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市場調查報告書
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1616807

抗輻射電子產品的全球市場:各零件,各用途,各地區,範圍及預測

Global Radiation Hardened Electronics Market Size By Component (Power Management, Application-Specific Integrated Circuit (ASIC)), By Application (Commercial, Military), By Geographic Scope And Forecast

出版日期: | 出版商: Verified Market Research | 英文 202 Pages | 商品交期: 2-3個工作天內

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簡介目錄

抗輻射電子市場規模及預測

2022 年,抗輻射電子市場規模為 11.531 億美元,預計 2023 年至 2030 年複合年增長率為 4.82%,到 2030 年將達到 17.6215 億美元。航太和軍事等應用的耐輻射電子市場正在不斷成長。耐輻射電子全球市場報告提供了對市場的整體評估。它對關鍵細分市場、趨勢、市場驅動因素、限制因素、競爭格局以及在市場中發揮關鍵作用的因素進行了全面分析。

抗輻射電子產品的全球市場定義

抗輻射能力是指承受電離輻射(粒子輻射和高能量電磁輻射)引起的損壞和故障的能力,例如發生在外層空間或高空飛行、核反應器、粒子加速器或核事故和核戰可以定義為製造電子元件和系統的行為。抗輻射產品旨在處理一種或多種由此產生的效應,包括總電離劑量(TID)、增強型低劑量率效應(ELDRS)、中子和質子漂移損傷以及單粒子效應(SEE、SET、 SEL、SEB)。

抗輻射物理是指許多主要用於高空應用的電子元件、封裝和產品。用於製造此類零件的材料包括元素的化合物、碳化物、金屬元素和變質非晶元素。這些部件顯示了電離輻射、高能量輻射、伽馬射線和核反應器發出的電離輻射造成的危害。非晶元件廣泛應用於衛星、飛機和核電廠的開關和調節器、微處理器、電源等。因而在航空、航太、軍事、國防等許多行業中得到了深入應用。

已開發國家和新興國家醫療器材製造業的快速成長預計將有助於耐輻射自然哲學市場的成長。例如,在秘魯和智利等新興國家,政府措施正在增加對醫療設備和產品的需求。

抗輻射電子產品的世界市場概況

這些抗輻射設備主要用於高空應用,輻射等因素可能會損壞電子元件的整體功能。抗輻射元件通常用於衛星系統電源、開關穩壓器以及軍事和太空應用的微處理器等應用。防輻射電子元件市場預計將在太空和軍事等應用中成長。隨著市場的成長,這些設備在惡劣環境中的應用變得越來越容易。

抗輻射電子設備對於保護設備免受外太空有害輻射造成的物理損壞和故障極為重要。此外,該產品在電源管理設備製造中的廣泛採用也對市場產生了積極影響。這些電子元件主要用於生產用於眾多國防和軍事應用的二極體、電晶體和金屬氧化物半導體場效電晶體 (MOSFET)。此外,許多技術進步,例如高可靠積體電路的出現和現場可程式閘陣列(FPGA)技術的增強,為市場提供了積極的前景。

其他因素預計將推動市場發展,例如產業內的顯著成長以及密集的研發 (R&D) 活動。對可重構抗輻射設備的需求不斷增長,為參與者創造了市場機會。這些設備允許衛星用戶在軌道上切換操作範圍,從而大大降低重新配置的價值。業內主要公司正在合作開發最新的軟體定義的抗輻射電子元件。

目錄

第1章 抗輻射電子產品的全球市場:簡介

  • 市場概要
  • 調查範圍
  • 前提條件

第2章 摘要整理

第3章 VERIFIED MARKET RESEARCH的調查手法

  • 資料探勘
  • 檢驗
  • 主要採訪
  • 資料來源一覽

第4章 抗輻射電子產品的全球市場展望

  • 概要
  • 市場動態
    • 促進因素
    • 阻礙因素
    • 機會
  • 波特的五力分析模式
  • 價值鏈分析

第5章 抗輻射電子產品的全球市場:各零件

  • 概要
  • 電源管理
  • 特定用途的積體電路(ASIC)
  • 記憶體
  • Logic
  • 現場可程式化閘陣列(FPGA)

第6章 抗輻射電子產品的全球市場:各用途

  • 概要
  • 宇宙(人造衛星)
  • 商業
  • 軍事
  • 航太·防衛
  • 核能發電廠

第7章 抗輻射電子產品的全球市場:各地區

  • 概要
  • 北美
    • 美國
    • 加拿大
    • 墨西哥
  • 歐洲
    • 德國
    • 英國
    • 法國
    • 其他歐洲
  • 亞太地區
    • 中國
    • 日本
    • 印度
    • 其他亞太地區
  • 全球其他地區
    • 南美
    • 中東·非洲

第8章 抗輻射電子產品的全球市場:競爭情形

  • 概要
  • 各公司的市場排行榜
  • 主要的開發策略

第9章 企業簡介

  • Honeywell Aerospace
  • Microsemi Corp
  • Microchip Technology Inc.
  • Xilinx Inc
  • Texas Instruments Inc
  • BAE Systems Plc
  • Microelectronics NV
  • Maxwell Technologies Inc
  • Linear Technology Inc

第10章 附錄

  • 相關調查
簡介目錄
Product Code: 7398

Radiation Hardened Electronics Market Size And Forecast

Radiation Hardened Electronics Market size was valued at USD 1153.1 Million in 2022 and is projected to reach USD 1762.15 Million by 2030, growing at a CAGR of 4.82% from 2023 to 2030. The market for Radiation Hardened Electronics is growing with applications such as space and military. The Global Radiation Hardened Electronics Market report provides a holistic evaluation of the market. The report offers a comprehensive analysis of key segments, trends, drivers, restraints, competitive landscape, and factors that are playing a substantial role in the market.

Global Radiation Hardened Electronics Market Definition

Radiation hardening can be defined as the act of manufacturing electronic components and systems that can withstand damage or failure caused by ionizing radiation (particle radiation and high-energy electromagnetic radiation) such as occurs in space and during high-altitude flights in nuclear reactors and particle accelerators or in nuclear accidents or nuclear war. Radiation hardened products are classically tested for one or more resulting effect tests, including total ionizing dose (TID), enhanced low dose rate effects (ELDRS), neutron and proton drift damage, and single event effects (SEE, SET, SEL, and SEB).

Radiation-hardened natural philosophy refers to numerous electronic parts, packages, and products that are primarily used for high-altitude applications. The materials used for the production of such parts embrace elements, carbide, metallic element chemical compounds, and modify the amorphous element. These parts are proof of the harm caused by ionizing and high-energy radiation, and gamma and ionizing radiation emitted by nuclear reactors. They are widely utilized in satellites, aircraft, and atomic energy plants within the style of switch regulators, microprocessors and power provide devices. As a result of this, they realize in-depth applications across numerous industries, together with aviation, space, military, and defense.

The rapidly growing medical equipment manufacturing industry across developed and developing countries is predicted to contribute to the radiation-hardened natural philosophy market growth. The high investment by government bodies to push infrastructural development across medical facilities and equip an equivalent with the most recent medical devices contributes to the high medical instrumentation production across the world. for example, developing countries like Peru and Chile have intimated an increase in demand for medical instrumentation and products due to government initiatives.

Global Radiation Hardened Electronics Market Overview

These radiation resistant devices are primarily used in high altitude applications where factors such as radiation could damage the overall functioning of the electronic components. Radiation resistant components are often used in applications such as satellite system power, switching regulators and microprocessors in military and space applications. The market for radiation hardened electronics is seen to grow with applications such as space and military. With the growth of the market comes the ease of application of these devices in demanding environments.

Radiation-hardened electronics are crucial for safeguarding equipment from physical injury and failure caused by harmful radiation in space. Moreover, widespread product adoption for producing power management devices is making a positive impact on the market. These electronics are mainly used to manufacture diodes, transistors, and metal-oxide-semiconductor field-effect transistors (MOSFET) for numerous defense and military applications. In addition, numerous technological advancements, like the event of extremely reliable integrated circuits and enhancements within the field-programmable gate array (FPGA) technology, are making a positive outlook for the market.

Alternative factors, as well as vital growth within the industry and intensive analysis and development (R&D) activities, are projected to drive the market. The increasing demand for reconfigurable radiation-hardened devices creates a market chance for the players. These devices enable satellite users to switch their scope of operation while in orbit, majorly reducing the reconfiguration value. Major corporations operative within the vertical is collaborating on the development of recent software-defined radiation-hardened electronic elements.

Global Radiation Hardened Electronics Market: Segmentation Analysis

The Global Radiation Hardened Electronics Market is Segmented on the basis of Component, Application, and Geography.

Radiation Hardened Electronics Market, By Component

  • Power Management
  • Application-Specific Integrated Circuit (ASIC)
  • Memory
  • Logic
  • Field-Programmable Gate Array (FPGA)

Based on Component, the market is segmented into Power Management, Application-Specific Integrated Circuit (ASIC), Memory, Logic, and Field-Programmable Gate Array (FPGA). The power management sub-segment is expected to dominate the component in the Radiation Hardened Electronics Market during the forecast period. Power devices constitute an integral part of any electronics system as the entire operation is dependent upon them.

Radiation Hardened Electronics Market, By Application

  • Space (Satellites)
  • Commercial
  • Military
  • Aerospace & Defense
  • Nuclear Power Plants

Based on Application, the market is segmented into Space (Satellites), Commercial, Military, Aerospace & Defense, and Nuclear Power Plants. The space application segment is expected to dominate the Radiation Hardened Electronics Market throughout the forecast period. It is further expected to grow at a higher CAGR during the forecast period. The increased global ISR operations, along with the growing number of space missions, are influencing radiation-hardened electronics providers to offer more reliable and robust electronic components for space applications.

Radiation Hardened Electronics Market, By Geography

  • North America
  • Europe
  • Asia Pacific
  • Rest of the world
  • On the basis of Geography, the Global Radiation Hardened Electronics Market is classified into North America, Europe, Asia Pacific, and the Rest of the world. North America is expected to hold the largest share of the Radiation Hardened Electronics Market throughout the forecast period. This growth is attributed to the large presence of leading companies such as Honeywell Aerospace & Defense (US), Microchip Technology (US), and Xilinx, Inc. (US) and renowned space research institutes such as the National Aeronautics and Space Administration (NASA) and the Florida Space Research Institute (FSRI).

Key Players

  • The "Global Radiation Hardened Electronics Market" study report will provide valuable insight with an emphasis on the global market. The major players in the market are
  • Honeywell Aerospace, Microsemi Corp, Microchip Technology Inc., Xilinx Inc, Texas Instruments Inc, BAE Systems Plc, Microelectronics NV, Maxwell Technologies Inc, Linear Technology Inc, etc.

Our market analysis also includes a section dedicated exclusively to these major players, where our analysts provide insight into the financial statements of all the major players along with their product benchmarking and SWOT analysis. The competitive landscape section also includes key development strategies, market share, and market evaluation analysis of the aforementioned players globally.

Key Developments

  • In March 2022, STMicroelectronics (Switzerland) announced the launch of its new series of radiation-hardened power, analog, and logic ICs with a low-cost plastic package. The new series will include radiation-hardened devices such as voltage regulators, data converters, logic gates, as well as LVDS transceivers that are utilized in various space applications such as telemetry start trackers and onboard computers.

TABLE OF CONTENTS

1 INTRODUCTION OF THE GLOBAL RADIATION HARDENED ELECTRONICS MARKET

  • 1.1 Overview of the Market
  • 1.2 Scope of Report
  • 1.3 Assumptions

2 EXECUTIVE SUMMARY

3 RESEARCH METHODOLOGY OF VERIFIED MARKET RESEARCH

  • 3.1 Data Mining
  • 3.2 Validation
  • 3.3 Primary Interviews
  • 3.4 List of Data Sources

4 GLOBAL RADIATION HARDENED ELECTRONICS MARKET OUTLOOK

  • 4.1 Overview
  • 4.2 Market Dynamics
    • 4.2.1 Drivers
    • 4.2.2 Restraints
    • 4.2.3 Opportunities
  • 4.3 Porter Five Force Model
  • 4.4 Value Chain Analysis

5 GLOBAL RADIATION HARDENED ELECTRONICS MARKET, BY COMPONENT

  • 5.1 Overview
  • 5.2 Power Management
  • 5.3 Application-Specific Integrated Circuit (ASIC)
  • 5.4 Memory
  • 5.5 Logic
  • 5.6 Field-Programmable Gate Array (FPGA)

6 GLOBAL RADIATION HARDENED ELECTRONICS MARKET, BY APPLICATION

  • 6.1 Overview
  • 6.2 Space (Satellites)
  • 6.3 Commercial
  • 6.4 Military
  • 6.5 Aerospace & Defense
  • 6.6 Nuclear Power Plants

7 GLOBAL RADIATION HARDENED ELECTRONICS MARKET, BY GEOGRAPHY

  • 7.1 Overview
  • 7.2 North America
    • 7.2.1 The U.S.
    • 7.2.2 Canada
    • 7.2.3 Mexico
  • 7.3 Europe
    • 7.3.1 Germany
    • 7.3.2 The U.K.
    • 7.3.3 France
    • 7.3.4 Rest of Europe
  • 7.4 Asia Pacific
    • 7.4.1 China
    • 7.4.2 Japan
    • 7.4.3 India
    • 7.4.4 Rest of Asia Pacific
  • 7.5 Rest of the World
    • 7.5.1 Latin America
    • 7.5.2 The Middle East and Africa

8 GLOBAL RADIATION HARDENED ELECTRONICS MARKET COMPETITIVE LANDSCAPE

  • 8.1 Overview
  • 8.2 Company Market Ranking
  • 8.3 Key Development Strategies

9 COMPANY PROFILES

  • 9.1 Honeywell Aerospace
    • 9.1.1 Overview
    • 9.1.2 Financial Performance
    • 9.1.3 Product Outlook
    • 9.1.4 Key Developments
  • 9.2 Microsemi Corp
    • 9.2.1 Overview
    • 9.2.2 Financial Performance
    • 9.2.3 Product Outlook
    • 9.2.4 Key Developments
  • 9.3 Microchip Technology Inc.
    • 9.3.1 Overview
    • 9.3.2 Financial Performance
    • 9.3.3 Product Outlook
    • 9.3.4 Key Developments
  • 9.4 Xilinx Inc
    • 9.4.1 Overview
    • 9.4.2 Financial Performance
    • 9.4.3 Product Outlook
    • 9.4.4 Key Developments
  • 9.5 Texas Instruments Inc
    • 9.5.1 Overview
    • 9.5.2 Financial Performance
    • 9.5.3 Product Outlook
    • 9.5.4 Key Developments
  • 9.6 BAE Systems Plc
    • 9.6.1 Overview
    • 9.6.2 Financial Performance
    • 9.6.3 Product Outlook
    • 9.6.4 Key Developments
  • 9.7 Microelectronics NV
    • 9.7.1 Overview
    • 9.7.2 Financial Performance
    • 9.7.3 Product Outlook
    • 9.7.4 Key Developments
  • 9.8 Maxwell Technologies Inc
    • 9.8.1 Overview
    • 9.8.2 Financial Performance
    • 9.8.3 Product Outlook
    • 9.8.4 Key Developments
  • 9.9 Linear Technology Inc
    • 9.9.1 Overview
    • 9.9.2 Financial Performance
    • 9.9.3 Product Outlook
    • 9.9.4 Key Developments

10 APPENDIX

  • 10.1 Related Research