市場調查報告書
商品編碼
1451367
2024-2032 年按組件(射頻濾波器、射頻開關、射頻功率放大器等)、應用(消費電子、汽車、無線通訊等)及地區分類的射頻前端模組市場報告RF Front End Module Market Report by Component (RF Filters, RF Switches, RF Power Amplifiers, and Others), Application (Consumer Electronics, Automotive, Wireless Communication, and Others), and Region 2024-2032 |
2023年全球射頻前端模組市場規模達229億美元。展望未來, IMARC Group預計到2032年市場規模將達到623億美元,2024-2032年複合年成長率(CAGR)為11.4%。
射頻(RF)前端模組是指結合了天線和接收器之間所有電路的設備面板。它由射頻濾波器、放大器、本振、混頻器和多個開關組成。它通常用於最小化影像響應並防止強帶外訊號使輸入級飽和。此模組也用於無線系統和調頻 (FM) 無線電中的無線電訊號和基頻頻率之間的切換,以在傳輸過程中對訊號進行編碼/解碼。因此,它廣泛應用於消費性電子、汽車、軍事設備和無線通訊工具的製造,例如家用設備、智慧恆溫器、穿戴式裝置、物聯網(IoT)設備、智慧照明、感測器和範圍擴展器。
快速的數位化以及不斷成長的工業自動化(尤其是在發展中經濟體)是創造積極市場前景的關鍵因素之一。此外,隨著社交網路平台和物聯網設備的使用越來越多,銀行、金融服務和保險(BFSI)等資料密集產業產生的流量大幅增加。這增強了消費者對配備創新射頻前端模組的智慧設備的偏好,從而促進了市場成長。此外,各種技術進步,例如絕緣體上矽(SOI)基板的開發,也是其他成長誘導因素。 RF-SOI 基板支援 3G、4G/LTE 的功能和未來網路要求,以實現更快、更可靠的資料傳輸。其他因素,包括 5G 技術的商業化以及資訊技術 (IT) 基礎設施的顯著改善,預計將進一步推動市場發展。
The global RF front end module market size reached US$ 22.9 Billion in 2023. Looking forward, IMARC Group expects the market to reach US$ 62.3 Billion by 2032, exhibiting a growth rate (CAGR) of 11.4% during 2024-2032.
A radio frequency (RF) front end module refers to a device panel that combines all circuits between the antenna and the receiver. It consists of an RF filter, amplifier, local oscillator, mixer and multiple switches. It is commonly used to minimize the image response and prevent strong out-of-band signals from saturating the input stages. The module is also used for switching between the radio signal and baseband frequency in wireless systems and frequency modulation (FM) radios to encode/decode the signals during transmission. Thus, it is widely used in the manufacturing of consumer electronics, automobiles, military equipment and wireless communication tools, such as in-home devices, smart thermostats, wearables, internet of things (IoT) devices, smart lighting, sensors and range extenders.
Rapid digitalization, along with growing industrial automation, especially in developing economies, represents one of the key factors creating a positive outlook for the market. Furthermore, with the increasing use of social networking platforms and IoT devices, there is a substantial rise in the traffic generated from data-intensive industries, such as banking, financial services and insurance (BFSI). This has enhanced the consumer preference for smart devices equipped with innovative RF front end modules, which, in turn, is contributing to the market growth. Additionally, various technological advancements, such as the development of silicon-on-insulator (SOI) substrates, are acting as other growth-inducing factors. RF-SOI substrates support the functioning of 3G, 4G/LTE and future network requirements to enable faster and reliable data transmission. Other factors, including the commercialization of 5G technology, along with significant improvements in the information technology (IT) infrastructure, are anticipated to drive the market further.
IMARC Group provides an analysis of the key trends in each sub-segment of the global RF front end module market report, along with forecasts at the global, regional and country level from 2024-2032. Our report has categorized the market based on component and application.
RF Filters
RF Switches
RF Power Amplifiers
Others
Consumer Electronics
Automotive
Wireless Communication
Others
North America
United States
Canada
Asia Pacific
China
Japan
India
South Korea
Australia
Indonesia
Others
Europe
Germany
France
United Kingdom
Italy
Spain
Russia
Others
Latin America
Brazil
Mexico
Others
Middle East and Africa
The report has also analysed the competitive landscape of the market with some of the key players being Broadcom Inc., Infineon Technologies AG, Murata Manufacturing Co. Ltd., NXP Semiconductors N.V., Qorvo Inc., Skyworks Solutions Inc., STMicroelectronics N.V., Taiyo Yuden Co. Ltd., TDK Corporation, Teradyne Inc. and Texas Instruments Incorporated.