查看購物車
  • Simplified Chinese
  • English
  • Japanese
  • Korean
封面
市場調查報告書
商品編碼
1617236

預成型錫片市場至2030年的預測：按類型、形式、應用、最終用戶和地區的全球分析

Solder Preform Market Forecasts to 2030 - Global Analysis By Type (Solid Solder Preforms, Flux-Cored Solder Preforms, Composite Solder Preforms, Paste Solder Preforms and Other Types), Form, Application, End User and By Geography
出版日期: | 出版商: Stratistics Market Research Consulting | 英文 200+ Pages | 商品交期: 2-3個工作天內

價格

根據 Stratistics MRC 的資料，全球預成型錫片市場在預測期內將以 8.5%的年複合成長率成長。

預成型焊料是用於各種電子、機械和工業組裝過程的預成型焊接材料。它們由錫、鉛、銀、金和其他金屬等合金製成，具有標準形狀，如圓盤、墊圈、帶狀和自訂配置。透過保持一致的焊接品質並向目標區域提供正確數量的焊料來消除浪費。它在航太、汽車、醫療設備和半導體製造等高可靠性應用中特別有效。它與回流焊接等自動化製程相容，在受控熱量下熔化，形成牢固的接頭。助焊劑通常摻入預成型件中或單獨塗布。

電子產品的需求不斷成長

家用電子電器、汽車、航太和醫療設備等領域對精密焊接的需求增加了電子設備中對可靠、耐用焊點的需求。預成型焊料非常適合這些應用，因為它們可確保均勻的焊料分佈並增強組件的機械和電氣完整性。因此，預成型錫片的採用率不斷提高，其市場佔有率也不斷增加。

小企業的技術壁壘

中小型企業在採用新技術將預成型錫片納入生產線時經常面臨財務挑戰。自動化設備和機械（例如回流焊接爐和精密貼裝系統）的初始成本高昂，令許多公司望而卻步。因此，預成型錫片的優點（例如提高精度和減少焊料浪費）無法充分利用，阻礙了市場成長。

製造自動化的進展

製造中的自動化技術優先考慮與預成型錫片的優勢相匹配的精度和一致性。這些預成型件可提供均勻且精確的焊料分佈，這對於高品質電子組件非常重要。機械臂、焊接設備和回流焊接爐等自動化系統可以高精度定位和熔化焊料預成型件，最大限度地減少缺陷並創建可靠的接頭。這提高了家用電子電器和汽車系統的產品性能並降低了故障率。

與替代焊接方法的競爭

預成型焊料對於精密接頭非常有效，但在客製化複雜應用方面有其限制。助焊劑和焊膏印刷等替代方案具有更大的適應性，可以適應不同的元件尺寸和基板配置。這種靈活性對於需要專門焊接解決方案的製造商特別有吸引力，減少了對基於預成型件的焊接的需求並阻礙了市場成長。

COVID-19 的影響

COVID-19 大流行擾亂了供應鏈、導致生產延誤並造成原料短缺，對預成型錫片市場產生了重大影響。製造工廠面臨裁員和關閉，導致產量減少和計劃延誤。疫情也導致需求格局發生變化，家電、醫療設備等電子產業的需求因消費行為變化和醫療設備需求增加而波動。然而，隨著製造業的穩定和疫情後電子產品需求的持續成長，市場復甦。

預計固體預成型錫片細分市場在預測期內將是最大的

由於固體焊料預成型件具有穩定的品質和可靠性，可生產高品質焊點，預計在預測期內將出現最大需求，特別是在航太、汽車和醫療設備等行業。固態焊料預成型件也適用於電子組裝等自動化製造程序，以提高營運效率和產量。因此，隨著製造商尋求簡化生產和降低人事費用，基於預成型坯的焊接解決方案市場日益擴大。

在預測期內，LED 製造領域的年複合成長率最高。

LED製造領域需要高溫焊接以實現有效散熱，因此需要由能夠承受高溫的材料製成的固體焊料預成型件。由於需要提高高溫下的穩定性和性能以及提高效率和速度，LED 製造對特種材料的需求不斷增加，使得焊料預成型件適合自動化組裝，並且 LED 領域的需求不斷增加。

佔有率最大的地區

由於家用電子電器、工業自動化、通訊和汽車領域的整合，對電子設備的需求持續強勁，北美，尤其是美國和加拿大，將在預測期內佔據最大的市場佔有率。電子產業的擴張是預成型錫片市場的關鍵促進因素，因為預成型錫片對於電子元件的組裝和焊接非常重要。隨著更小、更有效率的電子設備的普及，對確保可靠連接和高耐用性的高品質焊料預成型件的需求不斷增加。

年複合成長率最高的地區：

由於智慧型手機、平板電腦、穿戴式裝置和智慧家庭產品等家用電子電器的需求激增，將顯著推動亞太預成型錫片市場的發展，預計亞太地區的年複合成長率將達到最高。家用電子電器需要精密焊接以確保可靠的性能和耐用性。這導致對高品質焊料預成型件的需求不斷成長，特別是那些滿足小型化和高組件整合度特定行業標準的焊料預成型件。

提供免費客製化

訂閱此報告的客戶可以存取以下免費自訂選項之1：

  • 公司簡介
    • 其他市場參與者的綜合分析（最多3家公司）
    • 主要企業SWOT分析（最多3家公司）
  • 區域細分
    • 根據客戶興趣對主要國家的市場估計、預測和年複合成長率（註：基於可行性檢查）
  • 競爭標基準化分析
    • 根據產品系列、地理分佈和策略聯盟對主要企業基準化分析

目錄

第1章 執行摘要

第2章 前言

  • 概述
  • 相關利益者
  • 調查範圍
  • 調查方法
    • 資料探勘
    • 資料分析
    • 資料檢驗
    • 研究途徑
  • 研究資訊來源
    • 主要研究資訊來源
    • 二次研究資訊來源
    • 先決條件

第3章 市場趨勢分析

  • 促進要素
  • 抑制因素
  • 機會
  • 威脅
  • 應用分析
  • 最終用戶分析
  • 新興市場
  • COVID-19 的影響

第4章 波特五力分析

  • 供應商的議價能力
  • 買方議價能力
  • 替代品的威脅
  • 新進入者的威脅
  • 競爭公司之間的敵對關係

第5章 全球預成型錫片市場：依類型

  • 固體預成型焊料
  • 助焊劑芯預成型焊料
  • 複合預成型焊料
  • 預成型焊膏
  • 其他類型

第6章 全球預成型錫片市場：依形式分類

  • 片材和鋁箔
  • 線材和棒材
  • 環
  • 自訂形狀
  • 其他形式

第7章 全球預成型錫片市場：依應用分類

  • PCB（印刷基板）組裝
  • 半導體封裝
  • LED製造
  • 電池製造和汽車電子
  • 軍事和航太電子
  • 穿戴式醫療設備
  • 電池和能源儲存
  • 工業控制系統
  • 其他用途

第8章 全球預成型錫片市場：依最終用戶分類

  • 電子產品
  • 車輛
  • 衛生保健
  • 能源和電力
  • 消費品
  • 其他最終用戶

第9章 全球預成型錫片市場：依地區

  • 北美洲
    • 美國
    • 加拿大
    • 墨西哥
  • 歐洲
    • 德國
    • 英國
    • 義大利
    • 法國
    • 西班牙
    • 其他歐洲國家
  • 亞太地區
    • 日本
    • 中國
    • 印度
    • 澳洲
    • 紐西蘭
    • 韓國
    • 其他亞太地區
  • 南美洲
    • 阿根廷
    • 巴西
    • 智利
    • 南美洲其他地區
  • 中東、非洲
    • 沙烏地阿拉伯
    • 阿拉伯聯合大公國
    • 卡達
    • 南非
    • 其他中東和非洲

第10章 主要進展

  • 合約、夥伴關係、合作和合資企業
  • 收購和合併
  • 新產品發布
  • 業務拓展
  • 其他關鍵策略

第11章 公司概況

  • AIM
  • Alpha Assembly Solutions
  • AMETEK Coining
  • FCT Assembly
  • Fromosol
  • Fusite Co.
  • Harris Products
  • Indium Corporation
  • Kester
  • Nihon Superior
  • Qualitek International
  • Senju Metal Industry Co. Ltd
  • Shanghai Huaqing
  • Solderwell Advanced Materials
  • Stella Welding Alloys
  • Teka Interconnection Systems Co. Ltd
Product Code: SMRC28116

According to Stratistics MRC, the Global Solder Preform Market is growing at a CAGR of 8.5% during the forecast period. A solder preform is a pre-shaped piece of solder material used in various electronic, mechanical, and industrial assembly processes. Made from alloys like tin, lead, silver, gold, or other metals, they come in standardized shapes like discs, washers, ribbons, or custom configurations. They ensure consistent soldering quality and reduce waste by delivering an exact amount of solder to a targeted area. They are particularly effective in high-reliability applications like aerospace, automotive, medical devices, and semiconductor manufacturing. They are compatible with automated processes like reflow soldering, where they melt under controlled heat to create strong bonds. Flux is often integrated into preforms or applied separately.

Market Dynamics:

Driver:

Growing demand for electronics

The demand for reliable and durable solder joints in electronic devices is increasing due to the need for precision soldering in sectors like consumer electronics, automotive, aerospace, and medical devices. Solder preforms are ideal for these applications as they ensure uniform solder distribution, enhancing component mechanical and electrical integrity. This has led to higher adoption of solder performs boosting its markets presence.

Restraint:

Technological barriers for smaller companies

Smaller companies often face financial difficulties when adopting new technologies for integrating solder preforms into their production lines. High upfront costs of automated equipment and machinery, such as reflow ovens and precision placement systems, can be prohibitive for many businesses. This can hinder their ability to fully utilize the benefits of solder preforms, such as improved accuracy and reduced solder waste hampering the market growth.

Opportunity:

Increased automation in manufacturing

Automation technologies in manufacturing prioritize precision and consistency, which align with the benefits of solder preforms. These preforms deliver uniform and accurate solder distribution, essential for high-quality electronic assemblies. Automated systems like robotic arms, soldering machines, and reflow ovens can place and melt solder preforms with high accuracy, minimizing defects and ensuring reliable joints. This leads to improved product performance and reduced failure rates in consumer electronics and automotive systems.

Threat:

Competition from alternative soldering methods

Solder preforms are effective for precise joints, but they have limitations in customization for complex applications. Alternative methods like flux-cored solder wire and solder paste printing offer greater adaptability, suitable for various component sizes and board configurations. This flexibility is particularly appealing to manufacturers needing specialized soldering solutions, decreasing the demand for preform-based soldering impeding growth of the market.

Covid-19 Impact

The COVID-19 pandemic significantly impacted the solder preform market by disrupting supply chains, causing delays in production, and creating shortages of raw materials. Manufacturing plants faced workforce reductions and shutdowns, leading to decreased output and project delays. The pandemic also shifted demand patterns as electronics industries, such as consumer electronics and medical devices, saw fluctuating needs due to changes in consumer behavior and increased demand for medical equipment. However, the market is rebounding as manufacturing stabilizes, and electronic demand continues to grow post-pandemic.

The solid solder preforms segment is expected to be the largest during the forecast period

The solid solder preforms is expected to be the largest during the forecast period owing to consistent quality and reliability in producing high-quality solder joints, particularly in industries like aerospace, automotive, and medical devices. Solid solder preforms are also well-suited for automated manufacturing processes, such as electronics assembly, as they enhance operational efficiency and throughput. This has led to a growing market for preform-based soldering solutions, as manufacturers seek to streamline production and reduce labor costs.

The LED manufacturing segment is expected to have the highest CAGR during the forecast period

The LED manufacturing segment is expected to have the highest CAGR during the forecast period because LEDs require high-temperature soldering for effective heat dissipation, necessitating solid solder preforms made from materials that can withstand high temperatures. The demand for specialized materials in LED manufacturing is increasing due to the need for stability and performance at elevated temperatures which have increased efficiency and speed, making solder preforms suitable for automated assembly lines, boosting demand in the LED sector.

Region with largest share:

North America is expected to hold the largest market share during the forecast period owing to North America, particularly the United States and Canada, continues to see a robust demand for electronic devices due to their integration into consumer electronics, industrial automation, telecommunications, and automotive sectors. The expansion of the electronics industry is a significant driver for the solder preform market, as these preforms are vital for assembling and soldering electronic components. With the push towards more compact and efficient electronics, the demand for high-quality solders preforms that ensure reliable connections and high durability is on the rise.

Region with highest CAGR:

Asia Pacific is projected to hold the highest CAGR over the forecast period due to surging demand for consumer electronics, such as smartphones, tablets, wearable devices, and smart home products, has been a significant driver for the Asia-Pacific solder preform market. Consumer electronics require high-precision soldering to ensure reliable performance and durability. This has led to an increased need for high-quality solder preforms, especially those that meet specific industry standards for miniaturization and advanced component integration.

Key players in the market

Some of the key players in Solder Preform market include AIM, Alpha Assembly Solutions, AMETEK Coining, FCT Assembly, Fromosol, Fusite Co., Harris Products, Indium Corporation, Kester, Nihon Superior, Qualitek International, Senju Metal Industry Co. Ltd, Shanghai Huaqing, Solderwell Advanced Materials, Stella Welding Alloys and Teka Interconnection Systems Co. Ltd.

Key Developments:

In November 2024, Indium Corporation announced that InnoJoin GmbH will be the exclusive global sales partner for NanoFoil(R) in component mounting applications. NanoFoil(R) is a leading nanotechnology material that delivers energy in a controlled and precise manner for joining, energetics, and heating applications.

In November 2024, Shanghai Stock Exchange, Deutsche Borse Group and China Europe International Exchange signed a memorandum of understanding on special cooperation on depository receipts under the stock connect. This is an important measure for the SSE to actively promote the high-level institutional two-way opening up of the capital.

In July 2024, Indium Corporation(R) introduced new, high-reliability Au-based Precision Die-Attach (PDA) Preforms. Compared to standard preforms, these gold-based PDA preforms offer a higher level of precision to reduce defects, control bondline thickness (BLT), and deliver high-yield performance and reliability in critical die-attach applications.

Types Covered:

  • Solid Solder Preforms
  • Flux-Cored Solder Preforms
  • Composite Solder Preforms
  • Paste Solder Preforms
  • Other Types

Forms Covered:

  • Sheet & Foil
  • Wire & Rod
  • Ring
  • Custom Shapes
  • Other Forms

Applications Covered:

  • PCB (Printed Circuit Board) Assembly
  • Semiconductor Packaging
  • LED Manufacturing
  • Battery Manufacturing & Automotive Electronics
  • Military & Aerospace Electronics
  • Wearable Medical Device
  • Batteries & Energy Storage
  • Industrial Control System
  • Other Applications

End Users Covered:

  • Electronics
  • Automotive
  • Healthcare
  • Energy & Power
  • Consumer Goods
  • Other End Users

Regions Covered:

  • North America
    • US
    • Canada
    • Mexico
  • Europe
    • Germany
    • UK
    • Italy
    • France
    • Spain
    • Rest of Europe
  • Asia Pacific
    • Japan
    • China
    • India
    • Australia
    • New Zealand
    • South Korea
    • Rest of Asia Pacific
  • South America
    • Argentina
    • Brazil
    • Chile
    • Rest of South America
  • Middle East & Africa
    • Saudi Arabia
    • UAE
    • Qatar
    • South Africa
    • Rest of Middle East & Africa

What our report offers:

  • Market share assessments for the regional and country-level segments
  • Strategic recommendations for the new entrants
  • Covers Market data for the years 2022, 2023, 2024, 2026, and 2030
  • Market Trends (Drivers, Constraints, Opportunities, Threats, Challenges, Investment Opportunities, and recommendations)
  • Strategic recommendations in key business segments based on the market estimations
  • Competitive landscaping mapping the key common trends
  • Company profiling with detailed strategies, financials, and recent developments
  • Supply chain trends mapping the latest technological advancements

Free Customization Offerings:

All the customers of this report will be entitled to receive one of the following free customization options:

  • Company Profiling
    • Comprehensive profiling of additional market players (up to 3)
    • SWOT Analysis of key players (up to 3)
  • Regional Segmentation
    • Market estimations, Forecasts and CAGR of any prominent country as per the client's interest (Note: Depends on feasibility check)
  • Competitive Benchmarking
    • Benchmarking of key players based on product portfolio, geographical presence, and strategic alliances

Table of Contents

1 Executive Summary

2 Preface

  • 2.1 Abstract
  • 2.2 Stake Holders
  • 2.3 Research Scope
  • 2.4 Research Methodology
    • 2.4.1 Data Mining
    • 2.4.2 Data Analysis
    • 2.4.3 Data Validation
    • 2.4.4 Research Approach
  • 2.5 Research Sources
    • 2.5.1 Primary Research Sources
    • 2.5.2 Secondary Research Sources
    • 2.5.3 Assumptions

3 Market Trend Analysis

  • 3.1 Introduction
  • 3.2 Drivers
  • 3.3 Restraints
  • 3.4 Opportunities
  • 3.5 Threats
  • 3.6 Application Analysis
  • 3.7 End User Analysis
  • 3.8 Emerging Markets
  • 3.9 Impact of Covid-19

4 Porters Five Force Analysis

  • 4.1 Bargaining power of suppliers
  • 4.2 Bargaining power of buyers
  • 4.3 Threat of substitutes
  • 4.4 Threat of new entrants
  • 4.5 Competitive rivalry

5 Global Solder Preform Market, By Type

  • 5.1 Introduction
  • 5.2 Solid Solder Preforms
  • 5.3 Flux-Cored Solder Preforms
  • 5.4 Composite Solder Preforms
  • 5.5 Paste Solder Preforms
  • 5.6 Other Types

6 Global Solder Preform Market, By Form

  • 6.1 Introduction
  • 6.2 Sheet & Foil
  • 6.3 Wire & Rod
  • 6.4 Ring
  • 6.5 Custom Shapes
  • 6.6 Other Forms

7 Global Solder Preform Market, By Application

  • 7.1 Introduction
  • 7.2 PCB (Printed Circuit Board) Assembly
  • 7.3 Semiconductor Packaging
  • 7.4 LED Manufacturing
  • 7.5 Battery Manufacturing & Automotive Electronics
  • 7.6 Military & Aerospace Electronics
  • 7.7 Wearable Medical Device
  • 7.8 Batteries & Energy Storage
  • 7.9 Industrial Control System
  • 7.10 Other Applications

8 Global Solder Preform Market, By End User

  • 8.1 Introduction
  • 8.2 Electronics
  • 8.3 Automotive
  • 8.4 Healthcare
  • 8.5 Energy & Power
  • 8.6 Consumer Goods
  • 8.7 Other End Users

9 Global Solder Preform Market, By Geography

  • 9.1 Introduction
  • 9.2 North America
    • 9.2.1 US
    • 9.2.2 Canada
    • 9.2.3 Mexico
  • 9.3 Europe
    • 9.3.1 Germany
    • 9.3.2 UK
    • 9.3.3 Italy
    • 9.3.4 France
    • 9.3.5 Spain
    • 9.3.6 Rest of Europe
  • 9.4 Asia Pacific
    • 9.4.1 Japan
    • 9.4.2 China
    • 9.4.3 India
    • 9.4.4 Australia
    • 9.4.5 New Zealand
    • 9.4.6 South Korea
    • 9.4.7 Rest of Asia Pacific
  • 9.5 South America
    • 9.5.1 Argentina
    • 9.5.2 Brazil
    • 9.5.3 Chile
    • 9.5.4 Rest of South America
  • 9.6 Middle East & Africa
    • 9.6.1 Saudi Arabia
    • 9.6.2 UAE
    • 9.6.3 Qatar
    • 9.6.4 South Africa
    • 9.6.5 Rest of Middle East & Africa

10 Key Developments

  • 10.1 Agreements, Partnerships, Collaborations and Joint Ventures
  • 10.2 Acquisitions & Mergers
  • 10.3 New Product Launch
  • 10.4 Expansions
  • 10.5 Other Key Strategies

11 Company Profiling

  • 11.1 AIM
  • 11.2 Alpha Assembly Solutions
  • 11.3 AMETEK Coining
  • 11.4 FCT Assembly
  • 11.5 Fromosol
  • 11.6 Fusite Co.
  • 11.7 Harris Products
  • 11.8 Indium Corporation
  • 11.9 Kester
  • 11.10 Nihon Superior
  • 11.11 Qualitek International
  • 11.12 Senju Metal Industry Co. Ltd
  • 11.13 Shanghai Huaqing
  • 11.14 Solderwell Advanced Materials
  • 11.15 Stella Welding Alloys
  • 11.16 Teka Interconnection Systems Co. Ltd

List of Tables

  • Table 1 Global Solder Preform Market Outlook, By Region (2022-2030) ($MN)
  • Table 2 Global Solder Preform Market Outlook, By Type (2022-2030) ($MN)
  • Table 3 Global Solder Preform Market Outlook, By Solid Solder Preforms (2022-2030) ($MN)
  • Table 4 Global Solder Preform Market Outlook, By Flux-Cored Solder Preforms (2022-2030) ($MN)
  • Table 5 Global Solder Preform Market Outlook, By Composite Solder Preforms (2022-2030) ($MN)
  • Table 6 Global Solder Preform Market Outlook, By Paste Solder Preforms (2022-2030) ($MN)
  • Table 7 Global Solder Preform Market Outlook, By Other Types (2022-2030) ($MN)
  • Table 8 Global Solder Preform Market Outlook, By Form (2022-2030) ($MN)
  • Table 9 Global Solder Preform Market Outlook, By Sheet & Foil (2022-2030) ($MN)
  • Table 10 Global Solder Preform Market Outlook, By Wire & Rod (2022-2030) ($MN)
  • Table 11 Global Solder Preform Market Outlook, By Ring (2022-2030) ($MN)
  • Table 12 Global Solder Preform Market Outlook, By Custom Shapes (2022-2030) ($MN)
  • Table 13 Global Solder Preform Market Outlook, By Other Forms (2022-2030) ($MN)
  • Table 14 Global Solder Preform Market Outlook, By Application (2022-2030) ($MN)
  • Table 15 Global Solder Preform Market Outlook, By PCB (Printed Circuit Board) Assembly (2022-2030) ($MN)
  • Table 16 Global Solder Preform Market Outlook, By Semiconductor Packaging (2022-2030) ($MN)
  • Table 17 Global Solder Preform Market Outlook, By LED Manufacturing (2022-2030) ($MN)
  • Table 18 Global Solder Preform Market Outlook, By Battery Manufacturing & Automotive Electronics (2022-2030) ($MN)
  • Table 19 Global Solder Preform Market Outlook, By Military & Aerospace Electronics (2022-2030) ($MN)
  • Table 20 Global Solder Preform Market Outlook, By Wearable Medical Device (2022-2030) ($MN)
  • Table 21 Global Solder Preform Market Outlook, By Batteries & Energy Storage (2022-2030) ($MN)
  • Table 22 Global Solder Preform Market Outlook, By Industrial Control System (2022-2030) ($MN)
  • Table 23 Global Solder Preform Market Outlook, By Other Applications (2022-2030) ($MN)
  • Table 24 Global Solder Preform Market Outlook, By End User (2022-2030) ($MN)
  • Table 25 Global Solder Preform Market Outlook, By Electronics (2022-2030) ($MN)
  • Table 26 Global Solder Preform Market Outlook, By Automotive (2022-2030) ($MN)
  • Table 27 Global Solder Preform Market Outlook, By Healthcare (2022-2030) ($MN)
  • Table 28 Global Solder Preform Market Outlook, By Energy & Power (2022-2030) ($MN)
  • Table 29 Global Solder Preform Market Outlook, By Consumer Goods (2022-2030) ($MN)
  • Table 30 Global Solder Preform Market Outlook, By Other End Users (2022-2030) ($MN)

Note: Tables for North America, Europe, APAC, South America, and Middle East & Africa Regions are also represented in the same manner as above.