高溫半導體裝置:市場機會
市場調查報告書
商品編碼
1691632

高溫半導體裝置:市場機會

Semiconductor Devices for High-Temperature Applications: Market Opportunities

出版日期: | 出版商: BCC Research | 英文 141 Pages | 訂單完成後即時交付

價格

全球高溫半導體元件市場規模預計將從2024年的118億美元增至2029年的185億美元,預測期內的年複合成長率為 9.4%。

預計矽市場規模將從2024年的84億美元成長到2029年的128億美元,預測期間的年複合成長率為 8.9%。 III-V 材料市場預計將從2024年的34億美元成長到2029年的57億美元,預測期內的年複合成長率為 10.6%。

本報告調查了全球高溫半導體裝置市場,並總結了市場概況、市場影響因素和市場機會分析、法律制度、新興技術和技術發展趨勢、市場規模趨勢和預測、各個細分市場和地區的詳細分析、競爭格局以及主要企業的概況。

目錄

第1章 執行摘要

  • 市場展望
  • 研究範圍
  • 市場摘要
  • 市場動態與成長要素
  • 新興技術
  • 細分分析
  • 區域見解和新興市場
  • 結論

第2章 市場概況

  • 當前市場狀況和未來預期
  • 宏觀經濟因素分析
  • 通貨膨脹和勞動力短缺的影響
  • 外匯波動
  • 地緣政治緊張局勢與貿易趨勢
  • 波特五力分析
  • 價值鏈分析
  • 監管狀態

第3章 市場動態

  • 關鍵要點
  • 市場促進因素
  • 超寬頻隙材料的出現
  • 高溫電子設備需求不斷增加
  • 對電動飛機和電動車的需求不斷增加
  • 市場限制
  • 設計、測試和製造半導體裝置的複雜性
  • 特殊材料成本上漲
  • 包裝限制和缺乏標準化測試
  • 市場機會
  • 加強政府參與與合作
  • 超高溫電子學的進展
  • 加強全球太空探勘

第4章 新興趨勢與技術

  • 概述
  • 新趨勢
  • 高溫碳化矽技術與製造的進展
  • 人們對超越矽的超高溫半導體材料的興趣日益濃厚
  • 新興技術
  • 封裝創新實現可靠的高溫半導體運行
  • 鐵電非揮發性記憶體(NVM)和溫度控管的創新
  • 專利分析
  • 地理版圖
  • 主要調查結果

第5章 市場區隔分析

  • 細分市場
  • 市場區隔:依材料
  • 關鍵要點
  • III-V族材料
  • 砷化鎵(GaAs)
  • 氮化鎵(GaN)
  • 碳化矽(SiC)
  • 其他
  • 依設備類型分類的市場
  • 關鍵要點
  • 微控制器和處理器
  • 功率半導體
  • 電源管理和控制
  • 其他
  • 市場區隔:依動作溫度
  • 關鍵要點
  • 126°C~250°C
  • 250°C以上
  • 市場區隔:依行業
  • 關鍵要點
  • 工業和測量設備
  • 車輛
  • 航太和國防
  • 能源和電力
  • 其他
  • 地理分佈
  • 市場區隔:依地區
  • 關鍵要點
  • 北美洲
  • 歐洲
  • 亞太地區
  • 其他地區

第6章 競爭訊息

  • 關鍵要點
  • 市場生態系分析
  • 主要企業分析
  • Infineon Technologies AG
  • NXP Semiconductors
  • TDK Corp.
  • 戰略分析

第7章 高溫半導體元件產業的永續性:ESG 視角

  • 關鍵要點
  • 高溫半導體元件市場的關鍵 ESG 議題
  • 高溫半導體裝置中的主要環境問題。
  • 高溫半導體裝置的社會責任
  • 高溫半導體裝置的管治
  • ESG績效分析
  • 環境績效
  • 社會績效
  • 管治績效
  • ESG在高溫半導體元件市場的現狀
  • BCC的結語

第8章 附錄

  • 調查方法
  • 簡稱
  • 公司簡介
  • ALLEGRO MICROSYSTEMS INC.
  • ANALOG DEVICES INC.
  • CISSOID
  • FUJITSU
  • GENERAL ELECTRIC CO.
  • HONEYWELL INTERNATIONAL INC.
  • INFINEON TECHNOLOGIES AG
  • LATTICE SEMICONDUCTOR
  • MITSUBISHI ELECTRIC CORP.
  • NXP SEMICONDUCTORS
  • QORVO INC.
  • RENESAS ELECTRONICS CORP.
  • RTX
  • TDK CORP.
  • TEXAS INSTRUMENTS INC.
  • TOSHIBA CORP.
  • WOLFSPEED INC.
Product Code: SMC114B

The global market for semiconductor devices for high-temperature applications is estimated to increase from $11.8 billion in 2024 to reach $18.5 billion by 2029, at a compound annual growth rate (CAGR) of 9.4% from 2024 through 2029.

The silicon market for semiconductor devices for high-temperature applications is estimated to increase from $8.4 billion in 2024 to reach $12.8 billion by 2029, at a CAGR of 8.9% from 2024 through 2029.

The III-V materials market for semiconductor devices for high-temperature applications is estimated to increase from $3.4 billion in 2024 to reach $5.7 billion by 2029, at a CAGR of 10.6% from 2024 through 2029.

Report Scope

This report provides an overview of the global semiconductor devices for high-temperature applications market and analyzes market trends. It provides the global revenue (in $ millions) for segments and regions, considering 2023 as the base year, with estimated market data for 2024 through 2029. The market is based on materials, device types, operating temperatures, industries and regions. Geographical segments covered are North America (U.S., Canada, Mexico), Europe (U.K., Germany, France, Italy, Rest of Europe), Asia-Pacific (China, Japan, South Korea, Rest of Asia-Pacific) and the Rest of the World (RoW), which includes South America, Middle East and Africa. The report also focuses on emerging technologies and vendor landscape. It concludes with profiles of the major players in the market.

Report Includes

  • 59 data tables and 54 additional tables
  • An analysis of the global market for semiconductor devices for high-temperature applications
  • Analyses of the global market trends, with data from 2023, estimates for 2024, forecasts for 2025 and 2026, and projections of compound annual growth rates (CAGRs) through 2029
  • Evaluation of the market potential for semiconductor devices for high- temperature applications, industry growth drivers, and forecasts for this market's segments and sub-segments
  • Estimates of the actual market size and revenue forecast for the global market for semiconductor devices for high-temperature applications, and a corresponding market share analysis by material type, device type, operating temperature, industry and region
  • Description of gallium nitride (GaN), silicon carbide (SiC) and gallium arsenide (GaAs); their products and applications
  • Discussion of the market dynamics and shifts, and the regulations, industry challenges, and macroeconomic factors affecting the demand for semiconductor devices for high-temperature applications
  • Discussion on the industry's ESG challenges and practices
  • Identification of the companies that are best positioned to meet this demand because of their proprietary technologies, strategic alliances or other advantages
  • Insights into the industry structure for semiconductor devices for high-temperature applications, and the competitive landscape
  • Company profiles of major players within the industry, including Infineon Technologies AG, NXP Semiconductors, TDK Corp., Wolfspeed Inc., and Allegro MicroSystems LLC.

Table of Contents

Chapter 1 Executive Summary

  • Market Outlook
  • Scope of Report
  • Market Summary
  • Market Dynamics and Growth Factors
  • Emerging Technologies
  • Segmental Analysis
  • Regional Insights and Emerging Markets
  • Conclusion

Chapter 2 Market Overview

  • Current Market Scenario and Future Expectations
  • Macro-Economic Factors Analysis
  • Impact of Rising Inflation and Labor Shortages
  • Currency Exchange Rate Fluctuations
  • Geopolitical Tension and Trade Dynamics
  • Porter's Five Force Analysis
  • Value Chain Analysis
  • Regulatory Landscape

Chapter 3 Market Dynamics

  • Key Takeaways
  • Market Drivers
  • Emergence of UWBG Materials
  • Growing Demand for High-Temperature Electronics
  • Growing Demand for Electric Aircraft and EVs
  • Market Restraints
  • Complexity in Design, Testing and Manufacturing for Semiconductor Devices
  • Higher Cost of Specialized Materials
  • Packaging Limitations and Absence of Standardized Testing
  • Market Opportunities
  • Growing Government Initiatives and Collaborative Efforts
  • Advancing Ultra-High-Temperature Electronics
  • Increasing Global Space Exploration

Chapter 4 Emerging Trends and Technologies

  • Overview
  • Emerging Trends
  • Advances in High-Temperature SiC Technologies and Manufacturing
  • Rising Focus on Ultra-High-Temperature Semiconductors Materials Beyond Silicon
  • Emerging Technologies
  • Packaging Innovations Enabling Reliable High-Temperature Semiconductor Operation
  • Ferroelectric Non-volatile Memory (NVM) and Thermal Management Innovations
  • Patent Analysis
  • Geographical Patterns
  • Key Findings

Chapter 5 Market Segmentation Analysis

  • Segmentation Breakdown
  • Market Breakdown by Materials
  • Key Takeaways
  • Silicon
  • III-V materials
  • Gallium Arsenide (GaAs)
  • Gallium Nitride (GaN)
  • Silicon Carbide (SiC)
  • Others
  • Market Breakdown by Device Types
  • Key Takeaways
  • Microcontrollers and Processing
  • Power Semiconductors
  • Power Management and Control
  • Others
  • Market Breakdown by Operating Temperature
  • Key Takeaways
  • 126°C to 250°C
  • Higher than 250°C
  • Market Breakdown by Industry
  • Key Takeaways
  • Industrial and Instrumentation
  • Automotive
  • Aerospace and Defense
  • Energy and Power
  • Others
  • Geographic Breakdown
  • Market Breakdown by Region
  • Key Takeaways
  • North America
  • Europe
  • Asia-Pacific
  • Rest of the World

Chapter 6 Competitive Intelligence

  • Key Takeaways
  • Market Ecosystem Analysis
  • Analysis of Key Companies
  • Infineon Technologies AG
  • NXP Semiconductors
  • TDK Corp.
  • Strategic Analysis

Chapter 7 Sustainability in the Semiconductor Devices for High-Temperature Applications Industry: An ESG Perspective

  • Key Takeaways
  • Key ESG Issues in the Semiconductor Devices for High-Temperature Applications Market
  • Key Environmental Issues in Semiconductor Devices for High-Temperature Applications
  • Social Responsibility in Semiconductor Devices for High-Temperature Applications
  • Governance in Semiconductor Devices for High-Temperature Applications
  • ESG Performance Analysis
  • Environmental Performance
  • Social Performance
  • Governance Performance
  • Current Status of ESG in the Semiconductor Devices for High-Temperature Applications Market
  • Concluding Remarks from BCC Research

Chapter 8 Appendix

  • Methodology
  • Abbreviations
  • Company Profiles
  • ALLEGRO MICROSYSTEMS INC.
  • ANALOG DEVICES INC.
  • CISSOID
  • FUJITSU
  • GENERAL ELECTRIC CO.
  • HONEYWELL INTERNATIONAL INC.
  • INFINEON TECHNOLOGIES AG
  • LATTICE SEMICONDUCTOR
  • MITSUBISHI ELECTRIC CORP.
  • NXP SEMICONDUCTORS
  • QORVO INC.
  • RENESAS ELECTRONICS CORP.
  • RTX
  • TDK CORP.
  • TEXAS INSTRUMENTS INC.
  • TOSHIBA CORP.
  • WOLFSPEED INC.

List of Tables

  • Summary Table : Global Market for Semiconductor Devices for High-Temperature Applications, by Materials, Through 2029
  • Table 1 : Semiconductor Devices for High-Temperature Applications: Regulatory Bodies, Standards Organizations and Government Agencies, by Region
  • Table 2 : Published Patents on Semiconductor Devices for High-Temperature Applications, January 2024-September 2024
  • Table 3 : Global Market for Semiconductor Devices for High-Temperature Applications, by Materials, Through 2029
  • Table 4 : Global Market for Silicon in Semiconductor Devices for High-Temperature Applications, by Region, Through 2029
  • Table 5 : Global Market for III-V materials in Semiconductor Devices for High-Temperature Applications, by Region, Through 2029
  • Table 6 : Global Market for Semiconductor Devices for High-Temperature Applications, by III-V Materials, Through 2029
  • Table 7 : Global Market for Gallium Arsenide (GaAs) in Semiconductor Devices for High-Temperature Applications, by Region, Through 2029
  • Table 8 : Global Market for GaN in Semiconductor Devices for High-Temperature Applications, by Region, Through 2029
  • Table 9 : Global Market for III-SiC in Semiconductor Devices for High-Temperature Applications, by Region, Through 2029
  • Table 10 : Global Market for Other III-V Materials in Semiconductor Devices for High-Temperature Applications, by Region, Through 2029
  • Table 11 : Global Market for Semiconductor Devices for High-Temperature Applications, by Device Type, Through 2029
  • Table 12 : Global Market for Microcontrollers and Processing Devices for High-Temperature Applications, by Region, Through 2029
  • Table 13 : Global Market for Power Semiconductors for High-Temperature Applications, by Region, Through 2029
  • Table 14 : Global Market for Power Management and Control for High-Temperature Applications, by Region, Through 2029
  • Table 15 : Global Market for Other Device Types for High-Temperature Applications, by Region, Through 2029
  • Table 16 : Global Market for Semiconductor Devices for High-Temperature Applications, by Operating Temperature, Through 2029
  • Table 17 : Global Market for Semiconductor Devices for Temperatures Between 126°C and 250°C, by Region, Through 2029
  • Table 18 : Global Market for Semiconductor Devices for Temperatures Exceeding 250°C, by Region, Through 2029
  • Table 19 : Global Market for Semiconductor Devices for High-Temperature Applications, by Industry, Through 2029
  • Table 20 : Global Market for Semiconductor Devices for High-Temperature Applications in Industrial and Instrumentation, by Region, Through 2029
  • Table 21 : Global Market for Semiconductor Devices for High-Temperature Applications in the Automotive Industry, by Region, Through 2029
  • Table 22 : Global Market for Semiconductor Devices for High-Temperature Applications in Aerospace and Defense Industry, by Region, Through 2029
  • Table 23 : Global Market for Semiconductor Devices for High-Temperature Applications in Energy and Power Industries, by Region, Through 2029
  • Table 24 : Global Market for Semiconductor Devices for High-Temperature Applications in Other Industries, by Region, Through 2029
  • Table 25 : Global Market for Semiconductor Devices for High-Temperature Applications, by Region, Through 2029
  • Table 26 : North American Market for Semiconductor Devices for High-Temperature Applications, by Country, Through 2029
  • Table 27 : North American Market for Semiconductor Devices for High-Temperature Applications, by Materials, Through 2029
  • Table 28 : North American Market for Semiconductor Devices for High-Temperature Applications, by Device Type, Through 2029
  • Table 29 : North American Market for Semiconductor Devices for High-Temperature Applications, by Operating Temperature, Through 2029
  • Table 30 : North American Market for Semiconductor Devices for High-Temperature Applications, by Industry, Through 2029
  • Table 31 : European Market for Semiconductor Devices for High-Temperature Applications, by Country, Through 2029
  • Table 32 : European Market for Semiconductor Devices for High-Temperature Applications, by Materials, Through 2029
  • Table 33 : European Market for Semiconductor Devices for High-Temperature Applications, by Device Type, Through 2029
  • Table 34 : European Market for Semiconductor Devices for High-Temperature Applications, by Operating Temperature, Through 2029
  • Table 35 : European Market for Semiconductor Devices for High-Temperature Applications, by Industry, Through 2029
  • Table 36 : Asia-Pacific Market for Semiconductor Devices for High-Temperature Applications, by Country, Through 2029
  • Table 37 : Asia-Pacific Market for Semiconductor Devices for High-Temperature Applications, by Materials, Through 2029
  • Table 38 : Asia-Pacific Market for Semiconductor Devices for High-Temperature Applications, by Device Type, Through 2029
  • Table 39 : Asia-Pacific Market for Semiconductor Devices for High-Temperature Applications, by Operating Temperature, Through 2029
  • Table 40 : Asia-Pacific Market for Semiconductor Devices for High-Temperature Applications, by Industry, Through 2029
  • Table 41 : RoW Market for Semiconductor Devices for High-Temperature Applications, by Materials, Through 2029
  • Table 42 : RoW Market for Semiconductor Devices for High-Temperature Applications, by Device Type, Through 2029
  • Table 43 : RoW Market for Semiconductor Devices for High-Temperature Applications, by Operating Temperature, Through 2029
  • Table 44 : RoW Market for Semiconductor Devices for High-Temperature Applications, by Industry, Through 2029
  • Table 45 : Ranking of Key Players in the Global Semiconductor Devices Market for High-Temperature Applications, 2023
  • Table 46 : Global Semiconductor Devices for High-Temperature Applications Market: Key Recent Developments, January 2022- November 2024
  • Table 47 : Global Semiconductor Devices Market for High-Temperature Applications: Environmental Impact
  • Table 48 : Global Semiconductor Devices Market for High-Temperature Applications: Social Impact
  • Table 49 : Global Semiconductor Devices Market for High-Temperature Applications: Governance Impact
  • Table 50 : Global Semiconductor Devices for High-Temperature Applications Market: ESG Risk Ratings Metric, 2023
  • Table 51 : Abbreviations Used in the Report
  • Table 52 : Allegro Microsystems Inc.: Company Snapshot
  • Table 53 : Allegro Microsystems Inc.: Financial Performance, FY 2022 and 2023
  • Table 54 : Allegro Microsystems Inc.: Product Portfolio
  • Table 55 : Allegro Microsystems Inc.: News/Key Developments, 2024
  • Table 56 : Analog Devices Inc.: Company Snapshot
  • Table 57 : Analog Devices Inc.: Financial Performance, FY 2023 and 2024
  • Table 58 : Analog Devices Inc.: Product Portfolio
  • Table 59 : Analog Devices Inc.: News/Key Developments, 2023
  • Table 60 : Cissoid: Company Snapshot
  • Table 61 : Cissoid: Product Portfolio
  • Table 62 : Fujitsu: Company Snapshot
  • Table 63 : Fujitsu: Financial Performance, FY 2022 and 2023
  • Table 64 : Fujitsu: Product Portfolio
  • Table 65 : Fujitsu: Key Developments, 2022 and 2023
  • Table 66 : General Electric Co.: Company Snapshot
  • Table 67 : General Electric Co.: Financial Performance, FY 2022 and 2023
  • Table 68 : General Electric Co.: Product Portfolio
  • Table 69 : General Electric Co.: News/Key Developments, 2023
  • Table 70 : Honeywell International Inc.: Company Snapshot
  • Table 71 : Honeywell International Inc.: Financial Performance, FY 2022 and 2023
  • Table 72 : Honeywell International Inc.: Product Portfolio
  • Table 73 : Infineon Technologies AG: Company Snapshot
  • Table 74 : Infineon Technologies AG: Financial Performance, FY 2023 and 2024
  • Table 75 : Infineon Technologies AG: Product Portfolio
  • Table 76 : Infineon Technologies AG: News/Key Developments, 2023
  • Table 77 : Lattice Semiconductor: Company Snapshot
  • Table 78 : Lattice Semiconductor: Financial Performance, FY 2022 and 2023
  • Table 79 : Lattice Semiconductor: Product Portfolio
  • Table 80 : Mitsubishi Electric Corp.: Company Snapshot
  • Table 81 : Mitsubishi Electric Corp.: Financial Performance, FY 2022 and 2023
  • Table 82 : Mitsubishi Electric Corp.: Product Portfolio
  • Table 83 : NXP Semiconductors: Company Snapshot
  • Table 84 : NXP Semiconductors: Financial Performance, FY 2022 and 2023
  • Table 85 : NXP Semiconductors: Product Portfolio
  • Table 86 : NXP Semiconductors: News/Key Developments, 2024
  • Table 87 : Qorvo Inc.: Company Snapshot
  • Table 88 : Qorvo Inc.: Financial Performance, FY 2022 and 2023
  • Table 89 : Qorvo Inc.: Product Portfolio
  • Table 90 : Renesas Electronics Corp.: Company Snapshot
  • Table 91 : Renesas Electronics Corp.: Financial Performance, FY 2022 and 2023
  • Table 92 : Renesas Electronics Corp.: Product Portfolio
  • Table 93 : Renesas Electronics Corp.: News/Key Developments, 2023
  • Table 94 : RTX: Company Snapshot
  • Table 95 : RTX: Financial Performance, FY 2022 and 2023
  • Table 96 : RTX: Product Portfolio
  • Table 97 : RTX: News/Key Developments, 2024
  • Table 98 : TDK Corp.: Company Snapshot
  • Table 99 : TDK Corp.: Financial Performance, FY 2022 and 2023
  • Table 100 : TDK Corp.: Product Portfolio
  • Table 101 : TDK Corp.: News/Key Developments, 2024
  • Table 102 : Texas Instruments Inc.: Company Snapshot
  • Table 103 : Texas Instruments Inc.: Financial Performance, FY 2022 and 2023
  • Table 104 : Texas Instruments Inc.: Product Portfolio
  • Table 105 : Toshiba Corp.: Company Snapshot
  • Table 106 : Toshiba Corp.: Financial Performance, FY 2022 and 2023
  • Table 107 : Toshiba Corp.: Product Portfolio
  • Table 108 : Toshiba Corp.: News/Key Developments, 2024
  • Table 109 : Wolfspeed Inc.: Company Snapshot
  • Table 110 : Wolfspeed Inc.: Financial Performance, FY 2022 and 2023
  • Table 111 : Wolfspeed Inc.: Product Portfolio
  • Table 112 : Wolfspeed Inc.: News/Key Developments, 2023

List of Figures

  • Summary Figure : Global Market Shares of Semiconductor Devices for High-Temperature Applications, by Materials, 2023
  • Figure 1 : Value Chain for Semiconductor Devices for High-Temperature Applications Market
  • Figure 2 : Market Dynamics of Semiconductor Devices for High-Temperature Applications Market
  • Figure 3 : Share of Published Patents and Patent Applications on Semiconductor Devices for High-Temperature Applications, by Applicants in Key Regions, July 2023-August 2024
  • Figure 4 : Global Market Shares of Semiconductor Devices for High-Temperature Applications, by Materials, 2023
  • Figure 5 : Global Market Shares of Semiconductor Devices for High-Temperature Applications, by III-V Materials, 2023
  • Figure 6 : Global Market Shares of Semiconductor Devices for High-Temperature Applications, by Device Type, 2023
  • Figure 7 : Global Market Shares of Semiconductor Devices for High-Temperature Applications, by Operating Temperature, 2023
  • Figure 8 : Global Market Shares of Semiconductor Devices for High-Temperature Applications, by Industry, 2023
  • Figure 9 : Global Market Shares of Semiconductor Devices for High-Temperature Applications Market, by Region, 2023
  • Figure 10 : Global Semiconductor Devices Market for High-Temperature Applications Ecosystem
  • Figure 11 : Allegro Microsystems Inc.: Revenue Shares, by Business Unit, FY 2023
  • Figure 12 : Allegro Microsystems Inc.: Revenue Shares, by Region, FY 2023
  • Figure 13 : Analog Devices Inc.: Revenue Shares, by Business Unit, FY 2024
  • Figure 14 : Analog Devices Inc.: Revenue Shares, by Region, FY 2024
  • Figure 15 : Fujitsu: Revenue Shares, by Business Unit, FY 2023
  • Figure 16 : Fujitsu: Revenue Shares, by Region, FY 2023
  • Figure 17 : General Electric Co.: Revenue Shares, by Business Unit, FY 2023
  • Figure 18 : General Electric Co.: Revenue Shares, by Region, FY 2023
  • Figure 19 : Honeywell International Inc.: Revenue Shares, by Business Unit, FY 2023
  • Figure 20 : Honeywell International Inc.: Revenue Shares, by Region, FY 2023
  • Figure 21 : Infineon Technologies AG: Revenue Shares, by Business Unit, FY 2024
  • Figure 22 : Infineon Technologies AG: Revenue Shares, by Region, FY 2024
  • Figure 23 : Lattice Semiconductor: Revenue Shares, by Business Unit, FY 2023
  • Figure 24 : Lattice Semiconductor: Revenue Shares, by Region, FY 2023
  • Figure 25 : Mitsubishi Electric Corp.: Revenue Shares, by Business Unit, FY 2023
  • Figure 26 : Mitsubishi Electric Corp.: Revenue Shares, by Region, FY 2023
  • Figure 27 : NXP Semiconductors: Revenue Shares, by Business Unit, FY 2023
  • Figure 28 : NXP Semiconductors: Revenue Shares, by Region, FY 2023
  • Figure 29 : Qorvo Inc.: Revenue Shares, by Business Unit, FY 2023
  • Figure 30 : Qorvo Inc.: Revenue Shares, by Region, FY 2023
  • Figure 31 : Renesas Electronics Corp.: Revenue Shares, by Business Unit, FY 2023
  • Figure 32 : Renesas Electronics Corp.: Revenue Shares, by Region, FY 2023
  • Figure 33 : RTX: Revenue Shares, by Business Unit, FY 2023
  • Figure 34 : RTX: Revenue Shares, by Region, FY 2023
  • Figure 35 : TDK Corp.: Revenue Shares, by Business Unit, FY 2023
  • Figure 36 : TDK Corp.: Revenue Shares, by Region, FY 2023
  • Figure 37 : Texas Instruments Inc.: Revenue Shares, by Business Unit, FY 2023
  • Figure 38 : Texas Instruments Inc.: Revenue Shares, by Region, FY 2023
  • Figure 39 : Wolfspeed Inc.: Revenue Shares, by Business Unit, FY 2023
  • Figure 40 : Wolfspeed Inc.: Revenue Shares, by Region, FY 2023