices (2021-2030) ($MN)
  • Table 138 Middle East & Africa Interposer and Fan-out Wafer Level Packaging Market Outlook, By Other End Users (2021-2030) ($MN)