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半導體生產設備半導體製造設備

市場調查報告書

商品編碼

1529050

半導體代工市場，依技術節點（7nm、10nm、14nm、22nm、28nm、40nm、65nm、90nm）、依應用（消費性電子、通訊、汽車、工業）、依晶圓尺寸（200mm、300mm、450mm）和預測, 2024 - 2032

Semiconductor Foundry Market, By Technology Node (7nm, 10nm, 14nm, 22nm, 28nm, 40nm, 65nm, 90nm), By Application (Consumer Electronics, Communication, Automotive, Industrial), By Wafer Size (200mm, 300mm, 450mm) & Forecast, 2024 - 2032

出版日期: 2024年05月15日 | 出版商:

Global Market Insights Inc. | 英文 200 Pages | 商品交期: 2-3個工作天內

價格

簡介目錄

在資料中心擴張和物聯網 (IoT) 興起的推動下，2024 年至 2032 年全球半導體代工市場將以 8.8% 的複合年成長率成長。隨著資料中心激增以支援不斷成長的資料處理和儲存需求，對高效能半導體的需求不斷增加。此外，物聯網設備的激增需要半導體來實現連接和功能，這進一步刺激了市場需求。這些趨勢凸顯了對先進半導體製造能力的日益成長的需求，以支援不斷擴大的數位基礎設施和互連設備。

例如，2024年2月，印度政府批准了塔塔電子與台灣功率晶片半導體製造公司合作在古吉拉特邦多萊拉建造半導體工廠的計畫。這一發展凸顯了印度在半導體供應鏈中日益重要的作用，並表明印度將採取戰略舉措來提高全球半導體產能。它可能會導致代工廠的區域分佈更加平衡，降低供應鏈風險，並促進產業創新。

半導體代工產業根據技術節點、應用、晶圓尺寸和地區進行分類。

與較小的晶圓尺寸相比，300 毫米晶圓市場由於其卓越的效率和成本效益，到 2032 年將經歷顯著的改善。較大的晶圓直徑允許每個晶圓生產更多的晶片，從而降低整體製造成本並增強規模經濟。隨著半導體技術的進步和對高性能晶片需求的增加，300mm 細分市場變得越來越重要。它支援複雜、高密度電路的能力推動了其在半導體代工市場的主導地位。

由於汽車中先進電子元件的需求不斷成長，到 2032 年，通訊領域將佔據顯著的市場佔有率。現代汽車越來越依賴半導體來實現自動駕駛、高級駕駛輔助系統 (ADAS)、資訊娛樂和電動車 (EV) 技術等功能。隨著產業朝向更智慧、更互聯和電動化的方向發展，對高性能和可靠的半導體解決方案的需求不斷增加。對複雜汽車電子產品的日益依賴極大地促進了市場的擴張。

在其強大的製造基礎設施、大量技術投資以及不斷成長的電子產品需求的推動下，亞太地區半導體代工產業將在 2024 年和 2032 年實現顯著的複合年成長率。該地區是主要半導體生產商和快速發展的電子行業的所在地，這推動了代工服務的大幅成長。此外，中國、台灣和韓國等國家的有利政府政策和先進技術的不斷採用進一步提振了市場。亞太地區的突出地位和進步使其成為全球半導體代工市場的關鍵貢獻者。

產業生態系統分析
供應商矩陣
利潤率分析
技術與創新格局
專利分析
重要新聞和舉措
監管環境
衝擊力
- 成長動力
  - 各行業對半導體晶片的需求增加
  - 汽車和工業領域的擴張
  - 對客製化設計積體電路的需求不斷成長
  - 智慧城市和基礎設施的發展
  - 消費性電子產品和穿戴式裝置的成長
- 產業陷阱與挑戰
  - 激烈的競爭和定價壓力
  - 技術過時和快速創新週期
成長潛力分析
波特的分析
PESTEL分析

第 4 章：競爭格局

介紹
公司市佔率分析
競爭定位矩陣
戰略展望矩陣

第 5 章：市場估計與預測：按技術節點，2021 - 2032

主要趨勢
7奈米
10奈米
14奈米
22奈米
28奈米
40奈米
65奈米
90奈米
其他

第 6 章：市場估計與預測：依應用分類，2021 - 2032

主要趨勢
消費性電子產品
溝通
汽車
工業的
其他

第 7 章：市場估計與預測：依晶圓尺寸，2021 - 2032 年

主要趨勢
200毫米
300毫米
450毫米

第 8 章：市場估計與預測：按地區，2021 - 2032

主要趨勢
北美洲
- 美國
- 加拿大
歐洲
- 英國
- 德國
- 法國
- 義大利
- 西班牙
- 歐洲其他地區
亞太地區
- 中國
- 印度
- 日本
- 韓國
- 澳新銀行
- 亞太地區其他地區
拉丁美洲
- 巴西
- 墨西哥
- 拉丁美洲其他地區
MEA
- 阿拉伯聯合大公國
- 南非
- 沙烏地阿拉伯
- MEA 的其餘部分

第 9 章：公司簡介

Dongbu Hitek Co. Ltd
Globalfoundries Inc.
Hua Hong Semiconductor Limited
Intel Corporation
Microchip Technologies Inc.
NXP Semiconductors NV
ON Semiconductor Corporation
Powerchip Technology Corporation
Renesas Electronics Corporation
Samsung Electronics Co. Ltd (Samsung Foundry)
Semiconductor Manufacturing International Corporation (SMIC)
Seoul Semiconductor Co., Ltd.
STMicroelectronics NV
Texas Instruments Inc.
Tower Semiconductor Ltd.
TSMC Limited
United Microelectronics Corporation (UMC)
Vanguard International Semiconductor Corporation
X-FAB Silicon Foundries

簡介目錄

Product Code: 9500

Global Semiconductor Foundry Market will expand at an 8.8% CAGR from 2024 to 2032, fueled by the expansion of data centers and the rise of the Internet of Things (IoT). As data centers proliferate to support increased data processing and storage needs, there is a heightened demand for high-performance semiconductors. Also, the proliferation of IoT devices, which require semiconductors for connectivity and functionality, further boosts market demand. These trends underscore the growing need for advanced semiconductor manufacturing capabilities to support the expanding digital infrastructure and interconnected devices.

For instance, in February 2024, the Indian government approved Tata Electronics' plan to build a semiconductor fab in Dholera, Gujarat, in collaboration with Taiwan's Power Chip Semiconductor Manufacturing Corporation. This development highlights India's growing role in the semiconductor supply chain and suggests a strategic move to enhance global semiconductor production capacity. It may lead to a more balanced regional distribution of foundries, reduce supply chain risks, and foster innovation in the industry.

The semiconductor foundry industry is divided based on technology node, application, wafer size, and region.

The 300mm wafer segment will undergo a notable upturn by 2032 due to its superior efficiency and cost-effectiveness compared to smaller wafer sizes. The larger wafer diameter allows for the production of more chips per wafer, reducing overall manufacturing costs and enhancing economies of scale. As semiconductor technology advances and demand for high-performance chips increases, the 300mm segment becomes increasingly vital. Its ability to support complex, high-density circuits drives its dominance in the semiconductor foundry market.

The communication segment will secure a noteworthy market presence by 2032, attributed to the escalating demand for advanced electronic components in vehicles. Modern automobiles increasingly rely on semiconductors for functions such as autonomous driving, advanced driver-assistance systems (ADAS), infotainment, and electric vehicle (EV) technologies. As the industry pushes towards smarter, more connected, and electrified vehicles, the need for high-performance and reliable semiconductor solutions intensifies. This growing reliance on sophisticated automotive electronics significantly contributes to the expansion of the market.

Asia Pacific semiconductor foundry industry will record a remarkable CAGR during 2024 and 2032, propelled by its robust manufacturing infrastructure, significant investments in technology, and growing demand for electronics. The region is home to major semiconductor producers and a rapidly expanding electronics industry, which drives substantial growth in foundry services. Additionally, favorable government policies and increasing adoption of advanced technologies in countries like China, Taiwan, and South Korea further bolster the market. Asia Pacific's prominence and advancements make it a key contributor to the global semiconductor foundry market.

Chapter 1 Methodology & Scope

1.1 Market scope & definition
1.2 Base estimates & calculations
1.3 Forecast calculation
1.4 Data sources
- 1.4.1 Primary
- 1.4.2 Secondary
  - 1.4.2.1 Paid sources
  - 1.4.2.2 Public sources

Chapter 2 Executive Summary

2.1 Semiconductor foundry industry 360° synopsis, 2021 - 2032
2.2 Business trends
- 2.2.1 Total addressable market (TAM), 2024-2032

Chapter 3 Industry Insights

3.1 Industry ecosystem analysis
3.2 Vendor matrix
3.3 Profit margin analysis
3.4 Technology & innovation landscape
3.5 Patent analysis
3.6 Key news and initiatives
3.7 Regulatory landscape
3.8 Impact forces
- 3.8.1 Growth drivers
  - 3.8.1.1 Increased demand for semiconductor chips in various industries
  - 3.8.1.2 Expansion of automotive and industrial sectors
  - 3.8.1.3 Rising demand for custom-designed integrated circuits
  - 3.8.1.4 Development of smart cities and infrastructure
  - 3.8.1.5 Growth in consumer electronics and wearables
- 3.8.2 Industry pitfalls & challenges
  - 3.8.2.1 Intense competition and pricing pressures
  - 3.8.2.2 Technological obsolescence and rapid innovation cycles
3.9 Growth potential analysis
3.10 Porter's analysis
- 3.10.1 Supplier power
- 3.10.2 Buyer power
- 3.10.3 Threat of new entrants
- 3.10.4 Threat of substitutes
- 3.10.5 Industry rivalry
3.11 PESTEL analysis

Chapter 4 Competitive Landscape, 2023

4.1 Introduction
4.2 Company market share analysis
4.3 Competitive positioning matrix
4.4 Strategic outlook matrix

Chapter 5 Market Estimates & Forecast, By Technology Node, 2021 - 2032 (USD Billion)

5.1 Key trends
5.2 7nm
5.3 10nm
5.4 14nm
5.5 22nm
5.6 28nm
5.7 40nm
5.8 65nm
5.9 90nm
5.10 Others

Chapter 6 Market Estimates & Forecast, By Application, 2021 - 2032 (USD Billion)

6.1 Key trends
6.2 Consumer electronics
6.3 Communication
6.4 Automotive
6.5 Industrial
6.6 Others

Chapter 7 Market Estimates & Forecast, By Wafer Size, 2021 - 2032 (USD Billion)

7.1 Key trends
7.2 200mm
7.3 300mm
7.4 450mm

Chapter 8 Market Estimates & Forecast, By Region, 2021 - 2032 (USD Billion)

8.1 Key trends
8.2 North America
- 8.2.1 U.S.
- 8.2.2 Canada
8.3 Europe
- 8.3.1 UK
- 8.3.2 Germany
- 8.3.3 France
- 8.3.4 Italy
- 8.3.5 Spain
- 8.3.6 Rest of Europe
8.4 Asia Pacific
- 8.4.1 China
- 8.4.2 India
- 8.4.3 Japan
- 8.4.4 South Korea
- 8.4.5 ANZ
- 8.4.6 Rest of Asia Pacific
8.5 Latin America
- 8.5.1 Brazil
- 8.5.2 Mexico
- 8.5.3 Rest of Latin America
8.6 MEA
- 8.6.1 UAE
- 8.6.2 South Africa
- 8.6.3 Saudi Arabia
- 8.6.4 Rest of MEA