市場調查報告書
商品編碼
1597146
歐洲射頻前端晶片市場預測至 2030 年 - 區域分析 - 按組件(功率放大器、射頻濾波器、低雜訊放大器、射頻開關等)和應用(消費性電子、無線通訊等)Europe RF Front-End Chip Market Forecast to 2030 - Regional Analysis - by Component (Power Amplifier, Radio Frequency Filter, Low Noise Amplifier, RF Switch, and Others) and Application (Consumer Electronics, Wireless Communication, and Others) |
2022年歐洲射頻前端晶片市值為46.1607億美元,預計2030年將達到105.7219億美元;預計2022年至2030年複合年成長率為10.9%。
智慧型手機、平板電腦和其他消費性電子產品的日益普及推動了歐洲射頻前端晶片市場
根據 GSMA 年度《2023 年行動網路連線狀況報告》(SOMIC),2023 年 10 月,全球一半以上 (54%) 的人口(約 43 億人)擁有智慧型手機。智慧型手機的數量正在顯著增加。例如,根據愛立信和Radicati Group的數據,2020年,智慧型手機數量為57.5億部,2024年,智慧型手機數量成長至69.3億部,截至2025年,預計將達到71.5億部。此外,近年來,平板電腦變得越來越受歡迎,因為它們比傳統筆記型電腦和桌上型電腦具有一系列優勢。平板電腦、智慧型手機、耳機和穿戴式裝置等連網裝置的日益普及,進一步推動了對射頻前端晶片的需求。智慧型手機和平板電腦通常支援多種無線服務,包括跨多個頻段的 FM 收音機和 LTE。同時,越來越多的智慧型手機和平板電腦使用多個天線來提高靈敏度並減少串擾。微型射頻固態開關在智慧型行動裝置的射頻前端設計中發揮著至關重要的作用。消費者期望無縫連接和高資料速度,這促使製造商將先進的射頻技術融入他們的設備中。因此,各市場參與者紛紛推出針對智慧型手機的射頻前端解決方案。例如,2020年5月,恩智浦半導體宣布其最新的採用Wi-Fi 6標準設計的射頻前端(RFFE)解決方案已整合到小米10 5G智慧型手機中。因此,智慧型手機、平板電腦和其他消費性電子產品的日益普及正在推動射頻前端晶片市場的發展。
歐洲射頻前端晶片市場概況
歐洲射頻前端晶片市場分為德國、法國、義大利、英國、俄羅斯和歐洲其他地區。由於技術創新、堅實的工業基礎以及對先進通訊解決方案不斷成長的需求,歐洲射頻前端晶片市場正在迅速擴大。 5G技術的實施、工業自動化的發展以及無線通訊網路的擴展對歐洲的市場動態產生了積極影響。 5G技術的持續部署鼓勵歐洲各地的眾多參與者紛紛進行併購活動,以滿足對射頻前端晶片的需求。例如,2020 年 10 月,義法半導體收購了法國無晶圓廠半導體公司 Somos Semiconductor,該公司專注於為蜂窩物聯網和 5G 產業提供矽基功率放大器和射頻前端模組 (FEM)。收購 Somos Semiconductor 預計將改善其面向物聯網和 5G 產業的 FEM IP 和產品路線圖,並加強其專業員工隊伍。初始產品 NB-IoT/CAT-M1 模組目前正在接受標準認證流程,這是連接 RF FEM 產品新路線圖的開始。
歐洲也是物聯網等多種技術先進解決方案的發源地,歐洲國家的半導體產業蓬勃發展。根據歐盟統計局的數據,2021 年,29% 的歐盟企業使用物聯網設備,主要是為了確保其場所安全。這鼓勵了射頻前端晶片技術的創新,從而創造出高性能且可靠的組件。歐洲各地的多家廠商正在為物聯網設備提供射頻前端晶片。例如,Skyworks Solutions Inc. 提供 Skyworks Solutions Inc. IoT RF 前端模組 (FEM),在單一 RF 模組中支援多種無線協定和 SoC/RFIC。 IoT FEM 適用於無線連接,因為它支援 ZigBee、Thread 和藍牙標準(包括 BLUETOOTH 5)。因此,上述因素都推動了射頻前端晶片市場的成長。
歐洲射頻前端晶片市場收入及2030年預測(百萬美元)
歐洲射頻前端晶片市場細分
歐洲射頻前端晶片市場按組件、應用和國家分類。
依元件分類,歐洲射頻前端晶片市場分為功率放大器、射頻濾波器、低雜訊放大器、射頻開關等。 2022 年,功率放大器領域佔據最大的市場佔有率。
根據應用,歐洲射頻前端晶片市場分為消費性電子、無線通訊等。 2022 年,消費性電子領域佔據最大的市場佔有率。
依國家分類,歐洲射頻前端晶片市場分為德國、英國、法國、義大利、俄羅斯和歐洲其他國家。 2022年,德國在歐洲射頻前端晶片市場佔有率中佔據主導地位。
Broadcom Inc、Infineon Technologies AG、Microchip Technology Inc、Murata Manufacturing Co Ltd、NXP Semiconductors NV、Qorvo Inc、Skyworks Solutions Inc、STMicroElectronics NV、TDK Corp 和 Texas Instruments Inc 是歐洲 RF 領域的一些領先公司。
The Europe RF front-end chip market was valued at US$ 4,616.07 million in 2022 and is expected to reach US$ 10,572.19 million by 2030; it is estimated to register a CAGR of 10.9% from 2022 to 2030.
Rising Adoption of Smartphones, Tablets, and Other Consumer Electronics Products Drives Europe RF Front-End Chip Market
According to GSMA's annual State of Mobile Internet Connectivity Report 2023 (SOMIC), in October 2023, over half (54%) of the global population-approximately 4.3 billion people-owned a smartphone. The number of smartphones is increasing significantly. For example, according to Ericsson & The Radicati Group, in 2020, there were 5.75 billion smartphones, and in 2024, the number of smartphones grown to 6.93 billion, and as of 2025, it is expected to reach 7.15 billion. Also, tablets have become increasingly popular in recent years due to the range of benefits they offer over traditional laptops and desktop computers. The rising popularity of connected devices, such as tablets, smartphones, headphones, and wearables, further fuels the demand for RF frond-end chips. Smartphones and tablets often support numerous wireless services, including FM radio and LTE, across many frequency bands. At the same time, a growing number of smartphone and tablets use several antennas to improve sensitivity and reduce crosstalk. Miniature RF solid-state switches play a vital part in RF front-end designs for smart mobile devices. Consumers expect seamless connectivity and high data speeds, pushing manufacturers to incorporate advanced RF technologies into their devices. Hence, various market players have launched RF frond-end solutions for smartphones. For example, in May 2020, NXP Semiconductors NV announced that its most recent radio frequency front-end (RFFE) solution, designed with Wi-Fi 6 standards, was integrated into the Xiaomi Mi 10 5G smartphone. Thus, the growing adoption of smartphones, tablets, and other consumer electronics is driving the RF front-end chip market.
Europe RF Front-End Chip Market Overview
The Europe RF front-end chip market is segmented into Germany, France, Italy, the UK, Russia, and the Rest of Europe. The Europe RF front-end chip market is expanding rapidly due to technical innovation, a solid industrial base, and rising demand for advanced communication solutions. The implementation of 5G technology, developments in industrial automation, and the expansion of wireless communication networks positively impact the market dynamics in Europe. The rising deployment of 5G technology has encouraged various players across Europe to indulge in mergers and acquisitions activities to cater to the demand for RF front-end chips. For example, in October 2020, STMicroelectronics acquired Somos Semiconductor, a French fabless semiconductor firm focused on silicon-based power amplifiers and RF front-end modules (FEM) for the cellular IoT and 5G industries. The acquisition of Somos Semiconductor is projected to improve its FEM IP and product roadmap for the IoT and 5G industries, as well as reinforce its specialized staff. An initial product-an NB-IoT/CAT-M1 module-is now going through the standard qualification process and is the beginning of a new roadmap of connectivity RF FEM products.
Europe is also home to several technologically advanced solutions, such as IoT, and the countries in Europe have thriving semiconductor industries. According to Eurostat, in 2021, 29% of EU enterprises used IoT devices, mostly for keeping their premises secure. This encourages innovation in RF front-end chip technologies, resulting in the creation of high-performance and dependable components. Various players across Europe are providing RF front-end chips for IoT devices. For example, Skyworks Solutions Inc. provides Skyworks Solutions Inc. IoT RF Front-End Modules (FEM) support numerous wireless protocols and SoCs/RFICs in a single RF module. The IoT FEM is suitable for wireless connectivity, as it supports ZigBee, Thread, and Bluetooth standards, including BLUETOOTH 5. The IoT FEM is an efficient Internet of Things (IoT) solution when linked with a System on Chip (SoC) platform. Thus, all the factors mentioned above propel the growth of the RF front-end chip market.
Europe RF Front-End Chip Market Revenue and Forecast to 2030 (US$ Million)
Europe RF Front-End Chip Market Segmentation
The Europe RF front-end chip market is categorized into component, application, and country.
Based on component, the Europe RF front-end chip market is segmented into power amplifier, radio frequency filter, low noise amplifier, RF switch, and others. The power amplifier segment held the largest market share in 2022.
Based on application, the Europe RF front-end chip market is segmented into consumer electronics, wireless communication, and others. The consumer electronics segment held the largest market share in 2022.
By country, the Europe RF front-end chip market is segmented into Germany, the UK, France, Italy, Russia, and the Rest of Europe. Germany dominated the Europe RF front-end chip market share in 2022.
Broadcom Inc, Infineon Technologies AG, Microchip Technology Inc, Murata Manufacturing Co Ltd, NXP Semiconductors NV, Qorvo Inc, Skyworks Solutions Inc, STMicroelectronics NV, TDK Corp, and Texas Instruments Inc are some of the leading companies operating in the Europe RF front-end chip market.