市場調查報告書
商品編碼
1450088
2024-2028年全球半導體晶圓拋光研磨設備市場Global Semiconductor Wafer Polishing and Grinding Equipment Market 2024-2028 |
預計2023-2028年半導體晶圓拋光研磨設備市場將成長4.4201億美元,預測期內複合年成長率為4.06%。
該報告包括對半導體晶圓拋光和研磨設備市場的整體分析、市場規模和預測、趨勢、成長動力、挑戰以及涵蓋約 25 家供應商的供應商分析。
它提供了對當前市場狀況、最新趨勢和促進因素以及整體市場環境的最新分析。該市場是由半導體元件的小型化、對新製造工廠的投資增加以及對長期最終用戶客戶的激勵和折扣所推動的。
市場範圍 | |
---|---|
基準年 | 2024年 |
結束年份 | 2028年 |
預測期 | 2024-2028 |
成長動力 | 加速度 |
2024年與前一年同期比較 | 3.94% |
複合年成長率 | 4.06% |
增量 | 44201萬美元 |
這項研究指出,NEMS 的使用日益增多是推動未來幾年半導體晶圓拋光和研磨設備市場成長的關鍵因素之一。此外,超大規模積體電路的成長和向 3D 結構的過渡將帶來巨大的市場需求。
The semiconductor wafer polishing and grinding equipment market is forecasted to grow by USD 442.01 mn during 2023-2028, accelerating at a CAGR of 4.06% during the forecast period. The report on the semiconductor wafer polishing and grinding equipment market provides a holistic analysis, market size and forecast, trends, growth drivers, and challenges, as well as vendor analysis covering around 25 vendors.
The report offers an up-to-date analysis regarding the current market scenario, the latest trends and drivers, and the overall market environment. The market is driven by emergence of miniaturized semiconductor components, growing investment in new fabrication plants, and incentives and discounts for long-term customers of end-users.
Technavio's semiconductor wafer polishing and grinding equipment market is segmented as below:
Market Scope | |
---|---|
Base Year | 2024 |
End Year | 2028 |
Series Year | 2024-2028 |
Growth Momentum | Accelerate |
YOY 2024 | 3.94% |
CAGR | 4.06% |
Incremental Value | $442.01mn |
By Application
By End-user
By Geographical Landscape
This study identifies the increasing use of NEMS as one of the prime reasons driving the semiconductor wafer polishing and grinding equipment market growth during the next few years. Also, growth of ULSI and transition toward 3D structures will lead to sizable demand in the market.
The report on the semiconductor wafer polishing and grinding equipment market covers the following areas:
The robust vendor analysis is designed to help clients improve their market position, and in line with this, this report provides a detailed analysis of several leading semiconductor wafer polishing and grinding equipment market vendors that include ALLIED HIGH TECH PRODUCTS, INC, Amtech Systems Inc., Applied Materials Inc., ASM International NV, Axus Technology, DISCO Corp., G and N GmbH, Gigamat Technologies Inc, KLA Corp., Lapmaster Wolters, Logitech Ltd., Okamoto Corp, Revasum Inc., S Cubed, S3 Alliance., Tokyo Electron Ltd., TOKYO SEIMITSU CO. LTD, ULTRA TEC Manufacturing Inc., UNITED GRINDING North America, Inc., and Ebara Corp.. Also, the semiconductor wafer polishing and grinding equipment market analysis report includes information on upcoming trends and challenges that will influence market growth. This is to help companies strategize and leverage all forthcoming growth opportunities.
The study was conducted using an objective combination of primary and secondary information including inputs from key participants in the industry. The report contains a comprehensive market and vendor landscape in addition to an analysis of the key vendors.
The publisher presents a detailed picture of the market by the way of study, synthesis, and summation of data from multiple sources by an analysis of key parameters such as profit, pricing, competition, and promotions. It presents various market facets by identifying the key industry influencers. The data presented is comprehensive, reliable, and a result of extensive research - both primary and secondary. The market research reports provide a complete competitive landscape and an in-depth vendor selection methodology and analysis using qualitative and quantitative research to forecast the accurate market growth.
Exhibits: