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商品編碼
1517445

全球鍵合線市場規模研究，依材料（金、銅、銀、鋁等）、應用（積體電路、電晶體、感測器等）及 2022-2032 年區域預測

Global Bonding Wires Market Size study, by Material (Gold, Copper, Silver, Aluminum, Others), by Application (Integrated Circuits, Transistors, Sensors, Others), and Regional Forecasts 2022-2032
出版日期: | 出版商: Bizwit Research & Consulting LLP | 英文 200 Pages | 商品交期: 2-3個工作天內

價格
簡介目錄

2023年全球鍵合線市場價值約為129.6億美元，預計在2024-2032年預測期內將以超過3.7%的健康成長率成長。鍵合線是半導體封裝中的關鍵元件，旨在在積體電路 (IC) 晶片與其外部引線或端子之間建立電氣連接。這些電線通常由金、鋁或銅組成，可確保半導體裝置內電訊號的可靠傳輸，在熱膨脹和收縮時維持裝置功能方面發揮關鍵作用。它們在微電子組裝中是不可或缺的，可確保電子設備和積體電路的性能和壽命。半導體產業的擴張是鍵合線市場的主要驅動力。隨著消費性電子、汽車、電信和工業領域等應用對半導體晶片的需求不斷增加，對鍵合線的需求也日益增加。智慧型手機、物聯網設備、電動車和智慧家電的激增進一步推動了對先進半導體封裝的需求，從而推動了鍵合線市場的發展。

此外，半導體封裝技術的持續創新正在促進先進鍵合線解決方案的發展。製造商專注於製造更薄、更強、更可靠的鍵合線，以滿足半導體裝置不斷變化的需求。銅鍵合線、細間距鍵合和先進引線鍵合技術等創新正在提高電子設備的性能、效率和可靠性，從而推動市場成長。然而，半導體裝置的小型化給鍵合線製造商帶來了重大的技術挑戰。對更細線徑和更緊密節距的需求需要高精度和先進的製造程序，從而導致生產成本增加並可能降低良率。儘管存在這些挑戰，電子設備小型化的趨勢為鍵合線製造商提供了重要的機會來開發超細線，以在更小的半導體封裝內容納更密集的互連。

全球鍵合線市場研究涵蓋的關鍵區域包括北美、歐洲、亞太地區、拉丁美洲以及中東和非洲。由於亞太地區作為電子製造中心的角色以及對電子設備的需求不斷成長，預計到 2023 年，亞太地區將主導鍵合線市場。中國、日本、韓國和台灣等國家的快速工業化和城市化進一步促進了鍵合線產業的成長。此外，預計北美地區的成長最快。該地區受益於對技術和創新的大量投資、強大的供應鏈基礎設施以及促進工業成長的有利政府政策。

目錄

第 1 章：全球鍵合線市場執行摘要

  • 全球鍵合線市場規模及預測（2022-2032）
  • 區域概要
  • 分部摘要
    • 按材質
    • 按申請
  • 主要趨勢
  • 經濟衰退的影響
  • 分析師推薦與結論

第 2 章：全球鍵合線市場定義與研究假設

  • 研究目的
  • 市場定義
  • 研究假設
    • 包容與排除
    • 限制
    • 供給側分析
      • 可用性
      • 基礎設施
      • 監管環境
      • 市場競爭
      • 經濟可行性（消費者的角度）
    • 需求面分析
      • 監理框架
      • 技術進步
      • 環境考慮
      • 消費者意識和接受度
  • 估算方法
  • 研究涵蓋的年份
  • 貨幣兌換率

第 3 章：全球鍵合線市場動態

  • 市場促進因素
    • 對半導體晶片的需求不斷成長
    • 半導體封裝技術的創新
  • 市場挑戰
    • 小型化的技術挑戰
    • 生產成本增加
  • 市場機會
    • 超細接合線的開發
    • 電子工業的發展

第 4 章：全球鍵合線市場產業分析

  • 波特的五力模型
    • 供應商的議價能力
    • 買家的議價能力
    • 新進入者的威脅
    • 替代品的威脅
    • 競爭競爭
    • 波特五力模型的未來方法
    • 波特的 5 力影響分析
  • PESTEL分析
    • 政治的
    • 經濟
    • 社會的
    • 技術性
    • 環境的
    • 合法的
  • 頂級投資機會
  • 最佳制勝策略
  • 顛覆性趨勢
  • 產業專家視角
  • 分析師推薦與結論

第 5 章：2022-2032 年全球鍵結線市場規模及材料預測

  • 細分儀表板
  • 全球鍵合線市場：2022 年和 2032 年材料收入趨勢分析
    • 金子
    • 銅
    • 銀
    • 鋁
    • 其他

第 6 章：2022-2032 年全球鍵結線市場規模及應用預測

  • 細分儀表板
  • 全球鍵合線市場：2022 年和 2032 年應用收入趨勢分析
    • 積體電路
    • 電晶體
    • 感應器
    • 其他

第 7 章：2022-2032 年全球鍵結線市場規模及按地區預測

  • 北美鍵合線市場
    • 美國鍵合線市場
      • 2022-2032 年材料細分尺寸與預測
      • 2022-2032 年應用細分規模與預測
    • 加拿大鍵合線市場
  • 歐洲鍵合線市場
    • 英國鍵合線市場
    • 德國鍵合線市場
    • 法國鍵合線市場
    • 西班牙鍵合線市場
    • 義大利鍵合線市場
    • 歐洲其他地區鍵合線市場
  • 亞太鍵合線市場
    • 中國鍵合線市場
    • 印度鍵合線市場
    • 日本鍵合線市場
    • 澳洲鍵合線市場
    • 韓國鍵合線市場
    • 亞太地區其他鍵合線市場
  • 拉丁美洲鍵合線市場
    • 巴西鍵合線市場
    • 墨西哥鍵合線市場
    • 拉丁美洲其他地區鍵合線市場
  • 中東和非洲鍵合線市場
    • 沙烏地阿拉伯鍵合線市場
    • 南非鍵合線市場
    • 中東和非洲其他地區鍵合線市場

第 8 章：競爭情報

  • 重點企業SWOT分析
  • 頂級市場策略
  • 公司簡介
    • Tanaka Holdings Co., Ltd.
      • 關鍵訊息
      • 概述
      • 財務（視數據可用性而定）
      • 產品概要
      • 市場策略
    • Heraeus Holding GmbH
    • TATSUTA Electric Wire & Cable Co., Ltd.
    • Sumitomo Metal Mining Co., Ltd.
    • MK Electron Co., Ltd.
    • Yantai Zhaojin Kanfort Precision Machinery Co., Ltd.
    • Shinkawa Electric Co., Ltd.
    • AMETEK Electronic Components and Packaging
    • TANAKA Denshi Kogyo KK
    • NIPPON STEEL Chemical & Material Co., Ltd.
    • Palomar Technologies
    • California Fine Wire Company
    • Shinkawa Ltd.
    • Custom Chip Connectors, LLC
    • Kulicke & Soffa Industries, Inc.

第 9 章：研究過程

  • 研究過程
    • 資料探勘
    • 分析
    • 市場預測
    • 驗證
    • 出版
  • 研究屬性
簡介目錄

The Global Bonding Wires Market is valued at approximately USD 12.96 billion in 2023 and is anticipated to grow with a healthy growth rate of more than 3.7% over the forecast period 2024-2032. Bonding wires are crucial elements in semiconductor packaging, designed to establish electrical connections between the integrated circuit (IC) chip and its external leads or terminals. Typically composed of gold, aluminum, or copper, these wires ensure the reliable transmission of electrical signals within semiconductor devices, playing a critical role in maintaining device functionality amidst thermal expansions and contractions. They are indispensable in microelectronics assembly, ensuring the performance and longevity of electronic devices and integrated circuits. The semiconductor industry's expansion is the primary driver of the bonding wires market. With the escalating demand for semiconductor chips across applications such as consumer electronics, automotive, telecommunications, and industrial sectors, the necessity for bonding wires intensifies. The surge in smartphones, IoT devices, electric vehicles, and smart appliances further propels the demand for advanced semiconductor packages, thus boosting the bonding wires market.

Moreover, Continuous innovations in semiconductor packaging technologies are fostering the development of advanced bonding wire solutions. Manufacturers are focusing on creating thinner, stronger, and more reliable bonding wires to meet the evolving needs of semiconductor devices. Innovations such as copper bonding wires, fine pitch bonding, and advanced wire bonding techniques are enhancing the performance, efficiency, and reliability of electronic devices, thereby driving market growth. However, the miniaturization of semiconductor devices presents significant technological challenges for bonding wire manufacturers. The demand for finer wire diameters and tighter pitch spacing requires high precision and advanced manufacturing processes, leading to increased production costs and potentially reduced yield rates. Despite these challenges, the trend towards the miniaturization of electronic devices offers significant opportunities for bonding wire manufacturers to develop ultra-fine wires that accommodate denser interconnects within smaller semiconductor packages.

Key regions considered in the Global Bonding Wires Market study include North America, Europe, Asia Pacific, Latin America, and the Middle East & Africa. The Asia-Pacific region is expected to dominate the bonding wires market, in year 2023, driven by its role as a hub for electronics manufacturing and the rising demand for electronic devices. Rapid industrialization and urbanization in countries such as China, Japan, South Korea, and Taiwan further contribute to the growth of the bonding wires industry. Moreover, North America is projected to have fastest growth. The region benefits from substantial investments in technology and innovation, a strong supply chain infrastructure, and favorable government policies promoting industrial growth.

Major market player included in this report are:

  • Tanaka Holdings Co., Ltd.
  • Heraeus Holding GmbH
  • TATSUTA Electric Wire & Cable Co., Ltd.
  • Sumitomo Metal Mining Co., Ltd.
  • MK Electron Co., Ltd.
  • Yantai Zhaojin Kanfort Precision Machinery Co., Ltd.
  • Shinkawa Electric Co., Ltd.
  • AMETEK Electronic Components and Packaging
  • TANAKA Denshi Kogyo K.K.
  • NIPPON STEEL Chemical & Material Co., Ltd.
  • Palomar Technologies
  • California Fine Wire Company
  • Shinkawa Ltd.
  • Custom Chip Connectors, LLC
  • Kulicke & Soffa Industries, Inc.

The detailed segments and sub-segment of the market are explained below:

By Material:

  • Gold
  • Copper
  • Silver
  • Aluminum
  • Others

By Application:

  • Integrated Circuits
  • Transistors
  • Sensors
  • Others

By Region:

  • North America
  • U.S.
  • Canada
  • Europe
  • Germany
  • UK
  • France
  • Spain
  • Italy
  • Rest of Europe
  • Asia-Pacific
  • China
  • India
  • Japan
  • South Korea
  • Australia
  • Rest of Asia-Pacific
  • Latin America
  • Brazil
  • Mexico
  • Rest of Latin America
  • Middle East and Africa
  • Saudi Arabia
  • South Africa
  • Rest of LAMEA

Years considered for the study are as follows:

  • Historical year - 2022
  • Base year - 2023
  • Forecast period - 2024 to 2032

Key Takeaways:

  • Market Estimates & Forecast for 10 years from 2022 to 2032.
  • Annualized revenues and regional level analysis for each market segment.
  • Detailed analysis of geographical landscape with Country level analysis of major regions.
  • Competitive landscape with information on major players in the market.
  • Analysis of key business strategies and recommendations on future market approach.
  • Analysis of competitive structure of the market.
  • Demand side and supply side analysis of the market.

Table of Contents

Chapter 1. Global Bonding Wires Market Executive Summary

  • 1.1. Global Bonding Wires Market Size & Forecast (2022-2032)
  • 1.2. Regional Summary
  • 1.3. Segmental Summary
    • 1.3.1. By Material
    • 1.3.2. By Application
  • 1.4. Key Trends
  • 1.5. Recession Impact
  • 1.6. Analyst Recommendation & Conclusion

Chapter 2. Global Bonding Wires Market Definition and Research Assumptions

  • 2.1. Research Objective
  • 2.2. Market Definition
  • 2.3. Research Assumptions
    • 2.3.1. Inclusion & Exclusion
    • 2.3.2. Limitations
    • 2.3.3. Supply Side Analysis
      • 2.3.3.1. Availability
      • 2.3.3.2. Infrastructure
      • 2.3.3.3. Regulatory Environment
      • 2.3.3.4. Market Competition
      • 2.3.3.5. Economic Viability (Consumer's Perspective)
    • 2.3.4. Demand Side Analysis
      • 2.3.4.1. Regulatory frameworks
      • 2.3.4.2. Technological Advancements
      • 2.3.4.3. Environmental Considerations
      • 2.3.4.4. Consumer Awareness & Acceptance
  • 2.4. Estimation Methodology
  • 2.5. Years Considered for the Study
  • 2.6. Currency Conversion Rates

Chapter 3. Global Bonding Wires Market Dynamics

  • 3.1. Market Drivers
    • 3.1.1. Rising Demand for Semiconductor Chips
    • 3.1.2. Innovations in Semiconductor Packaging Technologies
  • 3.2. Market Challenges
    • 3.2.1. Technological Challenges of Miniaturization
    • 3.2.2. Increased Production Costs
  • 3.3. Market Opportunities
    • 3.3.1. Development of Ultra-Fine Bonding Wires
    • 3.3.2. Growth of the Electronics Industry

Chapter 4. Global Bonding Wires Market Industry Analysis

  • 4.1. Porter's 5 Force Model
    • 4.1.1. Bargaining Power of Suppliers
    • 4.1.2. Bargaining Power of Buyers
    • 4.1.3. Threat of New Entrants
    • 4.1.4. Threat of Substitutes
    • 4.1.5. Competitive Rivalry
    • 4.1.6. Futuristic Approach to Porter's 5 Force Model
    • 4.1.7. Porter's 5 Force Impact Analysis
  • 4.2. PESTEL Analysis
    • 4.2.1. Political
    • 4.2.2. Economical
    • 4.2.3. Social
    • 4.2.4. Technological
    • 4.2.5. Environmental
    • 4.2.6. Legal
  • 4.3. Top investment opportunity
  • 4.4. Top winning strategies
  • 4.5. Disruptive Trends
  • 4.6. Industry Expert Perspective
  • 4.7. Analyst Recommendation & Conclusion

Chapter 5. Global Bonding Wires Market Size & Forecasts by Material 2022-2032

  • 5.1. Segment Dashboard
  • 5.2. Global Bonding Wires Market: Material Revenue Trend Analysis, 2022 & 2032 (USD Billion)
    • 5.2.1. Gold
    • 5.2.2. Copper
    • 5.2.3. Silver
    • 5.2.4. Aluminum
    • 5.2.5. Others

Chapter 6. Global Bonding Wires Market Size & Forecasts by Application 2022-2032

  • 6.1. Segment Dashboard
  • 6.2. Global Bonding Wires Market: Application Revenue Trend Analysis, 2022 & 2032 (USD Billion)
    • 6.2.1. Integrated Circuits
    • 6.2.2. Transistors
    • 6.2.3. Sensors
    • 6.2.4. Others

Chapter 7. Global Bonding Wires Market Size & Forecasts by Region 2022-2032

  • 7.1. North America Bonding Wires Market
    • 7.1.1. U.S. Bonding Wires Market
      • 7.1.1.1. Material breakdown size & forecasts, 2022-2032
      • 7.1.1.2. Application breakdown size & forecasts, 2022-2032
    • 7.1.2. Canada Bonding Wires Market
  • 7.2. Europe Bonding Wires Market
    • 7.2.1. U.K. Bonding Wires Market
    • 7.2.2. Germany Bonding Wires Market
    • 7.2.3. France Bonding Wires Market
    • 7.2.4. Spain Bonding Wires Market
    • 7.2.5. Italy Bonding Wires Market
    • 7.2.6. Rest of Europe Bonding Wires Market
  • 7.3. Asia-Pacific Bonding Wires Market
    • 7.3.1. China Bonding Wires Market
    • 7.3.2. India Bonding Wires Market
    • 7.3.3. Japan Bonding Wires Market
    • 7.3.4. Australia Bonding Wires Market
    • 7.3.5. South Korea Bonding Wires Market
    • 7.3.6. Rest of Asia Pacific Bonding Wires Market
  • 7.4. Latin America Bonding Wires Market
    • 7.4.1. Brazil Bonding Wires Market
    • 7.4.2. Mexico Bonding Wires Market
    • 7.4.3. Rest of Latin America Bonding Wires Market
  • 7.5. Middle East & Africa Bonding Wires Market
    • 7.5.1. Saudi Arabia Bonding Wires Market
    • 7.5.2. South Africa Bonding Wires Market
    • 7.5.3. Rest of Middle East & Africa Bonding Wires Market

Chapter 8. Competitive Intelligence

  • 8.1. Key Company SWOT Analysis
  • 8.2. Top Market Strategies
  • 8.3. Company Profiles
    • 8.3.1. Tanaka Holdings Co., Ltd.
      • 8.3.1.1. Key Information
      • 8.3.1.2. Overview
      • 8.3.1.3. Financial (Subject to Data Availability)
      • 8.3.1.4. Product Summary
      • 8.3.1.5. Market Strategies
    • 8.3.2. Heraeus Holding GmbH
    • 8.3.3. TATSUTA Electric Wire & Cable Co., Ltd.
    • 8.3.4. Sumitomo Metal Mining Co., Ltd.
    • 8.3.5. MK Electron Co., Ltd.
    • 8.3.6. Yantai Zhaojin Kanfort Precision Machinery Co., Ltd.
    • 8.3.7. Shinkawa Electric Co., Ltd.
    • 8.3.8. AMETEK Electronic Components and Packaging
    • 8.3.9. TANAKA Denshi Kogyo K.K.
    • 8.3.10. NIPPON STEEL Chemical & Material Co., Ltd.
    • 8.3.11. Palomar Technologies
    • 8.3.12. California Fine Wire Company
    • 8.3.13. Shinkawa Ltd.
    • 8.3.14. Custom Chip Connectors, LLC
    • 8.3.15. Kulicke & Soffa Industries, Inc.

Chapter 9. Research Process

  • 9.1. Research Process
    • 9.1.1. Data Mining
    • 9.1.2. Analysis
    • 9.1.3. Market Estimation
    • 9.1.4. Validation
    • 9.1.5. Publishing
  • 9.2. Research Attributes