市場調查報告書
商品編碼
1489419
到 2030 年中介層和扇出晶圓層次電子構裝市場預測:全球封裝類型、裝置類型、技術、最終用戶和地區Interposer and Fan-out Wafer Level Packaging Market Forecasts to 2030 - Global Packaging Type (2.5D and 3D), Device Type, Technology, End User and By Geography |
根據 Stratistics MRC 的數據,2023 年全球中介層和扇出晶圓層次電子構裝市場規模將達到 311 億美元,預計在預測期內將以 14.3% 的複合年成長率成長,到 2030 年達到 793 億美元。到過。
中介層和扇出晶圓層次電子構裝(FOWLP) 是先進的半導體封裝技術。中介層技術將矽或玻璃基板放置在積體電路之間,從而實現高密度連接和異質整合。另一方面,FOWLP 重新分配從晶片外圍到封裝表面的連接,從而提高性能並實現小型化。 FOWLP 有助於將多個晶片整合到一個封裝中,從而能夠開發更小、更強大的電子設備,例如智慧型手機、穿戴式裝置和物聯網設備,並促進半導體產業的創新。
對先進封裝技術的需求不斷成長
中介層和 FOWLP 可實現半導體元件的小型化和整合,從而實現更小的外形尺寸和更高的裝置密度。這對於穿戴式裝置、物聯網裝置和行動裝置等空間敏感型應用至關重要。與傳統封裝方法相比,這些封裝技術提高了電氣和熱性能。更短的互連、減少的寄生和改善的散熱提高了裝置性能、功率效率和可靠性,推動市場成長。
複雜的晶圓級工藝
複雜的晶圓級製程通常需要對專用設備和基礎設施進行大量投資。製造商可能需要投資先進的製造設備和工具來處理複雜的工藝,例如線路重布(RDL)、穿透矽通孔(TSV) 和細間距互連。這些初始成本可能令人望而卻步,尤其是對於小型或現金短缺的公司而言,並且可能會阻礙市場成長。
擴大異質集群的採用
異質整合使半導體公司能夠開發具有獨特功能和性能的創新產品。透過將多種功能整合到一個封裝中,製造商可以滿足消費性電子、汽車、醫療保健和物聯網等行業的廣泛應用。這個不斷擴大的市場機會正在推動針對異質整合要求客製化的內插器和 FOWLP 技術的需求。
有限的生態系統
狹窄的生態系統意味著關鍵零件、材料和製造設備依賴有限數量的供應商。供應鏈中斷,例如供不應求或單一供應商的品質問題,可能會嚴重影響生產計劃和產品可用性。半導體公司在尋找替代供應商和降低供應鏈風險方面面臨挑戰,這可能會影響他們滿足市場需求和客戶期望的能力。
COVID-19 的影響
封鎖措施和旅行限制影響了製造業務,導致供不應求和出貨延誤。家用電子電器和汽車等關鍵行業的需求不確定性進一步影響了市場成長,而疫情加速了數位轉型,遠距工作、線上教育和醫療保健應用對半導體設備的需求增加。
MEMS/感測器產業預計在預測期內規模最大
隨著 MEMS 感測器在半導體封裝中的整合推動小型化,實現更小的外形尺寸和增強的功能,MEMS/感測器領域預計將出現良好的成長。中介層和 FOWLP 技術促進了 MEMS 裝置與其他半導體元件的整合,從而實現異質整合和系統級最佳化。這種整合提高了汽車、消費性電子、物聯網和醫療保健領域基於 MEMS 的應用的效能、可靠性和成本效率。
消費性電子產業預計在預測期內複合年成長率最高
家用電子電器產業預計在預測期內複合年成長率最高。隨著消費者對更小、更輕和更高性能設備的需求不斷增加,半導體製造商正在轉向採用中介層和 FOWLP 等先進封裝解決方案來滿足這些需求。這些技術可實現更高水準的整合、改進的溫度控管和更高的電氣性能,這對於智慧型手機、平板電腦、穿戴式裝置和智慧家居設備等家用電子電器至關重要。
亞太地區預計將在預測期內佔據最大的市場佔有率,因為該地區是世界上一些最大的消費性電子市場的所在地,包括中國、日本、韓國和印度。對智慧型手機、平板電腦、穿戴式裝置和其他消費性電子產品不斷成長的需求正在推動內插器和 FOWLP 等先進封裝技術的採用,以滿足更小外形尺寸、更高性能和更高能源效率的要求。
預計北美在預測期內的複合年成長率最高,因為它是全球專門從事半導體封裝及相關技術的研究機構、大學和研發中心的所在地。這些機構與產業合作夥伴合作進行前沿研究、開發創新解決方案並培訓下一代半導體專業人員。學術界和工業界之間的協同效應將推動技術進步並加速北美內插器和 FOWLP 技術的商業化。
According to Stratistics MRC, the Global Interposer and Fan-out Wafer Level Packaging Market is accounted for $31.1 billion in 2023 and is expected to reach $79.3 billion by 2030 growing at a CAGR of 14.3% during the forecast period. Interposer and Fan-out Wafer Level Packaging (FOWLP) are advanced semiconductor packaging techniques. Interposer technology involves placing a silicon or glass substrate between integrated circuits, enabling high-density connections and heterogeneous integration. FOWLP, on the other hand, redistributes connections from the chip's periphery to the package's surface, enhancing performance and miniaturization. They facilitate the integration of multiple chips into a single package, enabling the development of smaller, more powerful electronic devices such as smartphones, wearables, and IoT devices, driving innovation in the semiconductor industry.
Increasing demand for advanced packaging technologies
Interposer and FOWLP enable the miniaturization and integration of semiconductor components, leading to smaller form factors and higher device density. This is crucial for applications where space is a premium, such as wearables, IoT devices, and mobile devices. These packaging technologies provide enhanced electrical and thermal performance compared to traditional packaging methods. They offer shorter interconnects reduced parasitics, and better heat dissipation, resulting in improved device performance, power efficiency, and reliability boosting the growth of the market.
Complex wafer-level processes
Complex wafer-level processes often require significant investment in specialized equipment and infrastructure. Manufacturers may need to invest in advanced fabrication facilities and tools to handle intricate processes such as redistribution layers (RDLs), through-silicon vias (TSVs), and fine pitch interconnects. These upfront costs can be prohibitive for some companies, particularly smaller players or those with limited financial resources, thus hindering market growth.
Growing adoption of heterogeneous integration
Heterogeneous integration allows semiconductor companies to develop innovative products with unique features and capabilities. By integrating diverse functionalities into a single package, manufacturers can address a broader range of applications across various industries, including consumer electronics, automotive, healthcare, and IoT. This expanded market opportunity fuels the demand for interposer and FOWLP technologies tailored to heterogeneous integration requirements.
Limited ecosystem
A narrow ecosystem may result in dependencies on a limited number of suppliers for critical components, materials, and manufacturing equipment. Supply chain disruptions, such as shortages or quality issues from a single source, can significantly impact production schedules and product availability. Semiconductor companies may face challenges in securing alternative suppliers or mitigating supply chain risks, affecting their ability to meet market demand and customer expectations.
Covid-19 Impact
Lockdown measures and travel restrictions affected manufacturing operations, leading to supply shortages and shipment delays. Uncertainty in demand from key industries like consumer electronics and automotive further impacted market growth, however, the pandemic also accelerated digital transformation, increasing demand for semiconductor devices for remote work, online education, and healthcare applications.
The MEMS/sensors segment is expected to be the largest during the forecast period
The MEMS/sensors segment is estimated to have a lucrative growth, due to integration of MEMS sensors within semiconductor packages drives miniaturization, enabling smaller form factors and enhanced functionality. Interposer and FOWLP technologies facilitate the integration of MEMS devices with other semiconductor components, enabling heterogeneous integration and system-level optimization. This integration enhances the performance, reliability, and cost-effectiveness of MEMS-based applications in automotive, consumer electronics, IoT, and healthcare sectors.
The consumer electronics segment is expected to have the highest CAGR during the forecast period
The consumer electronics segment is anticipated to witness the highest CAGR growth during the forecast period, as consumer demand for smaller, lighter, and more powerful devices increases, semiconductor manufacturers turn to advanced packaging solutions like interposer and FOWLP to meet these requirements. These technologies enable higher levels of integration, improved thermal management, and enhanced electrical performance, crucial for consumer electronics such as smartphones, tablets, wearables, and smart home devices.
Asia Pacific is projected to hold the largest market share during the forecast period owing to the Asia Pacific region which is home to some of the world's largest consumer electronics markets, including China, Japan, South Korea, and India. The increasing demand for smartphones, tablets, wearables, and other consumer electronics drives the adoption of advanced packaging technologies like interposer and FOWLP to meet the requirements of smaller form factors, higher performance, and improved energy efficiency.
North America is projected to have the highest CAGR over the forecast period, as North America hosts world-class research institutions, universities, and R&D centers specializing in semiconductor packaging and related technologies. These institutions collaborate with industry partners to conduct cutting-edge research, develop innovative solutions, and train the next generation of semiconductor professionals. The synergy between academia and industry fosters technological advancements and accelerates the commercialization of interposer and FOWLP technologies in North America.
Key players in the market
Some of the key players in the Interposer and Fan-out Wafer Level Packaging Market include Advanced MICRO DEVICES, Inc, Amkor Technology, ASE Technology Holding Co., Ltd., DAI Nippon Printing CO., LTD., DECA Technologies, Dupont, Global Foundries Inc, JCET Group LTD., Nexlogic Technologies INC., Powertech Technology Inc., RENA Technologies GMBH, Samsung, SAMTEC, SK Hynix Inc., SPTS Technologies Ltd., Teledyne Digital Imaging Inc., Toshiba Electronic Devices & Storage Corporation and United Microelectronics Corporation
In April 2024, Infineon and Amkor Deepen Partnership and Strengthen European Supply Chain for Semiconductor Solutions. Both companies have agreed on operating a dedicated packaging and test center at Amkor's manufacturing site in Porto.
In March 2024, DuPont and Menatek Defense Technologies announced that they have entered into an agreement related to the global bearing market. This collaboration between the two companies involves NAZ Bearings(R), an innovative bearing that is self-lubricating and maintenance free.
In April 2024, Teledyne DALSA, a Teledyne Technologies company announced a radiometric version of its MicroCalibir(TM) Long Wave Infrared (LWIR) compact camera platform that delivers accurate temperature measurements of +/-2°C or +/-2%.