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1587592

到 2030 年覆晶市場預測：基板、凸塊技術、應用、最終用戶和地區進行的全球分析

Flip Chip Market Forecasts to 2030 - Global Analysis By Substrate, Bumping Technology, Application, End User and By Geography
出版日期: | 出版商: Stratistics Market Research Consulting | 英文 200+ Pages | 商品交期: 2-3個工作天內

價格

根據Stratistics MRC預測，2024年全球覆晶市場規模將達306億美元，預計2030年將達到518億美元，預測期內複合年成長率為9.2%。

覆晶是一種半導體封裝技術，它使用將晶片墊片連接到基板上相應墊片的焊料凸塊晶粒積體電路（IC）晶片直接安裝到基板或電路基板。與用細線連接晶粒的傳統引線接合法合不同，覆晶可以實現更緊湊的設計並提高電氣性能。將晶粒翻轉過來可以透過焊料焊料凸塊進行直接電氣連接，從而改善散熱並減少訊號延遲。

對先進封裝的需求不斷成長

對先進封裝技術不斷成長的需求極大地推動了覆晶構裝的採用和創新。這種翻轉晶片並透過焊料凸塊將其直接連接到基板的方法提高了電氣性能和溫度控管。隨著家用電子電器、物聯網設備和汽車應用變得越來越複雜，對更小、更快、更有效率元件的需求不斷增加，導致製造商考慮覆晶解決方案。這些技術提供了更高的 I/O 密度並減少了寄生電感和電容，使其成為高速應用的理想選擇。

溫度控管問題

溫度控管問題極大地影響了覆晶技術的性能和可靠性，覆晶技術是一種廣泛使用的積體電路封裝方法。覆晶的特點是將晶粒直接安裝到基板上並透過焊料凸塊連接。這種配置有利於縮短訊號途徑長度，但通常會帶來散熱挑戰。隨著晶片變得越來越複雜，它們會產生大量熱量，這可能會導致熱應力並影響性能。如果沒有有效的散熱，動作溫度可能會升高，導致效率降低、可能發生熱失控，甚至晶片故障。

擴大 LED 和功率元件的用途

LED技術和先進功率元件的日益採用顯著提高了覆晶構裝的性能和實用性。覆晶是一種將半導體晶粒直接安裝到基板上的方法，提供出色的電氣連接和溫度控管，使其成為高密度應用的理想選擇。隨著 LED 照明和電力電子在各個行業中變得越來越普遍，對更有效率、更緊湊、更可靠的封裝解決方案的需求正在迅速增加。覆晶技術透過實現更小的外形尺寸和改善散熱來滿足這些需求，這對於維持 LED 和功率裝置的性能和壽命至關重要。

智慧財產權問題

覆晶技術對於先進半導體封裝至關重要，但面臨阻礙其廣泛採用的重大智慧財產權 (IP) 挑戰。不同的公司在覆晶製程、材料和設計方面持有大量專利，從而形成複雜的授權合約並可能引發法律糾紛。這種碎片化對新參與企業和小型企業造成了障礙，它們可能缺乏應對複雜智慧財產權環境的資源。專注於訴訟而不是開發的公司可能會抑制創新並減緩覆晶技術本身的進步。此外，與智慧財產權合規和侵權風險相關的高成本阻礙了研發投資，進一步影響了技術發展。

COVID-19 的影響：

COVID-19 大流行對覆晶產業產生了重大影響，擾亂了世界各地的供應鏈和製造流程。由於封鎖，許多半導體製造工廠面臨暫時關閉或產能減少，導致生產延遲。由於遠端工作和對數位技術的依賴增加，對電子設備的需求增加，進一步加劇了供應鏈的緊張，並導致必需材料的短缺。總體而言，疫情凸顯了半導體生態系統的脆弱性，並促使人們重新評估策略，以增強抵禦能力並滿足全球對先進電子元件日益成長的需求。

預計聚醯胺細分市場將在預測期內成為最大的細分市場

預計聚醯胺細分市場在預測期內將佔據最大佔有率。聚醯胺以其優異的熱穩定性、機械強度和耐化學性而聞名，並且擴大用於覆晶封裝和絕緣層。這些特性有助於減少熱循環和潮濕問題，這在高性能應用中非常重要。聚醯胺透過增加層間黏合力並降低分層的可能性，有助於延長覆晶組件的使用壽命和耐用性。

預計航太和國防部門在預測期內複合年成長率最高

預計航太和國防領域將在預測期內快速成長。覆晶構裝允許半導體晶片直接連接到基板，減少電氣途徑長度並最大限度地減少訊號損失，這在高頻環境中至關重要。這項創新對於重量、尺寸和溫度控管都很重要的航太和國防應用特別有益。硬化覆晶設計採用了先進的材料和工藝，以確保在極端溫度和輻射等惡劣條件下的穩健性。

比最大的地區

預計亞太地區將在整個預測期內保持最大的市場佔有率。汽車技術的發展，特別是電動車 (EV) 和高級駕駛輔助系統 (ADAS) 的興起，增加了對緊湊高效半導體解決方案的需求。覆晶技術能夠實現更高效的晶片到基板互連，因此越來越受歡迎，因為它可以提高性能，同時最大限度地減少空間和重量，而空間和重量一直是現代汽車設計的關鍵因素。中國、日本和韓國等國家正在引領這一趨勢，大力投資半導體製造以支持其蓬勃發展的汽車工業。

複合年成長率最高的地區：

透過促進技術創新、確保品質標準和促進永續實踐，預計歐洲地區在預測期內的複合年成長率最高。旨在電子廢棄物管理和環境永續性的法律規範鼓勵製造商採用先進技術來提高效率並減少生態影響。嚴格的安全和性能法規確保覆晶產品符合高品質標準，提高消費者的信任和行業信譽。此外，歐盟（EU）以減少對不可再生資源的依賴為重點，正在促進替代材料和工藝的研發，以進一步提高競爭力。

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目錄

第1章執行摘要

第2章 前言

  • 概述
  • 相關利益者
  • 調查範圍
  • 調查方法
    • 資料探勘
    • 資料分析
    • 資料檢驗
    • 研究途徑
  • 研究資訊來源
    • 主要研究資訊來源
    • 二次研究資訊來源
    • 先決條件

第3章市場趨勢分析

  • 促進因素
  • 抑制因素
  • 機會
  • 威脅
  • 應用分析
  • 最終用戶分析
  • 新興市場
  • COVID-19 的影響

第4章波特五力分析

  • 供應商的議價能力
  • 買方議價能力
  • 替代品的威脅
  • 新進入者的威脅
  • 競爭公司之間的敵對關係

第5章全球覆晶市場：依基板

  • 層壓板
  • 陶瓷製品
  • 聚醯胺
  • 矽
  • 其他基板

第6章 全球覆晶市場：透過凸塊技術

  • 黏著凸塊
  • 焊料凸塊
  • 螺柱凸塊
  • 其他碰撞技術

第7章全球覆晶市場：依應用分類

  • 記憶庫
  • 感應器
  • 發光二極體
  • 圖形處理單元
  • 其他用途

第8章全球覆晶市場：依最終用戶分類

  • 家電
  • 車
  • 衛生保健
  • 航太和國防
  • 通訊/IT
  • 其他最終用戶

第9章全球覆晶市場：按地區

  • 北美洲
    • 美國
    • 加拿大
    • 墨西哥
  • 歐洲
    • 德國
    • 英國
    • 義大利
    • 法國
    • 西班牙
    • 其他歐洲國家
  • 亞太地區
    • 日本
    • 中國
    • 印度
    • 澳洲
    • 紐西蘭
    • 韓國
    • 其他亞太地區
  • 南美洲
    • 阿根廷
    • 巴西
    • 智利
    • 南美洲其他地區
  • 中東/非洲
    • 沙烏地阿拉伯
    • 阿拉伯聯合大公國
    • 卡達
    • 南非
    • 其他中東和非洲

第10章 主要進展

  • 合約、夥伴關係、協作和合資企業
  • 收購和合併
  • 新產品發布
  • 業務拓展
  • 其他關鍵策略

第11章 公司概況

  • ASE Group
  • Broadcom Inc
  • Chipbond Technology Corporation
  • Infineon Technologies
  • Intel Corporation
  • KLA Corporation
  • NXP Semiconductors
  • Powertech Technology Inc
  • Renesas Electronics Corporation
  • Semtech Corporation
  • Skyworks Solutions
  • Toshiba Corporation
  • UTAC Holdings Ltd
Product Code: SMRC27688

According to Stratistics MRC, the Global Flip Chip Market is accounted for $30.6 billion in 2024 and is expected to reach $51.8 billion by 2030 growing at a CAGR of 9.2% during the forecast period. Flip chip is a semiconductor packaging technology where an integrated circuit (IC) die is mounted directly onto a substrate or circuit board, using solder bumps that connect the chip's pads to corresponding pads on the substrate. Unlike traditional wire bonding, which connects the die with fine wires, flip chip allows for a more compact design and improved electrical performance. The die is flipped upside down, enabling a direct electrical connection through the solder bumps, which facilitates better heat dissipation and reduces signal delay.

Market Dynamics:

Driver:

Rising demand for advanced packaging

The rising demand for advanced packaging technologies is significantly enhancing the adoption and innovation of Flip Chip packaging. This method, which involves flipping the chip to connect directly to the substrate using solder bumps, allows for improved electrical performance and thermal management. As consumer electronics, IoT devices, and automotive applications become more sophisticated, the need for smaller, faster, and more efficient components drives manufacturers to explore Flip Chip solutions. These technologies facilitate higher I/O density and reduce parasitic inductance and capacitance, making them ideal for high-speed applications.

Restraint:

Thermal management issues

Thermal management issues significantly impact the performance and reliability of flip chip technology, a widely used packaging method in integrated circuits. Flip chips feature a die mounted directly onto a substrate, connecting through solder bumps. This configuration, while advantageous for reducing signal path lengths, often leads to challenges in heat dissipation. As chips become more powerful, they generate substantial heat, which can cause thermal stresses and affect performance. Ineffective heat removal can lead to increased operating temperatures, resulting in reduced efficiency, potential thermal runaway, and even failure of the chip.

Opportunity:

Increased adoption of LED and power devices

The increased adoption of LED technology and advanced power devices is substantially enhancing the performance and utility of flip chip packaging. Flip chip, a method where the semiconductor die is mounted directly onto a substrate, offers superior electrical connectivity and thermal management, making it ideal for high-density applications. As LED lighting and power electronics gain traction in various industries, the demand for more efficient, compact, and reliable packaging solutions has surged. Flip chip technology accommodates these needs by enabling smaller form factors and better heat dissipation, which is crucial for maintaining performance and longevity in LED and power devices.

Threat:

Intellectual property issues

The flip chip technology, essential for advanced semiconductor packaging, faces significant intellectual property (IP) challenges that hinder its widespread adoption. Various companies hold numerous patents related to flip chip processes, materials, and designs, leading to complex licensing agreements and potential legal disputes. This fragmentation creates barriers for new entrants and smaller firms, who may lack the resources to navigate the intricate IP landscape. Innovation can be stifled as companies focus on litigation rather than development, slowing the advancement of flip chip technology itself. The high costs associated with IP compliance and the risk of infringement also deter investment in research and development, further impacting the technology's evolution.

Covid-19 Impact:

The COVID-19 pandemic significantly impacted the flip chip industry, disrupting supply chains and manufacturing processes worldwide. As lockdowns were enforced, many semiconductor fabrication facilities faced temporary closures or reduced capacity, leading to delays in production. The heightened demand for electronics spurred by remote work and increased digital reliance further strained the supply chain, resulting in shortages of essential materials. Overall, the pandemic highlighted vulnerabilities in the semiconductor ecosystem, prompting a reevaluation of strategies to enhance resilience and meet the growing global demand for advanced electronic components.

The Polyamides segment is expected to be the largest during the forecast period

Polyamides segment is expected to dominate the largest share over the estimated period. Polyamides, known for their excellent thermal stability, mechanical strength, and chemical resistance, are increasingly used in the encapsulation and insulation layers of flip chips. These properties help mitigate issues related to thermal cycling and moisture, which are critical in high-performance applications. By improving adhesion between layers and reducing the likelihood of delamination, polyamides contribute to longer lifespans and increased durability of flip chip assemblies.

The Aerospace & Defense segment is expected to have the highest CAGR during the forecast period

Aerospace & Defense segment is estimated to grow at a rapid pace during the forecast period. Flip chip packaging allows for direct connection of semiconductor chips to substrates, reducing the length of electrical pathways and minimizing signal loss, which is vital in high-frequency environments. This innovation is particularly beneficial in aerospace and defense applications where weight, size, and thermal management are crucial. Enhanced flip chip designs incorporate advanced materials and processes to ensure robustness against harsh conditions, such as extreme temperatures and radiation.

Region with largest share:

Asia Pacific region is poised to hold the largest share of the market throughout the extrapolated period. As automotive technology evolves, particularly with the rise of electric vehicles (EVs) and advanced driver-assistance systems (ADAS), the need for compact and efficient semiconductor solutions is paramount. Flip Chip technology, which allows for a more efficient interconnection between chips and substrates, is increasingly favored for its ability to improve performance while minimizing space and weight crucial factors in modern automotive design. Countries like China, Japan, and South Korea are leading this trend, investing heavily in semiconductor manufacturing to support the burgeoning automotive industry.

Region with highest CAGR:

Europe region is estimated to witness the highest CAGR during the projected time frame by promoting innovation, ensuring quality standards, and fostering sustainable practices. Regulatory frameworks aimed at electronic waste management and environmental sustainability encourage manufacturers to adopt advanced technologies that improve efficiency and reduce ecological impact. Stringent safety and performance regulations ensure that Flip Chip products meet high-quality benchmarks, bolstering consumer confidence and industry credibility. The European Union's emphasis on reducing reliance on non-renewable resources also drives research and development in alternative materials and processes, further enhancing competitiveness.

Key players in the market

Some of the key players in Flip Chip market include ASE Group, Broadcom Inc, Chipbond Technology Corporation, Infineon Technologies, Intel Corporation, KLA Corporation, NXP Semiconductors, Powertech Technology Inc, Renesas Electronics Corporation, Semtech Corporation, Skyworks Solutions, Toshiba Corporation and UTAC Holdings Ltd.

Key Developments:

In December 2023, YES TECH launched the Mnano II series of small-pitch products in Spain that offers high reliability and low power dissipation in the display industry.

In December 2023, Innoscience launched low-voltage discrete HEMTs with FC QFN packaging that offers benefits such as easy assembly, mounting, and greater design flexibility.

In September 2022, Bharti Airtel, one of India's leading providers of communications services with more than 358 million subscribers, and IBM announced their intention to collaborate on the deployment of Airtel's edge computing platform in India, which will include 120 network data centers spread across 20 cities.

In July 2022, Luminus Devices Inc, a designer & manufacturer of LEDs and Solid-State Technology (SST) light sources for illumination markets, launched MP-3030-110F flip-chip LEDs. The flip chip design features no wire bond, creating higher reliability along with enhanced sulfur resistance for robust performance ideal for horticulture applications and outdoor & harsh lighting environments.

Substrates Covered:

  • Laminates
  • Ceramics
  • Polyamides
  • Silicon
  • Other Substrates

Bumping Technologies Covered:

  • Adhesive Bumping
  • Solder Bumping
  • Stud Bumping
  • Other Bumping Technologies

Applications Covered:

  • Memory Based
  • Sensors
  • Light Emitting Diode
  • Graphics Processing Unit
  • Other Applications

End Users Covered:

  • Consumer Electronics
  • Automotive
  • Healthcare
  • Aerospace & Defense
  • Telecom & IT
  • Other End Users

Regions Covered:

  • North America
    • US
    • Canada
    • Mexico
  • Europe
    • Germany
    • UK
    • Italy
    • France
    • Spain
    • Rest of Europe
  • Asia Pacific
    • Japan
    • China
    • India
    • Australia
    • New Zealand
    • South Korea
    • Rest of Asia Pacific
  • South America
    • Argentina
    • Brazil
    • Chile
    • Rest of South America
  • Middle East & Africa
    • Saudi Arabia
    • UAE
    • Qatar
    • South Africa
    • Rest of Middle East & Africa

What our report offers:

  • Market share assessments for the regional and country-level segments
  • Strategic recommendations for the new entrants
  • Covers Market data for the years 2022, 2023, 2024, 2026, and 2030
  • Market Trends (Drivers, Constraints, Opportunities, Threats, Challenges, Investment Opportunities, and recommendations)
  • Strategic recommendations in key business segments based on the market estimations
  • Competitive landscaping mapping the key common trends
  • Company profiling with detailed strategies, financials, and recent developments
  • Supply chain trends mapping the latest technological advancements

Free Customization Offerings:

All the customers of this report will be entitled to receive one of the following free customization options:

  • Company Profiling
    • Comprehensive profiling of additional market players (up to 3)
    • SWOT Analysis of key players (up to 3)
  • Regional Segmentation
    • Market estimations, Forecasts and CAGR of any prominent country as per the client's interest (Note: Depends on feasibility check)
  • Competitive Benchmarking
    • Benchmarking of key players based on product portfolio, geographical presence, and strategic alliances

Table of Contents

1 Executive Summary

2 Preface

  • 2.1 Abstract
  • 2.2 Stake Holders
  • 2.3 Research Scope
  • 2.4 Research Methodology
    • 2.4.1 Data Mining
    • 2.4.2 Data Analysis
    • 2.4.3 Data Validation
    • 2.4.4 Research Approach
  • 2.5 Research Sources
    • 2.5.1 Primary Research Sources
    • 2.5.2 Secondary Research Sources
    • 2.5.3 Assumptions

3 Market Trend Analysis

  • 3.1 Introduction
  • 3.2 Drivers
  • 3.3 Restraints
  • 3.4 Opportunities
  • 3.5 Threats
  • 3.6 Application Analysis
  • 3.7 End User Analysis
  • 3.8 Emerging Markets
  • 3.9 Impact of Covid-19

4 Porters Five Force Analysis

  • 4.1 Bargaining power of suppliers
  • 4.2 Bargaining power of buyers
  • 4.3 Threat of substitutes
  • 4.4 Threat of new entrants
  • 4.5 Competitive rivalry

5 Global Flip Chip Market, By Substrate

  • 5.1 Introduction
  • 5.2 Laminates
  • 5.3 Ceramics
  • 5.4 Polyamides
  • 5.5 Silicon
  • 5.6 Other Substrates

6 Global Flip Chip Market, By Bumping Technology

  • 6.1 Introduction
  • 6.2 Adhesive Bumping
  • 6.3 Solder Bumping
  • 6.4 Stud Bumping
  • 6.5 Other Bumping Technologies

7 Global Flip Chip Market, By Application

  • 7.1 Introduction
  • 7.2 Memory Based
  • 7.3 Sensors
  • 7.4 Light Emitting Diode
  • 7.5 Graphics Processing Unit
  • 7.6 Other Applications

8 Global Flip Chip Market, By End User

  • 8.1 Introduction
  • 8.2 Consumer Electronics
  • 8.3 Automotive
  • 8.4 Healthcare
  • 8.5 Aerospace & Defense
  • 8.6 Telecom & IT
  • 8.7 Other End Users

9 Global Flip Chip Market, By Geography

  • 9.1 Introduction
  • 9.2 North America
    • 9.2.1 US
    • 9.2.2 Canada
    • 9.2.3 Mexico
  • 9.3 Europe
    • 9.3.1 Germany
    • 9.3.2 UK
    • 9.3.3 Italy
    • 9.3.4 France
    • 9.3.5 Spain
    • 9.3.6 Rest of Europe
  • 9.4 Asia Pacific
    • 9.4.1 Japan
    • 9.4.2 China
    • 9.4.3 India
    • 9.4.4 Australia
    • 9.4.5 New Zealand
    • 9.4.6 South Korea
    • 9.4.7 Rest of Asia Pacific
  • 9.5 South America
    • 9.5.1 Argentina
    • 9.5.2 Brazil
    • 9.5.3 Chile
    • 9.5.4 Rest of South America
  • 9.6 Middle East & Africa
    • 9.6.1 Saudi Arabia
    • 9.6.2 UAE
    • 9.6.3 Qatar
    • 9.6.4 South Africa
    • 9.6.5 Rest of Middle East & Africa

10 Key Developments

  • 10.1 Agreements, Partnerships, Collaborations and Joint Ventures
  • 10.2 Acquisitions & Mergers
  • 10.3 New Product Launch
  • 10.4 Expansions
  • 10.5 Other Key Strategies

11 Company Profiling

  • 11.1 ASE Group
  • 11.2 Broadcom Inc
  • 11.3 Chipbond Technology Corporation
  • 11.4 Infineon Technologies
  • 11.5 Intel Corporation
  • 11.6 KLA Corporation
  • 11.7 NXP Semiconductors
  • 11.8 Powertech Technology Inc
  • 11.9 Renesas Electronics Corporation
  • 11.10 Semtech Corporation
  • 11.11 Skyworks Solutions
  • 11.12 Toshiba Corporation
  • 11.13 UTAC Holdings Ltd

List of Tables

  • Table 1 Global Flip Chip Market Outlook, By Region (2022-2030) ($MN)
  • Table 2 Global Flip Chip Market Outlook, By Substrate (2022-2030) ($MN)
  • Table 3 Global Flip Chip Market Outlook, By Laminates (2022-2030) ($MN)
  • Table 4 Global Flip Chip Market Outlook, By Ceramics (2022-2030) ($MN)
  • Table 5 Global Flip Chip Market Outlook, By Polyamides (2022-2030) ($MN)
  • Table 6 Global Flip Chip Market Outlook, By Silicon (2022-2030) ($MN)
  • Table 7 Global Flip Chip Market Outlook, By Other Substrates (2022-2030) ($MN)
  • Table 8 Global Flip Chip Market Outlook, By Bumping Technology (2022-2030) ($MN)
  • Table 9 Global Flip Chip Market Outlook, By Adhesive Bumping (2022-2030) ($MN)
  • Table 10 Global Flip Chip Market Outlook, By Solder Bumping (2022-2030) ($MN)
  • Table 11 Global Flip Chip Market Outlook, By Stud Bumping (2022-2030) ($MN)
  • Table 12 Global Flip Chip Market Outlook, By Other Bumping Technologies (2022-2030) ($MN)
  • Table 13 Global Flip Chip Market Outlook, By Application (2022-2030) ($MN)
  • Table 14 Global Flip Chip Market Outlook, By Memory Based (2022-2030) ($MN)
  • Table 15 Global Flip Chip Market Outlook, By Sensors (2022-2030) ($MN)
  • Table 16 Global Flip Chip Market Outlook, By Light Emitting Diode (2022-2030) ($MN)
  • Table 17 Global Flip Chip Market Outlook, By Graphics Processing Unit (2022-2030) ($MN)
  • Table 18 Global Flip Chip Market Outlook, By Other Applications (2022-2030) ($MN)
  • Table 19 Global Flip Chip Market Outlook, By End User (2022-2030) ($MN)
  • Table 20 Global Flip Chip Market Outlook, By Consumer Electronics (2022-2030) ($MN)
  • Table 21 Global Flip Chip Market Outlook, By Automotive (2022-2030) ($MN)
  • Table 22 Global Flip Chip Market Outlook, By Healthcare (2022-2030) ($MN)
  • Table 23 Global Flip Chip Market Outlook, By Aerospace & Defense (2022-2030) ($MN)
  • Table 24 Global Flip Chip Market Outlook, By Telecom & IT (2022-2030) ($MN)
  • Table 25 Global Flip Chip Market Outlook, By Other End Users (2022-2030) ($MN)
  • Table 26 North America Flip Chip Market Outlook, By Country (2022-2030) ($MN)
  • Table 27 North America Flip Chip Market Outlook, By Substrate (2022-2030) ($MN)
  • Table 28 North America Flip Chip Market Outlook, By Laminates (2022-2030) ($MN)
  • Table 29 North America Flip Chip Market Outlook, By Ceramics (2022-2030) ($MN)
  • Table 30 North America Flip Chip Market Outlook, By Polyamides (2022-2030) ($MN)
  • Table 31 North America Flip Chip Market Outlook, By Silicon (2022-2030) ($MN)
  • Table 32 North America Flip Chip Market Outlook, By Other Substrates (2022-2030) ($MN)
  • Table 33 North America Flip Chip Market Outlook, By Bumping Technology (2022-2030) ($MN)
  • Table 34 North America Flip Chip Market Outlook, By Adhesive Bumping (2022-2030) ($MN)
  • Table 35 North America Flip Chip Market Outlook, By Solder Bumping (2022-2030) ($MN)
  • Table 36 North America Flip Chip Market Outlook, By Stud Bumping (2022-2030) ($MN)
  • Table 37 North America Flip Chip Market Outlook, By Other Bumping Technologies (2022-2030) ($MN)
  • Table 38 North America Flip Chip Market Outlook, By Application (2022-2030) ($MN)
  • Table 39 North America Flip Chip Market Outlook, By Memory Based (2022-2030) ($MN)
  • Table 40 North America Flip Chip Market Outlook, By Sensors (2022-2030) ($MN)
  • Table 41 North America Flip Chip Market Outlook, By Light Emitting Diode (2022-2030) ($MN)
  • Table 42 North America Flip Chip Market Outlook, By Graphics Processing Unit (2022-2030) ($MN)
  • Table 43 North America Flip Chip Market Outlook, By Other Applications (2022-2030) ($MN)
  • Table 44 North America Flip Chip Market Outlook, By End User (2022-2030) ($MN)
  • Table 45 North America Flip Chip Market Outlook, By Consumer Electronics (2022-2030) ($MN)
  • Table 46 North America Flip Chip Market Outlook, By Automotive (2022-2030) ($MN)
  • Table 47 North America Flip Chip Market Outlook, By Healthcare (2022-2030) ($MN)
  • Table 48 North America Flip Chip Market Outlook, By Aerospace & Defense (2022-2030) ($MN)
  • Table 49 North America Flip Chip Market Outlook, By Telecom & IT (2022-2030) ($MN)
  • Table 50 North America Flip Chip Market Outlook, By Other End Users (2022-2030) ($MN)
  • Table 51 Europe Flip Chip Market Outlook, By Country (2022-2030) ($MN)
  • Table 52 Europe Flip Chip Market Outlook, By Substrate (2022-2030) ($MN)
  • Table 53 Europe Flip Chip Market Outlook, By Laminates (2022-2030) ($MN)
  • Table 54 Europe Flip Chip Market Outlook, By Ceramics (2022-2030) ($MN)
  • Table 55 Europe Flip Chip Market Outlook, By Polyamides (2022-2030) ($MN)
  • Table 56 Europe Flip Chip Market Outlook, By Silicon (2022-2030) ($MN)
  • Table 57 Europe Flip Chip Market Outlook, By Other Substrates (2022-2030) ($MN)
  • Table 58 Europe Flip Chip Market Outlook, By Bumping Technology (2022-2030) ($MN)
  • Table 59 Europe Flip Chip Market Outlook, By Adhesive Bumping (2022-2030) ($MN)
  • Table 60 Europe Flip Chip Market Outlook, By Solder Bumping (2022-2030) ($MN)
  • Table 61 Europe Flip Chip Market Outlook, By Stud Bumping (2022-2030) ($MN)
  • Table 62 Europe Flip Chip Market Outlook, By Other Bumping Technologies (2022-2030) ($MN)
  • Table 63 Europe Flip Chip Market Outlook, By Application (2022-2030) ($MN)
  • Table 64 Europe Flip Chip Market Outlook, By Memory Based (2022-2030) ($MN)
  • Table 65 Europe Flip Chip Market Outlook, By Sensors (2022-2030) ($MN)
  • Table 66 Europe Flip Chip Market Outlook, By Light Emitting Diode (2022-2030) ($MN)
  • Table 67 Europe Flip Chip Market Outlook, By Graphics Processing Unit (2022-2030) ($MN)
  • Table 68 Europe Flip Chip Market Outlook, By Other Applications (2022-2030) ($MN)
  • Table 69 Europe Flip Chip Market Outlook, By End User (2022-2030) ($MN)
  • Table 70 Europe Flip Chip Market Outlook, By Consumer Electronics (2022-2030) ($MN)
  • Table 71 Europe Flip Chip Market Outlook, By Automotive (2022-2030) ($MN)
  • Table 72 Europe Flip Chip Market Outlook, By Healthcare (2022-2030) ($MN)
  • Table 73 Europe Flip Chip Market Outlook, By Aerospace & Defense (2022-2030) ($MN)
  • Table 74 Europe Flip Chip Market Outlook, By Telecom & IT (2022-2030) ($MN)
  • Table 75 Europe Flip Chip Market Outlook, By Other End Users (2022-2030) ($MN)
  • Table 76 Asia Pacific Flip Chip Market Outlook, By Country (2022-2030) ($MN)
  • Table 77 Asia Pacific Flip Chip Market Outlook, By Substrate (2022-2030) ($MN)
  • Table 78 Asia Pacific Flip Chip Market Outlook, By Laminates (2022-2030) ($MN)
  • Table 79 Asia Pacific Flip Chip Market Outlook, By Ceramics (2022-2030) ($MN)
  • Table 80 Asia Pacific Flip Chip Market Outlook, By Polyamides (2022-2030) ($MN)
  • Table 81 Asia Pacific Flip Chip Market Outlook, By Silicon (2022-2030) ($MN)
  • Table 82 Asia Pacific Flip Chip Market Outlook, By Other Substrates (2022-2030) ($MN)
  • Table 83 Asia Pacific Flip Chip Market Outlook, By Bumping Technology (2022-2030) ($MN)
  • Table 84 Asia Pacific Flip Chip Market Outlook, By Adhesive Bumping (2022-2030) ($MN)
  • Table 85 Asia Pacific Flip Chip Market Outlook, By Solder Bumping (2022-2030) ($MN)
  • Table 86 Asia Pacific Flip Chip Market Outlook, By Stud Bumping (2022-2030) ($MN)
  • Table 87 Asia Pacific Flip Chip Market Outlook, By Other Bumping Technologies (2022-2030) ($MN)
  • Table 88 Asia Pacific Flip Chip Market Outlook, By Application (2022-2030) ($MN)
  • Table 89 Asia Pacific Flip Chip Market Outlook, By Memory Based (2022-2030) ($MN)
  • Table 90 Asia Pacific Flip Chip Market Outlook, By Sensors (2022-2030) ($MN)
  • Table 91 Asia Pacific Flip Chip Market Outlook, By Light Emitting Diode (2022-2030) ($MN)
  • Table 92 Asia Pacific Flip Chip Market Outlook, By Graphics Processing Unit (2022-2030) ($MN)
  • Table 93 Asia Pacific Flip Chip Market Outlook, By Other Applications (2022-2030) ($MN)
  • Table 94 Asia Pacific Flip Chip Market Outlook, By End User (2022-2030) ($MN)
  • Table 95 Asia Pacific Flip Chip Market Outlook, By Consumer Electronics (2022-2030) ($MN)
  • Table 96 Asia Pacific Flip Chip Market Outlook, By Automotive (2022-2030) ($MN)
  • Table 97 Asia Pacific Flip Chip Market Outlook, By Healthcare (2022-2030) ($MN)
  • Table 98 Asia Pacific Flip Chip Market Outlook, By Aerospace & Defense (2022-2030) ($MN)
  • Table 99 Asia Pacific Flip Chip Market Outlook, By Telecom & IT (2022-2030) ($MN)
  • Table 100 Asia Pacific Flip Chip Market Outlook, By Other End Users (2022-2030) ($MN)
  • Table 101 South America Flip Chip Market Outlook, By Country (2022-2030) ($MN)
  • Table 102 South America Flip Chip Market Outlook, By Substrate (2022-2030) ($MN)
  • Table 103 South America Flip Chip Market Outlook, By Laminates (2022-2030) ($MN)
  • Table 104 South America Flip Chip Market Outlook, By Ceramics (2022-2030) ($MN)
  • Table 105 South America Flip Chip Market Outlook, By Polyamides (2022-2030) ($MN)
  • Table 106 South America Flip Chip Market Outlook, By Silicon (2022-2030) ($MN)
  • Table 107 South America Flip Chip Market Outlook, By Other Substrates (2022-2030) ($MN)
  • Table 108 South America Flip Chip Market Outlook, By Bumping Technology (2022-2030) ($MN)
  • Table 109 South America Flip Chip Market Outlook, By Adhesive Bumping (2022-2030) ($MN)
  • Table 110 South America Flip Chip Market Outlook, By Solder Bumping (2022-2030) ($MN)
  • Table 111 South America Flip Chip Market Outlook, By Stud Bumping (2022-2030) ($MN)
  • Table 112 South America Flip Chip Market Outlook, By Other Bumping Technologies (2022-2030) ($MN)
  • Table 113 South America Flip Chip Market Outlook, By Application (2022-2030) ($MN)
  • Table 114 South America Flip Chip Market Outlook, By Memory Based (2022-2030) ($MN)
  • Table 115 South America Flip Chip Market Outlook, By Sensors (2022-2030) ($MN)
  • Table 116 South America Flip Chip Market Outlook, By Light Emitting Diode (2022-2030) ($MN)
  • Table 117 South America Flip Chip Market Outlook, By Graphics Processing Unit (2022-2030) ($MN)
  • Table 118 South America Flip Chip Market Outlook, By Other Applications (2022-2030) ($MN)
  • Table 119 South America Flip Chip Market Outlook, By End User (2022-2030) ($MN)
  • Table 120 South America Flip Chip Market Outlook, By Consumer Electronics (2022-2030) ($MN)
  • Table 121 South America Flip Chip Market Outlook, By Automotive (2022-2030) ($MN)
  • Table 122 South America Flip Chip Market Outlook, By Healthcare (2022-2030) ($MN)
  • Table 123 South America Flip Chip Market Outlook, By Aerospace & Defense (2022-2030) ($MN)
  • Table 124 South America Flip Chip Market Outlook, By Telecom & IT (2022-2030) ($MN)
  • Table 125 South America Flip Chip Market Outlook, By Other End Users (2022-2030) ($MN)
  • Table 126 Middle East & Africa Flip Chip Market Outlook, By Country (2022-2030) ($MN)
  • Table 127 Middle East & Africa Flip Chip Market Outlook, By Substrate (2022-2030) ($MN)
  • Table 128 Middle East & Africa Flip Chip Market Outlook, By Laminates (2022-2030) ($MN)
  • Table 129 Middle East & Africa Flip Chip Market Outlook, By Ceramics (2022-2030) ($MN)
  • Table 130 Middle East & Africa Flip Chip Market Outlook, By Polyamides (2022-2030) ($MN)
  • Table 131 Middle East & Africa Flip Chip Market Outlook, By Silicon (2022-2030) ($MN)
  • Table 132 Middle East & Africa Flip Chip Market Outlook, By Other Substrates (2022-2030) ($MN)
  • Table 133 Middle East & Africa Flip Chip Market Outlook, By Bumping Technology (2022-2030) ($MN)
  • Table 134 Middle East & Africa Flip Chip Market Outlook, By Adhesive Bumping (2022-2030) ($MN)
  • Table 135 Middle East & Africa Flip Chip Market Outlook, By Solder Bumping (2022-2030) ($MN)
  • Table 136 Middle East & Africa Flip Chip Market Outlook, By Stud Bumping (2022-2030) ($MN)
  • Table 137 Middle East & Africa Flip Chip Market Outlook, By Other Bumping Technologies (2022-2030) ($MN)
  • Table 138 Middle East & Africa Flip Chip Market Outlook, By Application (2022-2030) ($MN)
  • Table 139 Middle East & Africa Flip Chip Market Outlook, By Memory Based (2022-2030) ($MN)
  • Table 140 Middle East & Africa Flip Chip Market Outlook, By Sensors (2022-2030) ($MN)
  • Table 141 Middle East & Africa Flip Chip Market Outlook, By Light Emitting Diode (2022-2030) ($MN)
  • Table 142 Middle East & Africa Flip Chip Market Outlook, By Graphics Processing Unit (2022-2030) ($MN)
  • Table 143 Middle East & Africa Flip Chip Market Outlook, By Other Applications (2022-2030) ($MN)
  • Table 144 Middle East & Africa Flip Chip Market Outlook, By End User (2022-2030) ($MN)
  • Table 145 Middle East & Africa Flip Chip Market Outlook, By Consumer Electronics (2022-2030) ($MN)
  • Table 146 Middle East & Africa Flip Chip Market Outlook, By Automotive (2022-2030) ($MN)
  • Table 147 Middle East & Africa Flip Chip Market Outlook, By Healthcare (2022-2030) ($MN)
  • Table 148 Middle East & Africa Flip Chip Market Outlook, By Aerospace & Defense (2022-2030) ($MN)
  • Table 149 Middle East & Africa Flip Chip Market Outlook, By Telecom & IT (2022-2030) ($MN)
  • Table 150 Middle East & Africa Flip Chip Market Outlook, By Other End Users (2022-2030) ($MN)