全球介電前驅體（關鍵材料）市場，2024-2025

Dielectric Precursors Market Report 2024-2025 (Critical Materials Report)

出版日期: 2024年06月01日 | 出版商:

TECHCET | 英文 134 Pages | 商品交期: 最快1-2個工作天內

價格

簡介目錄圖表

該報告涵蓋了半導體裝置製造中使用的前驅物的市場趨勢和供應鏈。包含主要供應商的資訊、材料供應鏈的問題和趨勢、供應商市場佔有率的估計和預測、材料細分市場的預測等。

樣本視圖

世界經濟與展望
- 半導體產業與全球經濟的連結
- 半導體銷售額成長
- 台灣外包廠商每月銷售趨勢
晶片銷售額：依電子產品領域劃分
- 電子展望
- 汽車產業展望
- 智慧型手機前景
- 電腦展望
- 伺服器/IT市場
半導體製造業的成長與擴張
- 晶片擴產投入大量資金
- 美國新工廠
- 世界各地製造工廠的擴張推動成長
- 資本投資趨勢
- 先進邏輯技術路線圖
- 評估製造工廠投資
政策/貿易趨勢和影響
半導體材料概述
- 預測引入的晶圓數量（到 2028 年）
- 材料市場預測（~2028）

第4章材料市場趨勢

CVD/ALD/金屬：High-K和先進電介質前驅體市場趨勢
- 2023 年前驅體市場：與 2024 年的聯繫
- 開拓市場前景
- 電介質前驅體出貨量預測：依細分市場（未來 5 年）
- 頂級供應商電介質產量
- 電介質產量：依地區劃分
- 擴大ALD/CVD材料產能
- 投資公告摘要
價格趨勢
技術趨勢/技術推動因素—概述
- 前驅物的整體技術概述：技術趨勢
- 客戶驅動的技術
- NAND 路線圖與課題：堆疊/分層 3D NAND 級別
- 3D NAND 製程需要進步
- Micron推出突破性 NVDRAM：雙層 32 GB 非揮發性鐵電記憶體，具有類似 DRAM 的效能
- 先進邏輯路線圖與課題：邏輯電晶體EST.Roadmap
- 高階邏輯（代工）節點 HVM 估算
- 高階邏輯：未來的技術課題
- 光刻技術進步的影響
- CFET 架構：CFET 擴展的優勢
- 無機 EUV 光阻：旋塗沉積
- SADP（自對準多重模式）
- EUV/多重圖案化/地緣政治
- 區域選擇性沉積（ASD）
- 特殊/新興介電材料及應用領域
- 區域考慮因素：電介質
- 區域因素和驅動因素
EHS 與貿易/物流問題 - 金屬、高 K、電介質
分析師對介電市場趨勢的評估

第5章供給側市場情勢

前驅體材料市佔率
- 當前季度活動 - MERCK
- 當前季度活動 - 液化空氣集團
- 本季活動 - ENTEGRIS
- ADEKA
併購活動和夥伴關係
工廠關閉
新進入者
- MSP 推出 TURBO II (TM) 蒸發器：半導體製造的下一代效率
供應商或零件/產品線面臨停產風險
領先供應商的分析師評估

第6章次級（下層）供應鏈/前體

細分供應鏈：供應商與市場概述
- 次級供應鏈：供應商和市場概況 - 二級案例研究 (NOURYON/GELEST)
- Subtier 供應鏈：供應商和市場概況 - 化學品和氣體管理系統
- Subtier 供應鏈：供應商和市場概覽 - 化學品交付櫃
- Subtier 供應鏈：供應商和市場概覽 - 閥門歧管盒 (VMB)
- Subtier 供應鏈：供應商和市場概況 - 散裝規格氣體系統
- Subtier 供應鏈：供應商和市場概況 - 氣櫃
- Subtier 供應鏈：供應商和市場概況 - 成型氣體和摻雜氣體混合器
- Subtier 供應鏈：供應商和市場概況 - 化學監測和分析系統
高級材料：CVD-ALD 前驅體的趨勢
精細材質：工業級與半導體級
半導體級次級材料供應商的國際網絡：Merck
半導體級次級材料供應商的國際網路：Air Liquide
半導體級次級材料供應商最新訊息
供應鏈顛覆者
次級供應鏈T：分析師評估

第七章供應商簡介

ADEKA CORPORATION
AIR LIQUIDE (MAKER, PURIFIER, SUPPLIER)
AZMAX CO., LTD
CITY CHEMICAL LLC
DNF CO., LTD
其他20多家企業

簡介目錄圖表

This report covers the market landscape and supply-chain for Precursors used in semiconductor device fabrication. It includes information about key suppliers, issues/trends in the material supply chain, estimates on supplier market share, and forecast for the material segments.

SAMPLE VIEW

1 Executive Summary

1.1 PRECURSORS BUSINESS - MARKET OVERVIEW
1.2 PRECURSORS MARKET TRENDS IMPACTING 2024 OUTLOOK
1.3 5-YEAR UNIT SHIPMENT FORECAST BY SEGMENT: DIELECTRIC PRECURSORS
1.4 PRECURSOR TRENDS
1.5 PRECURSOR TECHNOLOGY TRENDS
1.6 COMPETITIVE LANDSCAPE DIELECTRIC PRECURSORS
1.7 ANALYST ASSESSMENT OF DIELECTRIC PRECURSORS

2 Scope, Purpose, and Methodology

2.1 SCOPE
2.2 METHODOLOGY
2.3 OVERVIEW OF OTHER TECHCET CMR(TM) OFFERINGS

3 Semiconductor Industry Market Status & Outlook

3.1 WORLDWIDE ECONOMY AND OUTLOOK
- 3.1.1 SEMICONDUCTOR INDUSTRIES TIES TO THE GLOBAL ECONOMY
- 3.1.2 SEMICONDUCTOR SALES GROWTH
- 3.1.3 TAIWAN OUTSOURCE MANUFACTURER MONTHLY SALES TRENDS
3.2 CHIPS SALES BY ELECTRONIC GOODS SEGMENT
- 3.2.1 ELECTRONICS OUTLOOK
- 3.2.2 AUTOMOTIVE INDUSTRY OUTLOOK
  - 3.2.2.1 ELECTRIC VEHICLE (EV) MARKET TRENDS
  - 3.2.2.2 INCREASE IN SEMICONDUCTOR CONTENT FOR AUTOS
- 3.2.3 SMARTPHONE OUTLOOK
- 3.2.4 PC OUTLOOK
- 3.2.5 SERVERS / IT MARKET
3.3 SEMICONDUCTOR FABRICATION GROWTH - EXPANSION
- 3.3.1 IN THE MIDST OF HUGE INVESTMENT IN CHIP EXPANSIONS
- 3.3.2 NEW FABS IN THE US
- 3.3.3 WW FAB EXPANSION DRIVING GROWTH
- 3.3.4 EQUIPMENT SPENDING TRENDS
- 3.3.5 ADVANCED LOGIC TECHNOLOGY ROADMAPS
  - 3.3.5.1 DRAM TECHNOLOGY ROADMAPS
  - 3.3.5.2 3D NAND TECHNOLOGY ROADMAPS
- 3.3.6 FAB INVESTMENT ASSESSMENT
3.4 POLICY & TRADE TRENDS AND IMPACT
3.5 SEMICONDUCTOR MATERIALS OVERVIEW
- 3.5.1 TECHCET WAFER STARTS FORECAST THROUGH 2028
- 3.5.2 TECHCET MATERIALS MARKET FORECAST THROUGH 2028

4 Material Market Trends

4.1 CVD, ALD METAL - HIGH-K AND ADVANCED DIELECTRIC PRECURSORS MARKET TRENDS
- 4.1.1 2023 PRECURSOR MARKET LEADING INTO 2024
- 4.1.2 PRECURSOR MARKET OUTLOOK
- 4.1.3 DIELECTRIC PRECURSORS 5-YEAR UNIT SHIPMENT FORECAST BY SEGMENT
- 4.1.4 DIELECTRIC PRODUCTION OF TOP SUPPLIERS
- 4.1.5 DIELECTRIC PRODUCTION BY REGION
- 4.1.6 ALD/CVD MATERIAL PRODUCTION CAPACITY EXPANSIONS
- 4.1.7 INVESTMENT ANNOUNCEMENTS OVERVIEW
4.2 PRICING TRENDS
4.3 TECHNOLOGY TRENDS/TECHNICAL DRIVERS - OUTLINE
- 4.3.1 PRECURSOR GENERAL TECHNOLOGY OVERVIEW - TECHNOLOGY TRENDS
- 4.3.2 CUSTOMER DRIVEN TECHNOLOGIES
- 4.3.3 NAND ROADMAPS AND CHALLENGES - 3D NAND LEVELS W/ STACKS/TIERS
- 4.3.4 3D NAND PROCESS ADVANCES REQUIRED
- 4.3.5 MICRON UNVEILS BREAKTHROUGH NVDRAM: A DUAL-LAYER 32GBIT NON-VOLATILEFERROELECTRIC MEMORY WITH NEAR-DRAM PERFORMANCE
- 4.3.6 ADVANCED LOGIC ROADMAPS AND CHALLENGES - LOGIC TRANSISTOR EST. ROADMAP
- 4.3.7 ADVANCED LOGIC (FOUNDRY) NODE HVM ESTIMATE
  - 4.3.7.1 THE SEMICONDUCTOR SHOWDOWN: SAMSUNG AND TSMC'S GAA FETS VS. INTEL'S RIBBONFET
- 4.3.8 ADV LOGIC FUTURE TECHNOLOGY CHALLENGES
- 4.3.9 ADVANCING TECHNOLOGIES IMPLICATION TO PHOTOLITHOGRAPHY
  - 4.3.9.1 ADVANCING TECHNOLOGIES IMPLICATION TO PHOTOLITHOGRAPHY - DSA
  - 4.3.9.2 ADVANCING TECHNOLOGIES IMPLICATION TO PHOTOLITHOGRAPHY: CENTURA SCULPTA BY APPLIED MATERIALS: SHAPING THE FUTURE OF SEMICONDUCTOR MANUFACTURING
  - 4.3.9.3 ADVANCING TECHNOLOGIES IMPLICATION TO PHOTOLITHOGRAPHY: LINE EDGE ROUGHNESS REDUCTION THRU DEPOSITION
- 4.3.10 CFET ARCHITECTURE: CFET SCALING ADVANTAGE
  - 4.3.10.1 CFET ARCHITECTURE: COMPLEMENTARY FETS (CFETS)
  - 4.3.10.2 CFET ARCHITECTURE: CFET FUTURE PROSPECTS
- 4.3.11 INORGANIC EUV RESIST - SPIN ON DEPOSITION
  - 4.3.11.1 INORGANIC EUV RESIST - ALD DEPOSITED
- 4.3.12 SELF ALIGNED MULTI PATTERNING - SADP
  - 4.3.12.1 SELF ALIGNED MULTI PATTERNING - SAQP
  - 4.3.12.2 SELF ALIGNED MULTI PATTERNING - PEALD EQUIPMENT
  - 4.3.12.3 SELF ALIGNED MULTI PATTERNING - CAN SAQP BYPASS EUV BEYOND 7 NM?
- 4.3.13 EUV, MULTI PATTERNING AND GEOPOLITICS
- 4.3.14 AREA SELECTIVE DEPOSITION (ASD)
  - 4.3.14.1 AREA SELECTIVE DEPOSITION (ASD) - TU EINDHOVEN SELECTIVE ALD ENABLED BY PLASMA PRETREATMENT
- 4.3.15 SPECIALTY/EMERGING DIELECTRIC AND APPLICATIONS
- 4.3.16 REGIONAL CONSIDERATIONS - DIELECTRICS
- 4.3.17 REGIONAL ASPECTS AND DRIVERS
4.4 EHS AND TRADE/LOGISTIC ISSUES - METALS, HIGH-K AND DIELECTRICS
4.5 ANALYST ASSESSMENT OF DIELECTRIC MARKET TRENDS

5 Supply-Side Market Landscape

5.1 PRECURSOR MATERIAL MARKET SHARE
- 5.1.1 CURRENT QUARTER ACTIVITY - MERCK
  - 5.1.1.1 MERCK
- 5.1.2 CURRENT QUARTER ACTIVITY - AIR LIQUIDE
  - 5.1.2.1 AIR LIQUIDE
- 5.1.3 CURRENT QUARTER ACTIVITY -ENTEGRIS
  - 5.1.3.1 ENTEGRIS
- 5.1.4 ADEKA
  - 5.1.4.1 ADEKA
5.2 M-A ACTIVITY AND PARTNERSHIPS
5.3 PLANT CLOSURES
5.4 NEW ENTRANTS
- 5.4.1 MSP LAUNCHES TURBO II(TM) VAPORIZERS: NEXT-GEN EFFICIENCY FOR SEMICONDUCTOR FABRICATION
5.5 SUPPLIERS OR PARTS/PRODUCT LINES THAT ARE AT RISK OF DISCONTINUATIONS
5.6 TECHCET ANALYST ASSESSMENT OF PRECURSOR SUPPLIERS

6 Sub Tier Supply Chain, Precursors

6.1 SUB-TIER SUPPLY CHAIN: SOURCES & MARKETS OVERVIEW
- 6.1.1 SUB-TIER SUPPLY CHAIN: SOURCES & MARKETS OVERVIEW - TIER 2 EXAMPLES NOURYON AND GELEST
- 6.1.2 SUB-TIER SUPPLY CHAIN: SOURCES & MARKETS OVERVIEW - CHEMICAL & GAS MANAGEMENT SYSTEMS
- 6.1.3 SUB-TIER SUPPLY CHAIN: SOURCES & MARKETS OVERVIEW - CHEMICAL DELIVERY CABINETS
- 6.1.4 SUB-TIER SUPPLY CHAIN: SOURCES & MARKETS OVERVIEW - VALVE MANIFOLD BOXES (VMB)
- 6.1.5 SUB-TIER SUPPLY CHAIN: SOURCES & MARKETS OVERVIEW - BULK SPEC GAS SYSTEMS
- 6.1.6 SUB-TIER SUPPLY CHAIN: SOURCES & MARKETS OVERVIEW - GAS CABINETS
- 6.1.7 SUB-TIER SUPPLY CHAIN: SOURCES & MARKETS OVERVIEW - FORMING GAS & DOPANT GAS BLENDERS
- 6.1.8 SUB-TIER SUPPLY CHAIN: SOURCES & MARKETS OVERVIEW CHEMICAL - MONITORING AND ANALYTICAL SYSTEMS
6.2 SUB-TIER MATERIAL CVD - ALD PRECURSOR TRENDS
6.3 SUB-TIER MATERIAL INDUSTRIAL VS. SEMICONDUCTOR-GRADE
6.4 SEMICONDUCTOR-GRADE SUB-TIER MATERIAL SUPPLIER GLOBAL NETWORK MERCK
6.5 SEMICONDUCTOR-GRADE SUB-TIER MATERIAL SUPPLIER GLOBAL NETWORK AIR LIQUIDE
6.6 SEMICONDUCTOR-GRADE SUB-TIER MATERIAL SUPPLIER NEWS
6.7 SUB-TIER SUPPLY-CHAIN DISRUPTORS
6.8 SUB-TIER SUPPLY-CHAIN TECHCET ANALYST ASSESSMENT

7 Supplier profiles

ADEKA CORPORATION
AIR LIQUIDE (MAKER, PURIFIER, SUPPLIER)
AZMAX CO., LTD
CITY CHEMICAL LLC
DNF CO., LTD
...and 20+ more

簡介目錄圖表

LIST OF FIGURES

FIGURE 1.1: DIELECTRIC PRECURSOR REVENUE (M USD) FORECAST BY SEGMENT
FIGURE 1.2: WW MARKET SHARE - DIELECTRIC PRECURSORS 2023
FIGURE 3.1: GLOBAL ECONOMY AND THE ELECTRONICS SUPPLY CHAIN (2023)
FIGURE 3.2: WORLDWIDE SEMICONDUCTOR SALES
FIGURE 3.3: TECHCET'S TAIWAN SEMICONDUCTOR INDUSTRY INDEX (TTSI)
FIGURE 3.4: 2023 SEMICONDUCTOR CHIP APPLICATIONS
FIGURE 3.5: GLOBAL LIGHT VEHICLE UNIT SALES (IN MILLIONS OF UNITS)
FIGURE 3.6: ELECTRIFICATION TREND BY WORLD REGION
FIGURE 3.7: AUTOMOTIVE SEMICONDUCTOR PRODUCTION
FIGURE 3.8: MOBILE PHONE SHIPMENTS, WW ESTIMATES
FIGURE 3.9: WORLDWIDE PC AND TABLET FORECAST
FIGURE 3.10: TSMC PHOENIX CAMPUS WITH THE 2ND FAB VISIBLE IN THE BACKGROUND
FIGURE 3.11: ESTIMATED GLOBAL FAB SPENDING 2023-2028
FIGURE 3.12: FAB EXPANSIONS WITHIN THE US
FIGURE 3.13: SEMICONDUCTOR CHIP MANUFACTURING REGIONS OF THE WORLD
FIGURE 3.14: GLOBAL TOTAL EQUIPMENT SPENDING (US$ M) AND Y-O-Y CHANGE
FIGURE 3.15: ADVANCED LOGIC DEVICE TECHNOLOGY ROADMAP OVERVIEW
FIGURE 3.16: DRAM TECHNOLOGY ROADMAP OVERVIEW
FIGURE 3.17: 3D NAND TECHNOLOGY ROADMAP OVERVIEW
FIGURE 3.18: INTEL OHIO PLANT SITE AS OF FEB. 2024
FIGURE 3.19: TECHCET WAFER START FORECAST BY NODE SEGMENTS
FIGURE 3.20: TECHCET WORLDWIDE MATERIALS FORECAST ($M USD)
FIGURE 4.1: DIELECTRIC PRECURSOR REVENUE (M USD) FORECAST BY SEGMENT
FIGURE 4.2: WW MARKET SHARE - DIELECTRIC PRECURSORS 2023
FIGURE 4.3: DIELECTRIC PRECURSOR MARKET REGIONAL ASSESSMENT 2023
FIGURE 4.4: END USE APPLICATIONS DRIVING NEW DEVICE PROCESSES
FIGURE 4.5: 3D NAND STACKING DRIVES DIELECTRICS AND METALS PRECURSOR VOLUME
FIGURE 4.6: 3D NAND PROGRESSION
FIGURE 4.7: 32 GB NVDRAM WITH 1T 1C MEMORY LAYERS
FIGURE 4.8: GATE STRUCTURE ROADMAP
FIGURE 4.9: ADVANCED LOGIC (FOUNDRY) NODE ROAD MAP
FIGURE 4.10: RIBBON FET
FIGURE 4.11: MONO LAYER NANO SHEETS CHANNELS
FIGURE 4.12: NANO IMPRINT LITHOGRAPHY PROCESS FLOW
FIGURE 4.13: ALD/ALE ENHANCEMENT OF NANO IMPRINT LITHOGRAPHY
FIGURE 4.14: DIRECTED SELF-ASSEMBLY
FIGURE 4.15: DSA PATENT FILING BY COMPANY
FIGURE 4.16: DSA PATEN FILING SINCE 2023
FIGURE 4.17: WHAT IS PATTERN SHAPING?
FIGURE 4.18: REFINING EUV PATTERNING BY APPLIED MATERIALS
FIGURE 4.19: COMPLEMENTARY FET (CFET)
FIGURE 4.20: CFET IMPROVES PERFORMANCE IN TRACK SCALING
FIGURE 4.21: MONOLITHIC CFET PROCESS FLOW EXAMPLE
FIGURE 4.22: MCFET NEW FEATURE: MIDDLE DIELECTRIC ISOLATION
FIGURE 4.23: LOW TEMPERATURE GATE STACK OPTION EXAMPLES
FIGURE 4.24: LOW TEMPERATURE SD/CONTACT OPTION EXAMPLES
FIGURE 4.25: BSPDN ADVANTAGE: IR DROP REDUCTION
FIGURE 4.26: INCREASING NUMBER OF ALD STEPS REQUIRED BY NEXT GENERATION GAA-FET AND CFET
FIGURE 4.27: IMEC SUB-1NM TRANSISTOR ROADMAP, 3D-STACKED CMOS 2.0 PLANS
FIGURE 4.28: INPRIA EUV MOR
FIGURE 4.29: INPRIA SPIN ON INORGANIC RESIST IS MUCH THINNER THAN STANDARD STACKS OF PHOTO RESIST
FIGURE 4.30: PATENT FILING FOR MLD DEPOSITED EUV RESIST SEARCH PERFORMED IN PATBASE
FIGURE 4.31: SADP PROCESS FLOW USING ALD SPACER
FIGURE 4.32: ONE OF MANY FLAVORS OF SAQP PROCESS FLOW
FIGURE 4.33: SELECTIVE ALD ENABLED BY PLASMA PRETREATMENT
FIGURE 4.34: SPECIALTY/EMERGING DIELECTRIC APPLICATIONS FOR HETEROGENOUS INTEGRATIONS (APPLIED MATERIALS)
FIGURE 4.35: 2023 DIELECTRIC REVENUE SHARE BY REGION
FIGURE 5.1: 2023 PRECURSOR MATERIAL SUPPLIER MARKET SHARE BY REVENUE
FIGURE 5.2: MERCK ELECTRONICS REVENUE 2022-2023 (M EUR), LEFT - SEMICONDUCTOR SOLUTIONS ANNUAL REVENUE FORECAST (M EUR), RIGHT
FIGURE 5.3: AIR LIQUIDE ELECTRONICS REVENUE FORECAST (M EUR)
FIGURE 5.4: THE MS (MATERIAL SOLUTIONS) DIVISION OF ENTEGRIS REVENUE FORECAST
FIGURE 5.5: ADEKA REVENUE ELECTRONICS REVENUE FORECAST (100M JPY)
FIGURE 6.1: FORMING GAS BLENDER CONFIGURATION
FIGURE 6.2: TOP COUNTRIES/REGIONS THAT SUPPLY VERSUM MATERIALS US LLC (PANJIVA APRIL 2024)
FIGURE 6.3: TOP COUNTRIES/REGIONS THAT SUPPLY AIR LIQUIDE AMERICA CORP. (PANJEIVA APRIL 2024)
FIGURE 6.4: TOP COUNTRIES/REGIONS THAT SUPPLY H.C. STARCK INC. (USA)