引線鍵結材料的全球市場2024

引線鍵合材料市場正在經歷顯著成長，預計到 2030 年將達到約 20 億美元，複合年增長率約為 6%，而 2022 年為 12 億美元。半導體技術的不斷進步、消費性電子產品使用的增加以及電子產品小型化的持續趨勢都促進了對引線鍵合材料的需求。

本報告提供引線鍵結材料詳細評估，並深入探討以下幾點:

產品概要

主要的引線接合法所使用的主要材料定義

• 貴金屬
• 非貴金屬等

引線鍵結材料的全球市場概要

引線鍵結材料的現在(2022年)與預測(2030年)的全球市場相關洞察。包括對影響市場成長和材料選擇的主要趨勢和驅動因素的分析。

各材料類型的全球市場市場區隔

所使用的主要各材料的全球市場市場區隔- 貴金屬，非貴金屬

材料選擇的關鍵選擇標準或性能參數，包括客戶對耐熱性、黏合精度、互連電阻等參數的回饋

競爭概要:

主要的競爭企業的簡介和LT Metals, Nippon Micrometal, TATSUTA Electric Wire & Cable, Cirexx International, California Fine Wire等的主要企業的競爭形勢的分析。

專利概要:

過去4～5年主要的專利轉讓處的主要專利系列分析。還有專利的研究焦點，調查對象材料，相關應用相關洞察也包含。

市場展望

在廣泛的二次和初步研究驗證的支持下，本報告還提供了對市場前景及其影響因素的權威看法。

目錄

第1章 簡介

• 報告概要
• 產品焦點
• 調查手法

第2章 流程概要

• 薄膜成型
• 光刻
• 蝕刻
• 摻雜
• CMP
• 切割
• 引線接合法
• 包裝

第3章 價值鏈概要

第4章 市場概要

第5章 詳細市場評估

• 引線接合法

第5章 專利概要

第6章 市場展望

第7章 市場展望附錄

The Wire bonding materials market is poised for remarkable growth, projected to reach approximately USD 2 billion by 2030, with a compelling CAGR of approximately 6% from a value of USD 1.2 billion in 2022. The continuous progress of semiconductor technology, the increase in consumer electronics usage, and the ongoing trend of electronics miniaturization are all contributing to the demand for wire bonding materials.

This report provides a deep-dive into the following points in this detailed assessment of wire bonding materials:

Product Overview

Defining the key materials used for major wire bonding:

• Precious
• Non-Precious, etc.

Global Wire Bonding Materials Market Overview

Insight on current (2022) and forecasted (2030) global market for Wire Bonding Materials including an analysis of the key trends and drivers impacting market growth and choice of materials.

Global market segmentation by material type

Global market segmentation by key materials used – Precious, Non-Precious metals

Key Selection criteria or Performance Parameters for material selection including the voice of the customer on parameters such as Heat Resistance, Bond Placement Accuracy, Interconnect Resistance, etc.

Competition overview:

Key competitor profiles and analyzing the competitor landscape of major companies including LT Metals, Nippon Micrometal, TATSUTA Electric Wire & Cable, Cirexx International, California Fine Wire, etc.

Patent overview:

Analyzing key patent families by major assignees in the last 4-5 years. The report also includes insights on the research focus of the patents, materials under consideration and the associated applications.

Market Outlook

Backed by extensive secondary research and validation through primary research, this report also presents a reliable view of the market outlook and factors influencing the same.

Table of Contents

1. Introduction

• 1.1 Report Overview
• 1.2 Product Focus
• 1.3 Methodology

2. Process Overview

• 2.1 Thin Film Molding
• 2.2 Photolithography
• 2.3 Etching
• 2.4 Doping
• 2.5 CMP
• 2.6 Dicing
• 2.7 Wire Bonding
• 2.8 Packaging

3. Value Chain Overview

4. Market Overview

5. Detailed Market Assessment

• 5.1 Wire Bonding

5. Patent Overview

6. Market Outlook

7. Annexure

List of Tables

• Table 4.1: Global Semiconductor Materials Market - By Material Type
• Table 4.2: Global Semiconductor Materials Market - Key Competitors
• Table 5.1.1: Global Wire Bonding Materials Market - By Material Type
• Table 5.1.2: Manufacturers v/s Component and Material Used - Wire Bonding
• Table 6.1: Patent Publications by Geography - Wire Bonding
• Table 6.2: Patent Listing - Wire Bonding

List of Figures

• Chart 4.1: Global Semiconductor Materials Market
• Chart 4.2: Global Semiconductor Materials Market - By Material Type
• Chart 4.3: Global Semiconductor Materials Market - By Component
• Chart 5.1.1: Global Wire Bonding Materials Market
• Chart 5.1.2: Global Wire Bonding Materials Market, By Material
• Chart 6.1: Patent Publication Trend - Wire Bonding