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CMP 耗材漿料和拋光墊市場：2024-2025
市場調查報告書
商品編碼
1501230

CMP 耗材漿料和拋光墊市場：2024-2025

CMP Consumables Slurry & Pads Executive Edition Market Report 2024-2025
出版日期: | 出版商: TECHCET | 英文 46 Pages | 商品交期: 最快1-2個工作天內

價格

本報告調查了 CMP 耗材漿料和拋光墊市場，並提供了半導體裝置製造中使用的 CMP 拋光墊和拋光墊的市場概況和供應鏈。

目錄

第1章 半導體市場現況與展望

  • 世界經濟與展望
  • 半導體產業與全球經濟的聯繫
  • TECHCET半導體銷售預測
  • 台灣外包廠商每月銷售趨勢
  • 半導體製造業的成長與擴張
  • 晶片擴張的巨額投資
  • WW FAB 擴張推動成長
  • 美國新廠
  • 政策和貿易趨勢及影響
  • 半導體材料概述

第2章 CMP漿料與拋光墊

  • CMP耗材市場前景
  • 影響 CMP 耗材前景的細分市場趨勢
  • 技術趨勢
  • 區域趨勢
  • CMP漿料5年獲利預測
  • 漿料供應商競爭格局
    • 氧化物（二氧化鈰）漿料市場
    • HKMG漿料市場
    • 多晶矽漿料市場
    • 氧化物（二氧化矽）漿料市場
    • 鎢漿市場
    • CU散裝漿料市場
    • 銅阻隔漿料市場
    • 新金屬（CO、MO、RU等）漿料市場
    • CU背面電源漿料市場
  • CMP Slurry 併購活動、投資、公告和合作夥伴關係
  • EHS：與漿料處置、回收和回收相關的問題
  • 物流問題
  • TECHHCET 分析師對 CMP 漿料市場的評級
  • CMP PADS 5年收入預測
  • 墊供應商的競爭格局
  • CMP PAD 物流問題、併購活動、公告和合作夥伴關係
  • TECHHCET 分析師評級

This report provides an executive overview of the market landscape and supply-chain for CMP Pads and Slurry used in semiconductor device fabrication. It includes concise information about key suppliers, issues/trends in the material supply chain, estimates on supplier share ranking, and forecasts for the material segments.This Executive Edition(TM) report provides focused information for Business Development Managers, Supply Chain Managers, R&D directors, Investors / Financial Analysts and Policy Makers.

TABLE OF CONTENTS

1. SEMICONDUCTOR MARKET STATUS & OUTLOOK

  • 1.1. WORLDWIDE ECONOMY AND OUTLOOK
  • 1.2. SEMICONDUCTOR INDUSTRIES TIES TO THE GLOBAL ECONOMY
  • 1.3. TECHCET'S SEMICONDUCTOR REVENUE FORECAST
  • 1.4. TAIWAN OUTSOURCE MANUFACTURER MONTHLY SALES TRENDS
  • 1.5. SEMICONDUCTOR FABRICATION GROWTH & EXPANSION
  • 1.6. IN THE MIDST OF HUGE INVESTMENT IN CHIP EXPANSIONS
  • 1.7. WW FAB EXPANSION DRIVING GROWTH
  • 1.8. NEW FABS IN THE US
  • 1.9. POLICY & TRADE TRENDS AND IMPACT
  • 1.10. SEMICONDUCTOR MATERIALS OVERVIEW

2. CMP SLURRY AND PADS

  • 2.1. CMP CONSUMABLES MARKET OUTLOOK
  • 2.2. SEGMENT TRENDS IMPACTING CMP CONSUMABLES OUTLOOK
  • 2.3. TECHNOLOGY TRENDS
  • 2.4. REGIONAL TRENDS
  • 2.5. CMP SLURRIES 5-YEAR REVENUE FORECAST
    • 2.5.1. CMP SLURRIES 5-YEAR FORECAST BY UNITS
  • 2.6. SLURRY SUPPLIER COMPETITIVE LANDSCAPE
    • 2.6.1. OXIDE (CERIA) SLURRY MARKET
    • 2.6.2. HKMG SLURRY MARKET
    • 2.6.3. POLYSILICON SLURRY MARKET
    • 2.6.4. OXIDE (SILICA) SLURRY MARKET
    • 2.6.5. TUNGSTEN SLURRY MARKET
    • 2.6.6. CU BULK SLURRY MARKET
    • 2.6.7. COPPER BARRIER SLURRY MARKET
    • 2.6.8. NEW METALS (CO, MO, RU, ETC.) SLURRY MARKET
    • 2.6.9. CU BACKSIDE POWER SLURRY MARKET
  • 2.7. CMP SLURRY M&A ACTIVITY, INVESTMENTS, ANNOUNCEMENTS AND PARTNERSHIPS
  • 2.8. EHS: ISSUES FOR SLURRY DISPOSAL, RECYCLING AND RECLAIM
    • 2.8.1. EHS: ISSUES FOR NEW MATERIALS
  • 2.9. LOGISTIC ISSUES
  • 2.10. TECHCET ANALYST ASSESSMENT OF CMP SLURRY MARKET
  • 2.11. CMP PADS 5-YEAR REVENUE FORECAST
    • 2.11.1. CMP PADS 5-YEAR REVENUE FORECAST BY WAFER SIZE
    • 2.11.2. CMP PADS 5-YEAR FORECAST BY UNITS
  • 2.12. PAD SUPPLIER COMPETITIVE LANDSCAPE
    • 2.12.1. PAD SUPPLIER COMPETITIVE LANDSCAPE: NEW ENTRANTS
  • 2.13. CMP PAD LOGISTICS ISSUES, M&A ACTIVITY, ANNOUNCEMENTS AND PARTNERSHIPS
  • 2.14. TECHCET ANALYST ASSESSMENT

LIST OF FIGURES

  • FIGURE 1.1: GLOBAL ECONOMY AND THE ELECTRONICS SUPPLY CHAIN (2023)
  • FIGURE 1.2: SEMICONDUCTOR CHIP REVENUE FORECAST
  • FIGURE 1.3: TECHCET'S TAIWAN SEMICONDUCTOR INDUSTRY INDEX (TTSITM)
  • FIGURE 1.4: TSMC PHOENIX CAMPUS WITH THE 2ND FAB VISIBLE IN THE BACKGROUND
  • FIGURE 1.5: ESTIMATED GLOBAL FAB SPENDING 2023-2028
  • FIGURE 1.6: SEMICONDUCTOR CHIP MANUFACTURING REGIONS OF THE WORLD
  • FIGURE 1.7: FAB EXPANSIONS WITHIN THE US
  • FIGURE 2.1: CMP CONSUMABLES FORECAST
  • FIGURE 2.2: CMP STEPS FOR ADVANCED DEVICES
  • FIGURE 2.3: CMOS TECHNOLOGY ROADMAP
  • FIGURE 2.4: SLURRY AND PAD REVENUE BY HQ REGION
  • FIGURE 2.5: CMP SLURRY REVENUE BY APPLICATION
  • FIGURE 2.6: FORECASTED SLURRY VOLUME DEMAND
  • FIGURE 2.7: CMP PAD REVENUE FORECAST BY APPLICATION
  • FIGURE 2.8: CMP PAD REVENUE BY WAFER SIZE
  • FIGURE 2.9: FORECASTED QUANTITY PAD USAGE

LIST OF TABLES

  • TABLE 1.1: GLOBAL GDP AND SEMICONDUCTOR REVENUES
  • TABLE 2.1: 2023 SLURRY SUPPLIER RANKING
  • TABLE 2.2: OXIDE (CERIA) CMP SLURRY 2023 - $399M SUPPLIER RANKING
  • TABLE 2.3: HKMG/FRONT-END CMP SLURRY 2023 - $67M MARKET SHARE
  • TABLE 2.4: POLYSILICON CMP SLURRY 2023 - $40M MARKET SHARE
  • TABLE 2.5: OXIDE (SILICA) CMP SLURRY 2023 - $236M MARKET SHARE
  • TABLE 2.6: TUNGSTEN CMP SLURRY 2023 - $429M MARKET SHARE
  • TABLE 2.7: CU-BULK CMP SLURRY 2023 - $302M MARKET SHARE
  • TABLE 2.8: CU-BARRIER CMP SLURRY 2023 SUPPLIER MARKET SHARE
  • TABLE 2.9: NEW METALS CMP SLURRY 2023 MARKET SHARE - $3M
  • TABLE 2.10: CU BACKSIDE POWER CMP SLURRY 2023 MARKET SHARE - $1M
  • TABLE 2.11: 2023 PAD SUPPLIER RANKINGS
  • TABLE 2.12: PAD AND SUB-PAD SUPPLIER LIST