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市場調查報告書
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1476999

3nM 半導體製造技術市場:依最終用途產業、技術類型和地區分類

Global 3nM Semiconductor Manufacturing Technology Market: Focus on End Use Industry, Technology Type, and Region

出版日期: | 出版商: BIS Research | 英文 | 商品交期: 7-10個工作天內

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簡介目錄

全球3nM半導體製造技術市場正處於半導體產業的模式轉移之中,與傳統節點相比,效能提高、功耗降低、電晶體密度增加。

隨著消費性電子產品、汽車和醫療保健等各個領域對更小、更高性能晶片的需求加速成長,3nM 技術的採用預計將徹底改變半導體格局。

推動全球3nM半導體製造技術市場成長的關鍵因素包括人工智慧、5G連接和物聯網設備等以資料為中心的應用的快速成長。對高效能運算解決方案不斷成長的需求以及奈米技術和材料科學的進步也推動了 3nM 技術的開發和採用。此外,市場正在經歷半導體公司之間不斷增加的垂直整合和策略聯盟,以克服製造複雜性並實現規模經濟。

北美和亞太地區是全球半導體產業的領跑者,特別是中國、日本、韓國和台灣等國家在半導體設備支出方面貢獻巨大。

本報告調查了全球3nM半導體製造技術市場,並提供了有關行業趨勢、市場成長促進和限制因素、市場規模趨勢和預測、各個細分市場/地區/主要國家的詳細分析、競爭格局的資訊,我們整理了以下幾方面的概況:主要企業。

目錄

第1章市場:產業展望

  • 趨勢:當前和未來的影響評估
    • 新材料、新結構
    • 邊緣AI晶片
  • 3nM半導體製造技術的演變
  • 2nm半導體製造技術的下一步
  • 供應鏈分析
  • 正在進行的計劃
  • 採用3nM晶片的主要企業
  • 市場動態概覽
    • 市場促進因素
    • 市場限制因素
    • 市場機會

第2章 全球3nM半導體製造技術市場:依應用分類

  • 應用概述
  • 全球 3nM 半導體製造技術市場:依最終用途產業
    • CE產品
    • 通訊
    • 衛生保健
    • 航太/國防
    • 其他

第3章 全球3nM半導體製造技術市場:依產品分類

  • 產品概要
  • 全球3nM半導體製造技術市場:依技術類型
    • FinFET
    • GAA
    • 極紫外光微影術

第4章全球3nM半導體製造技術市場:按地區

  • 區域概況
  • 全球3nM半導體製造技術市場:按地區
  • 北美洲
  • 歐洲
  • 亞太地區
  • 其他地區

第5章 公司簡介

  • GlobalFoundries Inc.
  • Intel
  • Samsung
  • Taiwan Semiconductor Manufacturing Company Limited
  • United Microelectronics Corporation
  • 其他主要企業

第6章調查方法

簡介目錄
Product Code: ES02059SA

This report will be delivered in 7-10 working days.

Introduction to 3nM Semiconductor Manufacturing Technology Market

The global 3nm semiconductor manufacturing technology market is witnessing a paradigm shift in the semiconductor industry, offering enhanced performance, reduced power consumption, and increased transistor density compared to previous nodes. As demand for smaller, more powerful chips accelerates across various sectors, including consumer electronics, automotive, and healthcare, the adoption of 3nm technology is poised to revolutionize the semiconductor landscape.

Key drivers fueling the growth of the global 3nm semiconductor manufacturing technology market include the exponential rise in data-centric applications such as artificial intelligence, 5G connectivity, and Internet of Things (IoT) devices. Moreover, the escalating demand for high-performance computing solutions, coupled with advancements in nanotechnology and materials science, is propelling the development and adoption of 3nm technology. Additionally, the market is witnessing a trend towards vertical integration among semiconductor companies and strategic collaborations to overcome manufacturing complexities and achieve economies of scale.

Despite its promising prospects, the global 3nm semiconductor manufacturing technology market faces several challenges, including the escalating costs associated with R&D and manufacturing processes, as well as technical hurdles related to extreme ultraviolet (EUV) lithography and process node scaling. However, these challenges present opportunities for innovation and differentiation, encouraging players to invest in advanced manufacturing techniques, materials, and design methodologies to address performance, power efficiency, and reliability requirements.

North America and the Asia-Pacific region stand out as frontrunners in the global semiconductor industry, with significant contributions from countries such as China, Japan, South Korea, and Taiwan, particularly in semiconductor equipment spending. Prominent companies in the 3nm market, including Taiwan Semiconductor Manufacturing Company Limited (TSMC), Samsung, Intel, United Microelectronics Corporation, and Globalfoundries, are pivotal players in this technological advancement. They provide state-of-the-art process capabilities to major clients, spearheading innovation within the sector and leading the charge in this transformative era of semiconductor technology.

Market Segmentation:

Segmentation 1: by End-use Industry

  • Consumer Electronics
  • Automotive
  • Telecommunications
  • Healthcare
  • Aerospace and Defense
  • Others

Segmentation 2: by Technology Type

  • FinFET
  • Gate-All-Around (GAA)
  • Extreme Ultraviolet (EUV) Lithography

Segmentation 3: by Region

  • North America
  • Europe
  • Asia-Pacific
  • Rest-of-the-World

Table of Contents

Executive Summary

Scope and Definition

Market/Product Definition

Key Questions Answered

Analysis and Forecast Note

1. Markets: Industry Outlook

  • 1.1 Trends: Current and Future Impact Assessment
    • 1.1.1 Introduction of New Materials and Structures
    • 1.1.2 Edge AI Chips
  • 1.2 Evolution of 3nM Semiconductor Manufacturing Technology
  • 1.3 2nM: The Next Step Semiconductor Manufacturing Technology
  • 1.4 Supply Chain Analysis
  • 1.5 Ongoing Programs
  • 1.6 Key Companies Adopting 3nM Chips
  • 1.7 Market Dynamics Overview
    • 1.7.1 Market Drivers
    • 1.7.2 Market Restraints
    • 1.7.3 Market Opportunities

2. Global 3nM Semiconductor Manufacturing Technology Market by Application

  • 2.1 Application Summary
  • 2.2 Global 3nM Semiconductor Manufacturing Technology Market by End Use Industry
    • 2.2.1 Consumer Electronics
    • 2.2.2 Automotive
    • 2.2.3 Telecommunications
    • 2.2.4 Healthcare
    • 2.2.5 Aerospace and Defense
    • 2.2.6 Others

3. Global 3nM Semiconductor Manufacturing Technology Market by Product

  • 3.1 Product Summary
  • 3.2 Global 3nM Semiconductor Manufacturing Technology Market by Technology Type
    • 3.2.1 FinFET
    • 3.2.2 Gate-All-Around (GAA)
    • 3.2.3 Extreme Ultraviolet (EUV) Lithography

4. Global 3nM Semiconductor Manufacturing Technology Market by Region

  • 4.1 Regional Summary
  • 4.2 Global 3nM Semiconductor Manufacturing Technology Market - by Region
  • 4.3 North America
    • 4.3.1 Markets
      • 4.3.1.1 Key Market Participants in North America
    • 4.3.2 Application
    • 4.3.3 Product
    • 4.3.4 North America by Country
      • 4.3.4.1 U.S.
        • 4.3.4.1.1 Market by Application
        • 4.3.4.1.2 Market by Product
      • 4.3.4.2 Canada
  • 4.4 Europe
    • 4.4.1 Markets
      • 4.4.1.1 Key Market Participants in Europe
    • 4.4.2 Application
    • 4.4.3 Product
    • 4.4.4 Europe By Country
      • 4.4.4.1 Germany
        • 4.4.4.1.1 Market by Application
        • 4.4.4.1.2 Market by Product
      • 4.4.4.2 France
      • 4.4.4.3 U.K.
      • 4.4.4.4 Others
  • 4.5 Asia-Pacific
    • 4.5.1 Markets
      • 4.5.1.1 Key Market Participants in Asia-Pacific
    • 4.5.2 Application
    • 4.5.3 Product
    • 4.5.4 Asia-Pacific by Country
      • 4.5.4.1 China
        • 4.5.4.1.1 Market by Application
        • 4.5.4.1.2 Market by Product
      • 4.5.4.2 Japan
      • 4.5.4.3 India
      • 4.5.4.4 Others
  • 4.6 Rest-of-the-World
    • 4.6.1 Markets
      • 4.6.1.1 Key Market Participants in Rest-of-the-World
    • 4.6.2 Application
    • 4.6.3 Product
    • 4.6.4 Rest-of-the-World by Region
      • 4.6.4.1 Middle East and Africa
      • 4.6.4.2 Latin America

5. Companies Profiled

  • 5.1 GlobalFoundries Inc.
  • 5.2 Intel
  • 5.3 Samsung
  • 5.4 Taiwan Semiconductor Manufacturing Company Limited
  • 5.5 United Microelectronics Corporation
  • 5.6 Other Key Players

6. Research Methodology