半導體拋光墊市場 - 2023-2028年預測

預計2021年全球半導體拋光墊市場規模將達到9.83億美元，年複合成長率為5.42%，2028年將達到14.23億美元。

預計半導體拋光墊市場在預測期內將大幅成長。拋光墊是用於半導體材料化學機械平坦化（CMP）的消耗品。墊材料範圍從金屬氧化物到陶瓷再到聚氨酯。半導體拋光墊市場可以按類型、用途和地區進行細分。市場成長的主要促進因素是電子和汽車等多個成長行業對半導體的需求不斷成長。

市場促進因素

電子設備的小型化

推動半導體拋光墊行業成長的主要要素是電子設備小型化趨勢的日益增強。隨著這一趨勢的加劇，對先進封裝的需求不斷成長，實現裝置小型化以及提高熱效率和可靠性。由於先進半導體封裝過程需要拋光墊，由於電子設備的小型化，預計需求將與先進封裝需求同步成長。

此外，由於私營公司和政府機構對研發的投資，電子行業不斷成長。例如，根據印度品牌資產基金會的一項研究，印度電子產品生產行業的規模從2015年到2021年將增加一倍以上。對空調、電視和智慧手機等家用電器的需求不斷成長，其製造需要使用半導體來控制和管理電流。因此，隨著家電需求的成長，半導體拋光墊的市場規模也會隨之成長。

汽車行業對半導體的需求。

半導體還用於汽車工業等成長型行業，這是推動半導體拋光墊市場規模的要素。半導體廣泛應用於現代車輛的 ADAS（高級駕駛輔助系統）技術以及自動駕駛和停車輔助等智慧功能。例如，2021年至2022年美國生產的汽車數量將增加10%（根據國際汽車工業協會的資料）。因此，隨著汽車產銷量的成長，半導體晶圓CMP用半導體拋光墊的需求預計將持續穩定成長。

• 抑制因素
• 技術複雜性和半導體短缺

行業成長的主要課題是需要技術熟練且合格的勞動力來製造半導體拋光墊。專業操作人員的短缺是成長的障礙，而僱用技術純熟勞工會增加產品的總體成本，使其更加難以承受。市場上還存在半導體晶片短缺的情況，冠狀病毒和俄羅斯-烏克蘭戰爭造成的供應鏈中斷加劇了這種短缺。這影響了對拋光墊的需求，而拋光墊與半導體需求直接相關。

主要企業提供的產品

• DuPont Optivision Pro 系列提供用於化學機械平坦化的拋光墊，可促進高級拋光和設計改進。這是該公司的第三代 CMP 拋光墊，目的是降低客戶的擁有成本。與傳統產品系列相比，該產品功能支持端點選項，並提供更高的去除率、更長的使用壽命和更少的缺陷。
• Fujibo Ehime超精密拋光墊可實現半導體裝置的精密拋光。它是充分利用公司的研發能力而開發的。 POLYPAS（晶圓系列）拋光墊可用於半導體晶圓的最終拋光，並有多種型號可供選擇，以滿足不同的需求。
• 3M 的 Trizact CMP 墊用於半導體製造，以實現 CMP 過程的均勻性。該產品提供使用壽命穩定性並減少腐蝕，並使用微複製技術來精確控制一致的墊性能。

亞太地區半導體拋光墊市場。

亞太地區在半導體拋光墊行業中佔有重要佔有率，預計在預測期內將繼續保持類似的趨勢。市場佔有率得益於中國和印度等該地區主要經濟體的電子和汽車行業的成長，以及中國、韓國和日本等國家電子工業基礎的成長。

中國和印度市場

中國擁有世界上最大的電子產品生產基地之一，被認為是全球最大的製造地之一。電子、醫療保健、國防和汽車等不斷成長的行業將繼續需要更多的半導體，促進半導體拋光墊市場規模的成長。在印度，透過致力於國內生產，各個領域的工業都在成長，對半導體的需求也相應增加。

世界其他地區的預測

北美和歐洲市場預計也將出現溫和成長。在美國，隨著3M和Cabot Microelectronics等主要半導體製造商大力投資半導體業務和進一步研究，加上汽車和醫療保健等不斷成長的行業對半導體的需求預計將激增。

主要趨勢

• 2021年 7月，三星電子與 F&S Tech 合作，宣布推出可重複使用的半導體晶圓拋光墊。該墊由聚氨酯製成，可用於透過化學和機械拋光來平坦化半導體晶片表面。利用該公司的專利技術，CMP墊可以透過分離、對磨損零件重新充電並重新固化來重複使用。
• 2023年1月，Amtek Systems宣布將以3500萬美元收購美國公司Entrepix。此次收購預計將透過增加基板處理解決方案並利用兩家公司基本客群的協同效應，增強 Amtech 在前端晶圓處理市場的市場佔有率。

目錄

第1章 簡介

• 市場概況
• 市場定義
• 調查範圍
• 市場區隔
• 貨幣
• 先決條件
• 基準年和預測年時間表

第2章 調查方法

• 調查資料
• 調查過程

第3章 執行摘要

• 研究亮點

第4章 市場動態

• 市場促進因素
• 市場抑制因素
• 波特五力分析
• 行業價值鏈分析

第5章 半導體拋光墊市場：按類型

• 介紹
• 硬質 CMP 墊
• 軟質 CMP 墊

第6章 半導體拋光墊市場：按用途

• 介紹
• 300毫米晶圓
• 200毫米晶圓
• 其他

第7章 半導體拋光墊市場：按地區

• 介紹
• 北美
  • 美國
  • 加拿大
  • 墨西哥
• 南美洲
  • 巴西
  • 阿根廷
  • 其他
• 歐洲
  • 德國
  • 法國
  • 英國
  • 西班牙
  • 其他
• 中東/非洲
  • 沙烏地阿拉伯
  • 阿拉伯聯合大公國
  • 以色列
  • 其他
• 亞太地區
  • 中國
  • 日本
  • 印度
  • 韓國
  • 印尼
  • 台灣
  • 其他

第8章 競爭環境及分析

• 主要企業及戰略分析
• 新興企業和市場盈利能力
• 合併、收購、協議與合作
• 供應商競爭力矩陣

第9章 公司簡介

• DuPont
• Logitech LTD
• FOJIBO
• Pureon
• 3M
• FNS POWER TECHNOLOGY INC.
• Kemet International Limited
• SKC Inc.

The global semiconductor polishing pads market was valued at US$0.983 billion in 2021 and is expected to grow at a CAGR of 5.42% to reach US$1.423 billion by 2028.

The semiconductor polishing pads market is projected to grow at a considerable pace during the forecast period. These pads refer to consumable products used in the chemical-mechanical planarization (CMP) of semiconductor materials. They are vital in determining the performance and quality level of the process and are made from several materials such as metal oxide, ceramic, polyurethane, etc. The semiconductor polishing pads market can be classified in the following ways: by type, application, and geographic region. The major drivers for the growth of this market include increased demand for semiconductors in several booming industries, such as electronics and automotive.

Market Drivers:

Miniaturization of electronic devices

A major factor driving the growth of the semiconductor polishing pads industry is the rising trend of miniaturization of electronic devices. As this trend grows, the need for advanced packaging will also increase as it improves thermal efficiency and provides better reliability, in addition to helping in reducing device sizes. Polishing pads are necessary for the advanced semiconductor packaging process, and, therefore, their demand will grow in tandem with the need for advanced packaging due to the miniaturization of electronic devices.

Further, the electronics industry has been experiencing growth due to investments by private players and government institutions in research and development efforts. For instance, the electronics production industry in India has grown by over double in size from 2015 to 2021, as per research from the India Brand Equity Foundation. The demand for consumer electronics such as air conditioners, televisions, and smartphones is growing, and their manufacturing involves using semiconductors to control and manage the flow of electric current. Therefore, as the demand for consumer electronics grows, the semiconductor polishing pads market size will increase too.

Demand for semiconductors by the automotive industry.

Semiconductors also find uses in growing industries such as automotive, which helps further boost the semiconductor polishing pads industry size. Semiconductors are used extensively in modern automobiles for advanced driver assistance system technologies and other smart features such as autopilot driving and parking assistance. For instance, the production of motor vehicles in the U.S. has grown by 10% from 2021 to 2022, as per the International Organization for Motor Vehicle Manufacturers. Therefore, as the production and sale of automobiles grow, the demand for semiconductor polishing pads for CMP of semiconductor wafers will continue to grow steadily.

• Restraints to the industry's expansion.

• Technical complexities and semiconductor shortage.

Key challenge to the industry's growth is the need for technically skilled and competent labor to manufacture semiconductor polishing pads. The lack of professional operators can act as a barrier to growth, and hiring skilled labor adds to the overall cost of the product, further reducing its affordability. There is also a shortage of semiconductor chips in the market due, which is further aggravated by supply chain disruptions due to the coronavirus and the Russia-Ukraine war. This impacts the demand for polishing pads directly related to the need for semiconductors.

Products Offered by key players.

• DuPont's Optivision Pro range offers polishing pads for chemical mechanical planarization by facilitating advanced polishing and design improvements. This is the company's third generation of CMP pads manufactured to ease customers' ownership costs. The product features enable endpointing options and offer increased removal rates, improved lifetimes, and reduced defectivity compared to previous ranges of its products.
• Fujibo's Ehime ultra-high precision polishing pads allow for the precise polishing of semiconductor devices. Developed with the help of the research and development capabilities of the company, the products are designed to meet the needs of the customers. The POLYPAS (Suede series) polishing pads help in the final polishing of semiconductor wafers and are available in different variants for multiple needs.
• 3M's Trizact CMP Pads are used in semiconductor fabrication to provide uniformity in the CMP process. The product offers stability through its usable life and reduced erosion and uses microreplication technology to provide precise control for consistent pad performance.

The Asia-Pacific region semiconductor polishing pads market.

Asia Pacific is expected to constitute a significant share of the semiconductor polishing pads industry, and similar trends are expected to be followed in the forecast period. This market share is owed to the growth in electronics and automotive sectors in the region's major economies, such as China and India, as well as the growing electronics industry bases in countries like China, South Korea, and Japan.

Chinese and Indian markets.

China holds one of the largest electronics production bases in the world and is also considered one of the largest manufacturing hubs globally. These are two key factors that will continue to increase the demand for semiconductors in Chinese markets as growing industries such as electronics, healthcare, defense, automotive, etc., will continue to demand more semiconductors which will help in the growth of semiconductor polishing pads market size. In India, the focus on domestic production has led to increased industrial growth in all sectors, which is proportionately driving the demand for semiconductors.

Forecast for the Rest of the World.

It is anticipated that North American and European markets will experience moderate growth too. The market for semiconductor polishing pads in the United States is expected to see a surge in demand due to the presence of large semiconductor manufacturers such as 3M, Cabot Microelectronics, etc., that are heavily investing in the semiconductor business and its further research, as well as demand from growing industries such as automotive, healthcare, etc. for semiconductors.

Key Developments.

• In July 2021, in collaboration with F&S Tech, Samsung Electronics announced the launch of reusable pads for semiconductor wafer polishing. These pads are made of polyurethane and allow for the flattening of semiconductor wafer surfaces by chemical and mechanical polishing. The CMP pads are reused by separating them, recharging the worn-out parts, and re-hardening them using their patented technology.
• In January 2023, Amtech Systems announced the acquisition of Entrepix, Inc. for US$35 million. The acquisition is expected to enhance Amtech's market share in the front-end wafer processing market by adding substrate processing solutions and utilizing the synergies between both companies' customer bases.

Market Segmentation:

By Type

• Hard CMP Pads
• Soft CMP Pads

By Application

• 300m Wafer
• 200mm Wafer
• Others

By Geography

• North America
• USA
• Canada
• Mexico
• South America
• Brazil
• Argentina
• Others
• Europe
• Germany
• France
• United Kingdom
• Spain
• Others
• Middle East and Africa
• Saudi Arabia
• UAE
• Israel
• Others
• Asia Pacific
• China
• Japan
• India
• South Korea
• Indonesia
• Taiwan
• Others

TABLE OF CONTENTS

1. INTRODUCTION

• 1.1. Market Overview
• 1.2. Market Definition
• 1.3. Scope of the Study
• 1.4. Market Segmentation
• 1.5. Currency
• 1.6. Assumptions
• 1.7. Base, and Forecast Years Timeline

2. RESEARCH METHODOLOGY

• 2.1. Research Data
• 2.2. Research Process

3. EXECUTIVE SUMMARY

• 3.1. Research Highlights

4. MARKET DYNAMICS

• 4.1. Market Drivers
• 4.2. Market Restraints
• 4.3. Porter's Five Force Analysis
  • 4.3.1. Bargaining Power of Suppliers
  • 4.3.2. Bargaining Power of Buyers
  • 4.3.3. Threat of New Entrants
  • 4.3.4. Threat of Substitutes
  • 4.3.5. Competitive Rivalry in the Industry
• 4.4. Industry Value Chain Analysis

5. SEMICONDUCTOR POLISHING PADS MARKET BY TYPE

• 5.1. Introduction
• 5.2. Hard CMP Pads
• 5.3. Soft CMP Pads

6. SEMICONDUCTOR POLISHING PADS MARKET BY APPLICATION

• 6.1. Introduction
• 6.2. 300mm Wafer
• 6.3. 200mm Wafer
• 6.4. Others

7. SEMICONDUCTOR POLISHING PADS MARKET BY GEOGRAPHY

• 7.1. Introduction
• 7.2. North America
  • 7.2.1. USA
  • 7.2.2. Canada
  • 7.2.3. Mexico
• 7.3. South America
  • 7.3.1. Brazil
  • 7.3.2. Argentina
  • 7.3.3. Others
• 7.4. Europe
  • 7.4.1. Germany
  • 7.4.2. France
  • 7.4.3. United Kingdom
  • 7.4.4. Spain
  • 7.4.5. Others
• 7.5. Middle East And Africa
  • 7.5.1. Saudi Arabia
  • 7.5.2. UAE
  • 7.5.3. Israel
  • 7.5.4. Others
• 7.6. Asia Pacific
  • 7.6.1. China
  • 7.6.2. Japan
  • 7.6.3. India
  • 7.6.4. South Korea
  • 7.6.5. Indonesia
  • 7.6.6. Taiwan
  • 7.6.7. Others

8. COMPETITIVE ENVIRONMENT AND ANALYSIS

• 8.1. Major Players and Strategy Analysis
• 8.2. Emerging Players and Market Lucrativeness
• 8.3. Mergers, Acquisitions, Agreements, and Collaborations
• 8.4. Vendor Competitiveness Matrix

9. COMPANY PROFILES

• 9.1. DuPont
• 9.2. Logitech LTD
• 9.3. FOJIBO
• 9.4. Pureon
• 9.5. 3M
• 9.6. FNS POWER TECHNOLOGY INC.
• 9.7. Kemet International Limited
• 9.8. SKC Inc.