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市場調查報告書
商品編碼
1518691
2024-2032 年按材料類型(鋁、銅)、應用(汽車領域、消費性電子產品)和地區分類的 IGBT 針翅式散熱器市場報告Pin Fin Heat Sink for IGBT Market Report by Material Type (Aluminium, Copper), Application (Automotive Field, Consumer Electronics), and Region 2024-2032 |
2023年,全球IMARC Group針翅散熱器市場規模達9.945億美元。現代消費性電子產品對有效冷卻解決方案的需求激增,汽車行業中電動汽車和混合動力汽車擴大使用IGBT 模組,以及用於多設備冷卻的混合針翅式散熱器的日益普及,這些都是推動這一趨勢的一些關鍵因素。
針翅式散熱器是指具有平坦底座和大量針狀結構的緊湊型散熱器,旨在將熱量散發到周圍空氣中。它們通常使用銅或鋁合金製造,並顯示為嵌入多個翅片的實心塊。可根據熱負荷、氣流和可用空間輕鬆客製化針翅片,以適應各種應用。這些水槽用作熱交換器,其幾何設計和結構可增加表面積和傳熱係數,在高氣流(200+ LFM)下提供從底座到翅片的低熱阻,並在氣流方向不明確的環境中工作,使他們非常有效。圓形空氣動力學銷釘設計和間距減少了對進入銷釘陣列的周圍氣流的阻力,同時增加了空氣湍流。這反過來又打破了包裹在其表面的靜止空氣的邊界層,從而產生了高對流熱效率。因此,針翅式散熱器被廣泛用於冷卻絕緣柵雙極電晶體 (IGBT)。
針翅式散熱器在解決空間有限和熱負荷較大的應用中的複雜熱問題方面越來越受歡迎。目前,為了透過適當的散熱方法來滿足現代電子產品的要求,對有效冷卻解決方案的需求不斷增加,這正在加速針翅式散熱器的採用。再加上全球人口不斷成長和數位化的快速發展對巨大電力供應的需求不斷增加,這是推動市場成長的主要因素。此外,由於人們越來越認知到針翅式散熱器的優點,例如更高的容積效率、緊湊的尺寸、重量輕、更好的冷卻能力和低成本,因此從其他類型的散熱器轉向針翅式散熱器。與此一致的是,汽車產業中混合動力電動車 (HEV) 和電動車 (EV) 擴大採用 IGBT 模組,從而促進了市場成長。此外,對元件密度的需求不斷增加以及電子設備的日益小型化,增強了對緊湊且經濟高效的冷卻解決方案(例如針翅式散熱器)的需求。此外,主要參與者的各種產品創新,例如混合針翅式散熱器的開發,其熱性能比標準鋁和銅散熱器更好,並且可用於多設備冷卻,為市場成長提供了積極的推動力。
The global pin fin heat sink for IGBT market size reached US$ 994.5 Million in 2023. Looking forward, IMARC Group expects the market to reach US$ 1,401.8 Million by 2032, exhibiting a growth rate (CAGR) of 3.77% during 2024-2032. The surging need for effective cooling solutions for modern consumer electronics, the rising use of IGBT modules in the automotive industry for EVs and HEVs, and the growing popularity of hybrid pin fin heat sinks for multi-device cooling represent some of the key factors driving the market.
Pin fin heat sinks refer to compact sinks with a flat base and a large number of pin-like structures designed to dissipate heat out into the surrounding air. They are usually manufactured using copper or aluminum alloys and appear as a solid block embedded with multiple fins. The pin fins can be easily customized for various applications based on the heat load, airflow, and available space. These sinks serve as heat exchangers and are designed and structured geometrically to increase the surface area and coefficient for heat transfer, provide low thermal resistance from base to fins at high airflow (200-plus LFM), and work in environments with ambiguous airflow direction, making them highly effective. The round aerodynamic pin design and spacing reduce resistance to surrounding airstreams that enter the pin array while simultaneously increasing air turbulence. This, in turn, breaks the boundary layers of still air wrapped around its surface, creating high convective thermal efficiencies. As a result, pin fin heat sinks are widely used to cool insulated-gate bipolar transistors (IGBT).
Pin fin heat sinks are gaining immense popularity in solving complex thermal problems in applications with limited space and substantial heat loads. At present, the surging need for effective cooling solutions to meet the requirements of modern electronics via proper heat dissipation methods is accelerating the adoption of pin fin heat sinks. This, coupled with the escalating demand for huge power supply due to the expanding global population and rapid digitization, represents the primary factor driving the market growth. Moreover, there has been a significant shift from other types of heat sinks toward pin fin heat sinks owing to the growing awareness about their benefits, such as higher volumetric efficiency, compact size, lightweight, better cooling capacity, and low cost. In line with this, the rising adoption of IGBT modules in the automotive industry for hybrid electric vehicles (HEVs) and electric vehicles (EVs) has catalyzed market growth. In addition, the augmenting demand for component density and the increasing miniaturization of electronic devices has strengthened the need for compact and cost-effective cooling solutions, such as pin fin heat sinks. Furthermore, various product innovations by key players, such as the development of the hybrid pin fin heat sink that offers better thermal performance than standard aluminum and copper sinks and can be used for multi-device cooling, are providing a positive thrust to the market growth.
IMARC Group provides an analysis of the key trends in each segment of the global pin fin heat sink for IGBT market, along with forecasts at the global, regional, and country levels from 2024-2032. Our report has categorized the market based on material type and application.
Aluminium
Copper
The report has provided a detailed breakup and analysis of the pin fin heat sink for IGBT market based on the material type. This includes aluminium and copper. According to the report, aluminium represented the largest segment.
Automotive Field
Consumer Electronics
A detailed breakup and analysis of the pin fin heat sink for IGBT market based on the application has also been provided in the report. This includes automotive field and consumer electronics. According to the report, the automotive field accounted for the largest market share.
North America
United States
Canada
Asia-Pacific
China
Japan
India
South Korea
Australia
Indonesia
Others
Europe
Germany
France
United Kingdom
Italy
Spain
Russia
Others
Latin America
Brazil
Mexico
Others
Middle East and Africa
The report has also provided a comprehensive analysis of all the major regional markets, which include North America (the United States and Canada); Asia-Pacific (China, Japan, India, South Korea, Australia, Indonesia, and others); Europe (Germany, France, the United Kingdom, Italy, Spain, Russia and others); Latin America (Brazil, Mexico, and others); and the Middle East and Africa. According to the report, Asia-Pacific was the largest market for pin fin heat sink for IGBT. Some of the factors driving the Asia-Pacific Pin Fin Heat Sink for IGBT market included the rapid growth in the automotive sector, increasing demand for power supply devices, emerging trend of home remodeling, etc.
The report has also provided a comprehensive analysis of the competitive landscape in the global pin fin heat sink for IGBT market. Competitive analysis such as market structure, market share by key players, player positioning, top winning strategies, competitive dashboard, and company evaluation quadrant has been covered in the report. Also, detailed profiles of all major companies have been provided. Some of the companies covered include Advanced Thermal Solutions Inc., Wellste Aluminum, etc. Kindly note that this only represents a partial list of companies, and the complete list has been provided in the report.
Kindly note that this only represents a partial list of companies, and the complete list has been provided in the report.