2025-2033 年嵌入式晶片封裝技術市場（按平台、垂直產業和地區分類）

2024年，全球嵌入式晶片封裝技術IMARC Group規模達到1.026億美元。不斷成長的半導體行業以及攜帶式電子設備銷售的成長正在推動市場發展。

嵌入式晶片封裝技術用於透過多步驟製造製程將組件嵌入基板內。它包括覆晶尺寸封裝（FC CSP）和晶圓級晶片尺寸封裝（WL CSP），以提高系統的效率。它透過縮小印刷電路板 (PCB) 中的整體解決方案，為其他組件創造更多空間。它還提供表面貼裝技術 (SMT) 整合和靈活的佈線解決方案，以縮小印刷電路板 (PCB) 尺寸。它提供從 2D 轉變為 3D 的設計靈活性，同時減少失真和功耗。因此，嵌入式晶片封裝技術在全球電子、資訊和技術 (IT)、汽車、醫療保健和電信行業中得到廣泛應用。

嵌入式晶片封裝技術市場趨勢：

目前，世界範圍內微電子裝置中的電子電路的小型化程度不斷提高。這與蓬勃發展的半導體產業一起，是推動市場的關鍵因素之一。此外，嵌入式晶片封裝技術還具有多種優勢，例如昇級的電氣和熱性能、異質整合以及原始設備製造商 (OEM) 的簡化物流，這些都有助於市場的成長。此外，各行業也擴大採用自主機器人提供專業服務，為產業投資者提供了利潤豐厚的成長機會。除此之外，智慧型手機和穿戴式裝置中擴大利用嵌入式晶片封裝技術來擴大可用空間並整合更多組件，這對市場產生了積極影響。此外，全球範圍內對整合物聯網 (IoT) 的嵌入式晶片封裝技術的需求也在增加。再加上筆記型電腦、電腦、平板電腦、電子閱讀器、智慧型手機、MP3播放器、無人機和電子玩具等攜帶式電子設備銷售的不斷成長，正在推動市場的成長。

本報告回答的關鍵問題

• 2024 年全球嵌入式晶片封裝技術市場規模有多大？ 2025-2033年全球嵌入式晶片封裝技術市場的預期成長率是多少？
• 推動全球嵌入式晶片封裝技術市場的關鍵因素是什麼？
• COVID-19 對全球嵌入式晶片封裝技術市場有何影響？
• 基於該平台的全球嵌入式晶片封裝技術市場的詳細情形如何？
• 基於垂直產業的全球嵌入式晶片封裝技術市場的詳細情形如何？
• 全球嵌入式晶片封裝技術市場的關鍵區域有哪些？
• 全球嵌入式晶片封裝技術市場的主要參與者/公司有哪些？

目錄

第1章：前言

第 2 章：範圍與方法

• 研究目的
• 利害關係人
• 數據來源
  • 主要來源
  • 二手資料
• 市場預測
  • 自下而上的方法
  • 自上而下的方法
• 預測方法

第 3 章：執行摘要

第 4 章：簡介

• 概述
• 主要行業趨勢

第 5 章：全球嵌入式晶片封裝技術市場

• 市場概況
• 市場表現
• COVID-19 的影響
• 市場預測

第 6 章：市場區隔：依平台

• IC 封裝基板中的嵌入式晶片
  • 市場趨勢
  • 市場預測
• 剛性板中的嵌入式晶片
  • 市場趨勢
  • 市場預測
• 軟性板中的嵌入式晶片
  • 市場趨勢
  • 市場預測

第 7 章：市場區隔：依垂直產業

• 消費性電子產品
  • 市場趨勢
  • 市場預測
• 資訊科技和電信
  • 市場趨勢
  • 市場預測
• 汽車
  • 市場趨勢
  • 市場預測
• 衛生保健
  • 市場趨勢
  • 市場預測
• 其他
  • 市場趨勢
  • 市場預測

第 8 章：市場區隔：按地區

• 北美洲
  • 美國
  • 加拿大
• 亞太
  • 中國
  • 日本
  • 印度
  • 韓國
  • 澳洲
  • 印尼
  • 其他
• 歐洲
  • 德國
  • 法國
  • 英國
  • 義大利
  • 西班牙
  • 俄羅斯
  • 其他
• 拉丁美洲
  • 巴西
  • 墨西哥
  • 其他
• 中東和非洲
  • 市場趨勢
  • 市場細分：按國家/地區
  • 市場預測

第 9 章：SWOT 分析

• 概述
• 優勢
• 弱點
• 機會
• 威脅

第 10 章：價值鏈分析

第 11 章：波特五力分析

• 概述
• 買家的議價能力
• 供應商的議價能力
• 競爭程度
• 新進入者的威脅
• 替代品的威脅

第 12 章：價格分析

第13章：競爭格局

• 市場結構
• 關鍵參與者
• 關鍵參與者簡介
  • Amkor Technology Inc.
  • ASE Technology Holding Co. Ltd.
  • AT & S Austria Technologie & Systemtechnik Aktiengesellschaft
  • Fujikura Ltd.
  • Infineon Technologies AG
  • Microsemi Corporation (Microchip Technology Inc.)
  • Schweizer Electronic AG
  • TDK Electronics AG (TDK Corporation)

The global embedded die packaging technology market size reached USD 102.6 Million in 2024. Looking forward, IMARC Group expects the market to reach USD 266.1 Million by 2033, exhibiting a growth rate (CAGR) of 10.62% during 2025-2033. The increasing semiconductor industry, along with the growing sales of portable electronic devices, are propelling the market.

Embedded die packaging technology is used to embed components inside the substrate via a multi-step manufacturing process. It comprises flip-chip chip scale packaging (FC CSP) and wafer-level chip scale packaging (WL CSP) to improve the efficiency of the system. It creates more space for other components by shrinking overall solutions in the printed circuit board (PCB). It also provides surface-mount technology (SMT) integration and a flexible routing solution to reduce printed circuit board (PCB) size. It offers design flexibility that shifts from 2D to 3D while reducing distortion and power loss. As a result, embedded die packaging technology finds extensive application in electronics, information and technology (IT), automotive, healthcare, and telecommunication industries across the globe.

Embedded Die Packaging Technology Market Trends:

At present, there is an increase in the miniaturization of electronic circuits in microelectronic devices around the world. This, along with the burgeoning semiconductor industry, represents one of the key factors driving the market. Moreover, embedded die packaging technology offers several benefits, such as upgraded electrical and thermal performance, heterogeneous integration, and streamlined logistics for original equipment manufacturers (OEMs), which are contributing to the growth of the market. In addition, the increasing adoption of autonomous robots for professional services in various industries is offering lucrative growth opportunities to industry investors. Besides this, the growing utilization of embedded die packaging technology in smartphones and wearable devices to enhance the available space and integrate more components is positively influencing the market. Additionally, there is a rise in the demand for embedded die packaging technology with integrated internet of things (IoT) across the globe. This, coupled with the increasing sales of portable electronic devices, such as laptops, computers, tablets, e-readers, smartphones, MP3 players, drones, and electronic toys, is bolstering the growth of the market.

Key Market Segmentation:

Breakup by Platform:

Embedded Die in IC Package Substrate

Embedded Die in Rigid Board

Embedded Die in Flexible Board

Breakup by Industry Vertical:

Consumer Electronics

IT and Telecommunication

Automotive

Healthcare

Others

Breakup by Region:

North America

United States

Canada

Asia-Pacific

China

Japan

India

South Korea

Australia

Indonesia

Others

Europe

Germany

France

United Kingdom

Italy

Spain

Russia

Others

Latin America

Brazil

Mexico

Others

Middle East and Africa

Competitive Landscape:

The competitive landscape of the industry has also been examined along with the profiles of the key players being Amkor Technology Inc., ASE Technology Holding Co. Ltd., AT & S Austria Technologie & Systemtechnik Aktiengesellschaft, Fujikura Ltd., Infineon Technologies AG, Microsemi Corporation (Microchip Technology Inc.), Schweizer Electronic AG and TDK Electronics AG (TDK Corporation). Kindly, note that this only represents a partial list of companies, and the complete list has been provided in the report.

Key Questions Answered in This Report

• 1. What was the size of the global embedded die packaging technology market in 2024?
• 2. What is the expected growth rate of the global embedded die packaging technology market during 2025-2033?
• 3. What are the key factors driving the global embedded die packaging technology market?
• 4. What has been the impact of COVID-19 on the global embedded die packaging technology market?
• 5. What is the breakup of the global embedded die packaging technology market based on the platform?
• 6. What is the breakup of the global embedded die packaging technology market based on the industry vertical?
• 7. What are the key regions in the global embedded die packaging technology market?
• 8. Who are the key players/companies in the global embedded die packaging technology market?

Table of Contents

1 Preface

2 Scope and Methodology

• 2.1 Objectives of the Study
• 2.2 Stakeholders
• 2.3 Data Sources
  • 2.3.1 Primary Sources
  • 2.3.2 Secondary Sources
• 2.4 Market Estimation
  • 2.4.1 Bottom-Up Approach
  • 2.4.2 Top-Down Approach
• 2.5 Forecasting Methodology

3 Executive Summary

4 Introduction

• 4.1 Overview
• 4.2 Key Industry Trends

5 Global Embedded Die Packaging Technology Market

• 5.1 Market Overview
• 5.2 Market Performance
• 5.3 Impact of COVID-19
• 5.4 Market Forecast

6 Market Breakup by Platform

• 6.1 Embedded Die in IC Package Substrate
  • 6.1.1 Market Trends
  • 6.1.2 Market Forecast
• 6.2 Embedded Die in Rigid Board
  • 6.2.1 Market Trends
  • 6.2.2 Market Forecast
• 6.3 Embedded Die in Flexible Board
  • 6.3.1 Market Trends
  • 6.3.2 Market Forecast

7 Market Breakup by Industry Vertical

• 7.1 Consumer Electronics
  • 7.1.1 Market Trends
  • 7.1.2 Market Forecast
• 7.2 IT and Telecommunication
  • 7.2.1 Market Trends
  • 7.2.2 Market Forecast
• 7.3 Automotive
  • 7.3.1 Market Trends
  • 7.3.2 Market Forecast
• 7.4 Healthcare
  • 7.4.1 Market Trends
  • 7.4.2 Market Forecast
• 7.5 Others
  • 7.5.1 Market Trends
  • 7.5.2 Market Forecast

8 Market Breakup by Region

• 8.1 North America
  • 8.1.1 United States
    • 8.1.1.1 Market Trends
    • 8.1.1.2 Market Forecast
  • 8.1.2 Canada
    • 8.1.2.1 Market Trends
    • 8.1.2.2 Market Forecast
• 8.2 Asia-Pacific
  • 8.2.1 China
    • 8.2.1.1 Market Trends
    • 8.2.1.2 Market Forecast
  • 8.2.2 Japan
    • 8.2.2.1 Market Trends
    • 8.2.2.2 Market Forecast
  • 8.2.3 India
    • 8.2.3.1 Market Trends
    • 8.2.3.2 Market Forecast
  • 8.2.4 South Korea
    • 8.2.4.1 Market Trends
    • 8.2.4.2 Market Forecast
  • 8.2.5 Australia
    • 8.2.5.1 Market Trends
    • 8.2.5.2 Market Forecast
  • 8.2.6 Indonesia
    • 8.2.6.1 Market Trends
    • 8.2.6.2 Market Forecast
  • 8.2.7 Others
    • 8.2.7.1 Market Trends
    • 8.2.7.2 Market Forecast
• 8.3 Europe
  • 8.3.1 Germany
    • 8.3.1.1 Market Trends
    • 8.3.1.2 Market Forecast
  • 8.3.2 France
    • 8.3.2.1 Market Trends
    • 8.3.2.2 Market Forecast
  • 8.3.3 United Kingdom
    • 8.3.3.1 Market Trends
    • 8.3.3.2 Market Forecast
  • 8.3.4 Italy
    • 8.3.4.1 Market Trends
    • 8.3.4.2 Market Forecast
  • 8.3.5 Spain
    • 8.3.5.1 Market Trends
    • 8.3.5.2 Market Forecast
  • 8.3.6 Russia
    • 8.3.6.1 Market Trends
    • 8.3.6.2 Market Forecast
  • 8.3.7 Others
    • 8.3.7.1 Market Trends
    • 8.3.7.2 Market Forecast
• 8.4 Latin America
  • 8.4.1 Brazil
    • 8.4.1.1 Market Trends
    • 8.4.1.2 Market Forecast
  • 8.4.2 Mexico
    • 8.4.2.1 Market Trends
    • 8.4.2.2 Market Forecast
  • 8.4.3 Others
    • 8.4.3.1 Market Trends
    • 8.4.3.2 Market Forecast
• 8.5 Middle East and Africa
  • 8.5.1 Market Trends
  • 8.5.2 Market Breakup by Country
  • 8.5.3 Market Forecast

9 SWOT Analysis

• 9.1 Overview
• 9.2 Strengths
• 9.3 Weaknesses
• 9.4 Opportunities
• 9.5 Threats

10 Value Chain Analysis

11 Porters Five Forces Analysis

• 11.1 Overview
• 11.2 Bargaining Power of Buyers
• 11.3 Bargaining Power of Suppliers
• 11.4 Degree of Competition
• 11.5 Threat of New Entrants
• 11.6 Threat of Substitutes

12 Price Analysis

13 Competitive Landscape

• 13.1 Market Structure
• 13.2 Key Players
• 13.3 Profiles of Key Players
  • 13.3.1 Amkor Technology Inc.
    • 13.3.1.1 Company Overview
    • 13.3.1.2 Product Portfolio
    • 13.3.1.3 Financials
    • 13.3.1.4 SWOT Analysis
  • 13.3.2 ASE Technology Holding Co. Ltd.
    • 13.3.2.1 Company Overview
    • 13.3.2.2 Product Portfolio
    • 13.3.2.3 Financials
  • 13.3.3 AT & S Austria Technologie & Systemtechnik Aktiengesellschaft
    • 13.3.3.1 Company Overview
    • 13.3.3.2 Product Portfolio
    • 13.3.3.3 Financials
  • 13.3.4 Fujikura Ltd.
    • 13.3.4.1 Company Overview
    • 13.3.4.2 Product Portfolio
    • 13.3.4.3 Financials
    • 13.3.4.4 SWOT Analysis
  • 13.3.5 Infineon Technologies AG
    • 13.3.5.1 Company Overview
    • 13.3.5.2 Product Portfolio
    • 13.3.5.3 Financials
    • 13.3.5.4 SWOT Analysis
  • 13.3.6 Microsemi Corporation (Microchip Technology Inc.)
    • 13.3.6.1 Company Overview
    • 13.3.6.2 Product Portfolio
    • 13.3.6.3 SWOT Analysis
  • 13.3.7 Schweizer Electronic AG
    • 13.3.7.1 Company Overview
    • 13.3.7.2 Product Portfolio
    • 13.3.7.3 Financials
  • 13.3.8 TDK Electronics AG (TDK Corporation)
    • 13.3.8.1 Company Overview
    • 13.3.8.2 Product Portfolio

Kindly, note that this only represents a partial list of companies, and the complete list has been provided in the report

List of Figures

• Figure 1: Global: Embedded Die Packaging Technology Market: Major Drivers and Challenges
• Figure 2: Global: Embedded Die Packaging Technology Market: Sales Value (in Million USD), 2019-2024
• Figure 3: Global: Embedded Die Packaging Technology Market Forecast: Sales Value (in Million USD), 2025-2033
• Figure 4: Global: Embedded Die Packaging Technology Market: Breakup by Platform (in %), 2024
• Figure 5: Global: Embedded Die Packaging Technology Market: Breakup by Industry Vertical (in %), 2024
• Figure 6: Global: Embedded Die Packaging Technology Market: Breakup by Region (in %), 2024
• Figure 7: Global: Embedded Die Packaging Technology (Embedded Die in IC Package Substrate) Market: Sales Value (in Million USD), 2019 & 2024
• Figure 8: Global: Embedded Die Packaging Technology (Embedded Die in IC Package Substrate) Market Forecast: Sales Value (in Million USD), 2025-2033
• Figure 9: Global: Embedded Die Packaging Technology (Embedded Die in Rigid Board) Market: Sales Value (in Million USD), 2019 & 2024
• Figure 10: Global: Embedded Die Packaging Technology (Embedded Die in Rigid Board) Market Forecast: Sales Value (in Million USD), 2025-2033
• Figure 11: Global: Embedded Die Packaging Technology (Embedded Die in Flexible Board) Market: Sales Value (in Million USD), 2019 & 2024
• Figure 12: Global: Embedded Die Packaging Technology (Embedded Die in Flexible Board) Market Forecast: Sales Value (in Million USD), 2025-2033
• Figure 13: Global: Embedded Die Packaging Technology (Consumer Electronics) Market: Sales Value (in Million USD), 2019 & 2024
• Figure 14: Global: Embedded Die Packaging Technology (Consumer Electronics) Market Forecast: Sales Value (in Million USD), 2025-2033
• Figure 15: Global: Embedded Die Packaging Technology (IT and Telecommunication) Market: Sales Value (in Million USD), 2019 & 2024
• Figure 16: Global: Embedded Die Packaging Technology (IT and Telecommunication) Market Forecast: Sales Value (in Million USD), 2025-2033
• Figure 17: Global: Embedded Die Packaging Technology (Automotive) Market: Sales Value (in Million USD), 2019 & 2024
• Figure 18: Global: Embedded Die Packaging Technology (Automotive) Market Forecast: Sales Value (in Million USD), 2025-2033
• Figure 19: Global: Embedded Die Packaging Technology (Healthcare) Market: Sales Value (in Million USD), 2019 & 2024
• Figure 20: Global: Embedded Die Packaging Technology (Healthcare) Market Forecast: Sales Value (in Million USD), 2025-2033
• Figure 21: Global: Embedded Die Packaging Technology (Other Industry Verticals) Market: Sales Value (in Million USD), 2019 & 2024
• Figure 22: Global: Embedded Die Packaging Technology (Other Industry Verticals) Market Forecast: Sales Value (in Million USD), 2025-2033
• Figure 23: North America: Embedded Die Packaging Technology Market: Sales Value (in Million USD), 2019 & 2024
• Figure 24: North America: Embedded Die Packaging Technology Market Forecast: Sales Value (in Million USD), 2025-2033
• Figure 25: United States: Embedded Die Packaging Technology Market: Sales Value (in Million USD), 2019 & 2024
• Figure 26: United States: Embedded Die Packaging Technology Market Forecast: Sales Value (in Million USD), 2025-2033
• Figure 27: Canada: Embedded Die Packaging Technology Market: Sales Value (in Million USD), 2019 & 2024
• Figure 28: Canada: Embedded Die Packaging Technology Market Forecast: Sales Value (in Million USD), 2025-2033
• Figure 29: Asia-Pacific: Embedded Die Packaging Technology Market: Sales Value (in Million USD), 2019 & 2024
• Figure 30: Asia-Pacific: Embedded Die Packaging Technology Market Forecast: Sales Value (in Million USD), 2025-2033
• Figure 31: China: Embedded Die Packaging Technology Market: Sales Value (in Million USD), 2019 & 2024
• Figure 32: China: Embedded Die Packaging Technology Market Forecast: Sales Value (in Million USD), 2025-2033
• Figure 33: Japan: Embedded Die Packaging Technology Market: Sales Value (in Million USD), 2019 & 2024
• Figure 34: Japan: Embedded Die Packaging Technology Market Forecast: Sales Value (in Million USD), 2025-2033
• Figure 35: India: Embedded Die Packaging Technology Market: Sales Value (in Million USD), 2019 & 2024
• Figure 36: India: Embedded Die Packaging Technology Market Forecast: Sales Value (in Million USD), 2025-2033
• Figure 37: South Korea: Embedded Die Packaging Technology Market: Sales Value (in Million USD), 2019 & 2024
• Figure 38: South Korea: Embedded Die Packaging Technology Market Forecast: Sales Value (in Million USD), 2025-2033
• Figure 39: Australia: Embedded Die Packaging Technology Market: Sales Value (in Million USD), 2019 & 2024
• Figure 40: Australia: Embedded Die Packaging Technology Market Forecast: Sales Value (in Million USD), 2025-2033
• Figure 41: Indonesia: Embedded Die Packaging Technology Market: Sales Value (in Million USD), 2019 & 2024
• Figure 42: Indonesia: Embedded Die Packaging Technology Market Forecast: Sales Value (in Million USD), 2025-2033
• Figure 43: Others: Embedded Die Packaging Technology Market: Sales Value (in Million USD), 2019 & 2024
• Figure 44: Others: Embedded Die Packaging Technology Market Forecast: Sales Value (in Million USD), 2025-2033
• Figure 45: Europe: Embedded Die Packaging Technology Market: Sales Value (in Million USD), 2019 & 2024
• Figure 46: Europe: Embedded Die Packaging Technology Market Forecast: Sales Value (in Million USD), 2025-2033
• Figure 47: Germany: Embedded Die Packaging Technology Market: Sales Value (in Million USD), 2019 & 2024
• Figure 48: Germany: Embedded Die Packaging Technology Market Forecast: Sales Value (in Million USD), 2025-2033
• Figure 49: France: Embedded Die Packaging Technology Market: Sales Value (in Million USD), 2019 & 2024
• Figure 50: France: Embedded Die Packaging Technology Market Forecast: Sales Value (in Million USD), 2025-2033
• Figure 51: United Kingdom: Embedded Die Packaging Technology Market: Sales Value (in Million USD), 2019 & 2024
• Figure 52: United Kingdom: Embedded Die Packaging Technology Market Forecast: Sales Value (in Million USD), 2025-2033
• Figure 53: Italy: Embedded Die Packaging Technology Market: Sales Value (in Million USD), 2019 & 2024
• Figure 54: Italy: Embedded Die Packaging Technology Market Forecast: Sales Value (in Million USD), 2025-2033
• Figure 55: Spain: Embedded Die Packaging Technology Market: Sales Value (in Million USD), 2019 & 2024
• Figure 56: Spain: Embedded Die Packaging Technology Market Forecast: Sales Value (in Million USD), 2025-2033
• Figure 57: Russia: Embedded Die Packaging Technology Market: Sales Value (in Million USD), 2019 & 2024
• Figure 58: Russia: Embedded Die Packaging Technology Market Forecast: Sales Value (in Million USD), 2025-2033
• Figure 59: Others: Embedded Die Packaging Technology Market: Sales Value (in Million USD), 2019 & 2024
• Figure 60: Others: Embedded Die Packaging Technology Market Forecast: Sales Value (in Million USD), 2025-2033
• Figure 61: Latin America: Embedded Die Packaging Technology Market: Sales Value (in Million USD), 2019 & 2024
• Figure 62: Latin America: Embedded Die Packaging Technology Market Forecast: Sales Value (in Million USD), 2025-2033
• Figure 63: Brazil: Embedded Die Packaging Technology Market: Sales Value (in Million USD), 2019 & 2024
• Figure 64: Brazil: Embedded Die Packaging Technology Market Forecast: Sales Value (in Million USD), 2025-2033
• Figure 65: Mexico: Embedded Die Packaging Technology Market: Sales Value (in Million USD), 2019 & 2024
• Figure 66: Mexico: Embedded Die Packaging Technology Market Forecast: Sales Value (in Million USD), 2025-2033
• Figure 67: Others: Embedded Die Packaging Technology Market: Sales Value (in Million USD), 2019 & 2024
• Figure 68: Others: Embedded Die Packaging Technology Market Forecast: Sales Value (in Million USD), 2025-2033
• Figure 69: Middle East and Africa: Embedded Die Packaging Technology Market: Sales Value (in Million USD), 2019 & 2024
• Figure 70: Middle East and Africa: Embedded Die Packaging Technology Market: Breakup by Country (in %), 2024
• Figure 71: Middle East and Africa: Embedded Die Packaging Technology Market Forecast: Sales Value (in Million USD), 2025-2033
• Figure 72: Global: Embedded Die Packaging Technology Industry: SWOT Analysis
• Figure 73: Global: Embedded Die Packaging Technology Industry: Value Chain Analysis
• Figure 74: Global: Embedded Die Packaging Technology Industry: Porter's Five Forces Analysis

List of Tables

• Table 1: Global: Embedded Die Packaging Technology Market: Key Industry Highlights, 2024 and 2033
• Table 2: Global: Embedded Die Packaging Technology Market Forecast: Breakup by Platform (in Million USD), 2025-2033
• Table 3: Global: Embedded Die Packaging Technology Market Forecast: Breakup by Industry Vertical (in Million USD), 2025-2033
• Table 4: Global: Embedded Die Packaging Technology Market Forecast: Breakup by Region (in Million USD), 2025-2033
• Table 5: Global: Embedded Die Packaging Technology Market: Competitive Structure
• Table 6: Global: Embedded Die Packaging Technology Market: Key Players