濺鍍靶材市場:2024年～2025年(Critical Materials Report)

Sputter Targets Market Report 2024-2025 (Critical Materials Report)

出版日期: 2024年10月10日 | 出版商:

TECHCET | 英文 | 商品交期: 最快1-2個工作天內

價格

簡介目錄圖表

本報告考察了濺射靶材市場，重點關注半導體裝置製造中使用的 PVD 技術中的濺射，特別關注該領域靶材的市場和供應鏈。

資訊圖表

This report addresses sputtering, the dominant PVD technique used in semiconductor device fabrication, and specifically covers the market and supply-chain for targets within that segment. The report contains data and analysis from TECHCET's data base and Sr. Analyst experience, as well as that developed from primary and secondary market research.

INFOGRAPHICS

1 EXECUTIVE SUMMARY

1.1 SPUTTERING TARGETS BUSINESS - MARKET OVERVIEW
1.2 MARKET TRENDS IMPACTING 2024 OUTLOOK
1.3 SPUTTER TARGETS 5-YEAR UNIT SHIPMENT FORECAST BY SEGMENT
1.4 SPUTTERING TARGETS 5-YEAR REVENUE FORECAST BY SEGMENT
1.5 SPUTTERING TARGETS SEGMENT TRENDS
1.6 TECHNOLOGY TRENDS
1.7 COMPETITIVE LANDSCAPE
1.8 MOST RECENTLY REPORTED QUARTERLY FINANCIALS OF TOP-5 SUPPLIERS
1.9 EHS, TRADE, AND/OR LOGISTICS ISSUES/CONCERNS
1.10 ANALYST ASSESSMENT OF SPUTTERING TARGETS

2 SCOPE, PURPOSE AND METHODOLOGY

2.1 SCOPE
2.2 PURPOSE & METHODOLOGY
2.3 OVERVIEW OF OTHER TECHCET CMRTM OFFERINGS

3 SEMICONDUCTOR INDUSTRY MARKET STATUS & OUTLOOK

3.1 WORLDWIDE ECONOMY AND OUTLOOK
- 3.1.1 SEMICONDUCTOR INDUSTRIES TIES TO THE GLOBAL ECONOMY
- 3.1.2 SEMICONDUCTOR SALES GROWTH
- 3.1.3 TAIWAN OUTSOURCE MANUFACTURER MONTHLY SALES TRENDS
3.2 CHIPS SALES BY ELECTRONIC GOODS SEGMENT
- 3.2.1 ELECTRONICS OUTLOOK
- 3.2.2 AUTOMOTIVE INDUSTRY OUTLOOK
  - 3.2.2.1 ELECTRIC VEHICLE (EV) MARKET TRENDS
  - 3.2.2.2 INCREASE IN SEMICONDUCTOR CONTENT FOR AUTOS
- 3.2.3 SMARTPHONE OUTLOOK
- 3.2.4 PC OUTLOOK
- 3.2.5 SERVERS / IT MARKET
3.3 SEMICONDUCTOR FABRICATION GROWTH & EXPANSION
- 3.3.1 IN THE MIDST OF HUGE INVESTMENT IN CHIP EXPANSIONS
- 3.3.2 NEW FABS IN THE US
- 3.3.3 WW FAB EXPANSION DRIVING GROWTH
- 3.3.4 EQUIPMENT SPENDING TRENDS
- 3.3.5 TECHNOLOGY ROADMAPS
- 3.3.6 FAB INVESTMENT ASSESSMENT
3.4 POLICY & TRADE TRENDS AND IMPACT
3.5 SEMICONDUCTOR MATERIALS OVERVIEW
- 3.5.1 TECHCET WAFER STARTS FORECAST THROUGH 2028
- 3.5.2 TECHCET MATERIALS MARKET FORECAST THROUGH 2028

4 SPUTTERING TARGETS MARKET TRENDS

4.1 SPUTTERING TARGETS MARKET TRENDS - OUTLINE
- 4.1.1 2023 SPUTTERING TARGETS MARKET LEADING INTO 2024
- 4.1.2 SPUTTERING TARGETS MARKET OUTLOOK
- 4.1.3 SPUTTERING TARGETS 5-YEAR UNIT SHIPMENT FORECAST BY SEGMENT
- 4.1.4 SPUTTERING TARGETS 5-YEAR REVENUE FORECAST BY SEGMENT
4.2 SPUTTERING TARGETS MANUFACTURING LOCATIONS AND INVESTMENTS - BY REGION
- 4.2.1 SPUTTERING TARGETS MANUFACTURING LOCATIONS AND INVESTMENTS - CAPACITY EXPANSIONS
4.3 PRICING TRENDS
4.4 SPUTTERING TARGET TECHNOLOGY OVERVIEW
- 4.4.1 SPUTTERING TARGET TECHNOLOGY- Trends
- 4.4.2 SPUTTERING TARGET technology- DRIVERS BY DIAMETER
- 4.4.3 SPUTTERING TARGET technology- SPECIALTY/ EMERGING MATERIALS APPLICATIONS
4.5 REGIONAL CONSIDERATIONS
- 4.5.1 REGIONAL ASPECTS AND DRIVERS
4.6 EHS AND TRADE/LOGISTICS ISSUES
- 4.6.1 EHS ISSUES
- 4.6.2 TRADE/LOGISTICS ISSUES
4.7 TECHCET ANALYST ASSESSMENT OF SPUTTERING TARGETS MARKET TRENDS

5 SUPPLY-SIDE MARKET LANDSCAPE

5.1 SPUTTERING TARGETS MARKET SHARE
- 5.2.1 CURRENT QUARTER - SUPPLIERS' ACTIVITIES & REPORTED EVENUES
- 5.2.2 CURRENT QUARTER REPORTING - JX ADVANCED METALS
- 5.2.3 CURRENT QUARTER REPORTING - HONEYWELL
- 5.2.4 CURRENT QUARTER REPORTING - KFMI
- 5.2.5 CURRENT QUARTER REPORTING - LINDE
- 5.2.6 CURRENT QUARTER REPORTING - TOSOH
5.3 M&A ACTIVITY AND PARTNERSHIPS
5.4 PLANT CLOSURES
5.5 NEW ENTRANTS
- 5.5.1 NEW ENTRANTS- BARRIERS TO ENTRY
- 5.5.2 NEW ENTRANTS- COMPANIES
5.6 SUPPLIERS OR PARTS/PRODUCT LINES THAT ARE AT RISK OF DISCONTINUATIONS
5.7 TECHCET ANALYST ASSESSMENT OF MATERIAL SUPPLIERS

6 SUB-TIER SUPPLY-CHAIN, METALS

6.1 SUB-TIER SUPPLY-CHAIN: SOURCES & MARKETS OVERVIEW
- 6.1.1 SUB-TIER Metals MARKET BACKGROUND
- 6.1.2 SUB-TIER Metals MARKET TRENDS
- 6.1.3 SUB-TIER METALS MARKET STATISTICS
- 6.1.4 SUB-TIER METALS SUPPLY CHAIN MANAGEMENT CONSIDERATIONS
- 6.1.5 SUB-TIER METALS SUPPLY CHAIN SUPPLY SIDE OVERVIEW
- 6.1.6 SUB-TIER METALS SUPPLIER NEWS
6.2 SUB-TIER SUPPLY-CHAIN: DISRUPTIONS
6.3 SUB-TIER SUPPLY-CHAIN M&A OR PARTNERSHIP ACTIVITY
6.4 SUB-TIER SUPPLY-CHAIN EHS AND LOGISTICS ISSUES
6.5 SUB-TIER SUPPLY-CHAIN "NEW" ENTRANTS
6.6 SUB-TIER SUPPLY-CHAIN PLANT UPDATES
6.7 SUB-TIER SUPPLY-CHAIN PLANT CLOSURES
6.9 SUB-TIER SUPPLY-CHAIN TECHCET ANALYST ASSESSMENT

7 SUPPLIER PROFILES

ADVANCED TARGETS MATERIALS CO., LTD.
AMERICAN ELEMENTS
FURUYA METAL CO
GO ELEMENT
GRIKIN
...AND 20+ MORE

8 APPENDIX

8.1 ADVANCED PROCESSES, EMERGING STRUCTURES, AND SPECIALTY FILMS USING PVD
- 8.1.1 LOGIC, 10 NM & BELOW
- 8.1.2 DRAM - PVD VERSUS OTHER DEPOSITIONS
- 8.1.3 3D NAND - PVD VERSUS OTHER DEPOSITIONS
- 8.1.4 NEW DEVELOPMENTS IN THE TECHNOLOGY OR MARKETS: UNIVERSITY AND SUPPLIER R&D IN 5-7 YEARS
- 8.1.5 BPR ARCHITECTURE
- 8.1.6 SPECIALTY (STT MRAM, FE RAM, OTHER) MEMORY PVD MATERIALS

簡介目錄圖表

LIST OF FIGURES

FIGURE 1.1: SPUTTERING TARGET SHIPMENT FORECAST BY SEGMENT
FIGURE 1.2: SPUTTERING TARGET REVENUE FORECAST BY SEGMENT
FIGURE 1.3: 2023 SPUTTERING TARGET SUPPLIER MARKET SHARE ESTIMATES BY REVENUE
FIGURE 3.1: GLOBAL ECONOMY AND THE ELECTRONICS SUPPLY CHAIN (2023)
FIGURE 3.2: WORLDWIDE SEMICONDUCTOR SALES
FIGURE 3.3: TECHCET'S TAIWAN SEMICONDUCTOR INDUSTRY INDEX (TTSII) IN 000'S OF NTD
FIGURE 3.4: 2023 SEMICONDUCTOR CHIP APPLICATIONS
FIGURE 3.5: GLOBAL LIGHT VEHICLE UNIT SALES (IN MILLIONS OF UNITS)
FIGURE 3.6: ELECTRIFICATION TREND BY WORLD REGION
FIGURE 3.7: AUTOMOTIVE SEMICONDUCTOR PRODUCTION
FIGURE 3.8: MOBILE PHONE SHIPMENTS, WW ESTIMATES
FIGURE 3.9: WORLDWIDE PC AND TABLET FORECAST
FIGURE 3.10: TSMC PHOENIX CAMPUS WITH THE 2ND FAB VISIBLE IN THE BACKGROUND
FIGURE 3.11: ESTIMATED GLOBAL FAB SPENDING 2023-2028
FIGURE 3.12: FAB EXPANSIONS WITHIN THE US
FIGURE 3.13: SEMICONDUCTOR CHIP MANUFACTURING REGIONS OF THE WORLD
FIGURE 3.14: GLOBAL TOTAL EQUIPMENT SPENDING (US$ M) AND Y-O-Y CHANGE
FIGURE 3.15: ADVANCED LOGIC DEVICE TECHNOLOGY ROADMAP OVERVIEW
FIGURE 3.16: DRAM TECHNOLOGY ROADMAP OVERVIEW
FIGURE 3.17: 3D NAND TECHNOLOGY ROADMAP OVERVIEW
FIGURE 3.18: INTEL OHIO PLANT SITE AS OF FEB. 2024
FIGURE 3.19: TECHCET WAFER START FORECAST BY NODE SEGMENTS
FIGURE 3.20: TECHCET WORLDWIDE MATERIALS FORECAST ($M USD)
FIGURE 4.1: SPUTTER TARGET SHIPMENT FORECAST BY SEGMENT
FIGURE 4.2: SPUTTERING TARGET REVENUE FORECAST BY SEGMENT
FIGURE 4.3: US CHIPS ACT DIRECT FUNDING OVERVIEW
FIGURE 4.4: JX ADVANCED METALS' PLANNED EXPANSIONS
FIGURE 4.5: MARKET METAL PRICE TRENDS (2019 = 100)
FIGURE 4.6: HIGH MAGNIFICATION IMAGES OF AL SPUTTERING TARGET SURFACES
FIGURE 4.7: 2023 SPUTTERING TARGET REVENUE SHARE BY REGION
FIGURE 4.8: AN EXAMPLE OF CIRCULARITY OF MATERIALS IN METALLURGY
FIGURE 5.1: 2023 SPUTTERING TARGET SUPPLIER MARKET SHARE ESTIMATES BY REVENUE
FIGURE 5.2: ENEOS HOLDINGS METALS SEGMENT QUARTER ENDING 06/30/2024 FINANCIALS
FIGURE 5.3: HONEYWELL ADVANCED MATERIALS QUARTER ENDING 06/30/2024 FINANCIALS
FIGURE 5.4: KFMI SALES BY REGION (M CNY)
FIGURE 5.5: LINDE QUARTER ENDING 06/30/2024 FINANCIALS
FIGURE 5.6: TOSOH SPECIALTY QUARTER ENDING 06/30/2024 FINANCIALS
FIGURE 6.1: METAL PURIFICATION SOURCING IN-HOUSE VERSUS OUTSOURCED TRADEOFFS
FIGURE 6.2: PRICE COMPARISON OF VARIOUS METALS
FIGURE 6.3: PRICE INDICES OF BASE VS. PRECIOUS METALS
FIGURE 6.4: DIAMETER AND THICKNESS IMPACT ON VOLUME
FIGURE 6.5: AL TARGET SAMPLE PRICING OFFERED BY A DISTRIBUTOR
FIGURE 6.6: TARGET EROSION PROFILE
FIGURE 6.7: CU PRODUCTION AND APPLICATION HIGHLIGHTS QUADRANT CHART
FIGURE 6.8: CU 5-YEAR PRICE HISTORY
FIGURE 6.9: AL PRODUCTION AND APPLICATION HIGHLIGHTS QUADRANT CHART
FIGURE 6.10: AL 5-YEAR PRICE HISTORY
FIGURE 6.11: TI PRODUCTION, APPLICATION HIGHLIGHTS, AND 5-YEAR PRICE HISTORY QUADRANT CHART
FIGURE 6.12: TA PRODUCTION, APPLICATION HIGHLIGHTS, AND 5-YEAR PRICE HISTORY QUADRANT CHART
FIGURE 6.13: W PRODUCTION, APPLICATION HIGHLIGHTS, AND 5-YEAR PRICE HISTORY QUADRANT CHART
FIGURE 6.14: NI PRODUCTION, APPLICATION HIGHLIGHTS, AND 5-YEAR PRICE HISTORY QUADRANT CHART
FIGURE 6.15: CO PRODUCTION, APPLICATION HIGHLIGHTS, AND 5-YEAR PRICE HISTORY QUADRANT CHART
FIGURE 6.16: MO PRODUCTION, APPLICATION HIGHLIGHTS, AND 5-YEAR PRICE HISTORY QUADRANT CHART
FIGURE 6.17: CR PRODUCTION, APPLICATION HIGHLIGHTS, AND 5-YEAR PRICE HISTORY QUADRANT CHART
FIGURE 6.18: IN PRODUCTION, APPLICATION HIGHLIGHTS, AND 5-YEAR PRICE HISTORY QUADRANT CHART
FIGURE 6.19: RU PRODUCTION, APPLICATION HIGHLIGHTS, AND 5-YEAR PRICE HISTORY QUADRANT CHART
FIGURE 6.20: AU PRODUCTION, APPLICATION HIGHLIGHTS, AND 5-YEAR PRICE HISTORY QUADRANT CHART
FIGURE 6.21: AG PRODUCTION, APPLICATION HIGHLIGHTS, AND 5-YEAR PRICE HISTORY QUADRANT CHART
FIGURE 6.22: PT PRODUCTION, APPLICATION HIGHLIGHTS, AND 5-YEAR PRICE HISTORY QUADRANT CHART
FIGURE 6.23: PD PRODUCTION, APPLICATION HIGHLIGHTS, AND 5-YEAR PRICE HISTORY QUADRANT CHART
FIGURE 6.24: METALS MAKEUP IN CLEANTECH, BY MASS
FIGURE 6.25: METAL USAGE INDICES IN CLEANTECH BY SCENARIO
FIGURE 6.26: SUPPLY / DEMAND BALANCE AND CLEANTECH'S IMPACT
FIGURE 6.27: RELATED CHINA MINING AND REFINING PRODUCTION
FIGURE 6.28: RISK ASSESSMENT OF METALS
FIGURE 6.29: KEY PLAYERS IN THE SPUTTERING TARGET SUPPLY CHAIN
FIGURE 6.30: CAPITAL EXPENDITURE ($B) FROM EACH MINING GROUP
FIGURE 6.31: CAPITAL SPENDING CONTRIBUTION FROM EACH MINING GROUP
FIGURE 6.32: RECENT EXPLORATION SPENDING, IN $B
FIGURE 6.33: VENTURE CAPITAL INVESTMENT IN CRITICAL MINERALS OPERATIONS
FIGURE 6.34: A COMPARISON OF METAL TO MINING ETFS
FIGURE 6.35: A GUIDE TO UNDERSTANDING THE TVPRA LIST
FIGURE 6.36: PGM LCA FROM 2022 AND SELECTIVE COMPARISON VERSUS 2017
FIGURE 8.1: ILLUSTRATION OF 3D NAND ARCHITECTURE
FIGURE 8.2: ILLUSTRATION OF THE BPR ARCHITECTURE AND NOTABLE CHARACTERISTICS
FIGURE 8.3: ILLUSTRATION OF MRAM DEVICE STRUCTURE

LIST OF TABLES

TABLE 1.1: SPUTTERING TARGET GROWTH OVERVIEW
TABLE 1.2: MOST RECENT QUARTERLY SUPPLIER SALES (IN LOCAL REPORTING CURRENCY)
TABLE 3.1: GLOBAL GDP AND SEMICONDUCTOR REVENUES
TABLE 3.2: BATTERY ELECTRIC VEHICLE (BEV) REGIONAL TRENDS
TABLE 3.3: DATA CENTER SYSTEMS AND COMMUNICATION SERVICES MARKET SPENDING 2023
TABLE 4.1: A SELECTED LIST OF SPUTTERING TARGET SUPPLIER MANUFACTURING LOCATIONS
TABLE 4.2: PRINCIPAL PVD APPLICATIONS BY WAFER DIAMETER
TABLE 4.3: REGIONAL SPUTTERING TARGET MARKETS
TABLE 5.1: MOST RECENT QUARTERLY SUPPLIER SALES
TABLE 5.2: ENTRY BARRIERS TO THE SPUTTERING TARGET MARKET AND MITIGATION APPROACHES
TABLE 6.1: HEIGHTENED RISK SUMMARIZATION
TABLE 6.2: KEY OPERATIONS OF SUB-TIER METALS SUPPLIERS AND THEIR COMPANY-WIDE INVESTMENTS
TABLE 6.3: SUMMARY OF CAPEX GROWTH FROM EACH MINING GROUP
TABLE 8.1: LOGIC PVD APPLICATIONS
TABLE 8.2: DRAM PVD APPLICATIONS
TABLE 8.3: 3D NAND PVD APPLICATIONS