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到 2030 年球焊機市場預測：按驅動、電線類型、組件、用途、最終用戶和地區進行的全球分析
市場調查報告書
商品編碼
1340005

到 2030 年球焊機市場預測：按驅動、電線類型、組件、用途、最終用戶和地區進行的全球分析

Ball Bonder Machine Market Forecasts to 2030 - Global Analysis By Actuation, Wire Type, Component, Application, End User and By Geography
出版日期: | 出版商: Stratistics Market Research Consulting | 英文 175+ Pages | 商品交期: 2-3個工作天內

價格

根據Stratistics MRC的數據，2023年全球球焊機市場規模為12.513億美元，預計年複合成長率為6.04%，到2030年達到18.864億美元。

IC（積體電路）和任何半導體裝置之間的連接都可以通過球焊機實現。連接由細線製成，通常由銅、鋁、金或銀結構。球焊是一種結合壓力、熱量和超音波能量來建立這種連接的技術。

市場動態：

促進因素：

  • 新電氣設備的開發和半導體產業的擴張。
  • 在預測期內，市場預計將受益於新電子設備的推出，例如改進的功能和新標準的智慧手機。此外，隨著消費者對電子產品的需求增加以及3D晶片封裝的使用增加，晶片需求也將增加。半導體是結構各種電子設備的重要零件，包括電腦、行動電話、汽車電子和工業機械。隨著半導體需求的不斷增加，對球焊機的需求也在增加。

抑制因素：

  • 技術創新和成本壓力。
  • 球焊機製造商可能會因技術改進而面臨困難。如果新技術取代引線鍵合或提供更有效的替代方案，對球焊機的需求可能會受到影響。然而，球焊機製造商之間的激烈競爭可能會帶來價格壓力。尤其是在價格敏感的行業，製造商可能很難在提供有競爭力的價格的同時保持盈利能力。

機會：

  • 對先進封裝的需求。
  • 覆晶、晶圓級封裝、3D封裝等創新封裝技術在半導體行業日益流行。這些封裝技術具有提高電氣性能、改進熱控制和縮小外形尺寸等優點。球焊機對於這些尖端封裝技術中引線鍵合應用的擴展至關重要，並為其提供支持。

威脅

  • 技能和勞動力挑戰。
  • 球焊機的操作和維護需要合格的工程師和技術人員。可能沒有足夠的合格人員來操作和維護此類機械。對於生產商和最終用戶來說，球焊機的引進和有效使用可能會因人才短缺而受到阻礙。

新冠肺炎 (COVID-19) 影響：

  • 疫情改變了消費者的需求模式，人們對生活必需品的需求增加，對奢侈品的需求減少。消費電子產品是半導體設備的大消費者，是受這一轉型影響的行業之一。由於疫情導致消費電子產品需求下降，球焊機的需求可能間接受到影響。
  • 自動化領域預計將在預測期內成為最大的領域
  • 由於半導體封裝中新技術的不斷使用，自動化領域將在預測期內佔據大部分市場。自動執行器使用外部電源來產生打開閥門所需的力。自動執行器使用液壓、氣動或電力來操作閥門。
  • 預計半導體和電子行業在預測期內將經歷最高的年複合成長率。
  • 預計半導體和電子行業在預測期內將出現良好成長。半導體是電子設備的重要結構要素，它推動了許多行業的進步，包括清潔能源、交通、電腦、醫療保健和軍事系統。此外，隨著電子設備變得更小、更快、更可靠，半導體技術也在不斷進步。

佔比最大的地區：

由於智慧手機和其他小工具的尺寸更小、使用金屬蓋以及更大的顯示螢幕，設計複雜性不斷增加，預計亞太地區將在預測期內佔據最大比例。此外，半導體封裝行業研發活動的活性化和最尖端科技的採用預計將支持該地區的市場擴張。

複合年複合成長率最高的地區：

由於越來越多的 IDM 供應商使用銲線機設備進行先進晶片生產，預計亞太地區在預測期內的年複合成長率最高。此外，生產能力的提高和包裝方法的技術進步也促進了該地區的成長。

免費客製化服務：

訂閱此報告的客戶將收到以下免費客製化選項之一：

  • 公司簡介
    • 其他市場參與者的綜合分析（最多 3 家公司）
    • 主要企業SWOT分析（最多3家企業）
  • 區域分割
    • 根據客戶意願對主要國家的市場估計、預測和年複合成長率（注：基於可行性檢查）
  • 競爭標杆管理
    • 根據產品系列、地域分佈和戰略聯盟對主要企業進行基準測試

目錄

第1章 執行摘要

第2章 前言

  • 概述
  • 利益相關者
  • 調查範圍
  • 調查方法
    • 資料挖掘
    • 資料分析
    • 資料檢驗
    • 研究途徑
  • 調查來源
    • 主要調查來源
    • 二次調查來源
    • 假設

第3章 市場趨勢分析

  • 促進因素
  • 抑制因素
  • 機會
  • 威脅
  • 用途分析
  • 最終用戶分析
  • 新興市場
  • 新型冠狀病毒感染疾病（COVID-19）的影響

第4章 波特五力分析

  • 供應商的議價能力
  • 買方議價能力
  • 替代品的威脅
  • 新進入者的威脅
  • 競爭公司之間的敵對關係

第5章 全球焊球機市場：按營運分類

  • 自動化
    • 全自動球焊機
    • 半自動球焊機
  • 手動的
  • 其他操作

第6章 全球球焊機市場：按線材類型

  • 銀
  • 銅
  • 錢
  • 其他電線類型

第7章 全球球焊機市場：按組成部分

  • 工件固定架
  • 夾鉗
  • 感應器
  • 加熱裝置
  • 其他組件

第8章 全球球焊機市場：按用途

  • 資訊技術和通訊
  • 半導體和電子產品
  • 包裝
  • 其他用途

第9章 全球球焊機市場：按最終用戶分類

  • 醫療保健
  • 航太和國防
  • 車
  • 其他最終用戶

第10章 全球球焊機市場：按地區

  • 北美
    • 美國
    • 加拿大
    • 墨西哥
  • 歐洲
    • 德國
    • 英國
    • 義大利
    • 法國
    • 西班牙
    • 其他歐洲國家
  • 亞太地區
    • 日本
    • 中國
    • 印度
    • 澳大利亞
    • 紐西蘭
    • 韓國
    • 其他亞太地區
  • 南美洲
    • 阿根廷
    • 巴西
    • 智利
    • 南美洲其他地區
  • 中東和非洲
    • 沙烏地阿拉伯
    • 阿拉伯聯合大公國
    • 卡達
    • 南非
    • 其他中東和非洲

第11章進展

  • 契約、夥伴關係、協作和合資企業
  • 收購和合併
  • 新產品發布
  • 業務擴展
  • 其他關鍵策略

第12章公司簡介

  • Anza Technology
  • ASM Pacific Technology
  • F&K
  • FandK
  • Hesse
  • Hybond
  • KAIJO
  • Kulicke and Soffa（KandS）
  • Mech-El Industries
  • Micro Point Pro（MPP）
  • Palomar
  • Planar
  • Questar Products
  • Shinkawa
  • TPT
  • Ultrasonic Engineering
  • West-Bond
Product Code: SMRC23712

According to Stratistics MRC, the Global Ball Bonder Machine Market is accounted for $1,251.3 million in 2023 and is expected to reach $1,886.4 million by 2030 growing at a CAGR of 6.04% during the forecast period. Connections between ICs (Integrated Circuits) or any semiconductor device are made accessible by a ball bonder machine. The connection is created with a thin wire, typically consisting of copper, aluminum, gold, or silver. Ball bonding is a technique that establishes this link using a combination of pressure, heat, and ultrasonic energy.

Market Dynamics:

Driver:

  • New electrical device development and expanding industry for semiconductors.
  • The market is anticipated to gain from the introduction of new electronic devices during the course of the forecast period, such as smartphones with improved functionality and novel standards. Additionally, as consumer demand for gadgets rises and 3D chip packaging usage rises, chip demand also rises. Semiconductors are essential parts that comprise a wide range of electronic devices, including computers, cell phones, car electronics, and industrial machinery. Ball bonder machines are becoming more necessary as the manufacture of semiconductors rises along with the demand for these devices.

Restraint:

  • Technological innovations and cost pressure.
  • Manufacturers of ball bonding machines may face difficulties as a result of technological improvements. Ball bonder machine demand may be impacted if a new technology replaces wire bonding or provides a more effective substitute. However, price pressures could result from the intense rivalry among ball bonder machine makers. Particularly in price-sensitive sectors, manufacturers may struggle to sustain profitability while providing competitive prices.

Opportunity:

  • Advanced packaging demand.
  • In the semiconductor industry, innovative packaging techniques, including flip-chip, wafer-level packaging, and 3D packaging, are becoming more popular. These packaging methods offer benefits such as enhanced electrical performance, better thermal control, and form factor reduction. Ball bonder machines are essential for wire bonding applications in these cutting-edge packaging technologies, assisting in their expansion.

Threat:

  • Challenges in skills and workforce.
  • Ball bonder machine operation and maintenance demand qualified engineers and technicians. It's possible that there might not be enough qualified personnel available for the operation and upkeep of these machines. Ball bonder machine uptake and effective use may be hampered by this shortage for producers and end users.

COVID-19 Impact:

  • Consumer demand patterns changed as a result of the epidemic, with a greater emphasis on necessities and a decline in the demand for luxury. Consumer electronics, a big consumer of semiconductor devices, was among the businesses affected by this transition. Ball bonder machine demand may have been indirectly impacted by the pandemic's lower demand for consumer electronics.
  • The automated segment is expected to be the largest during the forecast period
  • Due to the ongoing use of new technologies in semiconductor packaging, the automated segment held the majority of the market over the forecast period. Automated actuators produce the force necessary to open valves using an external power source. Automatic actuators employ hydraulic, pneumatic, or electrical power to operate valves.
  • The semiconductor & electronics segment is expected to have the highest CAGR during the forecast period
  • Semiconductor & Electronics segment is estimated to witness lucrative growth over the forecast period. A crucial component of electronic devices, semiconductors enable advances in a number of industries, including clean energy, transportation, computers, healthcare, and military systems. In addition, as semiconductor technology has improved as electronic devices have become smaller, faster, and more dependable.

Region with largest share:

Due to increased design complexity, which has led to smaller versions, the use of metallic covers, and larger displays in smartphones and other gadgets, the Asia-Pacific area is anticipated to hold the largest proportion over the projected time. Additionally, growing R&D activities and the adoption of cutting-edge technologies by the semiconductor packaging industry are anticipated to fuel the market's expansion in the region.

Region with highest CAGR:

Asia Pacific is predicted to experience the highest CAGR over the projected period due to an expansion in the number of IDM suppliers using wire bonder equipment for advanced chip production. Additionally, the expansion of production capacity and ongoing technological advancements in packaging methods are contributing to the region's growth.

Key players in the market:

Some of the key players in Ball Bonder Machine market include: Anza Technology, ASM Pacific Technology, F&K, FandK, Hesse, Hybond, KAIJO, Kulicke and Soffa (KandS), Mech-El Industries, Micro Point Pro(MPP), Palomar, Planar, Questar Products, Shinkawa, TPT, Ultrasonic Engineering and West-Bond.

Key Developments:

In February 2022, ASMPT Completes Acquisition of Automation Engineering Inc (AEi). The acquisition provides ASMPT not only a significant presence in the automotive camera assembly and test solutions space.

Actuations Covered:

  • Automated
  • Manual
  • Other Actuations

Wire Types Covered:

  • Silver
  • Copper
  • Gold
  • Other Wire Types

Components Covered:

  • Workholders
  • Clamps
  • Transducers
  • Heating Units
  • Other Components

Applications Covered:

  • IT & Telecommunication
  • Semiconductor & Electronics
  • Packaging
  • Other Applications

End Users Covered:

  • Medical
  • Aerospace & Defense
  • Automotive
  • Other End Users

Regions Covered:

  • North America
    • US
    • Canada
    • Mexico
  • Europe
    • Germany
    • UK
    • Italy
    • France
    • Spain
    • Rest of Europe
  • Asia Pacific
    • Japan
    • China
    • India
    • Australia
    • New Zealand
    • South Korea
    • Rest of Asia Pacific
  • South America
    • Argentina
    • Brazil
    • Chile
    • Rest of South America
  • Middle East & Africa
    • Saudi Arabia
    • UAE
    • Qatar
    • South Africa
    • Rest of Middle East & Africa

What our report offers:

  • Market share assessments for the regional and country-level segments
  • Strategic recommendations for the new entrants
  • Covers Market data for the years 2021, 2022, 2023, 2026, and 2030
  • Market Trends (Drivers, Constraints, Opportunities, Threats, Challenges, Investment Opportunities, and recommendations)
  • Strategic recommendations in key business segments based on the market estimations
  • Competitive landscaping mapping the key common trends
  • Company profiling with detailed strategies, financials, and recent developments
  • Supply chain trends mapping the latest technological advancements

Free Customization Offerings:

All the customers of this report will be entitled to receive one of the following free customization options::

  • Company Profiling
    • Comprehensive profiling of additional market players (up to 3)
    • SWOT Analysis of key players (up to 3)
  • Regional Segmentation
    • Market estimations, Forecasts and CAGR of any prominent country as per the client's interest (Note: Depends on feasibility check)
  • Competitive Benchmarking
    • Benchmarking of key players based on product portfolio, geographical presence, and strategic alliances

Table of Contents

1 Executive Summary

2 Preface

  • 2.1 Abstract
  • 2.2 Stake Holders
  • 2.3 Research Scope
  • 2.4 Research Methodology
    • 2.4.1 Data Mining
    • 2.4.2 Data Analysis
    • 2.4.3 Data Validation
    • 2.4.4 Research Approach
  • 2.5 Research Sources
    • 2.5.1 Primary Research Sources
    • 2.5.2 Secondary Research Sources
    • 2.5.3 Assumptions

3 Market Trend Analysis

  • 3.1 Introduction
  • 3.2 Drivers
  • 3.3 Restraints
  • 3.4 Opportunities
  • 3.5 Threats
  • 3.6 Application Analysis
  • 3.7 End User Analysis
  • 3.8 Emerging Markets
  • 3.9 Impact of Covid-19

4 Porters Five Force Analysis

  • 4.1 Bargaining power of suppliers
  • 4.2 Bargaining power of buyers
  • 4.3 Threat of substitutes
  • 4.4 Threat of new entrants
  • 4.5 Competitive rivalry

5 Global Ball Bonder Machine Market, By Actuation

  • 5.1 Introduction
  • 5.2 Automated
    • 5.2.1 Fully Automatic Ball Bonder
    • 5.2.2 Semi-Automatic Ball Bonder
  • 5.3 Manual
  • 5.4 Other Actuations

6 Global Ball Bonder Machine Market, By Wire Type

  • 6.1 Introduction
  • 6.2 Silver
  • 6.3 Copper
  • 6.4 Gold
  • 6.5 Other Wire Types

7 Global Ball Bonder Machine Market, By Component

  • 7.1 Introduction
  • 7.2 Workholders
  • 7.3 Clamps
  • 7.4 Transducers
  • 7.5 Heating Units
  • 7.6 Other Components

8 Global Ball Bonder Machine Market, By Application

  • 8.1 Introduction
  • 8.2 IT & Telecommunication
  • 8.3 Semiconductor & Electronics
  • 8.4 Packaging
  • 8.5 Other Applications

9 Global Ball Bonder Machine Market, By End User

  • 9.1 Introduction
  • 9.2 Medical
  • 9.3 Aerospace & Defense
  • 9.4 Automotive
  • 9.5 Other End Users

10 Global Ball Bonder Machine Market, By Geography

  • 10.1 Introduction
  • 10.2 North America
    • 10.2.1 US
    • 10.2.2 Canada
    • 10.2.3 Mexico
  • 10.3 Europe
    • 10.3.1 Germany
    • 10.3.2 UK
    • 10.3.3 Italy
    • 10.3.4 France
    • 10.3.5 Spain
    • 10.3.6 Rest of Europe
  • 10.4 Asia Pacific
    • 10.4.1 Japan
    • 10.4.2 China
    • 10.4.3 India
    • 10.4.4 Australia
    • 10.4.5 New Zealand
    • 10.4.6 South Korea
    • 10.4.7 Rest of Asia Pacific
  • 10.5 South America
    • 10.5.1 Argentina
    • 10.5.2 Brazil
    • 10.5.3 Chile
    • 10.5.4 Rest of South America
  • 10.6 Middle East & Africa
    • 10.6.1 Saudi Arabia
    • 10.6.2 UAE
    • 10.6.3 Qatar
    • 10.6.4 South Africa
    • 10.6.5 Rest of Middle East & Africa

11 Key Developments

  • 11.1 Agreements, Partnerships, Collaborations and Joint Ventures
  • 11.2 Acquisitions & Mergers
  • 11.3 New Product Launch
  • 11.4 Expansions
  • 11.5 Other Key Strategies

12 Company Profiling

  • 12.1 Anza Technology
  • 12.2 ASM Pacific Technology
  • 12.3 F&K
  • 12.4 FandK
  • 12.5 Hesse
  • 12.6 Hybond
  • 12.7 KAIJO
  • 12.8 Kulicke and Soffa (KandS)
  • 12.9 Mech-El Industries
  • 12.10 Micro Point Pro(MPP)
  • 12.11 Palomar
  • 12.12 Planar
  • 12.13 Questar Products
  • 12.14 Shinkawa
  • 12.15 TPT
  • 12.16 Ultrasonic Engineering
  • 12.17 West-Bond

List of Tables

  • Table 1 Global Ball Bonder Machine Market Outlook, By Region (2021-2030) ($MN)
  • Table 2 Global Ball Bonder Machine Market Outlook, By Actuation (2021-2030) ($MN)
  • Table 3 Global Ball Bonder Machine Market Outlook, By Automated (2021-2030) ($MN)
  • Table 4 Global Ball Bonder Machine Market Outlook, By Fully Automatic Ball Bonder (2021-2030) ($MN)
  • Table 5 Global Ball Bonder Machine Market Outlook, By Semi-Automatic Ball Bonder (2021-2030) ($MN)
  • Table 6 Global Ball Bonder Machine Market Outlook, By Manual (2021-2030) ($MN)
  • Table 7 Global Ball Bonder Machine Market Outlook, By Other Actuations (2021-2030) ($MN)
  • Table 8 Global Ball Bonder Machine Market Outlook, By Wire Type (2021-2030) ($MN)
  • Table 9 Global Ball Bonder Machine Market Outlook, By Silver (2021-2030) ($MN)
  • Table 10 Global Ball Bonder Machine Market Outlook, By Copper (2021-2030) ($MN)
  • Table 11 Global Ball Bonder Machine Market Outlook, By Gold (2021-2030) ($MN)
  • Table 12 Global Ball Bonder Machine Market Outlook, By Other Wire Types (2021-2030) ($MN)
  • Table 13 Global Ball Bonder Machine Market Outlook, By Component (2021-2030) ($MN)
  • Table 14 Global Ball Bonder Machine Market Outlook, By Workholders (2021-2030) ($MN)
  • Table 15 Global Ball Bonder Machine Market Outlook, By Clamps (2021-2030) ($MN)
  • Table 16 Global Ball Bonder Machine Market Outlook, By Transducers (2021-2030) ($MN)
  • Table 17 Global Ball Bonder Machine Market Outlook, By Heating Units (2021-2030) ($MN)
  • Table 18 Global Ball Bonder Machine Market Outlook, By Other Components (2021-2030) ($MN)
  • Table 19 Global Ball Bonder Machine Market Outlook, By Application (2021-2030) ($MN)
  • Table 20 Global Ball Bonder Machine Market Outlook, By IT & Telecommunication (2021-2030) ($MN)
  • Table 21 Global Ball Bonder Machine Market Outlook, By Semiconductor & Electronics (2021-2030) ($MN)
  • Table 22 Global Ball Bonder Machine Market Outlook, By Packaging (2021-2030) ($MN)
  • Table 23 Global Ball Bonder Machine Market Outlook, By Other Applications (2021-2030) ($MN)
  • Table 24 Global Ball Bonder Machine Market Outlook, By End User (2021-2030) ($MN)
  • Table 25 Global Ball Bonder Machine Market Outlook, By Medical (2021-2030) ($MN)
  • Table 26 Global Ball Bonder Machine Market Outlook, By Aerospace & Defense (2021-2030) ($MN)
  • Table 27 Global Ball Bonder Machine Market Outlook, By Automotive (2021-2030) ($MN)
  • Table 28 Global Ball Bonder Machine Market Outlook, By Other End Users (2021-2030) ($MN)

Note: Tables for North America, Europe, APAC, South America, and Middle East & Africa Regions are also represented in the same manner as above.