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市場調查報告書

商品編碼

1696239

全球可脫黏黏合劑市場 - 2025 至 2032 年

Global De-bondable Adhesives Market - 2025-2032

出版日期: 2025年03月25日 | 出版商:

DataM Intelligence | 英文 180 Pages | 商品交期: 最快1-2個工作天內

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簡介目錄

2024 年全球可脫黏黏合劑市場規模達到 4.2 億美元，預計到 2032 年將達到 8.0 億美元，在 2025-2032 年預測期內的複合年成長率為 8.52%。

由於各行各業對永續、可返工黏合解決方案的需求不斷增加，可脫黏黏合劑市場正在大幅擴張。這些黏合劑廣泛應用於電子、汽車、建築和醫療應用，具有易於拆卸且不損壞基材的優點。人們對可回收性、可修復性和材料回收的日益關注推動了市場成長。

可脫黏膠黏劑的發展趨勢

向循環經濟原則的轉變增加了對易於進行材料回收和再循環的可脫粘黏合劑的需求。電子和汽車等行業擴大使用這些黏合劑來遵守嚴格的環境法規。

隨著對輕質材料和模組化組裝的日益關注，汽車和航太工業正在採用可脫粘粘合劑用於面板粘合、內飾組裝和部件修理等應用。此項採用增強了永續性和易維護性。

動態的

促進因素：對循環經濟解決方案的需求不斷增加

對循環經濟和永續產品生命週期的日益重視是可脫黏黏合劑市場發展的主要驅動力。各行各業都致力於減少浪費並提高材料的可回收性，從而增加了可逆黏合劑的使用。尤其是電子業，正在利用這些黏合劑輕鬆拆卸組件，從而減少電子垃圾。

同樣，汽車行業正在採用這些黏合劑實現輕量化模組化設計，提高可修復性和永續性。據歐洲環境署稱，循環經濟措施到 2030 年可使工業材料需求減少 20%，進一步推動市場成長。

限制：開發成本高，認知有限

儘管可脫黏黏合劑具有諸多優點，但它也面臨研發成本高以及最終用戶認知度有限的挑戰。開發具有可控脫粘機制的智慧黏合劑需要先進的材料科學和創新的工程技術，從而增加生產成本。

此外，依賴傳統黏合劑的行業可能會因不熟悉其應用和性能優勢而猶豫是否採用可脫粘替代品。尤其是中小型企業可能難以證明轉向這些先進黏合解決方案所產生的更高成本是合理的，從而抑制了市場擴張。

The de-bondable adhesives market is expanding significantly due to the increasing demand for sustainable and reworkable bonding solutions across various industries. These adhesives are widely utilized in electronics, automotive, construction, and medical applications, offering the advantage of easy disassembly without damaging substrates. The rising focus on recyclability, repairability, and material recovery is fueling market growth.

De-bondable Adhesives Trends

The shift towards circular economy principles has increased the demand for de-bondable adhesives that facilitate easy material recovery and recycling. Industries such as electronics and automotive are increasingly incorporating these adhesives to comply with stringent environmental regulations.

With the increasing focus on lightweight materials and modular assembly, the automotive and aerospace industries are adopting de-bondable adhesives for applications such as panel bonding, interior assembly, and component repair. This adoption enhances sustainability and ease of maintenance.

Dynamic

Driver: Increasing Demand for Circular Economy Solutions

The growing emphasis on a circular economy and sustainable product life cycles is a major driver for the de-bondable adhesives market. Industries are focusing on reducing waste and enhancing the recyclability of materials, leading to increased adoption of reversible adhesives. The electronics sector, in particular, is leveraging these adhesives for easy disassembly of components, thereby reducing electronic waste.

Similarly, the automotive industry is adopting these adhesives for lightweight modular designs, improving repairability and sustainability. According to the European Environment Agency, the circular economy initiatives could reduce material demand in industries by 20% by 2030, further propelling market growth.

Restraint: High Development Costs and Limited Awareness

Despite their advantages, de-bondable adhesives face challenges related to high research and development costs and limited awareness among end-users. The development of smart adhesives with controlled debonding mechanisms requires advanced material science and innovative engineering, increasing production costs.

Additionally, industries that rely on traditional adhesives may be hesitant to adopt de-bondable alternatives due to unfamiliarity with their applications and performance benefits. Small and medium enterprises, in particular, may find it difficult to justify the higher costs associated with switching to these advanced bonding solutions, thereby restraining market expansion.

Segment Analysis

The global de-bondable adhesives market is segmented based on type, composition, form, end-use industry, and region.

The electronics and electrical applications segment holds the largest share in the global de-bondable adhesives market, driven by increasing demand for miniaturization, flexible electronics, and reworkable components. These adhesives are widely used in chip packaging, printed circuit boards (PCBs), display panels, and semiconductor assembly, allowing manufacturers to perform repairs and modifications efficiently.

Additionally, with the rising adoption of 5G technology, demand for high-frequency PCBs and optoelectronic devices is escalating, further propelling market growth. Leading electronic manufacturers, including Apple, Samsung, and Intel, are investing in advanced bonding solutions to enhance device performance and sustainability. Similarly, in semiconductor manufacturing, de-bondable adhesives facilitate wafer handling, chip stacking, and die-attach processes, improving yield and reducing material waste.

Geographical Penetration

Rapid Industrialization Drives the Market in the Asia-Pacific Region.

The Asia-Pacific region dominates the global de-bondable adhesives market, driven by rapid industrialization, expanding electronics manufacturing, and increasing government support for sustainable solutions. Countries such as China, Japan, South Korea, and India are witnessing high demand for adhesives in consumer electronics, automotive, and semiconductor industries. Meanwhile, India's rising automotive and electronics sectors, supported by government initiatives like "Make in India" and PLI schemes, are fostering the adoption of de-bondable adhesives in EV battery assembly and consumer gadgets.

China, the world's largest electronics producer, accounts for over 35% of global semiconductor manufacturing. The Chinese government's "Made in China 2025" initiative is accelerating the adoption of advanced adhesives in flexible electronics and microelectronics production. Japan and South Korea, home to leading electronics giants like Sony, Panasonic, Samsung, and LG, are investing heavily in reworkable adhesives for OLED displays, foldable devices, and high-performance computing components.

Competitive Landscape

The major players in the market include Henkel AG & Co. KGaA, 3M Company, Flanders Make, Conagen, Inc., and ATSP Innovations.

By Type

Thermally De-bondable Adhesives
UV/Photo-Debondable Adhesives
Chemically De-bondable Adhesives
Electrically De-bondable Adhesives
Others

By Composition

Reactive
Non-reactive
Hybrid

By Form

Liquid Adhesives
Film Adhesives
Paste Adhesives

By End-Use Industry

Electronics and Electrical
Automotive
Healthcare and Medical
Aerospace and Defense
Construction
Others

By Region

North America
- US
- Canada
- Mexico
Europe
- Germany
- UK
- France
- Italy
- Spain
- Rest of Europe
South America
- Brazil
- Argentina
- Rest of South America
Asia-Pacific
- China
- India
- Japan
- Australia
- Rest of Asia-Pacific
Middle East and Africa

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Target Audience 2024

Manufacturers/ Buyers
Industry Investors/Investment Bankers
Research Professionals
Emerging Companies

1. Methodology and Scope

1.1. Research Methodology
1.2. Research Objective and Scope of the Report

2. Definition and Overview

3. Executive Summary

3.1. Snippet by Type
3.2. Snippet by Composition
3.3. Snippet by Form
3.4. Snippet by End-Use Industry
3.5. Snippet by Region

4. Dynamics

4.1. Impacting Factors
- 4.1.1. Drivers
  - 4.1.1.1. Increasing Demand for Reworkable and Recyclable Adhesives
- 4.1.2. Restraints
  - 4.1.2.1. High Cost and Performance Limitations
- 4.1.3. Opportunity
- 4.1.4. Impact Analysis

5. Industry Analysis

5.1. Porter's Five Force Analysis
5.2. Supply Chain Analysis
5.3. Value Chain Analysis
5.4. Pricing Analysis
5.5. Regulatory and Compliance Analysis
5.6. AI & Automation Impact Analysis
5.7. R&D and Innovation Analysis
5.8. Sustainability & Green Technology Analysis
5.9. Technology Roadmap
5.10. Patent Landscape
5.11. DMI Opinion

6. By Type

6.1. Introduction
- 6.1.1. Market Size Analysis and Y-o-Y Growth Analysis (%), By Type
- 6.1.2. Market Attractiveness Index, By Type
6.2. Thermally De-bondable Adhesives*
- 6.2.1. Introduction
- 6.2.2. Market Size Analysis and Y-o-Y Growth Analysis (%)
6.3. UV/Photo-De-bondable Adhesives
6.4. Chemically De-bondable Adhesives
6.5. Electrically De-bondable Adhesives
6.6. Others

7. By Composition

7.1. Introduction
- 7.1.1. Market Size Analysis and Y-o-Y Growth Analysis (%), By Composition
- 7.1.2. Market Attractiveness Index, By Composition
7.2. Reactive*
- 7.2.1. Introduction
- 7.2.2. Market Size Analysis and Y-o-Y Growth Analysis (%)
7.3. Non-reactive
7.4. Hybrid

8. By Form

8.1. Introduction
- 8.1.1. Market Size Analysis and Y-o-Y Growth Analysis (%), By Form
- 8.1.2. Market Attractiveness Index, By Form
8.2. Liquid Adhesives*
- 8.2.1. Introduction
- 8.2.2. Market Size Analysis and Y-o-Y Growth Analysis (%)
8.3. Film Adhesives
8.4. Paste Adhesives

9. By End-Use Industry

9.1. Introduction
- 9.1.1. Market Size Analysis and Y-o-Y Growth Analysis (%), By End-Use Industry
- 9.1.2. Market Attractiveness Index, By End-Use Industry
9.2. Electronics and Electrical*
- 9.2.1. Introduction
- 9.2.2. Market Size Analysis and Y-o-Y Growth Analysis (%)
9.3. Automotive
9.4. Healthcare and Medical
9.5. Aerospace and Defense
9.6. Construction
9.7. Others

10. By Region

10.1. Introduction
- 10.1.1. Market Size Analysis and Y-o-Y Growth Analysis (%), By Region
- 10.1.2. Market Attractiveness Index, By Region
10.2. North America
- 10.2.1. Introduction
- 10.2.2. Key Region-Specific Dynamics
- 10.2.3. Market Size Analysis and Y-o-Y Growth Analysis (%), By Type
- 10.2.4. Market Size Analysis and Y-o-Y Growth Analysis (%), By Composition
- 10.2.5. Market Size Analysis and Y-o-Y Growth Analysis (%), By Form
- 10.2.6. Market Size Analysis and Y-o-Y Growth Analysis (%), By End-Use Industry
- 10.2.7. Market Size Analysis and Y-o-Y Growth Analysis (%), By Country
  - 10.2.7.1. US
  - 10.2.7.2. Canada
  - 10.2.7.3. Mexico
10.3. Europe
- 10.3.1. Introduction
- 10.3.2. Key Region-Specific Dynamics
- 10.3.3. Market Size Analysis and Y-o-Y Growth Analysis (%), By Type
- 10.3.4. Market Size Analysis and Y-o-Y Growth Analysis (%), By Composition
- 10.3.5. Market Size Analysis and Y-o-Y Growth Analysis (%), By Form
- 10.3.6. Market Size Analysis and Y-o-Y Growth Analysis (%), By End-Use
- 10.3.7. Market Size Analysis and Y-o-Y Growth Analysis (%), By Country
  - 10.3.7.1. Germany
  - 10.3.7.2. UK
  - 10.3.7.3. France
  - 10.3.7.4. Italy
  - 10.3.7.5. Spain
  - 10.3.7.6. Rest of Europe
10.4. South America
- 10.4.1. Introduction
- 10.4.2. Key Region-Specific Dynamics
- 10.4.3. Key Region-Specific Dynamics
- 10.4.4. Market Size Analysis and Y-o-Y Growth Analysis (%), By Type
- 10.4.5. Market Size Analysis and Y-o-Y Growth Analysis (%), By Composition
- 10.4.6. Market Size Analysis and Y-o-Y Growth Analysis (%), By Form
- 10.4.7. Market Size Analysis and Y-o-Y Growth Analysis (%), By End-Use
- 10.4.8. Market Size Analysis and Y-o-Y Growth Analysis (%), By Country
  - 10.4.8.1. Brazil
  - 10.4.8.2. Argentina
  - 10.4.8.3. Rest of South America
10.5. Asia-Pacific
- 10.5.1. Introduction
- 10.5.2. Key Region-Specific Dynamics
- 10.5.3. Market Size Analysis and Y-o-Y Growth Analysis (%), By Type
- 10.5.4. Market Size Analysis and Y-o-Y Growth Analysis (%), By Composition
- 10.5.5. Market Size Analysis and Y-o-Y Growth Analysis (%), By Form
- 10.5.6. Market Size Analysis and Y-o-Y Growth Analysis (%), By End-Use
- 10.5.7. Market Size Analysis and Y-o-Y Growth Analysis (%), By Country
  - 10.5.7.1. China
  - 10.5.7.2. India
  - 10.5.7.3. Japan
  - 10.5.7.4. Australia
  - 10.5.7.5. Rest of Asia-Pacific
10.6. Middle East and Africa
- 10.6.1. Introduction
- 10.6.2. Key Region-Specific Dynamics
- 10.6.3. Market Size Analysis and Y-o-Y Growth Analysis (%), By Type
- 10.6.4. Market Size Analysis and Y-o-Y Growth Analysis (%), By Composition
- 10.6.5. Market Size Analysis and Y-o-Y Growth Analysis (%), By Form
- 10.6.6. Market Size Analysis and Y-o-Y Growth Analysis (%), By End-Use

11. Competitive Landscape

11.1. Competitive Scenario
11.2. Market Positioning/Share Analysis
11.3. Mergers and Acquisitions Analysis

12. Company Profiles

12.1. Henkel AG & Co. KGaA*
- 12.1.1. Company Overview
- 12.1.2. Product Portfolio and Description
- 12.1.3. Financial Overview
- 12.1.4. Key Developments
12.2. 3M Company
12.3. Flanders Make
12.4. Conagen, Inc.
12.5. ATSP Innovations

LIST NOT EXHAUSTIVE