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市場調查報告書
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1652744

電子市場中的 PUR 黏合劑：全球產業分析、規模、佔有率、成長、趨勢和預測，2025-2032 年

PUR Adhesives in Electronics Market: Global Industry Analysis, Size, Share, Growth, Trends, and Forecast, 2025 - 2032
出版日期: | 出版商: Persistence Market Research | 英文 222 Pages | 商品交期: 2-5個工作天內

價格
簡介目錄

Persistence Market Research 最近發布了一份關於電子領域 PUR 黏合劑全球市場的詳盡報告。該報告對關鍵市場動態進行了全面的分析，包括市場促進因素、趨勢、機會和挑戰，並對市場結構提供了深入的見解。

關鍵見解

  • 電子產業 PUR 膠合劑市場規模（2025 年預測）：43.606 億美元
  • 預計市場價值（2032F）：6,568,900,000 美元
  • 全球市場成長率（2025-2032 年複合年成長率）：6.0%

電子市場中的 PUR 黏合劑 - 研究範圍：

電子領域的 PUR 黏合劑市場包括用於電子元件黏合、封裝和密封應用的反應性聚氨酯接著劑。這些黏合劑具有優異的機械強度、防潮性和熱穩定性，適用於家用電子電器、汽車電子和工業電子應用。市場涉及廣泛的領域，包括電路基板、感測器、半導體和顯示面板。成長的動力來自對更小、更強大的電子產品的需求不斷成長、黏合劑配方的進步以及 PUR 黏合劑在關鍵電子組裝過程中的廣泛使用。

市場成長動力：

有幾個關鍵因素推動了全球電子產品 PUR 黏合劑市場的發展。電子製造業對耐用、柔韌黏合劑的需求不斷成長，對市場成長做出了巨大貢獻。由於 PUR 黏合劑具有出色的黏合能力和抵抗環境因素的能力，因此電子元件向輕量化和緊湊化的轉變正在增加其使用。智慧電子、5G 基礎設施和電動車 (EV) 的技術進步進一步擴大了 PUR 黏合劑在高性能應用領域的範圍。此外，人們對永續性和環保黏合劑的日益重視，促進了無溶劑和低VOC PUR黏合劑的開發，這種黏合劑擴大被各行各業採用。

市場限制：

儘管成長前景看好，但電子市場中的 PUR 黏合劑面臨材料成本高和加工複雜性相關的挑戰。需要特殊的固化條件和精確的應用技術，這會增加生產成本。此外，環氧樹脂和矽膠黏合劑等替代黏合劑技術的競爭可能會限制市場滲透。對 PUR 黏合劑在高溫應用中的長期穩定性以及對環境標準的合規性的擔憂增加了進一步的挑戰。解決這些問題需要持續投入研究和技術進步，以提高黏合劑的性能和成本效益。

市場機會：

由於先進電子應用對可靠黏合劑的需求不斷成長，該市場提供了巨大的機會。開發具有增強導熱性和電絕緣性的新一代 PUR 黏合劑可滿足高性能電子組件的需求。物聯網（IoT）、穿戴式技術和軟性電子產品的擴展為 PUR 黏合劑提供了新的成長途徑，尤其是在高密度電路基板和智慧設備領域。策略聯盟、自動化投資和生物基 PUR 黏合劑的引入對於利用新機會和維持市場領導至關重要。

本報告探討的關鍵問題

  • 推動電子市場 PUR 黏合劑全球成長的關鍵因素有哪些？
  • 哪些黏合劑配方和技術在各種應用中被廣泛採用？
  • 技術進步如何影響電子市場中 PUR 黏合劑的競爭格局？
  • 電子市場 PUR 黏合劑的主要企業是誰？
  • 全球PUR膠黏劑市場的新趨勢與未來前景如何？

目錄

第1章執行摘要

第2章 市場概況

  • 市場範圍和定義
  • 市場動態
    • 驅動程式
    • 限制因素
    • 機會
    • 任務
    • 主要趨勢
  • 組件類型生命週期分析
  • 電子市場中的 PUR 黏合劑：價值鏈
    • 原物料供應商名單
    • 製造商列表
    • 經銷商名單
    • 應用程式列表
    • 盈利分析
  • 波特五力分析
  • 地緣政治緊張局勢：市場影響
  • 宏觀經濟因素
    • 全球產業展望
    • 全球GDP成長前景
    • 全球母市場概覽
  • 預測因子－相關性和影響力
  • 監管和技術格局

第 3 章。

  • 主要亮點
    • 市場規模（單位）預測
    • 市場規模及與前一年同期比較率
    • 絕對商機
  • 市場規模（百萬美元）分析及預測
    • 2019 年至 2023 年歷史市場規模分析
    • 目前市場規模預測，2025-2032
  • 全球電子產品中聚氨酯膠黏劑的展望：元件類型
    • 簡介/主要發現
    • 2019 年至 2023 年按組件類型分類的歷史市場規模（百萬美元）和銷售量（單位）分析
    • 當前市場規模（百萬美元）和銷售（單位）預測，2025-2032 年，按組件類型分類
      • 熱導率
      • 電導率
      • 紫外線固化
      • 其他
  • 市場吸引力分析-元件類型
  • 全球電子產品中聚氨酯膠黏劑的展望：應用
    • 簡介/主要發現
    • 2019 年至 2023 年歷史市場規模（百萬美元）和銷售（單位）分析，按應用
    • 當前市場規模（百萬美元）和 2025 年至 2032 年銷售（單位）預測（按應用分類）
      • 表面黏著型元件
      • 灌封和封裝
      • 三防膠
      • 其他
  • 市場吸引力分析：應用

4. 全球電子產業 PUR 膠合劑市場區域展望

  • 主要亮點
  • 2019 年至 2023 年按地區分類的歷史市場規模（百萬美元）和銷售量（單位）分析
  • 2025 年至 2032 年各地區目前市場規模（百萬美元）及銷售量（單位）預測
    • 北美洲
    • 歐洲
    • 東亞
    • 南亞和大洋洲
    • 拉丁美洲
    • 中東和非洲
  • 市場吸引力分析：地區

第 5 章 北美電子 PUR 黏合劑市場展望：歷史（2019-2023 年）與預測（2025-2032 年）

6. 歐洲電子 PUR 膠合劑市場展望（2019-2023）及預測（2025-2032）

第 7 章。

8. 南亞和大洋洲電子 PUR 黏合劑市場展望（2019-2023）和預測（2025-2032）

第 9 章。

第 10 章。

第11章 競爭格局

  • 2024 年市場佔有率分析
  • 市場結構
    • 市場競爭加劇圖
    • 競爭儀錶板
    • 表觀產品體積
  • 公司簡介（詳情－概述、財務狀況、策略、最新發展）
    • Henkel AG &Co. KGaA
    • 3M
    • HB Fuller
    • Dow Chemical Company
    • Sika AG
    • Avery Dennison
    • Master Bond Inc.
    • Lord Corporation
    • Huntsman Corporation
    • Permabond
    • DELO Industries Adhesives
    • Panacol
    • ITW Polymers Adhesives

第12章 附錄

1.調查方法

2. 調查前提

H12.3. 首字母縮寫與簡稱

簡介目錄
Product Code: PMRREP33796

Persistence Market Research has recently published an extensive report on the global PUR Adhesives in Electronics Market. This report offers a comprehensive analysis of the key market dynamics, including drivers, trends, opportunities, and challenges, providing deep insights into the market structure.

Key Insights:

  • PUR Adhesives in Electronics Market Size (2025E): USD 4360.6 Mn
  • Projected Market Value (2032F): USD 6568.9 Mn
  • Global Market Growth Rate (CAGR 2025 to 2032): 6.0%

PUR Adhesives in Electronics Market - Report Scope:

The PUR Adhesives in Electronics Market encompasses a range of reactive polyurethane adhesives used for bonding, encapsulation, and sealing applications in electronic components. These adhesives offer excellent mechanical strength, moisture resistance, and thermal stability, making them suitable for applications in consumer electronics, automotive electronics, and industrial electronics. The market serves diverse segments such as circuit boards, sensors, semiconductors, and display panels. Growth is driven by the increasing demand for miniaturized and high-performance electronic devices, advancements in adhesive formulations, and the expanding application of PUR adhesives in critical electronic assembly processes.

Market Growth Drivers:

Several key factors are driving the global PUR Adhesives in Electronics Market. The rising demand for durable and flexible adhesives in electronic device manufacturing is significantly contributing to market growth. The shift toward lightweight and compact electronic components has increased the use of PUR adhesives due to their superior bonding capabilities and resistance to environmental factors. Technological advancements in smart electronics, 5G infrastructure, and electric vehicles (EVs) have further expanded the scope of PUR adhesives in high-performance applications. Additionally, the growing emphasis on sustainability and eco-friendly adhesives has led to the development of solvent-free and low-VOC PUR adhesives, enhancing their adoption in various industries.

Market Restraints:

Despite promising growth prospects, the PUR Adhesives in Electronics Market faces challenges related to high material costs and processing complexities. The requirement for specialized curing conditions and precise application techniques can increase production costs. Additionally, competition from alternative adhesive technologies, such as epoxy and silicone-based adhesives, may limit market penetration. Concerns regarding the long-term stability of PUR adhesives in high-temperature applications and regulatory compliance with environmental standards further add to the challenges. Addressing these issues requires continuous investment in research and technological advancements to enhance adhesive performance and cost-effectiveness.

Market Opportunities:

The market presents significant opportunities driven by the increasing demand for high-reliability adhesives in advanced electronic applications. The development of next-generation PUR adhesives with enhanced thermal conductivity and electrical insulation properties caters to the need for high-performance electronic assemblies. The expansion of the Internet of Things (IoT), wearable technology, and flexible electronics provides new growth avenues for PUR adhesives, particularly in high-density circuit boards and smart devices. Strategic collaborations, investments in automation, and the introduction of bio-based PUR adhesives are essential for capitalizing on emerging opportunities and maintaining market leadership.

Key Questions Answered in the Report:

  • What are the primary factors driving the growth of the PUR Adhesives in Electronics Market globally?
  • Which adhesive formulations and technologies are leading the adoption in various applications?
  • How are technological advancements influencing the competitive landscape of the PUR Adhesives in Electronics Market?
  • Who are the key players in the PUR Adhesives in Electronics Market, and what strategies are they employing to stay competitive?
  • What are the emerging trends and future prospects in the global PUR Adhesives in Electronics Market?

Competitive Intelligence and Business Strategy:

Leading players in the global PUR Adhesives in Electronics Market, including Henkel AG & Co. KGaA, 3M Company, H.B. Fuller Company, and Sika AG, focus on innovation, product differentiation, and strategic collaborations to gain a competitive edge. These companies invest in R&D to develop advanced adhesive solutions with improved thermal stability, electrical insulation, and sustainability attributes. Collaborations with electronics manufacturers, material scientists, and research institutions facilitate market access and promote new technology adoption. Emphasis on automation, sustainable manufacturing practices, and advanced adhesive application techniques fosters market growth and enhances brand reputation in the evolving PUR Adhesives in Electronics Market landscape.

Key Companies Profiled:

  • Henkel AG & Co. KGaA
  • 3M
  • H.B Fuller
  • Dow Chemical Company
  • Sika AG
  • Avery Dennison
  • Master Bond Inc.
  • Lord Corporation
  • Huntsman Corporation
  • Permabond
  • DELO Industries Adhesives
  • Panacol
  • ITW Polymers Adhesives

PUR Adhesives in Electronics Market Research Segmentation

By Component Type:

  • Thermal Conductive
  • Electrically Conductive
  • UV Curing
  • Others

By Application:

  • Surface-mount devices
  • Potting & Encapsulation
  • Conformal Coatings
  • Others

By Region:

  • North America
  • Europe
  • East Asia
  • South Asia & Oceania
  • Latin America
  • Middle East & Africa

Table of Contents

1. Executive Summary

  • 1.1. Global PUR Adhesives in Electronics Market Snapshot, 2025 - 2032
  • 1.2. Market Opportunity Assessment, 2025 - 2032, US$ Mn
  • 1.3. Key Market Trends
  • 1.4. Future Market Projections
  • 1.5. Premium Market Insights
  • 1.6. Industry Developments and Key Market Events
  • 1.7. PMR Analysis and Recommendations

2. Market Overview

  • 2.1. Market Scope and Definition
  • 2.2. Market Dynamics
    • 2.2.1. Drivers
    • 2.2.2. Restraints
    • 2.2.3. Opportunity
    • 2.2.4. Challenges
    • 2.2.5. Key Trends
  • 2.3. Component Type Lifecycle Analysis
  • 2.4. PUR Adhesives in Electronics Market: Value Chain
    • 2.4.1. List of Raw Material Supplier
    • 2.4.2. List of Manufacturers
    • 2.4.3. List of Distributors
    • 2.4.4. List of Applications
    • 2.4.5. Profitability Analysis
  • 2.5. Porter Five Force's Analysis
  • 2.6. Geopolitical Tensions: Market Impact
  • 2.7. Macro-Economic Factors
    • 2.7.1. Global Sectorial Outlook
    • 2.7.2. Global GDP Growth Outlook
    • 2.7.3. Global Parent Market Overview
  • 2.8. Forecast Factors - Relevance and Impact
  • 2.9. Regulatory and Technology Landscape

3. Global PUR Adhesives in Electronics Market Outlook: Historical (2019 - 2023) and Forecast (2025 - 2032)

  • 3.1. Key Highlights
    • 3.1.1. Market Volume (Units) Projections
    • 3.1.2. Market Size and Y-o-Y Growth
    • 3.1.3. Absolute $ Opportunity
  • 3.2. Market Size (US$ Mn) Analysis and Forecast
    • 3.2.1. Historical Market Size Analysis, 2019 - 2023
    • 3.2.2. Current Market Size Forecast, 2025 - 2032
  • 3.3. Global PUR Adhesives in Electronics Market Outlook: Component Type
    • 3.3.1. Introduction / Key Findings
    • 3.3.2. Historical Market Size (US$ Mn) and Volume (Units) Analysis By Component Type, 2019 - 2023
    • 3.3.3. Current Market Size (US$ Mn) and Volume (Units) Forecast By Component Type, 2025 - 2032
      • 3.3.3.1. Thermal Conductive
      • 3.3.3.2. Electrically Conductive
      • 3.3.3.3. UV Curing
      • 3.3.3.4. Others
  • 3.4. Market Attractiveness Analysis: Component Type
  • 3.5. Global PUR Adhesives in Electronics Market Outlook: Application
    • 3.5.1. Introduction / Key Findings
    • 3.5.2. Historical Market Size (US$ Mn) and Volume (Units) Analysis By Application, 2019 - 2023
    • 3.5.3. Current Market Size (US$ Mn) and Volume (Units) Forecast By Application, 2025 - 2032
      • 3.5.3.1. Surface-mount devices
      • 3.5.3.2. Potting & Encapsulation
      • 3.5.3.3. Conformal Coatings
      • 3.5.3.4. Others
  • 3.6. Market Attractiveness Analysis: Application

4. Global PUR Adhesives in Electronics Market Outlook: Region

  • 4.1. Key Highlights
  • 4.2. Historical Market Size (US$ Mn) and Volume (Units) Analysis By Region, 2019 - 2023
  • 4.3. Current Market Size (US$ Mn) and Volume (Units) Forecast By Region, 2025 - 2032
    • 4.3.1. North America
    • 4.3.2. Europe
    • 4.3.3. East Asia
    • 4.3.4. South Asia and Oceania
    • 4.3.5. Latin America
    • 4.3.6. Middle East & Africa (MEA)
  • 4.4. Market Attractiveness Analysis: Region

5. North America PUR Adhesives in Electronics Market Outlook: Historical (2019 - 2023) and Forecast (2025 - 2032)

  • 5.1. Key Highlights
  • 5.2. Pricing Analysis
  • 5.3. Historical Market Size (US$ Mn) and Volume (Units) Analysis By Market, 2019 - 2023
    • 5.3.1. By Country
    • 5.3.2. By Component Type
    • 5.3.3. By Application
  • 5.4. Current Market Size (US$ Mn) and Volume (Units) Forecast By Country, 2025 - 2032
    • 5.4.1. U.S.
    • 5.4.2. Canada
  • 5.5. Current Market Size (US$ Mn) and Volume (Units) Forecast By Component Type, 2025 - 2032
    • 5.5.1. Thermal Conductive
    • 5.5.2. Electrically Conductive
    • 5.5.3. UV Curing
    • 5.5.4. Others
  • 5.6. Current Market Size (US$ Mn) and Volume (Units) Forecast By Application, 2025 - 2032
    • 5.6.1. Surface-mount devices
    • 5.6.2. Potting & Encapsulation
    • 5.6.3. Conformal Coatings
    • 5.6.4. Others
  • 5.7. Market Attractiveness Analysis

6. Europe PUR Adhesives in Electronics Market Outlook: Historical (2019 - 2023) and Forecast (2025 - 2032)

  • 6.1. Key Highlights
  • 6.2. Pricing Analysis
  • 6.3. Historical Market Size (US$ Mn) and Volume (Units) Analysis By Market, 2019 - 2023
    • 6.3.1. By Country
    • 6.3.2. By Component Type
    • 6.3.3. By Application
  • 6.4. Current Market Size (US$ Mn) and Volume (Units) Forecast By Country, 2025 - 2032
    • 6.4.1. Germany
    • 6.4.2. France
    • 6.4.3. U.K.
    • 6.4.4. Italy
    • 6.4.5. Spain
    • 6.4.6. Russia
    • 6.4.7. Turkey
    • 6.4.8. Rest of Europe
  • 6.5. Current Market Size (US$ Mn) and Volume (Units) Forecast By Component Type, 2025 - 2032
    • 6.5.1. Thermal Conductive
    • 6.5.2. Electrically Conductive
    • 6.5.3. UV Curing
    • 6.5.4. Others
  • 6.6. Current Market Size (US$ Mn) and Volume (Units) Forecast By Application, 2025 - 2032
    • 6.6.1. Surface-mount devices
    • 6.6.2. Potting & Encapsulation
    • 6.6.3. Conformal Coatings
    • 6.6.4. Others
  • 6.7. Market Attractiveness Analysis

7. East Asia PUR Adhesives in Electronics Market Outlook: Historical (2019 - 2023) and Forecast (2025 - 2032)

  • 7.1. Key Highlights
  • 7.2. Pricing Analysis
  • 7.3. Historical Market Size (US$ Mn) and Volume (Units) Analysis By Market, 2019 - 2023
    • 7.3.1. By Country
    • 7.3.2. By Component Type
    • 7.3.3. By Application
  • 7.4. Current Market Size (US$ Mn) and Volume (Units) Forecast By Country, 2025 - 2032
    • 7.4.1. China
    • 7.4.2. Japan
    • 7.4.3. South Korea
  • 7.5. Current Market Size (US$ Mn) and Volume (Units) Forecast By Component Type, 2025 - 2032
    • 7.5.1. Thermal Conductive
    • 7.5.2. Electrically Conductive
    • 7.5.3. UV Curing
    • 7.5.4. Others
  • 7.6. Current Market Size (US$ Mn) and Volume (Units) Forecast By Application, 2025 - 2032
    • 7.6.1. Surface-mount devices
    • 7.6.2. Potting & Encapsulation
    • 7.6.3. Conformal Coatings
    • 7.6.4. Others
  • 7.7. Market Attractiveness Analysis

8. South Asia & Oceania PUR Adhesives in Electronics Market Outlook: Historical (2019 - 2023) and Forecast (2025 - 2032)

  • 8.1. Key Highlights
  • 8.2. Pricing Analysis
  • 8.3. Historical Market Size (US$ Mn) and Volume (Units) Analysis By Market, 2019 - 2023
    • 8.3.1. By Country
    • 8.3.2. By Component Type
    • 8.3.3. By Application
  • 8.4. Current Market Size (US$ Mn) and Volume (Units) Forecast By Country, 2025 - 2032
    • 8.4.1. India
    • 8.4.2. Southeast Asia
    • 8.4.3. ANZ
    • 8.4.4. Rest of South Asia & Oceania
  • 8.5. Current Market Size (US$ Mn) and Volume (Units) Forecast By Component Type, 2025 - 2032
    • 8.5.1. Thermal Conductive
    • 8.5.2. Electrically Conductive
    • 8.5.3. UV Curing
    • 8.5.4. Others
  • 8.6. Current Market Size (US$ Mn) and Volume (Units) Forecast By Application, 2025 - 2032
    • 8.6.1. Surface-mount devices
    • 8.6.2. Potting & Encapsulation
    • 8.6.3. Conformal Coatings
    • 8.6.4. Others
  • 8.7. Market Attractiveness Analysis

9. Latin America PUR Adhesives in Electronics Market Outlook: Historical (2019 - 2023) and Forecast (2025 - 2032)

  • 9.1. Key Highlights
  • 9.2. Pricing Analysis
  • 9.3. Historical Market Size (US$ Mn) and Volume (Units) Analysis By Market, 2019 - 2023
    • 9.3.1. By Country
    • 9.3.2. By Component Type
    • 9.3.3. By Application
  • 9.4. Current Market Size (US$ Mn) and Volume (Units) Forecast By Country, 2025 - 2032
    • 9.4.1. Brazil
    • 9.4.2. Mexico
    • 9.4.3. Rest of Latin America
  • 9.5. Current Market Size (US$ Mn) and Volume (Units) Forecast By Component Type, 2025 - 2032
    • 9.5.1. Thermal Conductive
    • 9.5.2. Electrically Conductive
    • 9.5.3. UV Curing
    • 9.5.4. Others
  • 9.6. Current Market Size (US$ Mn) and Volume (Units) Forecast By Application, 2025 - 2032
    • 9.6.1. Surface-mount devices
    • 9.6.2. Potting & Encapsulation
    • 9.6.3. Conformal Coatings
    • 9.6.4. Others
  • 9.7. Market Attractiveness Analysis

10. Middle East & Africa PUR Adhesives in Electronics Market Outlook: Historical (2019 - 2023) and Forecast (2025 - 2032)

  • 10.1. Key Highlights
  • 10.2. Pricing Analysis
  • 10.3. Historical Market Size (US$ Mn) and Volume (Units) Analysis By Market, 2019 - 2023
    • 10.3.1. By Country
    • 10.3.2. By Component Type
    • 10.3.3. By Application
  • 10.4. Current Market Size (US$ Mn) and Volume (Units) Forecast By Country, 2025 - 2032
    • 10.4.1. GCC
    • 10.4.2. Egypt
    • 10.4.3. South Africa
    • 10.4.4. Northern Africa
    • 10.4.5. Rest of Middle East & Africa
  • 10.5. Current Market Size (US$ Mn) and Volume (Units) Forecast By Component Type, 2025 - 2032
    • 10.5.1. Thermal Conductive
    • 10.5.2. Electrically Conductive
    • 10.5.3. UV Curing
    • 10.5.4. Others
  • 10.6. Current Market Size (US$ Mn) and Volume (Units) Forecast By Application, 2025 - 2032
    • 10.6.1. Surface-mount devices
    • 10.6.2. Potting & Encapsulation
    • 10.6.3. Conformal Coatings
    • 10.6.4. Others
  • 10.7. Market Attractiveness Analysis

11. Competition Landscape

  • 11.1. Market Share Analysis, 2024
  • 11.2. Market Structure
    • 11.2.1. Competition Intensity Mapping By Market
    • 11.2.2. Competition Dashboard
    • 11.2.3. Apparent Product Capacity
  • 11.3. Company Profiles (Details - Overview, Financials, Strategy, Recent Developments)
    • 11.3.1. Henkel AG & Co. KGaA
      • 11.3.1.1. Overview
      • 11.3.1.2. Segments and Product
      • 11.3.1.3. Key Financials
      • 11.3.1.4. Market Developments
      • 11.3.1.5. Market Strategy
    • 11.3.2. 3M
      • 11.3.2.1. Overview
      • 11.3.2.2. Segments and Product
      • 11.3.2.3. Key Financials
      • 11.3.2.4. Market Developments
      • 11.3.2.5. Market Strategy
    • 11.3.3. H.B Fuller
      • 11.3.3.1. Overview
      • 11.3.3.2. Segments and Product
      • 11.3.3.3. Key Financials
      • 11.3.3.4. Market Developments
      • 11.3.3.5. Market Strategy
    • 11.3.4. Dow Chemical Company
      • 11.3.4.1. Overview
      • 11.3.4.2. Segments and Product
      • 11.3.4.3. Key Financials
      • 11.3.4.4. Market Developments
      • 11.3.4.5. Market Strategy
    • 11.3.5. Sika AG
      • 11.3.5.1. Overview
      • 11.3.5.2. Segments and Product
      • 11.3.5.3. Key Financials
      • 11.3.5.4. Market Developments
      • 11.3.5.5. Market Strategy
    • 11.3.6. Avery Dennison
      • 11.3.6.1. Overview
      • 11.3.6.2. Segments and Product
      • 11.3.6.3. Key Financials
      • 11.3.6.4. Market Developments
      • 11.3.6.5. Market Strategy
    • 11.3.7. Master Bond Inc.
      • 11.3.7.1. Overview
      • 11.3.7.2. Segments and Product
      • 11.3.7.3. Key Financials
      • 11.3.7.4. Market Developments
      • 11.3.7.5. Market Strategy
    • 11.3.8. Lord Corporation
      • 11.3.8.1. Overview
      • 11.3.8.2. Segments and Product
      • 11.3.8.3. Key Financials
      • 11.3.8.4. Market Developments
      • 11.3.8.5. Market Strategy
    • 11.3.9. Huntsman Corporation
      • 11.3.9.1. Overview
      • 11.3.9.2. Segments and Product
      • 11.3.9.3. Key Financials
      • 11.3.9.4. Market Developments
      • 11.3.9.5. Market Strategy
    • 11.3.10. Permabond
      • 11.3.10.1. Overview
      • 11.3.10.2. Segments and Product
      • 11.3.10.3. Key Financials
      • 11.3.10.4. Market Developments
      • 11.3.10.5. Market Strategy
    • 11.3.11. DELO Industries Adhesives
      • 11.3.11.1. Overview
      • 11.3.11.2. Segments and Product
      • 11.3.11.3. Key Financials
      • 11.3.11.4. Market Developments
      • 11.3.11.5. Market Strategy
    • 11.3.12. Panacol
      • 11.3.12.1. Overview
      • 11.3.12.2. Segments and Product
      • 11.3.12.3. Key Financials
      • 11.3.12.4. Market Developments
      • 11.3.12.5. Market Strategy
    • 11.3.13. ITW Polymers Adhesives
      • 11.3.13.1. Overview
      • 11.3.13.2. Segments and Product
      • 11.3.13.3. Key Financials
      • 11.3.13.4. Market Developments
      • 11.3.13.5. Market Strategy

12. Appendix

H12.1. Research Methodology

H12.2. Research Assumptions

H12.3. Acronyms and Abbreviations