焊料材料市場機會、成長動力、產業趨勢分析與預測 2024 - 2032

Solder Materials Market Opportunity, Growth Drivers, Industry Trend Analysis, and Forecast 2024 - 2032

出版日期: 2024年09月10日 | 出版商:

Global Market Insights Inc. | 英文 210 Pages | 商品交期: 2-3個工作天內

價格

簡介目錄

2023 年全球焊料材料市場價值為 47 億美元，預計 2024 年至 2032 年複合年成長率為 3.4%。隨著科技的進步，特別是在穿戴式裝置、智慧型裝置和物聯網等領域，可靠焊接材料的需求激增。此外，歐洲和北美等地區的環境法規正在加速向無鉛焊料材料的轉變，鼓勵製造商採用更環保的替代品並推動市場擴張。焊接材料市場按產品類型、形式、工藝和應用進行分類。

市場分為無鉛焊料和鉛基焊料。無鉛焊料在 2023 年佔據市場主導地位，價值 27 億美元，預計到 2032 年將以 3.6% 的複合年成長率成長。無鉛焊料通常由錫、銀和銅等合金製成，可與含鉛替代品的性能相媲美，同時對環境更安全。消費者對環保電子產品日益偏好，進一步推動了向永續實踐的轉變。

依形狀分類，市場分為線材、棒材、糊劑、預成型件和粉末。 2023年，焊絲佔了40.2%的市場佔有率，這主要是由於其在電子製造中的廣泛使用。焊絲對於手動焊接和返工工藝至關重要，可確保各行業 PCB 的可靠連接。儘管電子產品生產的自動化程度不斷提高，但對焊錫絲的需求仍然強勁，保持了其在市場上的主導地位。

市場範圍
開始年份	2023年
預測年份	2024-2032
起始值	47 億美元
預測值	63 億美元
複合年成長率	3.4%

該市場還按工藝細分，包括網版印刷、波峰/回流焊接和選擇性焊接。波峰焊/回流焊因其在電子元件大規模生產中的廣泛應用而佔據主導地位。這種方法可提供高精度和一致的質量，使其成為製造複雜 PCB 的關鍵。電子產業引領市場，佔 60% 的佔有率。

電信和運算等產業對可靠焊接的需求不斷成長，進一步支持了這種主導地位。小型化元件的日益普及鞏固了電子領域的領先地位。亞太地區以強大的電子製造基地引領焊接材料市場。該地區先進的基礎設施和技術投資進一步有助於其在全球市場需求中的領先地位。

The Global Solder Materials Market was valued at USD 4.7 billion in 2023 and is projected to reach grow at a CAGR of 3.4% from 2024 to 2032. This growth is largely driven by the increasing demand for electronics and consumer devices. As technology advances, particularly in areas such as wearables, smart devices, and IoT, the need for reliable solder materials has surged. Additionally, environmental regulations in regions like Europe and North America are accelerating the shift towards lead-free solder materials, encouraging manufacturers to adopt more eco-friendly alternatives and fueling market expansion. The solder materials market is categorized by product type, form, process, and application.

The market is segmented into lead-free and lead-based solder. Lead-free solder dominated the market with a value of USD 2.7 billion in 2023 and is projected to grow at a CAGR of 3.6% by 2032. This growth is mainly driven by environmental regulations that restrict the use of hazardous materials. Lead-free solder, often made from alloys like tin, silver, and copper, matches the performance of lead-based alternatives while being safer for the environment. The shift towards sustainable practices is further bolstered by consumers' increasing preference for eco-friendly electronics.

By form, the market is segmented into wire, bar, paste, preforms, and powder. In 2023, wire solder held a 40.2% share of the market, largely due to its extensive use in electronics manufacturing. Wire solder is essential for manual soldering and rework processes, ensuring reliable connections in PCBs across various industries. Despite growing automation in electronics production, the demand for wire solder remains strong, maintaining its dominant position in the market.

Market Scope
Start Year	2023
Forecast Year	2024-2032
Start Value	$4.7 Billion
Forecast Value	$6.3 Billion
CAGR	3.4%

The market is also segmented by process, including screen printing, wave/reflow, and selective soldering. Wave/reflow soldering dominates due to its widespread application in the mass production of electronic components. This method delivers high precision and consistent quality, making it essential in manufacturing complex PCBs. The electronics sector leads the market, holding a 60% share.

The rising demand for reliable soldering in sectors, such as telecommunications and computing further supports this dominance. The increasing use of miniaturized components has solidified the electronics segment's leading position. The Asia Pacific region leads the solder materials market, attributed to a strong electronics manufacturing base. This region's advanced infrastructure and technology investments further contribute to its leadership in global market demand.

Chapter 1 Methodology & Scope

1.1 Market scope & definition
1.2 Base estimates & calculations
1.3 Forecast calculation
1.4 Data sources
- 1.4.1 Primary
- 1.4.2 Secondary
  - 1.4.2.1 Paid sources
  - 1.4.2.2 Public sources

Chapter 2 Executive Summary

2.1 Industry 360° synopsis

Chapter 3 Industry Insights

3.1 Industry ecosystem analysis
- 3.1.1 Key manufacturers
- 3.1.2 Distributors
- 3.1.3 Profit margins across the industry
3.2 Industry impact forces
- 3.2.1 Growth drivers
- 3.2.2 Market challenges
- 3.2.3 Market opportunity
  - 3.2.3.1 New opportunities
  - 3.2.3.2 Growth potential analysis
3.3 Raw material landscape
3.4 Sustainable manufacturing
3.5 Pricing trends (USD/Ton), 2021 to 2032
3.6 Regulations & market impact
3.7 Porter's analysis
3.8 PESTEL analysis

Chapter 4 Competitive Landscape, 2023

4.1 Introduction
4.2 Company matrix analysis
4.3 Company market share analysis
- 4.3.1 Company Market share analysis by region
  - 4.3.1.1 North America
  - 4.3.1.2 Europe
  - 4.3.1.3 Asia Pacific
  - 4.3.1.4 Latin America
  - 4.3.1.5 Middle East Africa
4.4 Competitive positioning matrix
4.5 Strategic dashboard

Chapter 5 Market Size and Forecast, By Product Type, 2021-2032 (USD Billion, Kilo Tons)

5.1 Key trends
5.2 Lead-based solder
5.3 Lead-free solder

Chapter 6 Market Size and Forecast, By Form, 2021-2032 (USD Billion, Kilo Tons)

6.1 Key trends
6.2 Wire
6.3 Paste
6.4 Bar
6.5 Preforms
6.6 Powder

Chapter 7 Market Size and Forecast, By Process, 2021-2032 (USD Billion, Kilo Tons)

7.1 Key trends
7.2 Screen printing
7.3 Wave/reflow
7.4 Selective soldering

Chapter 8 Market Size and Forecast, By Application, 2021-2032 (USD Billion, Kilo Tons)

8.1 Key trends
8.2 Electronics
8.3 Automotive
8.4 Aerospace
8.5 Industrial

Chapter 9 Market Size and Forecast, By Region, 2021-2032 (USD Billion, Kilo Tons)

9.1 Key trends
9.2 North America
- 9.2.1 U.S.
- 9.2.2 Canada
9.3 Europe
- 9.3.1 Germany
- 9.3.2 UK
- 9.3.3 France
- 9.3.4 Italy
- 9.3.5 Spain
9.4 Asia Pacific
- 9.4.1 China
- 9.4.2 India
- 9.4.3 Japan
- 9.4.4 South Korea
- 9.4.5 Australia
9.5 Latin America
- 9.5.1 Brazil
- 9.5.2 Mexico
- 9.5.3 Argentina
9.6 MEA
- 9.6.1 Saudi Arabia
- 9.6.2 UAE
- 9.6.3 South Africa