封面
市場調查報告書
商品編碼
1677902

焊料材料市場規模、佔有率及成長分析(按合金類型、助焊劑類型、應用、形式、製程和地區)-2025-2032 年產業預測

Solder Materials Market Size, Share, and Growth Analysis, By Alloy Type (Lead-Based Solder, Lead-Free Solder), By Flux Type (Rosin-Based Flux, No-Clean Flux), By Applications, By Form, By Process, By Region - Industry Forecast 2025-2032

出版日期: | 出版商: SkyQuest | 英文 185 Pages | 商品交期: 3-5個工作天內

價格
簡介目錄

預計焊料材料市場規模將在 2023 年達到 300 億美元,從 2024 年的 312 億美元成長到 2032 年的 427 億美元,預測期內(2025-2032 年)的複合年成長率為 4.0%。

受智慧型手機、平板電腦和筆記型電腦等電子設備需求不斷成長的推動,全球焊料材料市場呈上升趨勢。特別是5G、AI等技術的快速進步極大地推動了市場的成長,而小型化趨勢則對具有優異導電性和導熱性的焊料材料產生了需求。此外,人們的環保意識不斷增強,推動了無鉛焊料的普及。人們對具有耐腐蝕性和極端溫度下穩定性的高性能材料的需求不斷成長。汽車和航太等行業需要先進的電子系統,因此代表著巨大的商機。隨著電動和混合動力汽車產量的增加,電子產業將繼續成為主要驅動力,確保未來四年對焊料的需求強勁。

目錄

介紹

  • 調查目的
  • 研究範圍
  • 定義

調查方法

  • 資訊採購
  • 二次資料和一次資料方法
  • 市場規模預測
  • 市場假設與限制

執行摘要

  • 全球市場展望
  • 供需趨勢分析
  • 細分機會分析

市場動態與展望

  • 市場概覽
  • 市場規模
  • 市場動態
    • 促進因素和機會
    • 限制與挑戰
  • 波特的分析

關鍵市場考察

  • 關鍵成功因素
  • 競爭程度
  • 主要投資機會
  • 市場生態系統
  • 市場吸引力指數(2024年)
  • PESTEL分析
  • 總體經濟指標
  • 價值鏈分析
  • 定價分析

焊料市場規模(按合金類型和複合年成長率) (2025-2032)

  • 市場概覽
  • 含鉛焊料
  • 無鉛焊料
  • 特殊焊料

焊錫材料市場規模(依助焊劑類型及複合年成長率)(2025-2032)

  • 市場概覽
  • 松香基助焊劑
  • 免清洗助焊劑
  • 水溶性助焊劑

焊錫材料市場規模(按應用分類)及複合年成長率(2025-2032)

  • 市場概覽
  • 電子產品
  • 航太
  • 工業機械

焊錫材料市場規模(按類型及複合年成長率) (2025-2032)

  • 市場概覽
  • 貼上
  • 金屬絲
  • 酒吧
  • 預製棒

焊料材料市場規模(按工藝和複合年成長率) (2025-2032)

  • 市場概覽
  • 波峰焊/回流焊接
  • 網版印刷
  • 雷射
  • 機器人

焊錫材料市場規模(按地區)及複合年成長率(2025-2032)

  • 北美洲
    • 美國
    • 加拿大
  • 歐洲
    • 德國
    • 西班牙
    • 法國
    • 英國
    • 義大利
    • 其他歐洲國家地區
  • 亞太地區
    • 中國
    • 印度
    • 日本
    • 韓國
    • 其他亞太地區
  • 拉丁美洲
    • 巴西
    • 其他拉丁美洲
  • 中東和非洲
    • 海灣合作理事會國家
    • 南非
    • 其他中東和非洲地區

競爭資訊

  • 前五大公司對比
  • 主要企業市場定位(2024年)
  • 主要市場參與者所採取的策略
  • 近期市場趨勢
  • 公司市場佔有率分析(2024年)
  • 主要企業簡介
    • 公司詳情
    • 產品系列分析
    • 公司分部佔有率分析
    • 收益與前一年同期比較對比(2022-2024 年)

主要企業簡介

  • Indium Corporation(USA)
  • Alpha Assembly Solutions(USA)
  • AIM Solder(Canada)
  • Kester(USA)
  • Senju Metal Industry Co., Ltd.(Japan)
  • Nihon Superior Co., Ltd.(Japan)
  • Heraeus Holding GmbH(Germany)
  • MBO Osswald GmbH & Co. KG(Germany)
  • Qualitek International, Inc.(USA)
  • TAMURA Corporation(Japan)
  • Inventec Performance Chemicals(France)
  • Fusion Incorporated(USA)
  • KOKI Company Limited(Japan)
  • Metallic Resources, Inc.(USA)
  • Shenzhen Jufeng Solder Co., Ltd.(China)
  • Canfield Technologies(USA)
  • Balver Zinn Josef Jost GmbH & Co. KG(Germany)
  • Stannol GmbH & Co. KG(Germany)
  • Advanced Joining Technology(USA)
  • Henkel AG & Co. KGaA(Germany)

結論和建議

簡介目錄
Product Code: SQMIG45N2110

Solder Materials Market size was valued at USD 30.0 billion in 2023 and is poised to grow from USD 31.2 billion in 2024 to USD 42.7 billion by 2032, growing at a CAGR of 4.0% during the forecast period (2025-2032).

The global solder materials market is on an upward trajectory, fueled by the rising demand for electronic devices such as smartphones, tablets, and laptops. Rapid technological advancements, particularly in 5G and AI, are significantly propelling market growth, while the trend toward miniaturization necessitates solder materials with superior electrical and thermal conductivity. Additionally, the rise in eco-consciousness is driving the popularity of lead-free solder options. Demand is further amplified for high-performance materials that offer corrosion resistance and stability under extreme temperatures. Industries such as automotive and aerospace present substantial opportunities as they require advanced electronic systems. As production of electric and hybrid vehicles increases, the electronic sector will continue to be the primary driver, ensuring robust demand for solder materials over the next four years.

Top-down and bottom-up approaches were used to estimate and validate the size of the Solder Materials market and to estimate the size of various other dependent submarkets. The research methodology used to estimate the market size includes the following details: The key players in the market were identified through secondary research, and their market shares in the respective regions were determined through primary and secondary research. This entire procedure includes the study of the annual and financial reports of the top market players and extensive interviews for key insights from industry leaders such as CEOs, VPs, directors, and marketing executives. All percentage shares split, and breakdowns were determined using secondary sources and verified through Primary sources. All possible parameters that affect the markets covered in this research study have been accounted for, viewed in extensive detail, verified through primary research, and analyzed to get the final quantitative and qualitative data.

Solder Materials Market Segments Analysis

Global Solder Materials Market is segmented by Alloy Type, Flux Type, Applications, Form, Process and region. Based on Alloy Type, the market is segmented into Lead-Based Solder, Lead-Free Solder and Specialty Solder. Based on Flux Type, the market is segmented into Rosin-Based Flux, No-Clean Flux and Water-Soluble Flux. Based on Applications, the market is segmented into Electronics, Automotive, Aerospace and Industrial Machinery. Based on Form, the market is segmented into Paste, Wire, Bar and Preforms. Based on Process, the market is segmented into Wave/reflow, Screen Printing', Laser and Robotic. Based on region, the market is segmented into North America, Europe, Asia Pacific, Latin America and Middle East & Africa.

Driver of the Solder Materials Market

The increasing demand for consumer electronics such as smartphones, laptops, and wearable devices is a primary catalyst for the growth of the global solder materials market. As technological advancements progress, manufacturers require advanced solder materials to ensure optimal performance, enhance miniaturization, and provide long-lasting durability in increasingly complex electronic devices. This trend is fueling the need for innovative solder solutions that can meet the stringent requirements of modern electronics. Consequently, the solder materials market experiences significant expansion as industry players strive to keep up with the evolving landscape of consumer technology and its corresponding fabrication needs.

Restraints in the Solder Materials Market

The global solder materials market faces significant constraints primarily due to supply chain disruptions, which can severely impact production timelines and costs. Factors such as transportation bottlenecks, geopolitical tensions, and shortages of critical raw materials contribute to these challenges, resulting in delays in the availability of solder materials. This instability creates difficulties for manufacturers across multiple sectors, hindering their ability to meet demand and maintain efficiency. Consequently, these disruptions not only affect production schedules but also increase operational costs, posing a notable challenge for businesses operating within the solder materials market.

Market Trends of the Solder Materials Market

The solder materials market is experiencing a significant shift towards lead-free soldering solutions, propelled by stringent environmental regulations and growing health concerns associated with lead exposure. This trend reflects a broader commitment to sustainability within various industries, where manufacturers increasingly adopt eco-friendly alternatives such as SAC (Tin-Silver-Copper) alloys. As a result, the demand for innovative lead-free solder technologies is surging, prompting investments in research and development to enhance performance and reliability. The market is thus evolving, with a clear emphasis on sustainable practices, driving both product innovation and changes in manufacturing processes across the electronics and automotive sectors.

Table of Contents

Introduction

  • Objectives of the Study
  • Scope of the Report
  • Definitions

Research Methodology

  • Information Procurement
  • Secondary & Primary Data Methods
  • Market Size Estimation
  • Market Assumptions & Limitations

Executive Summary

  • Global Market Outlook
  • Supply & Demand Trend Analysis
  • Segmental Opportunity Analysis

Market Dynamics & Outlook

  • Market Overview
  • Market Size
  • Market Dynamics
    • Drivers & Opportunities
    • Restraints & Challenges
  • Porters Analysis
    • Competitive rivalry
    • Threat of substitute
    • Bargaining power of buyers
    • Threat of new entrants
    • Bargaining power of suppliers

Key Market Insights

  • Key Success Factors
  • Degree of Competition
  • Top Investment Pockets
  • Market Ecosystem
  • Market Attractiveness Index, 2024
  • PESTEL Analysis
  • Macro-Economic Indicators
  • Value Chain Analysis
  • Pricing Analysis

Global Solder Materials Market Size by Alloy Type & CAGR (2025-2032)

  • Market Overview
  • Lead-Based Solder
  • Lead-Free Solder
  • Specialty Solder

Global Solder Materials Market Size by Flux Type & CAGR (2025-2032)

  • Market Overview
  • Rosin-Based Flux
  • No-Clean Flux
  • Water-Soluble Flux

Global Solder Materials Market Size by Applications & CAGR (2025-2032)

  • Market Overview
  • Electronics
  • Automotive
  • Aerospace
  • Industrial Machinery

Global Solder Materials Market Size by Form & CAGR (2025-2032)

  • Market Overview
  • Paste
  • Wire
  • Bar
  • Preforms

Global Solder Materials Market Size by Process & CAGR (2025-2032)

  • Market Overview
  • Wave/reflow
  • Screen Printing'
  • Laser
  • Robotic

Global Solder Materials Market Size & CAGR (2025-2032)

  • North America (Alloy Type, Flux Type, Applications, Form, Process)
    • US
    • Canada
  • Europe (Alloy Type, Flux Type, Applications, Form, Process)
    • Germany
    • Spain
    • France
    • UK
    • Italy
    • Rest of Europe
  • Asia Pacific (Alloy Type, Flux Type, Applications, Form, Process)
    • China
    • India
    • Japan
    • South Korea
    • Rest of Asia-Pacific
  • Latin America (Alloy Type, Flux Type, Applications, Form, Process)
    • Brazil
    • Rest of Latin America
  • Middle East & Africa (Alloy Type, Flux Type, Applications, Form, Process)
    • GCC Countries
    • South Africa
    • Rest of Middle East & Africa

Competitive Intelligence

  • Top 5 Player Comparison
  • Market Positioning of Key Players, 2024
  • Strategies Adopted by Key Market Players
  • Recent Developments in the Market
  • Company Market Share Analysis, 2024
  • Company Profiles of All Key Players
    • Company Details
    • Product Portfolio Analysis
    • Company's Segmental Share Analysis
    • Revenue Y-O-Y Comparison (2022-2024)

Key Company Profiles

  • Indium Corporation (USA)
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments
  • Alpha Assembly Solutions (USA)
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments
  • AIM Solder (Canada)
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments
  • Kester (USA)
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments
  • Senju Metal Industry Co., Ltd. (Japan)
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments
  • Nihon Superior Co., Ltd. (Japan)
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments
  • Heraeus Holding GmbH (Germany)
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments
  • MBO Osswald GmbH & Co. KG (Germany)
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments
  • Qualitek International, Inc. (USA)
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments
  • TAMURA Corporation (Japan)
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments
  • Inventec Performance Chemicals (France)
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments
  • Fusion Incorporated (USA)
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments
  • KOKI Company Limited (Japan)
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments
  • Metallic Resources, Inc. (USA)
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments
  • Shenzhen Jufeng Solder Co., Ltd. (China)
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments
  • Canfield Technologies (USA)
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments
  • Balver Zinn Josef Jost GmbH & Co. KG (Germany)
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments
  • Stannol GmbH & Co. KG (Germany)
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments
  • Advanced Joining Technology (USA)
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments
  • Henkel AG & Co. KGaA (Germany)
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments

Conclusion & Recommendations