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1521210

半導體晶圓拋光和研磨設備市場報告（按類型（半導體晶圓拋光設備、半導體晶圓研磨設備）、最終用戶（代工廠、記憶體製造商、IDM 等）和地區 2024-2032

Semiconductor Wafer Polishing and Grinding Equipment Market Report by Type (Semiconductor Wafer Polishing Equipment, Semiconductor Wafer Grinding Equipment), End User (Foundries, Memory Manufacturers, IDMs, and Others), and Region 2024-2032
出版日期: | 出版商: IMARC | 英文 146 Pages | 商品交期: 2-3個工作天內

價格

IMARC Group年全球半導體晶圓拋光研磨設備市場規模達4.312億美元。

拋光、研磨設備是指半導體晶圓製造過程中普遍使用的先進、不可或缺的零件。它們涉及沉積、光刻、離子注入、蝕刻和清潔，作為在金相工具、圓盤精加工和研磨機的幫助下執行的一些標準方法。半導體晶圓拋光和研磨設備有助於從薄膜中去除不需要的材料，並減薄和精煉產品，同時確保表面光滑且無損壞。由於這些特性，它們被代工廠和記憶體製造商廣泛用於建構積體電路。

半導體晶圓拋光和研磨設備市場趨勢：

隨著電子產業的快速擴張，用於製造各種消費性電子產品（包括智慧型手機、筆記型電腦和桌上型電腦）的微機電系統（MEMS）、微晶片和積體電路的需求不斷增加。這反過來又促進了先進的半導體晶圓研磨和拋光機械的廣泛採用，以減薄和減輕晶圓損壞，這是目前推動市場成長的主要因素之一。與此一致的是，重大技術進步，例如採用金屬氧化物半導體（MOS）和化學機械拋光（CMP）解決方案來在生產過程中保持晶圓表面輪廓，正在成為其他成長誘導因素。該市場還受到無線技術大規模整合的支持，包括物聯網 (IoT) 和人工智慧 (AI)，幫助製造商設計智慧設備。此外，晶圓製造廠廣泛使用拋光和研磨設備來製造系統單晶片（SoC）晶片，也促進了市場的成長。其他因素，例如對採用更薄晶圓的小型電子設備的需求不斷成長、對研發(R&D) 活動的持續投資，以及主要參與者之間的戰略合作以推出高性能晶圓拋光和研磨工具，都為該行業創造了積極的前景。

本報告回答的關鍵問題：

  • 迄今為止，全球半導體晶圓拋光和研磨設備市場表現如何，未來幾年將如何表現？
  • COVID-19對全球半導體晶圓拋光和研磨設備市場有何影響？
  • 主要區域市場有哪些？
  • 依類型分類市場是怎麼樣的？
  • 基於最終用戶的市場區隔是什麼？
  • 產業價值鏈的各個階段是什麼？
  • 該行業的關鍵促進因素和挑戰是什麼？
  • 全球半導體晶圓拋光研磨設備市場結構如何？
  • 產業競爭程度如何？

目錄

第1章：前言

第 2 章：範圍與方法

  • 研究目的
  • 利害關係人
  • 資料來源
    • 主要資源
    • 二手資料
  • 市場預測
    • 自下而上的方法
    • 自上而下的方法
  • 預測方法

第 3 章：執行摘要

第 4 章：簡介

  • 概述
  • 主要行業趨勢

第 5 章：全球半導體晶圓拋光與研磨設備市場

  • 市場概況
  • 市場業績
  • COVID-19 的影響
  • 市場預測

第 6 章：市場區隔：按類型

  • 半導體晶圓拋光設備
    • 市場走向
    • 市場預測
  • 半導體晶圓研磨設備
    • 市場走向
    • 市場預測

第 7 章：市場區隔：按最終用戶

  • 鑄造廠
    • 市場走向
    • 市場預測
  • 記憶體製造商
    • 市場走向
    • 市場預測
  • IDM
    • 市場走向
    • 市場預測
  • 其他
    • 市場走向
    • 市場預測

第 8 章：市場區隔：按地區

  • 北美洲
    • 美國
    • 加拿大
  • 亞太
    • 中國
    • 日本
    • 印度
    • 韓國
    • 澳洲
    • 印尼
    • 其他
  • 歐洲
    • 德國
    • 法國
    • 英國
    • 義大利
    • 西班牙
    • 俄羅斯
    • 其他
  • 拉丁美洲
    • 巴西
    • 墨西哥
    • 其他
  • 中東和非洲
    • 市場走向
    • 市場細分：按國家/地區
    • 市場預測

第 9 章：SWOT 分析

  • 概述
  • 優勢
  • 弱點
  • 機會
  • 威脅

第 10 章：價值鏈分析

第 11 章：波特五力分析

  • 概述
  • 買家的議價能力
  • 供應商的議價能力
  • 競爭程度
  • 新進入者的威脅
  • 替代品的威脅

第 12 章：價格分析

第13章：競爭格局

  • 市場結構
  • 關鍵參與者
  • 關鍵參與者簡介
    • Accretech (Europe) Gmbh (Tokyo Seimitsu Co. Ltd.)
    • Amtech Systems Inc.
    • Axus Technology
    • BBS Kinmei Co Ltd
    • Disco Corporation
    • Dynavest Pte Ltd
    • Ebara Corporation
    • Gigamat Technologies Inc.
    • Lapmaster Wolters GmbH (Lapmaster International LLC)
    • Logitech Ltd.
    • Okamoto Machine Tool Works Ltd
    • Revasum Inc.
Product Code: SR112024A5866

The global semiconductor wafer polishing and grinding equipment market size reached US$ 431.2 Million in 2023. Looking forward, IMARC Group expects the market to reach US$ 647.8 Million by 2032, exhibiting a growth rate (CAGR) of 4.5% during 2024-2032.

Polishing and grinding equipment refer to advanced, indispensable components generally used while fabricating semiconductor wafers. They involve deposition, lithography, Ion implant, etching, and cleaning as some of the standard methods performed with the assistance of metallographic tools, disc finishing, and lapping machines. Semiconductor wafer polishing and grinding equipment aid in removing unwarranted material from a film and thinning and refining the product while ensuring a smooth and damage-free surface. On account of these properties, they are extensively utilized by foundries and memory manufacturers for composing integrated circuits.

Semiconductor Wafer Polishing and Grinding Equipment Market Trends:

With the rapid expansion in the electronics industry, there has been increasing demand for microelectromechanical systems (MEMS), microchips and integrated circuits for manufacturing various consumer electronic goods, including smartphones, laptops and desktops. This, in turn, has facilitated the widespread adoption of advanced semiconductor wafer grinding and polishing machinery for thinning and mitigating damage from wafers, which represents one of the prime factors currently driving the market growth. In line with this, significant technological advancements, such as the employment of metal-oxide-semiconductor (MOS) and chemical-mechanical-polishing (CMP) solutions to maintain the wafer surface profile during production processes, are acting as other growth-inducing factors. The market is also being supported by the large-scale integration of wireless technologies, including the Internet of Things (IoT) and artificial intelligence (AI), that help manufacturers engineer smart devices. Additionally, the extensive utilization of polishing and grinding equipment in wafer fabrication plants to manufacture a system on a chip (SoC) dice is contributing to the market growth. Other factors, such as the rising need for miniaturized electronic devices with thinner wafers, continuous investments in research and development (R&D) activities, and strategic collaborations amongst key players to introduce high-performance wafer polishing and grinding tools are creating a positive outlook for the market.

Key Market Segmentation:

IMARC Group provides an analysis of the key trends in each sub-segment of the global semiconductor wafer polishing and grinding equipment market report, along with forecasts at the global, regional and country level from 2024-2032. Our report has categorized the market based on type and end user.

Breakup by Type:

Semiconductor Wafer Polishing Equipment

Semiconductor Wafer Grinding Equipment

Breakup by End User:

Foundries

Memory Manufacturers

IDMs

Others

Breakup by Region:

North America

United States

Canada

Asia-Pacific

China

Japan

India

South Korea

Australia

Indonesia

Others

Europe

Germany

France

United Kingdom

Italy

Spain

Russia

Others

Latin America

Brazil

Mexico

Others

Middle East and Africa

Competitive Landscape:

The competitive landscape of the industry has also been examined along with the profiles of the key players being Accretech (Europe) Gmbh (Tokyo Seimitsu Co. Ltd.), Amtech Systems Inc., Axus Technology, BBS Kinmei Co Ltd, Disco Corporation, Dynavest Pte Ltd, Ebara Corporation, Gigamat Technologies Inc., Lapmaster Wolters GmbH (Lapmaster International LLC), Logitech Ltd., Okamoto Machine Tool Works Ltd and Revasum Inc.

Key Questions Answered in This Report:

  • How has the global semiconductor wafer polishing and grinding equipment market performed so far and how will it perform in the coming years?
  • What has been the impact of COVID-19 on the global semiconductor wafer polishing and grinding equipment market?
  • What are the key regional markets?
  • What is the breakup of the market based on the type?
  • What is the breakup of the market based on the end user?
  • What are the various stages in the value chain of the industry?
  • What are the key driving factors and challenges in the industry?
  • What is the structure of the global semiconductor wafer polishing and grinding equipment market and who are the key players?
  • What is the degree of competition in the industry?

Table of Contents

1 Preface

2 Scope and Methodology

  • 2.1 Objectives of the Study
  • 2.2 Stakeholders
  • 2.3 Data Sources
    • 2.3.1 Primary Sources
    • 2.3.2 Secondary Sources
  • 2.4 Market Estimation
    • 2.4.1 Bottom-Up Approach
    • 2.4.2 Top-Down Approach
  • 2.5 Forecasting Methodology

3 Executive Summary

4 Introduction

  • 4.1 Overview
  • 4.2 Key Industry Trends

5 Global Semiconductor Wafer Polishing and Grinding Equipment Market

  • 5.1 Market Overview
  • 5.2 Market Performance
  • 5.3 Impact of COVID-19
  • 5.4 Market Forecast

6 Market Breakup by Type

  • 6.1 Semiconductor Wafer Polishing Equipment
    • 6.1.1 Market Trends
    • 6.1.2 Market Forecast
  • 6.2 Semiconductor Wafer Grinding Equipment
    • 6.2.1 Market Trends
    • 6.2.2 Market Forecast

7 Market Breakup by End User

  • 7.1 Foundries
    • 7.1.1 Market Trends
    • 7.1.2 Market Forecast
  • 7.2 Memory Manufacturers
    • 7.2.1 Market Trends
    • 7.2.2 Market Forecast
  • 7.3 IDMs
    • 7.3.1 Market Trends
    • 7.3.2 Market Forecast
  • 7.4 Others
    • 7.4.1 Market Trends
    • 7.4.2 Market Forecast

8 Market Breakup by Region

  • 8.1 North America
    • 8.1.1 United States
      • 8.1.1.1 Market Trends
      • 8.1.1.2 Market Forecast
    • 8.1.2 Canada
      • 8.1.2.1 Market Trends
      • 8.1.2.2 Market Forecast
  • 8.2 Asia-Pacific
    • 8.2.1 China
      • 8.2.1.1 Market Trends
      • 8.2.1.2 Market Forecast
    • 8.2.2 Japan
      • 8.2.2.1 Market Trends
      • 8.2.2.2 Market Forecast
    • 8.2.3 India
      • 8.2.3.1 Market Trends
      • 8.2.3.2 Market Forecast
    • 8.2.4 South Korea
      • 8.2.4.1 Market Trends
      • 8.2.4.2 Market Forecast
    • 8.2.5 Australia
      • 8.2.5.1 Market Trends
      • 8.2.5.2 Market Forecast
    • 8.2.6 Indonesia
      • 8.2.6.1 Market Trends
      • 8.2.6.2 Market Forecast
    • 8.2.7 Others
      • 8.2.7.1 Market Trends
      • 8.2.7.2 Market Forecast
  • 8.3 Europe
    • 8.3.1 Germany
      • 8.3.1.1 Market Trends
      • 8.3.1.2 Market Forecast
    • 8.3.2 France
      • 8.3.2.1 Market Trends
      • 8.3.2.2 Market Forecast
    • 8.3.3 United Kingdom
      • 8.3.3.1 Market Trends
      • 8.3.3.2 Market Forecast
    • 8.3.4 Italy
      • 8.3.4.1 Market Trends
      • 8.3.4.2 Market Forecast
    • 8.3.5 Spain
      • 8.3.5.1 Market Trends
      • 8.3.5.2 Market Forecast
    • 8.3.6 Russia
      • 8.3.6.1 Market Trends
      • 8.3.6.2 Market Forecast
    • 8.3.7 Others
      • 8.3.7.1 Market Trends
      • 8.3.7.2 Market Forecast
  • 8.4 Latin America
    • 8.4.1 Brazil
      • 8.4.1.1 Market Trends
      • 8.4.1.2 Market Forecast
    • 8.4.2 Mexico
      • 8.4.2.1 Market Trends
      • 8.4.2.2 Market Forecast
    • 8.4.3 Others
      • 8.4.3.1 Market Trends
      • 8.4.3.2 Market Forecast
  • 8.5 Middle East and Africa
    • 8.5.1 Market Trends
    • 8.5.2 Market Breakup by Country
    • 8.5.3 Market Forecast

9 SWOT Analysis

  • 9.1 Overview
  • 9.2 Strengths
  • 9.3 Weaknesses
  • 9.4 Opportunities
  • 9.5 Threats

10 Value Chain Analysis

11 Porters Five Forces Analysis

  • 11.1 Overview
  • 11.2 Bargaining Power of Buyers
  • 11.3 Bargaining Power of Suppliers
  • 11.4 Degree of Competition
  • 11.5 Threat of New Entrants
  • 11.6 Threat of Substitutes

12 Price Analysis

13 Competitive Landscape

  • 13.1 Market Structure
  • 13.2 Key Players
  • 13.3 Profiles of Key Players
    • 13.3.1 Accretech (Europe) Gmbh (Tokyo Seimitsu Co. Ltd.)
      • 13.3.1.1 Company Overview
      • 13.3.1.2 Product Portfolio
    • 13.3.2 Amtech Systems Inc.
      • 13.3.2.1 Company Overview
      • 13.3.2.2 Product Portfolio
      • 13.3.2.3 Financials
    • 13.3.3 Axus Technology
      • 13.3.3.1 Company Overview
      • 13.3.3.2 Product Portfolio
    • 13.3.4 BBS Kinmei Co Ltd
      • 13.3.4.1 Company Overview
      • 13.3.4.2 Product Portfolio
    • 13.3.5 Disco Corporation
      • 13.3.5.1 Company Overview
      • 13.3.5.2 Product Portfolio
      • 13.3.5.3 Financials
    • 13.3.6 Dynavest Pte Ltd
      • 13.3.6.1 Company Overview
      • 13.3.6.2 Product Portfolio
    • 13.3.7 Ebara Corporation
      • 13.3.7.1 Company Overview
      • 13.3.7.2 Product Portfolio
      • 13.3.7.3 Financials
      • 13.3.7.4 SWOT Analysis
    • 13.3.8 Gigamat Technologies Inc.
      • 13.3.8.1 Company Overview
      • 13.3.8.2 Product Portfolio
    • 13.3.9 Lapmaster Wolters GmbH (Lapmaster International LLC)
      • 13.3.9.1 Company Overview
      • 13.3.9.2 Product Portfolio
    • 13.3.10 Logitech Ltd.
      • 13.3.10.1 Company Overview
      • 13.3.10.2 Product Portfolio
    • 13.3.11 Okamoto Machine Tool Works Ltd
      • 13.3.11.1 Company Overview
      • 13.3.11.2 Product Portfolio
      • 13.3.11.3 Financials
    • 13.3.12 Revasum Inc.
      • 13.3.12.1 Company Overview
      • 13.3.12.2 Product Portfolio
      • 13.3.12.3 Financials

List of Figures

  • Figure 1: Global: Semiconductor Wafer Polishing and Grinding Equipment Market: Major Drivers and Challenges
  • Figure 2: Global: Semiconductor Wafer Polishing and Grinding Equipment Market: Sales Value (in Million US$), 2018-2023
  • Figure 3: Global: Semiconductor Wafer Polishing and Grinding Equipment Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 4: Global: Semiconductor Wafer Polishing and Grinding Equipment Market: Breakup by Type (in %), 2023
  • Figure 5: Global: Semiconductor Wafer Polishing and Grinding Equipment Market: Breakup by End User (in %), 2023
  • Figure 6: Global: Semiconductor Wafer Polishing and Grinding Equipment Market: Breakup by Region (in %), 2023
  • Figure 7: Global: Semiconductor Wafer Polishing and Grinding Equipment (Semiconductor Wafer Polishing Equipment) Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 8: Global: Semiconductor Wafer Polishing and Grinding Equipment (Semiconductor Wafer Polishing Equipment) Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 9: Global: Semiconductor Wafer Polishing and Grinding Equipment (Semiconductor Wafer Grinding Equipment) Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 10: Global: Semiconductor Wafer Polishing and Grinding Equipment (Semiconductor Wafer Grinding Equipment) Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 11: Global: Semiconductor Wafer Polishing and Grinding Equipment (Foundries) Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 12: Global: Semiconductor Wafer Polishing and Grinding Equipment (Foundries) Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 13: Global: Semiconductor Wafer Polishing and Grinding Equipment (Memory Manufacturers) Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 14: Global: Semiconductor Wafer Polishing and Grinding Equipment (Memory Manufacturers) Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 15: Global: Semiconductor Wafer Polishing and Grinding Equipment (IDMs) Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 16: Global: Semiconductor Wafer Polishing and Grinding Equipment (IDMs) Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 17: Global: Semiconductor Wafer Polishing and Grinding Equipment (Other End Users) Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 18: Global: Semiconductor Wafer Polishing and Grinding Equipment (Other End Users) Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 19: North America: Semiconductor Wafer Polishing and Grinding Equipment Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 20: North America: Semiconductor Wafer Polishing and Grinding Equipment Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 21: United States: Semiconductor Wafer Polishing and Grinding Equipment Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 22: United States: Semiconductor Wafer Polishing and Grinding Equipment Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 23: Canada: Semiconductor Wafer Polishing and Grinding Equipment Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 24: Canada: Semiconductor Wafer Polishing and Grinding Equipment Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 25: Asia-Pacific: Semiconductor Wafer Polishing and Grinding Equipment Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 26: Asia-Pacific: Semiconductor Wafer Polishing and Grinding Equipment Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 27: China: Semiconductor Wafer Polishing and Grinding Equipment Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 28: China: Semiconductor Wafer Polishing and Grinding Equipment Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 29: Japan: Semiconductor Wafer Polishing and Grinding Equipment Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 30: Japan: Semiconductor Wafer Polishing and Grinding Equipment Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 31: India: Semiconductor Wafer Polishing and Grinding Equipment Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 32: India: Semiconductor Wafer Polishing and Grinding Equipment Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 33: South Korea: Semiconductor Wafer Polishing and Grinding Equipment Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 34: South Korea: Semiconductor Wafer Polishing and Grinding Equipment Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 35: Australia: Semiconductor Wafer Polishing and Grinding Equipment Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 36: Australia: Semiconductor Wafer Polishing and Grinding Equipment Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 37: Indonesia: Semiconductor Wafer Polishing and Grinding Equipment Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 38: Indonesia: Semiconductor Wafer Polishing and Grinding Equipment Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 39: Others: Semiconductor Wafer Polishing and Grinding Equipment Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 40: Others: Semiconductor Wafer Polishing and Grinding Equipment Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 41: Europe: Semiconductor Wafer Polishing and Grinding Equipment Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 42: Europe: Semiconductor Wafer Polishing and Grinding Equipment Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 43: Germany: Semiconductor Wafer Polishing and Grinding Equipment Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 44: Germany: Semiconductor Wafer Polishing and Grinding Equipment Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 45: France: Semiconductor Wafer Polishing and Grinding Equipment Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 46: France: Semiconductor Wafer Polishing and Grinding Equipment Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 47: United Kingdom: Semiconductor Wafer Polishing and Grinding Equipment Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 48: United Kingdom: Semiconductor Wafer Polishing and Grinding Equipment Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 49: Italy: Semiconductor Wafer Polishing and Grinding Equipment Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 50: Italy: Semiconductor Wafer Polishing and Grinding Equipment Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 51: Spain: Semiconductor Wafer Polishing and Grinding Equipment Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 52: Spain: Semiconductor Wafer Polishing and Grinding Equipment Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 53: Russia: Semiconductor Wafer Polishing and Grinding Equipment Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 54: Russia: Semiconductor Wafer Polishing and Grinding Equipment Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 55: Others: Semiconductor Wafer Polishing and Grinding Equipment Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 56: Others: Semiconductor Wafer Polishing and Grinding Equipment Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 57: Latin America: Semiconductor Wafer Polishing and Grinding Equipment Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 58: Latin America: Semiconductor Wafer Polishing and Grinding Equipment Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 59: Brazil: Semiconductor Wafer Polishing and Grinding Equipment Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 60: Brazil: Semiconductor Wafer Polishing and Grinding Equipment Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 61: Mexico: Semiconductor Wafer Polishing and Grinding Equipment Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 62: Mexico: Semiconductor Wafer Polishing and Grinding Equipment Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 63: Others: Semiconductor Wafer Polishing and Grinding Equipment Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 64: Others: Semiconductor Wafer Polishing and Grinding Equipment Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 65: Middle East and Africa: Semiconductor Wafer Polishing and Grinding Equipment Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 66: Middle East and Africa: Semiconductor Wafer Polishing and Grinding Equipment Market: Breakup by Country (in %), 2023
  • Figure 67: Middle East and Africa: Semiconductor Wafer Polishing and Grinding Equipment Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 68: Global: Semiconductor Wafer Polishing and Grinding Equipment Industry: SWOT Analysis
  • Figure 69: Global: Semiconductor Wafer Polishing and Grinding Equipment Industry: Value Chain Analysis
  • Figure 70: Global: Semiconductor Wafer Polishing and Grinding Equipment Industry: Porter's Five Forces Analysis

List of Tables

  • Table 1: Global: Semiconductor Wafer Polishing and Grinding Equipment Market: Key Industry Highlights, 2023 and 2032
  • Table 2: Global: Semiconductor Wafer Polishing and Grinding Equipment Market Forecast: Breakup by Type (in Million US$), 2024-2032
  • Table 3: Global: Semiconductor Wafer Polishing and Grinding Equipment Market Forecast: Breakup by End User (in Million US$), 2024-2032
  • Table 4: Global: Semiconductor Wafer Polishing and Grinding Equipment Market Forecast: Breakup by Region (in Million US$), 2024-2032
  • Table 5: Global: Semiconductor Wafer Polishing and Grinding Equipment Market: Competitive Structure
  • Table 6: Global: Semiconductor Wafer Polishing and Grinding Equipment Market: Key Players