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市場調查報告書
商品編碼
1622117

全球 IGBT 針翅散熱器市場（按材料類型、地區、範圍和預測）

Global Pin Fin Heat Sink For IGBT Market By Material Type, By Geographic Scope And Forecast
出版日期: | 出版商: Verified Market Research | 英文 202 Pages | 商品交期: 2-3個工作天內

價格
簡介目錄

IGBT 針翅散熱器的市場規模及預測

2023 年 IGBT 針翅散熱器市場規模價值 25 億美元，預計到 2030 年將達到 61.7 億美元，2024 年至 2030 年的複合年增長率為 5.3%。電動車、家居裝修和廚房升級的趨勢正在推動 IGBT 針翅散熱器市場的發展。近年來，基於 IGBT 的功率模組變得更加先進和強大。這些模組裝有大批耗電的電子元件，需要高性能的散熱器來防止因過熱而造成損壞或毀壞。這將推動市場成長。

全球 IGBT 針翅散熱器市場報告對市場進行了全面評估。它對關鍵細分市場、趨勢、市場推動因素、阻礙因素、競爭格局以及在市場中發揮關鍵作用的因素進行了全面的分析。

IGBT 針翅散熱器的全球市場定義

針翅散熱器在平坦底座上嵌有圓形針腳。從金屬底座升起的長方形金屬片，其翅片垂直於金屬底座但彼此平行。這些散熱器的幾何設計和結構非常有效率。散熱器有銅和鋁兩種材質，針腳密度可適應各種空速環境。散熱器是一塊實心的銅或鋁塊，帶有重複的翅片，可以增加可用於傳熱的表面積。針狀翅片同時增加了傳熱面積和傳熱係數。有多種尺寸可供選擇，以適應從小型半導體到大型功率設備的各種應用和設備。

IGBT 針翅散熱器的全球市場概況

透過適當的散熱方法對消費性電子設備進行有效冷卻的需求不斷增加，由於人口增長和數位化而對高功率電源的需求不斷增加是推動全球針翅散熱器IGBT 市場成長的主要因素。一個促成因素。此外，與其他類型的散熱器相比，針翅散熱器具有體積效率高、成本低等多種優勢，因此對針翅散熱器的需求不斷增長，也有望推動IGBT 針翅散熱器市場的成長。預計。此外，汽車領域混合動力車和混合針翅散熱器對 IGBT 模組的使用不斷增加，也有望推動全球針翅散熱器 IGBT 市場的成長。

存在一些阻礙市場整體成長的限制和障礙。針翅散熱器製造商的利用率低是限制市場成長的因素之一。然而，技術進步、汽車領域混合動力汽車和混合針翅散熱器對 IGBT 模組的日益使用以及新興市場的尚未開發的潛力提供了有利可圖的成長機會。

目錄

第 1 章 IGBT 針翅散熱器的全球市場：簡介

    市場概況
  • 研究範圍
  • 先決條件

第 2 章執行摘要

第 3 章：經過驗證的市場研究方法

  • 資料探勘
  • 驗證
  • 第一次面試
  • 資料來源列表

第 4 章 IGBT 針翅散熱器全球市場展望

  • 概述
  • 市場動態
    • 驅動程式
    • 阻礙因素
    • 機會
  • 波特五力模型
  • 價值鏈分析
第 5 章 IGBT 針翅散熱器全球市場（按材料）
  • 概述
  • 銅
  • 鋁
第6章 IGBT 針翅散熱器全球市場（按地區）
  • 概述
  • 北美洲
    • 美國
    • 加拿大
    • 墨西哥
  • 歐洲
    • 德國
    • 英國
    • 法國
    • 其他歐洲國家
    亞太地區
    • 中國
    • 日本
    • 印度
    • 其他亞太地區
  • 世界其他地區
    • 拉丁美洲
    • 中東和非洲

第 7 章 IGBT 針翅散熱器全球市場：競爭格局

  • 概述
  • 各公司的市場排名
  • 主要發展策略

第 8 章 公司簡介

  • Advanced Micro Devices（AMD）
  • Apex Microtechnology
  • Aavid Thermalloy, LLC
  • Advanced Thermal Solutions, Inc.
  • Allbrass Industrial The Brass
  • CUI Inc
  • Comair Rotron
  • Honeywell International Inc
  • Kunshan Googe Metal Products Co., Ltd.

第9章 附錄

  • 關聯調查
簡介目錄
Product Code: 15425

Pin Fin Heat Sink For IGBT Market Size And Forecast

Pin Fin Heat Sink For IGBT Market size was valued at USD 2.5 Billion in 2023 and is projected to reach USD 6.17 Billion by 2030 , growing at a CAGR of 5.3% from 2024 to 2030. The increasing trend of electric mobility, home remodeling, and kitchen updates is boosting the Pin Fin Heat Sink For IGBT Market. IGBT-based power modules have become significantly more advanced and powerful in recent times. These modules contain large arrays of power-hungry electronic components that require high-performance heat sinks to prevent them from overheating and being damaged or destroyed. This will foster market growth.

The Global Pin Fin Heat Sink For IGBT Market report provides a holistic evaluation of the market. The report offers a comprehensive analysis of key segments, trends, drivers, restraints, competitive landscape, and factors that are playing a substantial role in the market.

Global Pin Fin Heat Sink For IGBT Market Definition

Pin Fin Heat Sink is comprised of a flat base with a scale of round pins that are implanted into the base. It is a rectangular-shaped piece of metal that rises from a metal base, the fins are situated perpendicular to the metal base, but are parallel to one another. These heat sinks are designed and structured geometrically to make them highly effective. These are available in copper and aluminum material and comes in different pin densities, which are suitable for different airspeed environments. A heat sink is a solid block of copper or aluminum with recurring fins that expand the possible surface area for heat transfer. Pin fins concurrently increase both the heat transfer surface region and the heat transfer coefficient. These are available in different sizes with a wide array of applications and devices, ranging from miniature semiconductors to large power devices.

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Global Pin Fin Heat Sink For IGBT Market Overview

The increasing need for effective cooling of consumer electronics by proper heat dissipation method, supported by an escalation in demand for huge power supply due to growing population and digitization are some of the prime factors that drive the global pin fin heat sink IGBT market growth. Moreover, the rise in demand for pin fin heat sinks owing to its multiple advantages such as higher volumetric efficiency and low cost over other types of heat sinks is also expected to fuel the growth of pin fin heat sink for the IGBT market. Also, an increase in the use of IGBT modules in the automotive field for HEVs and hybrid pin fin heat sinks has positively anticipated in propelling the growth of the global pin fin heat sink IGBT market.

There are certain restrictions and barriers that will hinder the overall market growth. Factors such as low capacity utilization of pin fin heat sink manufacturers are limiting the market growth. Nevertheless, the advancements in technologies, the increase in the use of IGBT modules in the automotive field for HEVs and hybrid pin fin heat sink, and untapped potential in emerging markets offer beneficial growth opportunities.

Global Pin Fin Heat Sink For IGBT Market: Segmentation Analysis

The Global Pin Fin Heat Sink For IGBT Market Segmented On The Basis Of Material Type, And Geography.

Pin Fin Heat Sink For IGBT Market, By Material Type

  • Copper
  • Aluminium

Based on Material Type, the market is bifurcated into Copper and Aluminium. The Aluminium segment holds the largest market share during the forecast period. The factors that can be attributed to the increasing need by electronic manufacturers owing to benefits such as high thermal performance and flexibility to fit into a variety of systems and designs are accelerating the demand for this segment.

Pin Fin Heat Sink For IGBT Market, By Geography

  • North America
  • Europe
  • Asia Pacific
  • Rest of the World
  • On the basis of regional analysis, the Global Pin Fin Heat Sink For IGBT Market is classified into North America, Europe, Asia Pacific, and Rest of the world. Asia-Pacific holds the largest market share. The increasing consumer electronics and ongoing projects will boost the market in the APAC region.

Key Players

  • The study report will provide a valuable insight with an emphasis on the global market including some of the major players such as
  • Advanced Micro Devices (AMD), Apex Microtechnology, Aavid Thermalloy, LLC, Advanced Thermal Solutions, Inc., Allbrass Industrial The Brass, CUI Inc, Comair Rotron, Honeywell International Inc and Kunshan Googe Metal Products Co., Ltd.

Our market analysis also entails a section solely dedicated to such major players wherein our analysts provide an insight into the financial statements of all the major players, along with its product benchmarking and SWOT analysis.

TABLE OF CONTENTS

1. INTRODUCTION OF GLOBAL PIN FIN HEAT SINK FOR IGBT MARKET

  • 1.1. Overview of the Market
  • 1.2. Scope of Report
  • 1.3. Assumptions

2. EXECUTIVE SUMMARY

3. RESEARCH METHODOLOGY OF VERIFIED MARKET RESEARCH

  • 3.1. Data Mining
  • 3.2. Validation
  • 3.3. Primary Interviews
  • 3.4. List of Data Sources

4. GLOBAL PIN FIN HEAT SINK FOR IGBT MARKET OUTLOOK

  • 4.1. Overview
  • 4.2. Market Dynamics
    • 4.2.1. Drivers
    • 4.2.2. Restraints
    • 4.2.3. Opportunities
  • 4.3. Porters Five Force Model
  • 4.4. Value Chain Analysis

5. GLOBAL PIN FIN HEAT SINK FOR IGBT MARKET, BY MATERIAL

  • 5.1. Overview
  • 5.2. Copper
  • 5.3. Aluminium

6. GLOBAL PIN FIN HEAT SINK FOR IGBT MARKET, BY GEOGRAPHY

  • 6.1. Overview
  • 6.2. North America
    • 6.2.1. U.S.
    • 6.2.2. Canada
    • 6.2.3. Mexico
  • 6.3. Europe
    • 6.3.1. Germany
    • 6.3.2. U.K.
    • 6.3.3. France
    • 6.3.4. Rest of Europe
  • 6.4. Asia Pacific
    • 6.4.1. China
    • 6.4.2. Japan
    • 6.4.3. India
    • 6.4.4. Rest of Asia Pacific
  • 6.5. Rest of the World
    • 6.5.1. Latin America
    • 6.5.2. Middle East & Africa

7. GLOBAL PIN FIN HEAT SINK FOR IGBT MARKET COMPETITIVE LANDSCAPE

  • 7.1. Overview
  • 7.2. Company Market Ranking
  • 7.3. Key Development Strategies

8. COMPANY PROFILES

  • 8.1. Advanced Micro Devices (AMD)
    • 8.1.1. Overview
    • 8.1.2. Financial Performance
    • 8.1.3. Product Outlook
    • 8.1.4. Key Developments
  • 8.2. Apex Microtechnology
    • 8.2.1. Overview
    • 8.2.2. Financial Performance
    • 8.2.3. Product Outlook
    • 8.2.4. Key Developments
  • 8.3. Aavid Thermalloy, LLC
    • 8.3.1. Overview
    • 8.3.2. Financial Performance
    • 8.3.3. Product Outlook
    • 8.3.4. Key Developments
  • 8.4. Advanced Thermal Solutions, Inc.
    • 8.4.1. Overview
    • 8.4.2. Financial Performance
    • 8.4.3. Product Outlook
    • 8.4.4. Key Developments
  • 8.5. Allbrass Industrial The Brass
    • 8.5.1. Overview
    • 8.5.2. Financial Performance
    • 8.5.3. Product Outlook
    • 8.5.4. Key Developments
  • 8.6. CUI Inc
    • 8.6.1. Overview
    • 8.6.2. Financial Performance
    • 8.6.3. Product Outlook
    • 8.6.4. Key Developments
  • 8.7. Comair Rotron
    • 8.7.1. Overview
    • 8.7.2. Financial Performance
    • 8.7.3. Product Outlook
    • 8.7.4. Key Developments
  • 8.8. Honeywell International Inc
    • 8.8.1. Overview
    • 8.8.2. Financial Performance
    • 8.8.3. Product Outlook
    • 8.8.4. Key Developments
  • 8.9. Kunshan Googe Metal Products Co., Ltd.
    • 8.9.1. Overview
    • 8.9.2. Financial Performance
    • 8.9.3. Product Outlook
    • 8.9.4. Key Developments

9. Appendix

  • 9.1. Related Reports