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市場調查報告書
商品編碼
1416808

半導體拋光墊片市場報告：2030 年趨勢、預測與競爭分析

Semiconductor Polishing Pads Market Report: Trends, Forecast and Competitive Analysis to 2030
出版日期: | 出版商: Lucintel | 英文 150 - page report | 商品交期: 3個工作天內

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簡介目錄

半導體拋光墊片趨勢與預測

預計到 2030 年，全球半導體拋光墊片市場將達到 11 億美元，2024 年至 2030 年年複合成長率為 5.7%。該市場的主要驅動力是5G、物聯網、人工智慧、電子設備小型化趨勢的上升以及半導體晶圓在各種應用中的使用不斷增加。全球半導體拋光墊片市場的未來前景廣闊，300毫米晶圓和200毫米晶圓市場存在機會。

半導體拋光墊片市場洞察

Lucintel 預計在預測期內會有更高的成長，因為硬質 CMP墊片由聚氨酯等更堅固的材料製成，使其適合主動去除晶圓表面多餘的材料。我預測是這樣的。

由於該地區最大的兩個經濟體中國和印度的汽車和電子行業的擴張，以及韓國、日本和中國電子行業足跡的擴大，預計亞太地區在預測期內將經歷最高的成長。 它一直。

常問問題

Q1.市場規模為：

A1. 到2030年，全球半導體拋光墊片市場預計將達到11億美元。

Q2.市場成長預測是多少：

A2. 2024年至2030年，全球半導體拋光墊片市場預計將以5.7%的年複合成長率成長。

Q3.影響市場成長的主要促進因素是：

A3. 該市場的主要驅動力是5G、物聯網和人工智慧等最尖端科技的日益普及、電子設備小型化趨勢的增強以及半導體晶圓在各種應用中的使用不斷增加。

Q4.市場的主要細分市場是：

A4. 半導體拋光墊片市場前景看好，300毫米晶圓和200毫米晶圓市場有機會。

Q5.市場的主要企業是：

A5. 主要半導體拋光墊片公司如下。

  • DuPont
  • 3M
  • Cabot Corporation
  • Amtech System
  • FNS POWER TECHNOLOGY
  • Fujibo
  • TWI Innovation Network

Q6.未來最大的細分市場是什麼？

A6.Lucintel 預計在預測期內會有更高的成長，因為硬 CMP墊片由聚氨酯等更堅固的材料製成，使其適合主動去除晶圓表面的多餘材料。我們預測

Q7. 未來五年預計哪些地區的市場成長最大？

A7. 由於該地區最大的兩個經濟體中國和印度的汽車和電子行業的擴張，以及韓國、日本和中國電子行業足跡的擴大，預計亞太地區在預測期內將經歷最高的成長。這是預料之中的。

Q8. 可以客製化報告嗎？

A8. 是的，Lucintel 提供 10% 的客製化服務，無需額外付費。

目錄

第1章執行摘要

第2章全球半導體拋光墊片市場：市場動態

  • 簡介、背景、分類
  • 供應鏈
  • 產業促進因素與挑戰

第3章 2018-2030年市場趨勢及預測分析

  • 宏觀經濟趨勢（2018-2023）與預測（2024-2030）
  • 全球半導體拋光墊片市場趨勢（2018-2023）與預測（2024-2030）
  • 全球半導體拋光墊片市場，依類型
    • 硬質 CMP墊片
    • 軟質 CMP墊片
  • 全球半導體拋光墊片市場（按應用）
    • 300m晶圓
    • 200毫米晶圓
    • 其他

第4章 2018-2030年區域市場趨勢及預測分析

  • 全球半導體拋光墊片市場區域分佈
  • 北美半導體拋光墊片市場
  • 歐洲半導體拋光墊片市場
  • 亞太半導體拋光墊片市場
  • 其他地區半導體拋光墊片市場

第5章 競爭分析

  • 產品系列分析
  • 營運整合
  • 波特五力分析

第6章 成長機會與策略分析

  • 成長機會分析
    • 按類型分類的全球半導體拋光墊片市場成長機會
    • 全球半導體拋光墊片市場成長機會（按應用）
    • 按地區分類的全球半導體拋光墊片市場成長機會
  • 全球半導體拋光墊片市場新趨勢
  • 戰略分析
    • 新產品開發
    • 全球半導體拋光墊片市場產能擴張
    • 全球半導體拋光墊片市場的併購、收購和合資企業
    • 認證和許可

第7章主要企業概況

  • DuPont
  • 3M
  • Cabot Corporation
  • Amtech System
  • FNS POWER TECHNOLOGY
  • Fujibo
  • TWI Innovation Network
簡介目錄

Semiconductor Polishing Pads Trends and Forecast

The future of the global semiconductor polishing pads market looks promising with opportunities in the 300 mm wafer and 200 mm wafer markets. The global semiconductor polishing pads market is expected to reach an estimated $1.1 billion by 2030 with a CAGR of 5.7% from 2024 to 2030. The major drivers for this market are increasing uptake of cutting-edge technology like 5G, the internet of things, and artificial intelligence, growing tendency of electronic device miniaturization, and increasing use of semiconductor wafers in various applications.

A more than 150-page report is developed to help in your business decisions.

Semiconductor Polishing Pads by Segment

The study includes a forecast for the global semiconductor polishing pads by type, application, and region.

Semiconductor Polishing Pads Market by Type [Shipment Analysis by Value from 2018 to 2030]:

  • Hard CMP Pads
  • Soft CMP Pads

Semiconductor Polishing Pads Market by Application [Shipment Analysis by Value from 2018 to 2030]:

  • 300M Wafer
  • 200Mm Wafer
  • Others

Semiconductor Polishing Pads Market by Region [Shipment Analysis by Value from 2018 to 2030]:

  • North America
  • Europe
  • Asia Pacific
  • The Rest of the World

List of Semiconductor Polishing Pads Companies

Companies in the market compete on the basis of product quality offered. Major players in this market focus on expanding their manufacturing facilities, R&D investments, infrastructural development, and leverage integration opportunities across the value chain. With these strategies semiconductor polishing pads companies cater increasing demand, ensure competitive effectiveness, develop innovative products & technologies, reduce production costs, and expand their customer base. Some of the semiconductor polishing pads companies profiled in this report include-

  • DuPont
  • 3M
  • Cabot Corporation
  • Amtech System
  • FNS POWER TECHNOLOGY
  • Fujibo
  • TWI Innovation Network

Semiconductor Polishing Pads Market Insights

Lucintel forecasts that hard cmp pads is expected to witness the higher growth over the forecast period because of construction of more robust materials, such as polyurethane, and are appropriate for removing superfluous material from the wafer surface in an aggressive manner.

APAC is expected to witness highest growth over the forecast period due to expansion of the automobile and electronics industries in the region's two largest economies, China and India, as well as the expanding electronics industry hubs in South Korea, Japan, and China.

Features of the Global Semiconductor Polishing Pads Market

Market Size Estimates: Semiconductor polishing pads market size estimation in terms of value ($B).

Trend and Forecast Analysis: Market trends (2018 to 2023) and forecast (2024 to 2030) by various segments and regions.

Segmentation Analysis: Semiconductor polishing pads market size by type, application, and region in terms of value ($B).

Regional Analysis: Semiconductor polishing pads market breakdown by North America, Europe, Asia Pacific, and Rest of the World.

Growth Opportunities: Analysis of growth opportunities in different type, application, and regions for the semiconductor polishing pads market.

Strategic Analysis: This includes M&A, new product development, and competitive landscape of the semiconductor polishing pads market.

Analysis of competitive intensity of the industry based on Porter's Five Forces model.

FAQ

Q1. What is the semiconductor polishing pads market size?

Answer: The global semiconductor polishing pads market is expected to reach an estimated $1.1 billion by 2030.

Q2. What is the growth forecast for semiconductor polishing pads market?

Answer: The global semiconductor polishing pads market is expected to grow with a CAGR of 5.7% from 2024 to 2030.

Q3. What are the major drivers influencing the growth of the semiconductor polishing pads market?

Answer: The major drivers for this market are increasing uptake of cutting-edge technology like 5G, the internet of things, and artificial intelligence, growing tendency of electronic device miniaturization and increasing use of semiconductor wafers in various applications.

Q4. What are the major segments for semiconductor polishing pads market?

Answer: The future of the semiconductor polishing pads market looks promising with opportunities in the 300 mm wafer and 200 mm wafer markets.

Q5. Who are the key semiconductor polishing pads market companies?

Answer: Some of the key semiconductor polishing pads companies are as follows:

  • DuPont
  • 3M
  • Cabot Corporation
  • Amtech System
  • FNS POWER TECHNOLOGY
  • Fujibo
  • TWI Innovation Network

Q6. Which semiconductor polishing pads market segment will be the largest in future?

Answer: Lucintel forecasts that hard cmp pads is expected to witness the higher growth over the forecast period because of construction of more robust materials, such as polyurethane, and are appropriate for removing superfluous material from the wafer surface in an aggressive manner.

Q7. In semiconductor polishing pads market, which region is expected to be the largest in next 5 years?

Answer: APAC is expected to witness highest growth over the forecast period due to expansion of the automobile and electronics industries in the region's two largest economies, China and India, as well as the expanding electronics industry hubs in South Korea, Japan, and China.

Q.8 Do we receive customization in this report?

Answer: Yes, Lucintel provides 10% customization without any additional cost.

This report answers following 11 key questions:

  • Q.1. What are some of the most promising, high-growth opportunities for the semiconductor polishing pads market by type (hard cmp pads and soft cmp pads), application (300m wafer, 200mm wafer, and others), and region (North America, Europe, Asia Pacific, and the Rest of the World)?
  • Q.2. Which segments will grow at a faster pace and why?
  • Q.3. Which region will grow at a faster pace and why?
  • Q.4. What are the key factors affecting market dynamics? What are the key challenges and business risks in this market?
  • Q.5. What are the business risks and competitive threats in this market?
  • Q.6. What are the emerging trends in this market and the reasons behind them?
  • Q.7. What are some of the changing demands of customers in the market?
  • Q.8. What are the new developments in the market? Which companies are leading these developments?
  • Q.9. Who are the major players in this market? What strategic initiatives are key players pursuing for business growth?
  • Q.10. What are some of the competing products in this market and how big of a threat do they pose for loss of market share by material or product substitution?
  • Q.11. What M&A activity has occurred in the last 5 years and what has its impact been on the industry?

Table of Contents

1. Executive Summary

2. Global Semiconductor Polishing Pads Market : Market Dynamics

  • 2.1: Introduction, Background, and Classifications
  • 2.2: Supply Chain
  • 2.3: Industry Drivers and Challenges

3. Market Trends and Forecast Analysis from 2018 to 2030

  • 3.1. Macroeconomic Trends (2018-2023) and Forecast (2024-2030)
  • 3.2. Global Semiconductor Polishing Pads Market Trends (2018-2023) and Forecast (2024-2030)
  • 3.3: Global Semiconductor Polishing Pads Market by Type
    • 3.3.1: Hard CMP Pads
    • 3.3.2: Soft CMP Pads
  • 3.4: Global Semiconductor Polishing Pads Market by Application
    • 3.4.1: 300m Wafer
    • 3.4.2: 200mm Wafer
    • 3.4.3: Others

4. Market Trends and Forecast Analysis by Region from 2018 to 2030

  • 4.1: Global Semiconductor Polishing Pads Market by Region
  • 4.2: North American Semiconductor Polishing Pads Market
    • 4.2.2: North American Semiconductor Polishing Pads Market by Application: 300m Wafer, 200mm Wafer, and Others
  • 4.3: European Semiconductor Polishing Pads Market
    • 4.3.1: European Semiconductor Polishing Pads Market by Type: Hard CMP Pads and Soft CMP Pads
    • 4.3.2: European Semiconductor Polishing Pads Market by Application: 300m Wafer, 200mm Wafer, and Others
  • 4.4: APAC Semiconductor Polishing Pads Market
    • 4.4.1: APAC Semiconductor Polishing Pads Market by Type: Hard CMP Pads and Soft CMP Pads
    • 4.4.2: APAC Semiconductor Polishing Pads Market by Application: 300m Wafer, 200mm Wafer, and Others
  • 4.5: ROW Semiconductor Polishing Pads Market
    • 4.5.1: ROW Semiconductor Polishing Pads Market by Type: Hard CMP Pads and Soft CMP Pads
    • 4.5.2: ROW Semiconductor Polishing Pads Market by Application: 300m Wafer, 200mm Wafer, and Others

5. Competitor Analysis

  • 5.1: Product Portfolio Analysis
  • 5.2: Operational Integration
  • 5.3: Porter's Five Forces Analysis

6. Growth Opportunities and Strategic Analysis

  • 6.1: Growth Opportunity Analysis
    • 6.1.1: Growth Opportunities for the Global Semiconductor Polishing Pads Market by Type
    • 6.1.2: Growth Opportunities for the Global Semiconductor Polishing Pads Market by Application
    • 6.1.3: Growth Opportunities for the Global Semiconductor Polishing Pads Market by Region
  • 6.2: Emerging Trends in the Global Semiconductor Polishing Pads Market
  • 6.3: Strategic Analysis
    • 6.3.1: New Product Development
    • 6.3.2: Capacity Expansion of the Global Semiconductor Polishing Pads Market
    • 6.3.3: Mergers, Acquisitions, and Joint Ventures in the Global Semiconductor Polishing Pads Market
    • 6.3.4: Certification and Licensing

7. Company Profiles of Leading Players

  • 7.1: DuPont
  • 7.2: 3M
  • 7.3: Cabot Corporation
  • 7.4: Amtech System
  • 7.5: FNS POWER TECHNOLOGY
  • 7.6: Fujibo
  • 7.7: TWI Innovation Network