全球晶片運輸、處理、加工和儲存市場規模（按產品、應用、地區、範圍和預測）

晶片運輸、搬運、加工和儲存的市場規模及預測

晶片運輸、處理、加工和儲存市場規模預計在 2023 年將達到 9.825 億美元，到 2030 年將達到 16.252 億美元，2024 年至 2030 年的複合年增長率為 6.2%。全球晶片運輸、處理、加工和儲存市場的市場推動因素晶片運輸、處理、加工和儲存市場的市場推動因素會受到多種因素的影響。這些包括：

半導體產業的成長：半導體產業的擴張與晶片運輸、處理、加工和儲存解決方案的需求直接相關。隨著半導體設備在多個行業中變得越來越普及，晶片的處理、加工和儲存需要更有效率和可靠的技術。

技術發展：生產更緊湊、更強大的晶片是技術推動半導體製造業發展的一個例子。這種發展通常需要特定的處理和加工方法。這需要對裸片的處理、加工、運輸和儲存採取創新的方法。

小型化需求：隨著電子產品變得越來越小，對更小且更易於管理的晶片組件的需求也日益增長。因此，相關服務市場受到精確處理和加工程序的需求所驅動，以確保晶片的完整性和性能。

半導體裝置的複雜性日益增加：由於層數多、設計複雜，現代半導體裝置變得越來越複雜。因此，更頻繁地需要複雜的運輸、處理、加工和儲存解決方案來確保這些設備在組裝和生產過程中的完整性和品質。

物聯網和人工智慧的興起：物聯網 (IoT) 設備和人工智慧 (AI) 應用的激增正在推動對支援這些技術的半導體元件的需求。這些應用中晶片的頻繁使用使得對方便晶片運輸、處理、加工和儲存的產品和服務的需求日益增長。

需要具有成本效益的解決方案：競爭激烈的市場不斷要求能夠加快半導體生產且不犧牲品質或可靠性的經濟實惠的解決方案。這種需求為提供有效晶片運輸、處理、加工和儲存服務的公司創造了機會。

供應鏈優化：為了降低成本和提高生產力，公司越來越注重優化其供應鏈。強大的晶片運輸、處理、加工和儲存選項對於優化半導體製造供應鏈和推動市場擴張至關重要。

法規遵循：在半導體製造業，遵守產業法規和準則至關重要。未來對合規晶片運輸、處理、加工和儲存解決方案提供者的服務需求可能會增加。

限制全球晶片運輸、處理、加工和儲存市場的因素

有幾個因素可能會對晶片運輸、處理、加工和儲存市場造成限製或課題。這些包括：

嚴格的立法：裸片的運輸、處理、加工和儲存受到眾多法律的管轄，特別是在可靠性和安全性至關重要的行業，例如電子和半導體。遵守這些法律成本高且耗時。

初始投資高：建立用於運輸、處理、加工和儲存裸片的基礎設施和設施需要在專用設備、無塵室環境和熟練勞動力方面進行大量的前期投資。這種較高的進入門檻可能會阻礙新進入者並限制市場成長。

技術複雜性：晶片的處理、加工和儲存需要複雜的技術和程序來確保產品的完整性和可靠性。為了滿足行業要求，需要不斷進行修改和技術改進，這會增加營運成本和複雜性。

供應鏈弱點：晶片業務高度依賴複雜的國際供應鏈。自然災害、地緣政治不穩定、供應短缺和其他中斷因素會嚴重影響零件、原材料和物流服務的供應和價格，從而造成供應鏈的脆弱性。

品質控制課題：在運輸、處理、加工和儲存過程中，必須維持品質控制措施，以避免損害或污染暴露的黴菌。然而，在不同的處理步驟和生產批次中保持一致的品質可能很困難，尤其是在大規模生產中。

環境問題：與許多其他半導體相關產業一樣，裸片產業面臨越來越大的減少環境影響的壓力。遵守環境法規、使用永續包裝技術和負責任地處理廢棄物會增加您的營運的複雜性和成本。

競爭與價格壓力：幾家公司正在爭奪運輸、處理、加工和儲存晶片的市場佔有率。這就創造了一個競爭環境。激烈競爭帶來的價格壓力可能會降低產業參與者的利潤率，並阻礙他們投資基礎設施和創新的能力。

安全風險：由於所涉及產品的敏感性，盜竊、假冒和知識產權盜竊是該行業公司的主要擔憂。必須實施強有力的安全措施來保護智慧財產權並防止未經授權的訪問，但這樣做會增加營運費用。

目錄

第 1 章 全球晶片運輸、處理、加工與儲存市場簡介

市場概況
• 研究範圍
• 先決條件

第 2 章執行摘要

第 3 章：經過驗證的市場研究方法

• 資料探勘
• 驗證
• 第一次面試
• 資料來源列表

第 4 章 全球晶片運輸、處理、加工與儲存市場展望

• 概述
• 市場動態
• 驅動程式
• 阻礙因素
• 機會
• 波特五力模型
• 價值鏈分析

第5章 全球晶片運輸、處理、加工和儲存市場（按產品類型）

• 概述
• 運輸管
• 托盤
• 載帶
• 其他

第6章 全球晶片運輸、處理、加工和儲存市場（按應用）

• 概述
• 通訊設備
• 計算機
• 消費性電子產品
• 汽車
• 工業和醫療
• 防守

第7章全球晶片運輸、處理、加工和儲存市場（按地區）

• 北美洲
• 美國
• 加拿大
• 墨西哥
• 歐洲
• 德國
• 英國
• 法國
• 其他歐洲國家 亞太地區
• 中國
• 日本
• 印度
• 其他亞太地區
• 世界其他地區
• 拉丁美洲
• 中東和非洲

第8章 全球晶片運輸、處理、加工與儲存市場：競爭格局

• 概述
• 各公司的市場排名
• 主要發展策略

第9章 公司簡介

• Entegris, Inc.
• MRTP Company
• 3M Company
• ITW ECPS
• Dalau
• Brooks Automation, Inc.
• TT Engineering & Manufacturing Sdn Bhd
• Daitron Incorporated
• Achilles USA, Inc.
• Kostat, Inc.
• DAEWON
• ePAK International, Inc.
• Keaco, Inc.
• Malaster
• Ted Pella, Inc.

第10章 附錄

• 關聯報告

Bare Die Shipping & Handling And Processing & Storage Market Size And Forecast

Bare Die Shipping & Handling And Processing & Storage Market size was valued at USD 982.5 Million in 2023 and is projected to reach USD 1625.2 Million by 2030, growing at a CAGR of 6.2% from 2024 to 2030. Global Bare Die Shipping & Handling And Processing & Storage Market Drivers The market drivers for the Bare Die Shipping & Handling And Processing & Storage Market can be influenced by various factors. These may include:

Growth of Semiconductor Industry: The expansion of the semiconductor industry is directly correlated with the need for bare die transportation, handling, processing, and storage solutions. As semiconductor devices proliferate across multiple industries, bare die handling, processing, and storage require ever-more-efficient and dependable techniques.

Technological Developments: The creation of more compact and potent chips is one example of how technology is advancing semiconductor production. These developments frequently need for specific handling and processing methods. This fuels the need for creative approaches to the handling, processing, shipping, and storage of bare dies.

Requirement for Miniaturisation: As electronics get more and more compact, there is an increasing demand for bare die components that are smaller and more manageable. Because of this, the market for associated services is driven by the need for precise handling and processing procedures to guarantee the integrity and performance of the bare dies.

Increasing Complexity of Semiconductor Devices: With numerous layers and elaborate designs, modern semiconductor devices are getting more and more complicated. Because of this, complex shipping, handling, processing, and storage solutions are required more often to guarantee the integrity and quality of these devices during the assembly and production processes.

Rise of IoT and AI: The demand for semiconductor components that can enable these technologies is being driven by the spread of Internet of Things (IoT) devices and artificial intelligence (AI) applications. These kinds of applications frequently use bare dies, which increases the need for products and services that make it easier to ship, handle, process, and store them.

Need for Cost-Effective Solutions: In a market where competition is fierce, there is a continuous need for affordable solutions that may expedite the production of semiconductors without sacrificing quality or dependability. This need presents an opportunity for businesses that provide effective bare die shipping, handling, processing, and storage services.

Supply Chain Optimisation: In an effort to cut expenses and boost productivity, businesses are concentrating more and more on supply chain optimisation. Robust bare die transportation, handling, processing, and storage options are essential for optimising the semiconductor manufacturing supply chain and propelling market expansion.

Regulatory Compliance: In the semiconductor manufacturing industry, adherence to industry rules and guidelines is crucial. There will probably be more demand for the services of businesses providing bare die shipping, handling, processing, and storage solutions that adhere to legal regulations.

Global Bare Die Shipping & Handling And Processing & Storage Market Restraints

Several factors can act as restraints or challenges for the Bare Die Shipping & Handling And Processing & Storage Market. These may include:

Strict laws: The transportation, handling, processing, and storage of bare dies are governed by a number of laws in the industry, especially in industries like electronics and semiconductors where dependability and safety are crucial. It can be expensive and time-consuming to comply with these laws.

High Initial Investment: A substantial upfront investment in specialised equipment, cleanroom settings, and skilled labour is necessary to establish the infrastructure and facilities for bare die shipping, handling, processing, and storage. This expensive entry barrier may discourage new competitors and restrict market growth.

Technological Complexity: To guarantee product integrity and dependability, complex technologies and procedures are needed for the handling, processing, and storage of bare dies. Operating expenses and complexity are increased by the ongoing modifications and technological improvements required to keep up with industry requirements.

Vulnerabilities in the Supply Chain: The bare die business is heavily reliant on an intricate international supply chain. The availability and pricing of components, raw materials, and logistics services can be greatly impacted by disruptions like natural catastrophes, geopolitical unrest, or supply shortages, creating vulnerabilities in the supply chain.

Challenges in Quality Control: It is imperative to uphold quality control measures during the transportation, handling, processing, and storage phases to avert any harm or contamination to bare dies. But maintaining uniform quality across various handling procedures and production batches can be difficult, especially in large-scale operations.

Environmental Concerns: There is growing pressure on the bare die industry, as well as many other semiconductor-related sectors, to reduce its environmental impact. Operational complexity and expenses are increased by adhering to environmental rules, using sustainable packaging techniques, and disposing of waste items responsibly.

Competition and Pricing Pressure: There are several companies fighting for market share in the shipping, handling, processing, and storage of bare dies. This creates a competitive environment. Price pressure brought on by fierce competition can lower industry participants' profit margins and impede their ability to invest in infrastructure and innovation.

Security Risks: For businesses in this industry, theft, counterfeiting, and intellectual property infringement are major problems due to the sensitive nature of the products involved. Strong security measures must be put in place to safeguard intellectual property and stop illegal access, but doing so raises operating expenses.

Global Bare Die Shipping & Handling And Processing & Storage Market Segmentation Analysis

The Global Bare Die Shipping & Handling And Processing & Storage Market is segmented into Product, Application, and Geography.

Bare Die Shipping & Handling And Processing & Storage Market, By Product

• Shipping Tubes
• Trays
• Carrier Tapes
• Others

Based on the Product, the Market is segmented into Shipping Tubes, Trays, Carrier Tapes, And Others. The Bare Die Shipping & Handling And Processing & Storage Market offers a range of products to ensure safe and efficient transportation and storage of bare semiconductor chips. Key product categories include Shipping Tubes, Trays, Carrier Tapes, and Other specialized packaging solutions. These products cater to diverse needs within the semiconductor industry, safeguarding delicate bare die during their journey through the supply chain.

Bare Die Shipping & Handling And Processing & Storage Market, By Application

• Communications
• Computers
• Consumer Electronics
• Automotive
• Industrial & Medical
• Defense

Based on the Application, The Market is Segmented into Communications, Computers, Consumer Electronics, Automotive, Industrial & Medical, And Defense. The Bare Die Shipping & Handling And Processing & Storage Market finds application across various industries. Key application segments include Communications (telecommunications and networking), Computers (data centers and computing devices), Consumer Electronics (smartphones and wearables), Automotive (automotive electronics and electric vehicles), Industrial & Medical (industrial equipment and medical devices), and Defense (aerospace and defense applications).

Bare Die Shipping & Handling And Processing & Storage Market, By Geography

• North America
• Europe
• Asia Pacific
• Latin America
• Middle East and Africa

Based on the Regional Analysis, The Market is Segmented into North America, Europe, Asia Pacific, Latin America, And Middle East And Africa. Asia-Pacific dominates the market due to the presence of key semiconductor manufacturers in countries like China, Taiwan, and South Korea. North America and Europe also contribute significantly to the market, driven by technological advancements and the strong presence of electronic device manufacturers. The market's global reach ensures that semiconductor chips reach various industries efficiently and securely across different geographic locations.

Key Players

• The "Global Bare Die Shipping & Handling And Processing & Storage Market" study report will offer useful insights. Some of the leading market participants are
• Entegris, Inc., MRTP Company, 3M Company, ITW ECPS, Dalau, Brooks Automation, Inc., TT Engineering & Manufacturing Sdn Bhd, Daitron Incorporated, Achilles USA, Inc., Kostat, Inc.

Our market analysis includes a section specifically devoted to such major players, where our analysts give an overview of each player's financial statements, along with Type benchmarking and SWOT analysis. Key development strategies, market share analysis, and market positioning analysis of the aforementioned players globally are also included in the competitive landscape section.

Key Developments

• In April 2021, Brooks revealed its plans to acquire Precise Automation.

TABLE OF CONTENTS

1. Introduction of Global Bare Die Shipping & Handling And Processing & Storage Market

• Overview of the Market
• Scope of Report
• Assumptions

2. Executive Summary

3. Research Methodology of Verified Market Research

• Data Mining
• Validation
• Primary Interviews
• List of Data Sources

4. Global Bare Die Shipping & Handling And Processing & Storage Market Outlook

• Overview
• Market Dynamics
• Drivers
• Restraints
• Opportunities
• Porters Five Force Model
• Value Chain Analysis

5. Global Bare Die Shipping & Handling And Processing & Storage Market, By Product

• Overview
• Shipping Tubes
• Trays
• Carrier Tapes
• Others

6. Global Bare Die Shipping & Handling And Processing & Storage Market, By Application

• Overview
• Communications
• Computers
• Consumer Electronics
• Automotive
• Industrial & Medical
• Defense

7. Global Bare Die Shipping & Handling And Processing & Storage Market, By Geography

• North America
• U.S.
• Canada
• Mexico
• Europe
• Germany
• UK
• France
• Rest of Europe
• Asia Pacific
• China
• Japan
• India
• Rest of Asia Pacific
• Rest of the World
• Latin America
• Middle East & Africa

8. Global Bare Die Shipping & Handling And Processing & Storage Market Competitive Landscape

• Overview
• Company Market Ranking
• Key Development Strategies

9. Company Profiles

• Entegris, Inc.
• MRTP Company
• 3M Company
• ITW ECPS
• Dalau
• Brooks Automation, Inc.
• TT Engineering & Manufacturing Sdn Bhd
• Daitron Incorporated
• Achilles USA, Inc.
• Kostat, Inc.
• DAEWON
• ePAK International, Inc.
• Keaco, Inc.
• Malaster
• Ted Pella, Inc.

10. Appendix

• Related Reports