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1629285

半導體晶圓拋光和研磨設備市場,按應用、最終用戶、國家和地區分類 - 2024-2032 年行業分析、市場規模、市場佔有率和預測

Semiconductor Wafer Polishing and Grinding Equipment Market, By Application, By End-user, By Country, and By Region - Industry Analysis, Market Size, Market Share & Forecast from 2024-2032

出版日期: | 出版商: AnalystView Market Insights | 英文 302 Pages | 商品交期: 2-3個工作天內

價格
簡介目錄

報告要點

2023年半導體晶圓拋光研磨設備市值為4.096億美元,2024年至2032年複合年成長率為4.20%。

半導體晶圓拋光研磨設備市場-市場動態

消費性電子產品需求不斷成長

對消費性電子產品的需求增加正在推動半導體晶圓拋光和研磨設備市場的成長。隨著智慧型手機、平板電腦和智慧家居設備的普及,對支援該技術的創新半導體的需求也不斷成長。這些半導體是在矽晶片上製造的,需要精密拋光和研磨以確保最佳性能和純度。推動更小、更快、更節能的設備需要日益複雜和高品質的半導體生產流程,從而導致對先進拋光和研磨設備的投資增加。此外,5G 和物聯網等即將推出的技術也推動了需求。

半導體晶圓拋光和研磨設備市場-關鍵見解

根據我們的研究分析師分享的分析,預計全球市場在預測期內(2024-2032)每年將以 4.20% 左右的複合年成長率成長

根據應用細分,300毫米細分市場目前在半導體晶圓拋光和研磨設備市場佔據主導地位。

根據最終用戶細分,記憶體製造商的市場預計將大幅成長。

從地區來看,北美是 2023 年最大的收入來源。

半導體晶圓拋光和研磨設備市場-細分分析:

全球半導體晶圓拋光和研磨設備市場根據應用、最終用戶和地區進行細分。

根據應用,市場分為三個部分:200 毫米、300 毫米和小於 200 毫米。 300毫米細分市場目前在半導體晶圓拋光和研磨設備市場佔據主導地位,主要是因為對更高厚度晶圓的需求,因為更大尺寸的晶圓確保了生產過程中產量和效率的提高。 300毫米廣泛應用於更多應用領域,例如微處理器、記憶體晶片等,因此是需求量大的產業。

根據最終用戶,市場分為三類:IDM、代工廠和記憶體製造商。由於從消費性電子產品到企業級資料中心等各種應用對更大記憶體容量和更快資料處理速度的需求不斷成長,預計記憶體製造商市場將在評估期內快速成長。 DRAM 和 NAND 快閃記憶體等儲存晶片對於提高不同電子設備的效能和操作至關重要。為了實現最大產量和性能,這些記憶體組件必須使用非常精確且可靠的晶圓拋光和研磨技術來製造。在雲端運算、巨量資料和連網設備激增等趨勢的推動下,全球資料消耗和產生持續成長,對儲存晶片的需求預計將增加,從而需要使用專用設備來實現其製造。

半導體晶圓拋光研磨設備市場-地理洞察

從地理來看,該市場分佈在北美、拉丁美洲、歐洲、亞太地區、中東和非洲。這些地區根據進行商業活動的國家進一步分類。由於該地區存在重要的行業參與者,北美目前在市場上佔據主導地位。此外,汽車應用中對功率半導體積體電路的需求不斷成長,以及對電力基礎設施的重大投資,可能會在整個預測期內推動北美市場的擴張。

預計亞太地區市場將顯著發展。各種設備類型的應用數量不斷增加推動了這一成長。此外,隨著公司尋求更有效率和創新的製造技術,無晶圓廠半導體產業的不斷整合預計將在未來幾年推動市場成長。

半導體晶圓拋光研磨設備市場-競爭格局:

半導體晶圓拋光和研磨設備市場競爭激烈,許多主要參與者佔據了該行業的主導地位。主要參與者包括 ALLIED HIGH TECH PRODUCTS, INC、Applied Materials Inc.、ASM International NV 和 Axus Technology,這些公司專注於半導體製造的製程控制和良率管理。 DISCO Corporation 和 Struers A/S 等其他公司也提供精密研磨和拋光的專用設備。各種應用(例如消費性電子產品和汽車技術)對更高性能半導體的要求推動了上述參與者之間的競爭。

最新進展:

2023年3月,半導體生產設備供應商DISCO公司發明了一款支援8吋晶圓的全自動劃片機,現已上市。

目錄

第1章:半導體晶圓拋光和研磨設備市場概述

  • 研究範圍
  • 市場預估年份

第 2 章:執行摘要

  • 市場片段
    • 半導體晶圓拋光和研磨設備市場片段(按應用)
    • 最終用戶的半導體晶圓拋光和研磨設備市場片段
    • 按國家/地區分類的半導體晶圓拋光和研磨設備市場片段
    • 按地區分類的半導體晶圓拋光和研磨設備市場片段
  • 競爭洞察

第 3 章:半導體晶圓拋光和研磨設備主要市場趨勢

  • 半導體晶圓拋光和研磨設備市場促進因素
    • 市場促進因素的影響分析
  • 半導體晶圓拋光研磨設備市場限制
    • 市場限制影響分析
  • 半導體晶圓拋光研磨設備市場機會
  • 半導體晶圓拋光研磨設備市場未來趨勢

第 4 章:半導體晶圓拋光和研磨設備產業研究

  • PEST分析
  • 波特五力分析
  • 成長前景圖
  • 規範架構分析

第 5 章:半導體晶圓拋光和研磨設備市場:地緣政治緊張局勢升級的影響

  • COVID-19 大流行的影響
  • 俄羅斯-烏克蘭戰爭的影響
  • 中東衝突的影響

第 6 章:半導體晶圓拋光與研磨設備市場格局

  • 2023年半導體晶圓拋光研磨設備市佔率分析
  • 按主要製造商分類的故障數據
    • 既有參與者分析
    • 新興參與者分析

第 7 章:半導體晶圓拋光和研磨設備市場 - 按應用

  • 概述
    • 按應用分類的細分市場佔有率分析
    • 200毫米
    • 300毫米
    • 小於200毫米

第 8 章:半導體晶圓拋光和研磨設備市場 - 按下最終用戶

  • 概述
    • 按最終用戶分類的細分市場佔有率分析
    • 整合裝置製造商
    • 鑄造廠
    • 記憶體廠商

第 9 章:半導體晶圓拋光和研磨設備市場 - 按地區分類

  • 介紹
    • 按地理位置分類的細分市場佔有率分析
  • 北美洲
    • 概述
    • 北美半導體晶圓拋光研磨設備主要製造商
    • 北美市場規模和預測(按國家)
    • 北美市場規模和預測(按應用)
    • 北美市場規模和預測(按最終用戶)
    • 美國
    • 加拿大
  • 歐洲
    • 概述
    • 歐洲半導體晶圓拋光和研磨設備主要製造商
    • 歐洲市場規模和預測(按國家)
    • 歐洲市場規模和預測(按應用)
    • 歐洲市場規模和預測(按最終用戶)
    • 德國
    • 義大利
    • 英國
    • 法國
    • 俄羅斯
    • 荷蘭
    • 瑞典
    • 波蘭
    • 歐洲其他地區
  • 亞太地區 (APAC)
    • 概述
    • 亞太地區半導體晶圓拋光研磨設備主要製造商
    • 亞太地區市場規模與預測(按國家)
    • 亞太地區市場規模與預測(按應用)
    • 亞太地區市場規模和預測(按最終用戶)
    • 印度
    • 中國
    • 日本
    • 韓國
    • 澳洲
    • 泰國
    • 印尼
    • 菲律賓
    • 亞太地區其他地區
  • 拉丁美洲
    • 概述
    • 拉丁美洲半導體晶圓拋光和研磨設備主要製造商
    • 拉丁美洲市場規模與預測(按國家)
    • 拉丁美洲市場規模與預測(按應用)
    • 拉丁美洲市場規模和預測(按最終用戶)
    • 巴西
    • 墨西哥
    • 阿根廷
    • 哥倫比亞
    • 拉丁美洲其他地區
  • 中東和非洲
    • 概述
    • 中東和非洲半導體晶圓拋光研磨設備主要製造商
    • 中東和非洲市場規模及預測(按國家)
    • 中東和非洲市場規模及預測(按應用)
    • 中東和非洲市場規模和預測(按最終用戶)
    • 沙烏地阿拉伯
    • 阿拉伯聯合大公國
    • 以色列
    • 土耳其
    • 阿爾及利亞
    • 埃及
    • MEA 的其餘部分

第10章:主要供應商分析-半導體晶圓拋光研磨設備產業

  • 競爭儀表板
    • Competitive Benchmarking
    • Competitive Positioning
  • 公司簡介
    • ALLIED HIGH TECH PRODUCTS, INC
    • Applied Materials Inc
    • ASM International NV
    • Axus Technology
    • G and N GmbH
    • Gigamat Technologies Inc
    • KLA Corp
    • Lapmaster Wolters
    • DISCO Corp
    • Logitech Ltd.
    • Okamoto Corp
    • S Cubed
    • Revasum Inc
    • S3 Alliance
    • Tokyo Electron Ltd
    • TOKYO SEIMITSU CO. LTD
    • ULTRA TEC Manufacturing Inc
    • Amtech Systems Inc.
    • UNITED GRINDING North America, Inc.
    • Ebara Corp.
    • Others

第 11 章:360 度分析師視角

第 12 章:附錄

  • 研究方法
  • 參考
  • 縮寫
  • 免責聲明
  • 聯絡我們
簡介目錄
Product Code: ANV4491

REPORT HIGHLIGHT

The Semiconductor Wafer Polishing and Grinding Equipment Market was valued at USD 409.6 million in 2023 and expanded at a CAGR of 4.20% from 2024 to 2032.

Semiconductor wafer polishing and grinding equipment are used during the semiconductor wafer manufacturing process to obtain the needed surface flatness and smoothness. This equipment removes defects and prepares wafers for subsequent processing and manufacture of semiconductor devices.

Semiconductor Wafer Polishing and Grinding Equipment Market- Market Dynamics

Increasing demand for consumer electronics

Increased demand for consumer electronics is driving the growth of the Semiconductor Wafer Polishing and Grinding Equipment Market. As the popularity of smartphones, tablets, and smart home gadgets grows, so does the demand for innovative semiconductors that power this technology. These semiconductors are made on silicon wafers, which require precision polishing and grinding to assure peak performance and purity. The push for smaller, quicker, and more energy-efficient devices necessitates increasingly complex and high-quality semiconductor production processes, resulting in increased investment in advanced polishing and grinding equipment. Furthermore, upcoming technologies like as 5G and IoT drive up demand.

Semiconductor Wafer Polishing and Grinding Equipment Market- Key Insights

As per the analysis shared by our research analyst, the global market is estimated to grow annually at a CAGR of around 4.20% over the forecast period (2024-2032)

Based on Application segmentation, the 300 mm segment currently dominates the Semiconductor Wafer Polishing and Grinding Equipment Market.

Based on End-user segmentation, The memory manufacturers' market is predicted to increase substantially.

In terms of region, North America was the largest revenue generator in 2023.

Semiconductor Wafer Polishing and Grinding Equipment Market- Segmentation Analysis:

The Global Semiconductor Wafer Polishing and Grinding Equipment Market is segmented on the basis of Application, End-user, and Region.

The market is segmented into three segments according to application: 200 mm, 300 mm, and Less than 200 mm. The 300 mm segment currently dominates the Semiconductor Wafer Polishing and Grinding Equipment Market mainly because of the demand for wafers in higher thicknesses, as larger-sized wafers ensure improved yields and efficiency in production processes. The 300 mm is widely used in more applications, such as microprocessors, memory chips, etc. Hence, it is a highly in-demand industry.

The market is divided into three categories based on End-user: IDM, Foundries, and Memory manufacturers. The memory manufacturers market is expected to grow rapidly over the assessment period, driven by rising demand for bigger memory capacity and quicker data processing rates in a wide range of applications, from consumer electronics to enterprise-level data centres. Memory chips, such as DRAM and NAND flash, are essential for improving the performance and operation of different electronic devices. To achieve maximum yield and performance, these memory components must be manufactured using very precise and dependable wafer polishing and grinding techniques. Global data consumption and generation continue to rise, fueled by trends such as cloud computing, big data, and the proliferation of connected devices, and the demand for memory chips is expected to rise, necessitating the use of specialised equipment to enable their manufacturing.

Semiconductor Wafer Polishing and Grinding Equipment Market- Geographical Insights

Geographically, this market is distributed over North America, Latin America, Europe, Asia Pacific, and the Middle East and Africa. These regions are further split based on the nations bringing commerce. North America currently dominates the market, owing to the presence of significant industry players in the area. Furthermore, rising demand for power semiconductor integrated circuits in automotive applications, as well as major investments in electric infrastructure, are likely to fuel market expansion in North America throughout the forecast period.

Asia-Pacific is predicted to develop significantly in the market. The rising number of applications for various equipment kinds drives this growth. Furthermore, increasing consolidation in the fabless semiconductor industry is expected to drive market growth in the future years as companies seek more efficient and innovative manufacturing techniques.

Semiconductor Wafer Polishing and Grinding Equipment Market- Competitive Landscape:

The Semiconductor Wafer Polishing and Grinding Equipment market is highly competitive, with a number of key players dominating the industry. Major players include ALLIED HIGH TECH PRODUCTS, INC, Applied Materials Inc., ASM International NV, and Axus Technology, which focus on process control and yield management in semiconductor fabrication. Other companies like DISCO Corporation and Struers A/S also offer specialised equipment for precision grinding and polishing. The requirements of higher performance semiconductors in various applications - such as consumer electronics and automotive technologies - drive the competition among the players listed above.

Recent Developments:

In March 2023, DISCO Corporation, a supplier of semiconductor production equipment, invented a completely automated dicing saw that supports 8-inch wafers, which is now available on the market.

SCOPE OF THE REPORT

This report's scope includes the following important market segments:

GLOBAL SEMICONDUCTOR WAFER POLISHING AND GRINDING EQUIPMENT MARKET KEY PLAYERS- DETAILED COMPETITIVE INSIGHTS

  • ALLIED HIGH-TECH PRODUCTS, INC
  • Applied Materials Inc
  • ASM International NV
  • Axus Technology
  • G and N GmbH
  • Gigamat Technologies Inc
  • KLA Corp
  • Lapmaster Wolters
  • DISCO Corp
  • Logitech Ltd.
  • Okamoto Corp
  • S Cubed
  • Revasum Inc
  • S3 Alliance
  • Tokyo Electron Ltd
  • TOKYO SEIMITSU CO. LTD
  • ULTRA TEC Manufacturing Inc
  • Amtech Systems Inc.
  • UNITED GRINDING North America, Inc.
  • Ebara Corp.
  • Others

GLOBAL SEMICONDUCTOR WAFER POLISHING AND GRINDING EQUIPMENT MARKET, BY APPLICATION- MARKET ANALYSIS, 2019 - 2032

  • 200 mm
  • 300 mm
  • Less than 200 mm

GLOBAL SEMICONDUCTOR WAFER POLISHING AND GRINDING EQUIPMENT MARKET, BY END-USER- MARKET ANALYSIS, 2019 - 2032

  • IDM
  • Foundries
  • Memory manufacturers

GLOBAL SEMICONDUCTOR WAFER POLISHING AND GRINDING EQUIPMENT MARKET, BY REGION- MARKET ANALYSIS, 2019 - 2032

  • North America
  • The U.S.
  • Canada
  • Europe
  • Germany
  • France
  • Italy
  • Spain
  • United Kingdom
  • Russia
  • Netherlands
  • Sweden
  • Poland
  • Rest of Europe
  • Asia Pacific
  • India
  • China
  • South Korea
  • Japan
  • Australia
  • Thailand
  • Indonesia
  • Philippines
  • Rest of APAC
  • Latin America
  • Brazil
  • Mexico
  • Argentina
  • Colombia
  • Rest of LATAM
  • The Middle East and Africa
  • Saudi Arabia
  • United Arab Emirates
  • Israel
  • Turkey
  • Algeria
  • Egypt
  • Rest of MEA

Table of Contents

1. Semiconductor Wafer Polishing and Grinding Equipment Market Overview

  • 1.1. Study Scope
  • 1.2. Market Estimation Years

2. Executive Summary

  • 2.1. Market Snippet
    • 2.1.1. Semiconductor Wafer Polishing and Grinding Equipment Market Snippet by Application
    • 2.1.2. Semiconductor Wafer Polishing and Grinding Equipment Market Snippet by End-user
    • 2.1.3. Semiconductor Wafer Polishing and Grinding Equipment Market Snippet by Country
    • 2.1.4. Semiconductor Wafer Polishing and Grinding Equipment Market Snippet by Region
  • 2.2. Competitive Insights

3. Semiconductor Wafer Polishing and Grinding Equipment Key Market Trends

  • 3.1. Semiconductor Wafer Polishing and Grinding Equipment Market Drivers
    • 3.1.1. Impact Analysis of Market Drivers
  • 3.2. Semiconductor Wafer Polishing and Grinding Equipment Market Restraints
    • 3.2.1. Impact Analysis of Market Restraints
  • 3.3. Semiconductor Wafer Polishing and Grinding Equipment Market Opportunities
  • 3.4. Semiconductor Wafer Polishing and Grinding Equipment Market Future Trends

4. Semiconductor Wafer Polishing and Grinding Equipment Industry Study

  • 4.1. PEST Analysis
  • 4.2. Porter's Five Forces Analysis
  • 4.3. Growth Prospect Mapping
  • 4.4. Regulatory Framework Analysis

5. Semiconductor Wafer Polishing and Grinding Equipment Market: Impact of Escalating Geopolitical Tensions

  • 5.1. Impact of COVID-19 Pandemic
  • 5.2. Impact of Russia-Ukraine War
  • 5.3. Impact of Middle East Conflicts

6. Semiconductor Wafer Polishing and Grinding Equipment Market Landscape

  • 6.1. Semiconductor Wafer Polishing and Grinding Equipment Market Share Analysis, 2023
  • 6.2. Breakdown Data, by Key Manufacturer
    • 6.2.1. Established Players' Analysis
    • 6.2.2. Emerging Players' Analysis

7. Semiconductor Wafer Polishing and Grinding Equipment Market - By Application

  • 7.1. Overview
    • 7.1.1. Segment Share Analysis, By Application, 2023 & 2032 (%)
    • 7.1.2. 200 mm
    • 7.1.3. 300 mm
    • 7.1.4. Less than 200 mm

8. Semiconductor Wafer Polishing and Grinding Equipment Market - By End-user

  • 8.1. Overview
    • 8.1.1. Segment Share Analysis, By End-user, 2023 & 2032 (%)
    • 8.1.2. IDM
    • 8.1.3. Foundries
    • 8.1.4. Memory manufacturers

9. Semiconductor Wafer Polishing and Grinding Equipment Market- By Geography

  • 9.1. Introduction
    • 9.1.1. Segment Share Analysis, By Geography, 2023 & 2032 (%)
  • 9.2. North America
    • 9.2.1. Overview
    • 9.2.2. Semiconductor Wafer Polishing and Grinding Equipment Key Manufacturers in North America
    • 9.2.3. North America Market Size and Forecast, By Country, 2019 - 2032 (US$ Million)
    • 9.2.4. North America Market Size and Forecast, By Application, 2019 - 2032 (US$ Million)
    • 9.2.5. North America Market Size and Forecast, By End-user, 2019 - 2032 (US$ Million)
    • 9.2.6. U.S.
      • 9.2.6.1. Overview
      • 9.2.6.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 9.2.6.3. U.S. Market Size and Forecast, By Application, 2019 - 2032 (US$ Million)
      • 9.2.6.4. U.S. Market Size and Forecast, By End-user, 2019 - 2032 (US$ Million)
    • 9.2.7. Canada
      • 9.2.7.1. Overview
      • 9.2.7.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 9.2.7.3. Canada Market Size and Forecast, By Application, 2019 - 2032 (US$ Million)
      • 9.2.7.4. Canada Market Size and Forecast, By End-user, 2019 - 2032 (US$ Million)
  • 9.3. Europe
    • 9.3.1. Overview
    • 9.3.2. Semiconductor Wafer Polishing and Grinding Equipment Key Manufacturers in Europe
    • 9.3.3. Europe Market Size and Forecast, By Country, 2019 - 2032 (US$ Million)
    • 9.3.4. Europe Market Size and Forecast, By Application, 2019 - 2032 (US$ Million)
    • 9.3.5. Europe Market Size and Forecast, By End-user, 2019 - 2032 (US$ Million)
    • 9.3.6. Germany
      • 9.3.6.1. Overview
      • 9.3.6.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 9.3.6.3. Germany Market Size and Forecast, By Application, 2019 - 2032 (US$ Million)
      • 9.3.6.4. Germany Market Size and Forecast, By End-user, 2019 - 2032 (US$ Million)
    • 9.3.7. Italy
      • 9.3.7.1. Overview
      • 9.3.7.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 9.3.7.3. Italy Market Size and Forecast, By Application, 2019 - 2032 (US$ Million)
      • 9.3.7.4. Italy Market Size and Forecast, By End-user, 2019 - 2032 (US$ Million)
    • 9.3.8. United Kingdom
      • 9.3.8.1. Overview
      • 9.3.8.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 9.3.8.3. United Kingdom Market Size and Forecast, By Application, 2019 - 2032 (US$ Million)
      • 9.3.8.4. United Kingdom Market Size and Forecast, By End-user, 2019 - 2032 (US$ Million)
    • 9.3.9. France
      • 9.3.9.1. Overview
      • 9.3.9.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 9.3.9.3. France Market Size and Forecast, By Application, 2019 - 2032 (US$ Million)
      • 9.3.9.4. France Market Size and Forecast, By End-user, 2019 - 2032 (US$ Million)
    • 9.3.10. Russia
      • 9.3.10.1. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 9.3.10.2. Russia Market Size and Forecast, By Application, 2019 - 2032 (US$ Million)
      • 9.3.10.3. Russia Market Size and Forecast, By End-user, 2019 - 2032 (US$ Million)
    • 9.3.11. Netherlands
      • 9.3.11.1. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 9.3.11.2. Netherlands Market Size and Forecast, By Application, 2019 - 2032 (US$ Million)
      • 9.3.11.3. Netherlands Market Size and Forecast, By End-user, 2019 - 2032 (US$ Million)
    • 9.3.12. Sweden
      • 9.3.12.1. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 9.3.12.2. Sweden Market Size and Forecast, By Application, 2019 - 2032 (US$ Million)
      • 9.3.12.3. Sweden Market Size and Forecast, By End-user, 2019 - 2032 (US$ Million)
    • 9.3.13. Poland
      • 9.3.13.1. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 9.3.13.2. Poland Market Size and Forecast, By Application, 2019 - 2032 (US$ Million)
      • 9.3.13.3. Poland Market Size and Forecast, By End-user, 2019 - 2032 (US$ Million)
    • 9.3.14. Rest of Europe
      • 9.3.14.1. Overview
      • 9.3.14.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 9.3.14.3. Rest of the Europe Market Size and Forecast, By Application, 2019 - 2032 (US$ Million)
      • 9.3.14.4. Rest of the Europe Market Size and Forecast, By End-user, 2019 - 2032 (US$ Million)
  • 9.4. Asia Pacific (APAC)
    • 9.4.1. Overview
    • 9.4.2. Semiconductor Wafer Polishing and Grinding Equipment Key Manufacturers in Asia Pacific
    • 9.4.3. Asia Pacific Market Size and Forecast, By Country, 2019 - 2032 (US$ Million)
    • 9.4.4. Asia Pacific Market Size and Forecast, By Application, 2019 - 2032 (US$ Million)
    • 9.4.5. Asia Pacific Market Size and Forecast, By End-user, 2019 - 2032 (US$ Million)
    • 9.4.6. India
      • 9.4.6.1. Overview
      • 9.4.6.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 9.4.6.3. India Market Size and Forecast, By Application, 2019 - 2032 (US$ Million)
      • 9.4.6.4. India Market Size and Forecast, By End-user, 2019 - 2032 (US$ Million)
    • 9.4.7. China
      • 9.4.7.1. Overview
      • 9.4.7.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 9.4.7.3. China Market Size and Forecast, By Application, 2019 - 2032 (US$ Million)
      • 9.4.7.4. China Market Size and Forecast, By End-user, 2019 - 2032 (US$ Million)
    • 9.4.8. Japan
      • 9.4.8.1. Overview
      • 9.4.8.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 9.4.8.3. Japan Market Size and Forecast, By Application, 2019 - 2032 (US$ Million)
      • 9.4.8.4. Japan Market Size and Forecast, By End-user, 2019 - 2032 (US$ Million)
    • 9.4.9. South Korea
      • 9.4.9.1. Overview
      • 9.4.9.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 9.4.9.3. South Korea Market Size and Forecast, By Application, 2019 - 2032 (US$ Million)
      • 9.4.9.4. South Korea Market Size and Forecast, By End-user, 2019 - 2032 (US$ Million)
    • 9.4.10. Australia
      • 9.4.10.1. Overview
      • 9.4.10.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 9.4.10.3. Australia Market Size and Forecast, By Application, 2019 - 2032 (US$ Million)
      • 9.4.10.4. Australia Market Size and Forecast, By End-user, 2019 - 2032 (US$ Million)
    • 9.4.11. Thailand
      • 9.4.11.1. Overview
      • 9.4.11.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 9.4.11.3. Thailand Market Size and Forecast, By Application, 2019 - 2032 (US$ Million)
      • 9.4.11.4. Thailand Market Size and Forecast, By End-user, 2019 - 2032 (US$ Million)
    • 9.4.12. Indonesia
      • 9.4.12.1. Overview
      • 9.4.12.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 9.4.12.3. Indonesia Market Size and Forecast, By Application, 2019 - 2032 (US$ Million)
      • 9.4.12.4. Indonesia Market Size and Forecast, By End-user, 2019 - 2032 (US$ Million)
    • 9.4.13. Philippines
      • 9.4.13.1. Overview
      • 9.4.13.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 9.4.13.3. Philippines Market Size and Forecast, By Application, 2019 - 2032 (US$ Million)
      • 9.4.13.4. Philippines Market Size and Forecast, By End-user, 2019 - 2032 (US$ Million)
    • 9.4.14. Rest of APAC
      • 9.4.14.1. Overview
      • 9.4.14.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 9.4.14.3. Rest of APAC Market Size and Forecast, By Application, 2019 - 2032 (US$ Million)
      • 9.4.14.4. Rest of APAC Market Size and Forecast, By End-user, 2019 - 2032 (US$ Million)
  • 9.5. Latin America
    • 9.5.1. Overview
    • 9.5.2. Semiconductor Wafer Polishing and Grinding Equipment Key Manufacturers in Latin America
    • 9.5.3. Latin America Market Size and Forecast, By Country, 2019 - 2032 (US$ Million)
    • 9.5.4. Latin America Market Size and Forecast, By Application, 2019 - 2032 (US$ Million)
    • 9.5.5. Latin America Market Size and Forecast, By End-user, 2019 - 2032 (US$ Million)
    • 9.5.6. Brazil
      • 9.5.6.1. Overview
      • 9.5.6.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 9.5.6.3. Brazil Market Size and Forecast, By Application, 2019 - 2032 (US$ Million)
      • 9.5.6.4. Brazil Market Size and Forecast, By End-user, 2019 - 2032 (US$ Million)
    • 9.5.7. Mexico
      • 9.5.7.1. Overview
      • 9.5.7.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 9.5.7.3. Mexico Market Size and Forecast, By Application, 2019 - 2032 (US$ Million)
      • 9.5.7.4. Mexico Market Size and Forecast, By End-user, 2019 - 2032 (US$ Million)
    • 9.5.8. Argentina
      • 9.5.8.1. Overview
      • 9.5.8.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 9.5.8.3. Argentina Market Size and Forecast, By Application, 2019 - 2032 (US$ Million)
      • 9.5.8.4. Argentina Market Size and Forecast, By End-user, 2019 - 2032 (US$ Million)
    • 9.5.9. Colombia
      • 9.5.9.1. Overview
      • 9.5.9.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 9.5.9.3. Colombia Market Size and Forecast, By Application, 2019 - 2032 (US$ Million)
      • 9.5.9.4. Colombia Market Size and Forecast, By End-user, 2019 - 2032 (US$ Million)
    • 9.5.10. Rest of LATAM
      • 9.5.10.1. Overview
      • 9.5.10.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 9.5.10.3. Rest of LATAM Market Size and Forecast, By Application, 2019 - 2032 (US$ Million)
      • 9.5.10.4. Rest of LATAM Market Size and Forecast, By End-user, 2019 - 2032 (US$ Million)
  • 9.6. Middle East and Africa
    • 9.6.1. Overview
    • 9.6.2. Semiconductor Wafer Polishing and Grinding Equipment Key Manufacturers in Middle East and Africa
    • 9.6.3. Middle East and Africa Market Size and Forecast, By Country, 2019 - 2032 (US$ Million)
    • 9.6.4. Middle East and Africa Market Size and Forecast, By Application, 2019 - 2032 (US$ Million)
    • 9.6.5. Middle East and Africa Market Size and Forecast, By End-user, 2019 - 2032 (US$ Million)
    • 9.6.6. Saudi Arabia
      • 9.6.6.1. Overview
      • 9.6.6.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 9.6.6.3. Saudi Arabia Market Size and Forecast, By Application, 2019 - 2032 (US$ Million)
      • 9.6.6.4. Saudi Arabia Market Size and Forecast, By End-user, 2019 - 2032 (US$ Million)
    • 9.6.7. United Arab Emirates
      • 9.6.7.1. Overview
      • 9.6.7.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 9.6.7.3. United Arab Emirates Market Size and Forecast, By Application, 2019 - 2032 (US$ Million)
      • 9.6.7.4. United Arab Emirates Market Size and Forecast, By End-user, 2019 - 2032 (US$ Million)
    • 9.6.8. Israel
      • 9.6.8.1. Overview
      • 9.6.8.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 9.6.8.3. Israel Market Size and Forecast, By Application, 2019 - 2032 (US$ Million)
      • 9.6.8.4. Israel Market Size and Forecast, By End-user, 2019 - 2032 (US$ Million)
    • 9.6.9. Turkey
      • 9.6.9.1. Overview
      • 9.6.9.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 9.6.9.3. Turkey Market Size and Forecast, By Application, 2019 - 2032 (US$ Million)
      • 9.6.9.4. Turkey Market Size and Forecast, By End-user, 2019 - 2032 (US$ Million)
    • 9.6.10. Algeria
      • 9.6.10.1. Overview
      • 9.6.10.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 9.6.10.3. Algeria Market Size and Forecast, By Application, 2019 - 2032 (US$ Million)
      • 9.6.10.4. Algeria Market Size and Forecast, By End-user, 2019 - 2032 (US$ Million)
    • 9.6.11. Egypt
      • 9.6.11.1. Overview
      • 9.6.11.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 9.6.11.3. Egypt Market Size and Forecast, By Application, 2019 - 2032 (US$ Million)
      • 9.6.11.4. Egypt Market Size and Forecast, By End-user, 2019 - 2032 (US$ Million)
    • 9.6.12. Rest of MEA
      • 9.6.12.1. Overview
      • 9.6.12.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 9.6.12.3. Rest of MEA Market Size and Forecast, By Application, 2019 - 2032 (US$ Million)
      • 9.6.12.4. Rest of MEA Market Size and Forecast, By End-user, 2019 - 2032 (US$ Million)

10. Key Vendor Analysis- Semiconductor Wafer Polishing and Grinding Equipment Industry

  • 10.1. Competitive Dashboard
    • 10.1.1. Competitive Benchmarking
    • 10.1.2. Competitive Positioning
  • 10.2. Company Profiles
    • 10.2.1. ALLIED HIGH TECH PRODUCTS, INC
    • 10.2.2. Applied Materials Inc
    • 10.2.3. ASM International NV
    • 10.2.4. Axus Technology
    • 10.2.5. G and N GmbH
    • 10.2.6. Gigamat Technologies Inc
    • 10.2.7. KLA Corp
    • 10.2.8. Lapmaster Wolters
    • 10.2.9. DISCO Corp
    • 10.2.10. Logitech Ltd.
    • 10.2.11. Okamoto Corp
    • 10.2.12. S Cubed
    • 10.2.13. Revasum Inc
    • 10.2.14. S3 Alliance
    • 10.2.15. Tokyo Electron Ltd
    • 10.2.16. TOKYO SEIMITSU CO. LTD
    • 10.2.17. ULTRA TEC Manufacturing Inc
    • 10.2.18. Amtech Systems Inc.
    • 10.2.19. UNITED GRINDING North America, Inc.
    • 10.2.20. Ebara Corp.
    • 10.2.21. Others

11. 360 Degree Analyst View

12. Appendix

  • 12.1. Research Methodology
  • 12.2. References
  • 12.3. Abbreviations
  • 12.4. Disclaimer
  • 12.5. Contact Us