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半導體生產設備半導體製造設備

市場調查報告書

商品編碼

1620437

薄晶圓加工和切割設備市場機會、成長促進因素、產業趨勢分析與預測 2024 - 2032 年

Thin Wafer Processing and Dicing Equipment Market Opportunity, Growth Drivers, Industry Trend Analysis, and Forecast 2024 - 2032

出版日期: 2024年10月08日 | 出版商:

Global Market Insights Inc. | 英文 240 Pages | 商品交期: 2-3個工作天內

價格

簡介目錄

2023 年，全球薄晶圓加工和切割設備市場估值為 7.103 億美元，預計 2024 年至 2032 年年複合成長率(CAGR) 為7%。需求不斷成長而推動的。 5G等技術的出現和電動車的日益普及提高了對精密晶圓加工的需求。碳化矽 (SiC) 和氮化鎵 (GaN) 等先進材料進一步強調了有效製造微晶片和感測器所需的精細生產流程的必要性。此外，基於雷射的切割技術的創新以其速度、準確性和成本效益而聞名，透過生產更薄、更耐用的半導體元件來推動市場擴張。

薄晶圓加工和切割設備市場可以根據設備類型分為減薄設備和切割設備。預計到 2032 年，切割設備市場將超過 8 億美元。在電子元件小型化趨勢的推動下，對複雜切割解決方案的需求不斷成長。精確且高效的切割方法對於提高產量和整體性能至關重要。

在應用方面，該市場涵蓋各個領域，包括CMOS影像感測器、記憶體和邏輯（矽通孔或TSV）、MEMS裝置、功率裝置和RFID。 MEMS 裝置領域預計成長最快，在預測期內複合年成長率超過 8%。這種成長是由眾多應用中對 MEMS 裝置不斷成長的需求所推動的。隨著 MEMS 技術因其緊湊的尺寸和多功能性而成為現代電子產品中不可或缺的一部分，製造商正在投資先進的晶圓加工技術，以確保高產量和最佳性能。

市場範圍
開始年份	2023年
預測年份	2024-2032
起始值	7.103 億美元
預測值	12.5 億美元
複合年成長率	7%

到 2023 年，北美將佔全球薄晶圓加工和切割設備市場的 25% 以上。這種趨勢在各個行業都很明顯，特別強調小型化以提高性能和效率。此外，旨在促進國內半導體製造以應對全球供應鏈挑戰的政府措施正在加速對晶圓加工技術的投資。這種成長軌跡也受到越來越多的尖端應用的採用的支持，這些應用需要高性能、緊湊的晶片，所有這些都受益於先進的薄晶圓加工解決方案。

產業生態系統分析
- 影響價值鏈的因素
- 利潤率分析
- 干擾
- 未來展望
- 製造商
- 經銷商
供應商格局
利潤率分析
重要新聞和舉措
監管環境
衝擊力
- 成長動力
  - 對小型電子設備的需求不斷成長
  - 5G和物聯網應用的擴展
  - 增加先進半導體材料的使用
  - 汽車電子和電動車的成長
- 產業陷阱與挑戰
  - 先進刮片設備成本高
  - 減薄晶圓的脆性增加
成長潛力分析
波特的分析
PESTEL分析

第 4 章：競爭格局

介紹
公司市佔率分析
競爭定位矩陣
戰略展望矩陣

第 5 章：市場估計與預測：按設備類型，2021-2032 年

主要趨勢
疏伐設備
刮片設備
- 刀片劃片
- 雷射切割
- 隱形切割
- 等離子切割

第 6 章：市場估計與預測：依晶圓尺寸，2021-2032 年

主要趨勢
小於4英寸
5寸和6寸
8寸
12寸

第 7 章：市場估計與預測：按應用分類，2021-2032 年

主要趨勢
CMOS影像感測器
記憶體和邏輯 (TSV)
微機電系統元件
功率元件
射頻識別
其他

第 8 章：市場估計與預測：依最終用途產業，2021-2032 年

主要趨勢
消費性電子產品
汽車
電信
衛生保健
航太與國防
工業的
其他

第 9 章：市場估計與預測：按地區，2021-2032 年

主要趨勢
北美洲
- 美國
- 加拿大
歐洲
- 英國
- 德國
- 法國
- 義大利
- 西班牙
- 俄羅斯
亞太地區
- 中國
- 印度
- 日本
- 韓國
- 澳洲
拉丁美洲
- 巴西
- 墨西哥
MEA
- 南非
- 沙烏地阿拉伯
- 阿拉伯聯合大公國

第 10 章：公司簡介

Advanced Dicing Technologies
ASMPT
AXUS TECHNOLOGY
Citizen Chiba Precision Co., Ltd.
DISCO Corporation
Dynatex International
EV Group (EVG)
HANMI Semiconductor
Han's Laser Technology Co., Ltd.
KLA Corporation
Lam Research Corporation
Loadpoint Ltd.
Modutek Corporation
NeonTech Co.,Ltd.
Panasonic Connect Co., Ltd.
Plasma-Therm
SPTS Technologies Ltd.
Suzhou Delphi Laser Co., Ltd.
Synova SA
Tokyo Electron Limited
TOKYO SEIMITSU CO., LTD (Accretech)

簡介目錄

Product Code: 11811

The Global Thin Wafer Processing And Dicing Equipment Market was valued at USD 710.3 million in 2023, with projections indicating a compound annual growth rate (CAGR) of 7% from 2024 to 2032. This growth is primarily driven by the rising demand for compact and high-performance electronic devices across diverse sectors, including consumer electronics, automotive, and telecommunications. The advent of technologies such as 5G and the increasing popularity of electric vehicles have heightened the need for precision wafer processing. Advanced materials like silicon carbide (SiC) and gallium nitride (GaN) further underscore the necessity for meticulous production processes to manufacture microchips and sensors effectively. Additionally, innovations in laser-based dicing technologies, known for their speed, accuracy, and cost-effectiveness, propel market expansion by enabling the production of thinner and more durable semiconductor components.

The thin wafer processing and dicing equipment market can be categorized based on equipment type into thinning equipment and dicing equipment. The dicing equipment segment is projected to surpass USD 800 million by 2032. This equipment is essential during the wafer fabrication post-processing phase, where wafers are separated into individual chips. The demand for sophisticated dicing solutions is rising, driven by the trend toward miniaturizing electronic components. Precise and efficient dicing methods are crucial for enhancing yield and overall performance.

In terms of applications, the market encompasses various sectors, including CMOS image sensors, memory and logic (through-silicon via or TSV), MEMS devices, power devices, and RFID. The MEMS device segment is anticipated to grow the fastest, with a CAGR exceeding 8% during the forecast period. This growth is fueled by the increasing need for MEMS devices in numerous applications. As MEMS technology becomes more integral to modern electronics due to its compact size and versatility, manufacturers are investing in advanced wafer processing technologies to ensure high yields and optimal performance.

Market Scope
Start Year	2023
Forecast Year	2024-2032
Start Value	$710.3 Million
Forecast Value	$1.25 Billion
CAGR	7%

North America accounted for over 25% of the global thin wafer processing and dicing equipment market in 2023. The region, particularly the United States, is witnessing significant growth due to the rising demand for advanced semiconductor technologies. This trend is evident across various industries, with a strong emphasis on miniaturization to enhance performance and efficiency. Furthermore, government initiatives aimed at boosting domestic semiconductor manufacturing in response to global supply chain challenges are accelerating investments in wafer processing technologies. This growth trajectory is also supported by the increasing adoption of cutting-edge applications that necessitate high-performance, compact chips, all of which benefit from advanced thin wafer processing solutions.

Chapter 1 Methodology & Scope

1.1 Market scope & definitions
1.2 Base estimates & calculations
1.3 Forecast calculations
1.4 Data sources
- 1.4.1 Primary
- 1.4.2 Secondary
  - 1.4.2.1 Paid sources
  - 1.4.2.2 Public sources

Chapter 2 Executive Summary

2.1 Industry synopsis, 2021-2032

Chapter 3 Industry Insights

3.1 Industry ecosystem analysis
- 3.1.1 Factor affecting the value chain
- 3.1.2 Profit margin analysis
- 3.1.3 Disruptions
- 3.1.4 Future outlook
- 3.1.5 Manufacturers
- 3.1.6 Distributors
3.2 Supplier landscape
3.3 Profit margin analysis
3.4 Key news & initiatives
3.5 Regulatory landscape
3.6 Impact forces
- 3.6.1 Growth drivers
  - 3.6.1.1 Rising demand for miniaturized electronic devices
  - 3.6.1.2. Expansion of 5 G and IoT applications
  - 3.6.1.3 Increased use of advanced semiconductor materials
  - 3.6.1.4 Growth in automotive electronics and EVs
- 3.6.2 Industry pitfalls & challenges
  - 3.6.2.1 High costs of advanced dicing equipment
  - 3.6.2.2 Increased fragility of thinned wafers
3.7 Growth potential analysis
3.8 Porter's analysis
3.9 PESTEL analysis

Chapter 4 Competitive Landscape, 2023

4.1 Introduction
4.2 Company market share analysis
4.3 Competitive positioning matrix
4.4 Strategic outlook matrix

Chapter 5 Market Estimates & Forecast, By Equipment Type, 2021-2032 (USD Million)

5.1 Key trends
5.2 Thinning equipment
5.3 Dicing equipment
- 5.3.1 Blade dicing
- 5.3.2 Laser dicing
- 5.3.3 Stealth dicing
- 5.3.4 Plasma dicing

Chapter 6 Market Estimates & Forecast, By Wafer Size, 2021-2032 (USD Million)

6.1 Key trends
6.2 Less than 4 inch
6.3 5 inch and 6 inch
6.4 8 inch
6.5 12 inch

Chapter 7 Market Estimates & Forecast, By Application, 2021-2032 (USD Million)

7.1 Key trends
7.2 CMOS image sensors
7.3 Memory and logic (TSV)
7.4 MEMS device
7.5 Power device
7.6 RFID
7.7 Others

Chapter 8 Market Estimates & Forecast, By End Use Industry, 2021-2032 (USD Million)

8.1 Key trends
8.2 Consumer electronics
8.3 Automotive
8.4 Telecommunications
8.5 Healthcare
8.6 Aerospace & defense
8.7 Industrial
8.8 Others

Chapter 9 Market Estimates & Forecast, By Region, 2021-2032 (USD Million)

9.1 Key trends
9.2 North America
- 9.2.1 U.S.
- 9.2.2 Canada
9.3 Europe
- 9.3.1 UK
- 9.3.2 Germany
- 9.3.3 France
- 9.3.4 Italy
- 9.3.5 Spain
- 9.3.6 Russia
9.4 Asia Pacific
- 9.4.1 China
- 9.4.2 India
- 9.4.3 Japan
- 9.4.4 South Korea
- 9.4.5 Australia
9.5 Latin America
- 9.5.1 Brazil
- 9.5.2 Mexico
9.6 MEA
- 9.6.1 South Africa
- 9.6.2 Saudi Arabia
- 9.6.3 UAE