半導體工廠自動化：技術問題與市場預測

Semiconductor Factory Automation: Technology Issues and Market Forecasts

出版日期: 2024年11月01日 | 出版商:

Information Network | 英文 | 商品交期: 2-3個工作天內

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簡介目錄圖表

簡介

半導體產業的特點是技術進步迅速，不斷追求更高的效率和精度。工廠自動化在實現這些目標方面發揮著關鍵作用，真空和常壓機器人、自動化物料搬運系統 (AMHS) 和製造執行系統 (MES) 等技術可以幫助實現這一目標，我們處於變革的前沿。

本報告深入分析了半導體製造工廠的關鍵自動化技術，研究了它們對半導體製造流程的影響、新興趨勢和策略課題。我們也全面調查推動半導體工廠引入自動化的因素，並提供策略預測以指導未來的投資和發展。

半導體工廠自動化技術趨勢

先進自動化技術在半導體製造中的整合正在重塑該行業，需要更高的吞吐量、更低的缺陷率和更高的營運效率。真空和大氣機器人是這種自動化的重要組成部分。真空機器人專門設計用於在半導體晶圓處理室典型的高真空環境中運作。這些機器人以極高的精度處理精緻的晶圓，最大限度地減少污染和物理損壞。真空機器人技術的進步集中在提高速度、準確性和可靠性，這對於維持半導體製造的高良率至關重要。

另一方面，大氣機器人在大氣環境中運行，廣泛用於在不同製程站之間運輸晶圓。這些機器人設計用於在無塵室中處理晶圓，確保滿足半導體製造的嚴格清潔度要求。在日益擁擠的工廠環境中，需要最大限度地利用空間，從而推動了更緊湊和敏捷的大氣機器人的發展趨勢。真空和大氣機器人都變得越來越複雜，結合了先進的感測器和人工智慧演算法來優化其性能和適應性。

自動物料搬運系統（AMHS）是半導體工廠自動化的另一項重要技術。 AMHS 負責在整個工廠內有效率地運輸晶圓、掩模版和消耗品等材料。這些系統包括各種自動化運輸機制，例如高架起重機運輸（OHT）和自動導引車（AGV），以確保物料及時且準確地運輸到各個處理站。 AMHS 顯然正在推進整合更智慧的路由和調度演算法，這增強了其適應動態製造環境並減少瓶頸的能力。

製造執行系統 (MES) 在協調半導體工廠內的複雜流程方面發揮關鍵作用。 MES 即時監控和控制生產活動，確保製造營運符合預先定義的規範和品質標準。這些系統收集並分析來自各種設備和流程的大量數據，從而實現主動決策和持續改進。更先進的 MES 解決方案的趨勢特點是採用大數據分析和機器學習，透過提高系統預測和預防潛在問題的能力來提高工廠的整體績效。

Introduction

The semiconductor industry is characterized by its rapid technological advancements and the constant pursuit of higher efficiency and precision. Factory automation plays a critical role in achieving these goals, with technologies such as vacuum and atmospheric robots, Automated Material Handling Systems (AMHS), and Manufacturing Execution Systems (MES) at the forefront of this transformation. Our report, "Semiconductor Factory Automation: Technology Issues and Market Forecasts," provides an in-depth analysis of these crucial automation technologies, examining their impact on the semiconductor manufacturing process, emerging trends, and strategic challenges. This report is tailored for industry professionals seeking comprehensive insights into the factors driving the adoption of automation in semiconductor factories and offering strategic forecasts to guide future investments and development.

Trends in Semiconductor Factory Automation Technology

The integration of advanced automation technologies in semiconductor manufacturing is reshaping the industry, driven by the need for higher throughput, lower defect rates, and greater operational efficiency. Vacuum and atmospheric robots are essential components of this automation landscape. Vacuum robots are specifically designed to operate in high-vacuum environments typical of semiconductor wafer processing chambers. These robots handle delicate wafers with extreme precision, minimizing contamination and physical damage. Advances in vacuum robot technology are focused on enhancing their speed, accuracy, and reliability, which are critical for maintaining high yield rates in semiconductor fabrication.

Atmospheric robots, on the other hand, operate in ambient environments and are used extensively for wafer transport between different processing stations. These robots are designed to handle wafers in cleanroom conditions, ensuring that the stringent cleanliness requirements of semiconductor manufacturing are met. The trend towards more compact and agile atmospheric robots is driven by the need to maximize space utilization in increasingly crowded fab environments. Both vacuum and atmospheric robots are becoming more sophisticated, incorporating advanced sensors and AI algorithms to optimize their performance and adaptability.

Automated Material Handling Systems (AMHS) are another pivotal technology in semiconductor factory automation. AMHS are responsible for the efficient movement of materials, such as wafers, reticles, and consumables, throughout the fab. These systems include a range of automated transport mechanisms, such as overhead hoist transport (OHT) and automated guided vehicles (AGVs), which ensure timely and accurate delivery of materials to various processing stations. The evolution of AMHS is marked by the integration of more intelligent routing and scheduling algorithms, which enhance their ability to adapt to dynamic manufacturing environments and reduce bottlenecks.

Manufacturing Execution Systems (MES) play a crucial role in orchestrating the complex processes within semiconductor fabs. MES provide real-time monitoring and control of production activities, ensuring that manufacturing operations adhere to predefined specifications and quality standards. These systems collect and analyze vast amounts of data from various equipment and processes, enabling proactive decision-making and continuous improvement. The trend towards more advanced MES solutions is characterized by the incorporation of big data analytics and machine learning, which enhance the ability of these systems to predict and prevent potential issues, thereby improving overall fab performance.

The Need to Purchase This Report

For businesses and professionals involved in the semiconductor industry, understanding the latest advancements and trends in factory automation is essential for maintaining a competitive edge. This report provides a detailed analysis of the technological issues, market drivers, and challenges associated with vacuum and atmospheric robots, AMHS, and MES. By purchasing this report, stakeholders will gain valuable insights into the factors influencing the adoption and implementation of these automation technologies, enabling them to make informed strategic decisions and capitalize on emerging opportunities.

Our report offers strategic recommendations for leveraging automation technologies to enhance manufacturing efficiency, reduce costs, and improve product quality. It includes comprehensive market forecasts, competitive landscape assessments, and an in-depth examination of the key players driving innovation in semiconductor factory automation. Companies looking to invest in or expand their automation capabilities will find this report indispensable for identifying growth opportunities and understanding the competitive dynamics of the market.

In conclusion, "Semiconductor Factory Automation: Technology Issues and Market Forecasts" is an essential resource for industry professionals, engineers, researchers, and business leaders. It provides a thorough exploration of the technological trends and market dynamics shaping the automation of semiconductor fabs, equipping readers with the knowledge necessary to navigate the complexities of this field and capitalize on its potential. This report is designed to inform strategic planning, investment decisions, and the development of innovative automation solutions that will drive future success in the semiconductor industry.

Chapter 1. Introduction

Chapter 2. Executive Summary

2.1. Summary of Major Issues
2.2. Summary of Market Forecasts

Chapter 3. Driving Forces

3.1. Chips Act-U.S. and Global
3.2. Trend to 200/300mm Wafers
3.2. Trends In Chip Linewidths
3.4. Trends in Processing Tools
3.5. Benefits of Automated Wafer Handling

Chapter 4. Software

4.1. Introduction
4.2. The Evolution of CIM
4.3. MES in Industry
- 4.3.1. MES Functionalities
- 4.3.1. MES and ERP Integration
- 4.3.2. MES Products

Chapter 5. Hardware

5.1. Introduction
5.2. Elements of Automation
- 5.2.1. Tool Automation
- 5.2.2. Intrabay Automation
- 5.2.3. Interbay Automation
- 5.2.4. Unified Transport System
5.3. Flexible Automation
5.4. Reliability
5.5. Tool Issues and Trends
- 5.5.1. Flexible Tool Interface
- 5.5.2. Vacuum Robotics
- 5.5.3. AGV
- 5.5.4. Robot Control Systems
- 5.5.5. 300mm Wafer Transport
- 5.5.6. Mini-Environments and Cleanroom Issues

Chapter 6. Market Analysis

6.1. Market Forces
6.2. Market Forecast
- 6.2.1. Automated Transfer Tool Market
- 6.2.2. Carrier Transport Market
- 6.2.3. MES Software Market

Chapter 7. User Issues

7.1. Current Automation Thinking
7.2. The New Factory Paradigm
7.3. The New Factory in Action
7.4. Return on Investment Considerations
7.5. Eight Symptoms of the Old Paradigm
7.6. Putting the New Paradigm to Work

簡介目錄圖表

LIST OF FIGURES

1.1. Advanced CIM System
3.1. Global Market Share Of Semiconductor Industry By Region
3.2. Semiconductor Manufacturing Wafer Capacity By Region
3.3. Global Logic Process Technology By Region
3.4. National Chip Incentive Programs By Region
3.5. Illustration Of Custer Tool
4.1. Vertical Integration Of A Semiconductor Fab
4.2. MES 4.0 Manufacturing Network
5.1. TSMC'S Leading-Edge Fab Costs
5.2. Inter & Intrabay (Top) And Unified (Bottom) Transport Systems
5.3. Traditional (Left) And Flexible (Right) Automated Material Handling System
5.4. Overhead Monorail Delivery
5.5. Stocker Design and Interfaces
6.1. Semiconductor Equipment Utilization
6.2. Revenue Losses from Wafer Defects
6.3. Market Shares of Atmospheric Robot Suppliers
6.4. Market Shares of Vacuum Robot Suppliers
6.5. Worldwide Market Shares of Carrier Transport Suppliers
6.6. Carrier Transport Market By Region
6.7. Worldwide Market of Shares MES Software Suppliers

LIST OF TABLES

3.1. Semiconductor Revenue And Shipments To Region
3.2. Semiconductor Fab Plans In U.S.
3.3. Semiconductor Fab Plans In China
3.4. Semiconductor Fab Plans Outside U.S.
3.5. Raw Wafer Overall Supply-Demand And Utilization Rate Analysis By Wafer Size
3.6. Foundry Market-Overall Supply-Demand And Utilization Rate Analysis By Wafer
3.7. Different Applications' Distribution To 12-Inch, 8-Inch, And 6-Inch
3.8. Wafer Metrics By Technology Node
3.9. Equipment Needed Per 10k Wpm Of New Capacity
5.1. Chip Cost per Node
6.1. Three-Year Savings for Automation
6.2. Cost of Alternative Automated Systems
6.3. Three-year Costs for Alternative Automated Systems
6.4. Worldwide Forecast of Automated Transfer Tools
6.5. Bill Of Materials For Atmospheric Automation Tool
6.6. Bill Of Materials For PVD Vacuum Tool
6.7. Process Tool Automation For 300mm Fabs
6.8. Worldwide Forecast of Carrier Transport Market
6.9. Worldwide Forecast of MES Software