![]() |
市場調查報告書
商品編碼
1679212
2030 年行動系統晶片(SoC) 市場預測:以核心類型、核心架構、連結性、效能分類、應用和地區進行的全球分析Mobile System-on-Chip (SoC) Market Forecasts to 2030 - Global Analysis By Core Type (Quad-core, Hexa-core, Octa-core, Deca-core & Higher and Other Core Types), Core Architecture, Connectivity, Performance Category, Application and By Geography |
根據 Stratistics MRC 的數據,全球行動系統晶片(SoC) 市場預計在 2024 年達到 8.5 億美元,到 2030 年將達到 31.5 億美元,預測期內的複合年成長率為 19.4%。
行動系統晶片(SoC) 是一種將智慧型手機或平板電腦的基本組件組合到單一晶片上的積體電路。它包括 CPU(處理器)、GPU(圖形)、RAM 控制器、數據機(用於連接)、ISP(影像訊號處理器)、AI 引擎和其他專用處理器。行動 SoC 專為節能和小尺寸而設計,可最佳化性能並最大限度地降低能耗。
根據愛立信的行動報告,到年終,全球5G行動用戶數量預計將超過15億,這將對能夠支援高速資料處理和高效電源管理的先進SoC解決方案產生巨大的需求。
智慧型手機日益普及
在印度、東南亞和非洲等新興市場,智慧型手機的普及率正在迅速成長,對具成本效益、高性能 SoC 的需求也日益成長。同時,在高階領域,對先進 AI、5G 和遊戲功能的需求正在推動旗艦 SoC 的技術創新。隨著智慧型手機成為通訊、工作、娛樂和電子商務的必需品,製造商不斷開發速度更快、更節能、功能更豐富的 SoC。需求的激增正促使晶片製造商加強生產和研發力度,進一步推動市場擴張。
複雜的製造程序
製造行動 SoC 非常複雜,因為它涉及將 CPU、GPU、AI 引擎、數據機、ISP 和記憶體控制器等多個組件整合到單一緊湊晶片上。奈米級的先進製造需要高精度的微影術、大量的研發以及昂貴的鑄造工作。其他挑戰包括低產量比率、高缺陷風險和供應鏈限制。這將增加生產成本、限制供應並造成延誤,從而阻礙市場成長。
5G 網路的興起
消費者對更快的連接速度、更低的延遲和更高的效率的需求正在推動智慧型手機製造商採用支援 5G 的 SoC。這將推動處理能力、人工智慧和電源效率的創新。 SoC 製造商正在投資先進的 5G 晶片組以滿足需求。此外,物聯網、雲端遊戲和人工智慧主導應用的興起將進一步加速 5G SoC 的採用,使其成為下一代智慧型手機和行動運算生態系統的關鍵元素。
熱和功率限制
行動 SoC 面臨熱量和功率限制,因為它們要求在緊湊、電池供電的設備中實現高性能。隨著處理器的功能越來越強大,它們會產生更多的熱量,需要高效的冷卻解決方案。過熱會導致熱感節流,降低效能並影響使用者體驗。耗電的 SoC 會很快耗盡電池,從而限制其使用時間。這些挑戰增加了設計複雜性和研發成本,阻礙了市場成長,限制了高效能運算的進步。
COVID-19 疫情擾亂了行動 SoC 市場,造成供應鏈瓶頸、晶片短缺以及工廠關閉導致的生產延遲。由於智慧型手機銷量下降,需求最初有所下降,但隨著人們更依賴遠距工作、線上學習和數位娛樂,需求又出現激增。 5G、主導應用和遊戲智慧型手機的加速普及部分抵消了這些損失。然而,物流成本上升、地緣政治緊張局勢以及原料短缺持續影響市場,推動半導體製造業回流和投資。
預計四核心市場在預測期內將佔據最大佔有率
預計預測期內四核心處理器將佔據最大的市場佔有率。四核心移動 SoC 在性能、能源效率和成本效益之間實現了平衡。與雙核心處理器相比,四個 CPU 核心可帶來更流暢的多工處理、更好的遊戲效能和更快的應用程式執行速度。它還能有效分配工作負載,降低功耗和發熱量。它也是一款更實惠的 SoC,非常適合注重成本的消費者。
智慧型手機市場預計在預測期內實現最高複合年成長率
預計智慧型手機領域將在預測期內實現最高成長率。在智慧型手機中,行動 SoC 將 CPU、GPU、數據機、AI 引擎、ISP 和記憶體控制器整合到單一晶片上,以實現高效能、低功耗和緊湊的設計。這使得處理速度更快、遊戲更高級、人工智慧攝影、5G 連接和流暢的多任務處理成為可能。智慧型手機 SoC 有多種版本,從廉價到旗艦型,可滿足各種用戶的需求。
由於智慧型手機普及率高、5G 推出以及強大的半導體生態系統,預計亞太地區將在預測期內佔據最大的市場佔有率。中國、印度、韓國和台灣等國家佔據生產和消費主導地位。中國在智慧型手機製造領域處於領先地位(華為、小米),而台灣(台積電)和韓國(三星)則是主要的晶片製造商。印度行動市場的成長正在推動具成本效益 SoC 的需求。 「印度製造」等政府舉措以及中國為實現晶片獨立而做出的努力正在推動投資。
在預測期內,預計北美將呈現最高的複合年成長率,這得益於對高階智慧型手機的強勁需求、5G 的擴張以及人工智慧設備的推動。美國是高通(驍龍)、蘋果(A系列)、Nvidia等主要SoC開發商的所在地,是先進研發和技術創新的所在地。加拿大透過半導體研究支持成長。該地區受益於早期的技術採用、高消費支出和強大的通訊基礎設施。
According to Stratistics MRC, the Global Mobile System-on-Chip (SoC) Market is accounted for $0.85 billion in 2024 and is expected to reach $3.15 billion by 2030 growing at a CAGR of 19.4% during the forecast period. A Mobile System-on-Chip (SoC) is an integrated circuit that combines essential smartphone or tablet components into a single chip. It includes the CPU (processor), GPU (graphics), RAM controller, modem (for connectivity), ISP (image signal processor), AI engine, and other specialized processors. Designed for power efficiency and compactness, mobile SoCs optimize performance while minimizing energy consumption.
According to Ericsson's mobility report, 5G mobile subscriptions are expected to surpass 1.5 billion globally by the end of 2023, creating substantial demand for advanced SoC solutions that can support high-speed data processing and efficient power management.
Growing smartphone penetration
Emerging markets like India, Southeast Asia, and Africa witness rapid smartphone adoption, driving the need for cost-effective yet high-performance SoCs. Meanwhile, premium segments demand advanced AI, 5G, and gaming capabilities, pushing innovation in flagship SoCs. With smartphones becoming essential for communication, work, entertainment, and e-commerce, manufacturers continuously develop faster, energy-efficient, and feature-rich SoCs. This surge in demand encourages chipmakers to enhance production and R&D, further propelling market expansion.
Complex manufacturing processes
Mobile SoC manufacturing is complex due to the integration of multiple components like CPU, GPU, AI engine, modem, ISP, and memory controller on a single, compact chip. Advanced nanometer-scale fabrication requires high-precision lithography, extensive R&D, and expensive foundries. Also, challenges include low yield rates, high defect risks, and supply chain constraints. This hampers market growth by increasing production costs, limiting supply, and causing delays.
Increasing 5G networks
Consumers demand faster connectivity, lower latency, and improved efficiency, pushing smartphone manufacturers to adopt 5G-capable SoCs. This fuels innovation in processing power, AI, and power efficiency. SoC makers are investing in advanced 5G chipsets to meet demand. Additionally, the rise of IoT, cloud gaming, and AI-driven applications further accelerates 5G SoC adoption, making it a key factor in the next-generation smartphone and mobile computing ecosystem.
Thermal & power constraints
Mobile SoCs face thermal and power constraints due to the need for high performance in compact, battery-powered devices. As processors become more powerful, they generate more heat, requiring efficient cooling solutions. Excessive heat can lead to thermal throttling, reducing performance and affecting user experience. Power-hungry SoCs drain batteries quickly, limiting usage time. These challenges hamper market growth by increasing design complexity, R&D costs, and limiting advancements in high-performance computing.
The covid-19 pandemic disrupted the mobile SoC market, causing supply chain bottlenecks, chip shortages, and production delays due to factory shutdowns. Demand initially declined as smartphone sales dropped, but later surged with increased reliance on remote work, online learning, and digital entertainment. The accelerated adoption of 5G, AI-driven applications, and gaming smartphones partially offset losses. However, rising logistics costs, geopolitical tensions, and raw material shortages continued to impact the market, driving reshoring efforts and investment in semiconductor manufacturing.
The quad-core segment is expected to be the largest during the forecast period
The quad-core segment is expected to account for the largest market share during the forecast period. A quad-core mobile SoC offers a balance of performance, power efficiency, and cost-effectiveness. With four CPU cores, it enables smooth multitasking, better gaming performance, and faster app execution compared to dual-core processors. It efficiently distributes workloads, reducing power consumption and heat generation. They are also more affordable SoCs, making them ideal for cost-conscious consumers.
The smartphones segment is expected to have the highest CAGR during the forecast period
Over the forecast period, the smartphones segment is predicted to witness the highest growth rate. In smartphones, a Mobile SoC integrates the CPU, GPU, modem, AI engine, ISP, and memory controller into a single chip, ensuring high performance, power efficiency, and compact design. It enables fast processing, advanced gaming, AI-driven photography, 5G connectivity, and smooth multitasking. Smartphone SoCs range from budget-friendly to flagship-grade, catering to different user needs.
During the forecast period, the Asia Pacific region is expected to hold the largest market share due to high smartphone adoption, 5G rollout, and a strong semiconductor ecosystem. Countries like China, India, South Korea, and Taiwan dominate production and consumption. China leads in smartphone manufacturing (Huawei, Xiaomi), while Taiwan (TSMC) and South Korea (Samsung) are key chipmakers. India's growing mobile market boosts demand for cost-effective SoCs. Government initiatives, such as "Make in India" and China's chip independence efforts, drive investments.
Over the forecast period, the North America region is anticipated to exhibit the highest CAGR driven by strong demand for premium smartphones, 5G expansion, and AI-powered devices. The U.S. is home to leading SoC developers like Qualcomm (Snapdragon), Apple (A-series), and NVIDIA, with advanced R&D and innovation. Canada supports growth through semiconductor research. The region benefits from early technology adoption, high consumer spending, and strong telecom infrastructure.
Key players in the market
Some of the key players in mobile system-on-chip (SoC) market include Qualcomm Technologies, Inc., Samsung Electronics Corporation, Apple Inc., Intel Corporation, Shanghai Technologies Corporation, Broadcom Inc., NVIDIA Corporation, Marvell Technology Group Ltd., STMicroelectronics, Texas Instruments Inc., NXP Semiconductors, Renesas Electronics Corporation, Fujitsu Semiconductor Limited, Google, MediaTek Inc., HiSilicon, Spreadtrum Communications and Allwinner Technology Corporation.
In February 2025, MediaTek has unveiled the Dimensity 7400 and Dimensity 7400X, designed to enhance AI processing, gaming performance, and power efficiency in smartphones and foldable devices. Both chipsets are built on TSMC's 4nm (N4P) process technology, ensuring improved energy efficiency and extended battery life.
In October 2024, Qualcomm introduced the Snapdragon 8 Elite Mobile Platform, heralded as the world's fastest mobile system-on-a-chip (SoC). This platform is powered by the second-generation Qualcomm Oryon(TM) CPU, featuring an octa-core configuration with two prime cores clocked at up to 4.32 GHz and six performance cores at up to 3.53 GHz.
Note: Tables for North America, Europe, APAC, South America, and Middle East & Africa Regions are also represented in the same manner as above.