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市場調查報告書
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1356567

IGBT柱狀散熱鰭片市場報告：至2030年的趨勢、預測與競爭分析

Pin Fin Heat Sink for IGBT Market Report: Trends, Forecast and Competitive Analysis to 2030
出版日期: | 出版商: Lucintel | 英文 150 Pages | 商品交期: 3個工作天內

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簡介目錄

IGBT柱狀散熱鰭片的趨勢與預測

預計到2030年，全球 IGBT柱狀散熱鰭片市場將達到 12.857 億美元，2024年至2030年年複合成長率為 5.6%。該市場的主要驅動力是現代電子設備對高效冷卻解決方案的需求不斷成長，各種自動化行業中 IGBT 的使用不斷增加，以及該設備在混合和電動車中的應用不斷擴大。全球IGBT柱狀散熱鰭片市場前景廣闊，汽車領域和消費性電子應用領域充滿機會。

IGBT柱狀散熱鰭片市場洞察

Lucintel 預測，鋁因其良好的導熱性、彈性和成本效益而被製造商廣泛使用，預計在預測期內將高速成長。

由於電動車（EVS）需求的增加以及 IGBT 模組在汽車中的大量整合，預計汽車產業在預測期內將出現高速成長。

由於該地區汽車行業的快速擴張，電源需求的增加以及家庭自動化計劃的出現，預計亞太地區將在預測期內實現最高的成長。

本報告回答了 11 個關鍵問題：

  • Q.1.細分市場中最有前途和高成長的機會為何？
  • Q.2.哪個細分市場將以更快的速度成長？理由為何？
  • Q.3.哪些地區未來會出現更快的成長？理由為何？
  • Q.4.影響市場動態的主要因素有哪些？市場的主要挑戰和商業風險是什麼？
  • Q.5.這個市場的商業風險和競爭威脅為何？
  • Q.6.這個市場有哪些新趨勢？理由為何？
  • Q.7.市場客戶需求有何改變？
  • Q.8.該市場有哪些新發展以及哪些公司處於領先地位？
  • Q.9.這個市場的主要企業有哪些？主要企業採取哪些策略配合措施來發展業務？
  • Q.10.該市場上的競爭產品有哪些？由於材料或產品替代而導致市場佔有率下降的威脅有多大？
  • Q.11.過去年度發生了哪些併購事件，對產業產生了哪些影響？

目錄

第1章 執行摘要

第2章 全球IGBT柱狀散熱鰭片市場：市場動態

  • 簡介、背景、分類
  • 供應鏈
  • 產業促進因素與挑戰

第3章 2018-2030年市場趨勢及預測分析

  • 宏觀經濟趨勢（2018-2023）與預測（2024-2030）
  • IGBT柱狀散熱鰭片全球市場趨勢（2018-2023年）與預測（2024-2030年）
  • 依材料類型：全球 IGBT Pin Fin 散熱器市場
    • 鋁
    • 銅
  • 依應用分：全球 IGBT柱狀散熱鰭片市場
    • 汽車領域
    • 家用電器

第4章 2018-2030年市場趨勢及預測分析，依地區

  • 全球IGBT柱狀散熱鰭片市場，依地區
  • 北美IGBT針翅式散熱器市場
  • 歐洲 IGBT柱狀散熱鰭片市場
  • 亞太IGBT針翅式散熱器市場
  • 其他地區IGBT針翅式散熱器市場

第5章 競爭分析

  • 產品系列分析
  • 營運整合
  • 波特五力分析

第6章 成長機會與策略分析

  • 成長機會分析
  • 全球IGBT針翅式散熱器市場新趨勢
  • 戰略分析
    • 新產品開發
    • 全球IGBT針翅散熱器市場產能擴張
    • 全球IGBT針翅散熱器市場的合併、收購與合資
    • 認證和許可

第7章 主要企業概況

  • Honeywell International
  • Comair Rotron
  • Aavid Thermalloy
  • CUI
  • Apex Microtechnology
  • Allbrass Industrial
  • Kunshan Googe
  • Advanced Thermal Solutions
簡介目錄

Pin Fin Heat Sink for IGBT Trends and forecast

The future of the global pin fin heat sink for IGBT market looks promising with opportunities in the automotive field and consumer electronic applications. The global pin fin heat sink for IGBT market is expected to reach an estimated $1285.7 million by 2030 with a CAGR of 5.6% from 2024 to 2030. The major drivers for this market are increasing demand for efficient cooling solutions in modern electronics, rising use of IGBTs across various automated industries,and growing application of this device in hybrid and electric vehicles.

A more than 150-page report is developed to help in your business decisions.

Pin Fin Heat Sink for IGBT by Segment

The study includes a forecast for the global pin fin heat sink for IGBT by material type, application, end use industry, technology, and region.

Pin Fin Heat Sink for IGBT Market by Material Type [Shipment Analysis by Value from 2018 to 2030]:

  • Aluminium
  • Copper

Pin Fin Heat Sink for IGBT Market by Application [Shipment Analysis by Value from 2018 to 2030]:

  • Automotive Field
  • Consumer Electronics

Pin Fin Heat Sink for IGBT Market by Region [Shipment Analysis by Value from 2018 to 2030]:

  • North America
  • Europe
  • Asia Pacific
  • The Rest of the World

List of Pin Fin Heat Sink for IGBT Companies

Companies in the market compete on the basis of product quality offered. Major players in this market focus on expanding their manufacturing facilities, R&D investments, infrastructural development, and leverage integration opportunities across the value chain. With these strategies pin fin heat sink for IGBT companies cater increasing demand, ensure competitive effectiveness, develop innovative products & technologies, reduce production costs, and expand their customer base. Some of the pin fin heat sink for IGBT companies profiled in this report include-

  • Honeywell International
  • Comair Rotron
  • Aavid Thermalloy
  • CUI
  • Apex Microtechnology
  • Allbrass Industrial
  • Kunshan Googe
  • Advanced Thermal Solutions

Pin Fin Heat Sink for IGBT Market Insights

Lucintel forecast that aluminium is expected to witness higher growth over the forecast period due to its significant use by manufacturers owing to its excellent thermal conductivity, flexibility, and cost-effectiveness.

Automotive field is expected to witness higher growth over the forecast perioddue to increasing demand for electric vehicles (EVS) and substantial integration of IGBT modules in automotive.

APAC is expected to witness highest growth over the forecast period due to rapid expansion of the automotive industry, rising demand for power supply equipment, and the emergence of home automation projects in the region.

Features of the Global Pin Fin Heat Sink for IGBT Market

Market Size Estimates: Pin fin heat sink for IGBT market size estimation in terms of value ($M).

Trend and forecast Analysis: Market trends (2018 to 2023) and forecast (2024 to 2030) by various segments and regions.

Segmentation Analysis: Pin fin heat sink for IGBT market size by material type, application, and region. in terms of value ($M).

Regional Analysis: Pin fin heat sink for IGBT market breakdown by North America, Europe, Asia Pacific, and Rest of the World.

Growth Opportunities: Analysis of growth opportunities in different material types, applications, and region.s for the pin fin heat sink for IGBT market.

Strategic Analysis: This includes M&A, new product development, and competitive landscape of the pin fin heat sink for IGBT market.

Analysis of competitive intensity of the industry based on Porter's Five forces model.

FAQ

Q.1. What is the pin fin heat sink for IGBT market size?

Answer: The global pin fin heat sink for IGBT market is expected to reach an estimated $1285.7 million by 2030.

Q.2. What is the growth forecast for pin fin heat sink for IGBT market?

Answer: The global pin fin heat sink for IGBT market is expected to grow with a CAGR of 5.6% from 2024 to 2030.

Q.3. What are the major drivers influencing the growth of the pin fin heat sink for IGBT market?

Answer: The major drivers for this market are increasing demand for efficient cooling solutions in modern electronics, rising use of IGBTs across various automated industries, and growing application of this device in hybrid and electric vehicles.

Q.4. What are the major segments for pin fin heat sink for IGBT market?

Answer: The future of the pin fin heat sink for IGBT market looks promising with opportunities in the automotive field and consumer electronic applications.

Q.5. Who are the key pin fin heat sink for IGBT market companies?

Answer: Some of the key pin fin heat sink for IGBT companies are as follows:

  • Honeywell International
  • Comair Rotron
  • Aavid Thermalloy
  • CUI
  • Apex Microtechnology
  • Allbrass Industrial
  • Kunshan Googe
  • Advanced Thermal Solutions

Q.6. Which pin fin heat sink for IGBT market segment will be the largest in future?

Answer: Lucintel forecast that aluminium is expected to witness higher growth over the forecast period due to its significant use by manufacturers owing to its excellent thermal conductivity, flexibility, and cost-effectiveness.

Q.7. In pin fin heat sink for IGBT market, which region is expected to be the largest in next 5 years?

Answer: APAC is expected to witness highest growth over the forecast period due to rapid expansion of the automotive industry, rising demand for power supply equipment, and the emergence of home automation projects in the region.

Q.8. Do we receive customization in this report?

Answer: Yes, Lucintel provides 10% customization without any additional cost.

This report answers following 11 key questions:

  • Q.1. What are some of the most promising, high-growth opportunities for the pin fin heat sink for IGBT market by material type (aluminium and copper), application (automotive field and consumer electronics), and region. (North America, Europe, Asia Pacific, and the Rest of the World)?
  • Q.2. Which segments will grow at a faster pace and why?
  • Q.3. Which region will grow at a faster pace and why?
  • Q.4. What are the key factors affecting market dynamics? What are the key challenges and business risks in this market?
  • Q.5. What are the business risks and competitive threats in this market?
  • Q.6. What are the emerging trends in this market and the reasons behind them?
  • Q.7. What are some of the changing demands of customers in the market?
  • Q.8. What are the new developments in the market? Which companies are leading these developments?
  • Q.9. Who are the major players in this market? What strategic initiatives are key players pursuing for business growth?
  • Q.10. What are some of the competing products in this market and how big of a threat do they pose for loss of market share by material or product substitution?
  • Q.11. What M&A activity has occurred in the last 5 years and what has its impact been on the industry?

Table of Contents

1. Executive Summary

2. Global Pin Fin Heat Sink for IGBT Market: Market Dynamics

  • 2.1: Introduction, Background, and Classifications
  • 2.2: Supply Chain
  • 2.3: Industry Drivers and Challenges

3. Market Trends and forecast Analysis from 2018 to 2030

  • 3.1. Macroeconomic Trends (2018-2023) and forecast (2024-2030)
  • 3.2. Global Pin Fin Heat Sink for IGBT Market Trends (2018-2023) and forecast (2024-2030)
  • 3.3: Global Pin Fin Heat Sink for IGBT Market by Material Type
    • 3.3.1: Aluminium
    • 3.3.2: Copper
  • 3.4: Global Pin Fin Heat Sink for IGBT Market by Application
    • 3.4.1: Automotive Field
    • 3.4.2: Consumer Electronics

4. Market Trends and forecast Analysis by Region from 2018 to 2030

  • 4.1: Global Pin Fin Heat Sink for IGBT Market by Region
  • 4.2: North American Pin Fin Heat Sink for IGBT Market
    • 4.2.1: North American Pin Fin Heat Sink for IGBT Market by Material Type: Aluminium and Copper
    • 4.2.2: North American Pin Fin Heat Sink for IGBT Market by Application: Automotive Field and Consumer Electronics
  • 4.3: European Pin Fin Heat Sink for IGBT Market
    • 4.3.1: European Pin Fin Heat Sink for IGBT Market by Material Type: Aluminium and Copper
    • 4.3.2: European Pin Fin Heat Sink for IGBT Market by Application: Automotive Field and Consumer Electronics
  • 4.4: APAC Pin Fin Heat Sink for IGBT Market
    • 4.4.1: APAC Pin Fin Heat Sink for IGBT Market by Material Type: Aluminium and Copper
    • 4.4.2: APAC Pin Fin Heat Sink for IGBT Market by Application: Automotive Field and Consumer Electronics
  • 4.5: ROW Pin Fin Heat Sink for IGBT Market
    • 4.5.1: ROW Pin Fin Heat Sink for IGBT Market by Material Type: Aluminium and Copper
    • 4.5.2: ROW Pin Fin Heat Sink for IGBT Market by Application: Automotive Field and Consumer Electronics

5. Competitor Analysis

  • 5.1: Product Portfolio Analysis
  • 5.2: Operational Integration
  • 5.3: Porter's Five forces Analysis

6. Growth Opportunities and Strategic Analysis

  • 6.1: Growth Opportunity Analysis
    • 6.1.1: Growth Opportunities for the Global Pin Fin Heat Sink for IGBT Market by Material Type
    • 6.1.2: Growth Opportunities for the Global Pin Fin Heat Sink for IGBT Market by Application
    • 6.1.3: Growth Opportunities for the Global Pin Fin Heat Sink for IGBT Market by Region
  • 6.2: Emerging Trends in the Global Pin Fin Heat Sink for IGBT Market
  • 6.3: Strategic Analysis
    • 6.3.1: New Product Development
    • 6.3.2: Capacity Expansion of the Global Pin Fin Heat Sink for IGBT Market
    • 6.3.3: Mergers, Acquisitions, and Joint Ventures in the Global Pin Fin Heat Sink for IGBT Market
    • 6.3.4: Certification and Licensing

7. Company Profiles of Leading Players

  • 7.1: Honeywell International
  • 7.2: Comair Rotron
  • 7.3: Aavid Thermalloy
  • 7.4: CUI
  • 7.5: Apex Microtechnology
  • 7.6: Allbrass Industrial
  • 7.7: Kunshan Googe
  • 7.8: Advanced Thermal Solutions