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市場調查報告書
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1356572

嵌入式晶片封裝技術市場報告：至2030年的趨勢、預測與競爭分析

Embedded Die Packaging Technology Market Report: Trends, Forecast and Competitive Analysis to 2030
出版日期: | 出版商: Lucintel | 英文 150 Pages | 商品交期: 3個工作天內

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簡介目錄

嵌入式晶片封裝技術市場趨勢與預測

預計到2030年，全球嵌入式晶片封裝技術市場將達到 8.2 億美元，2024年至2030年年複合成長率為 27.1%。該市場的主要促進因素是微電子設備中電路小型化的需求不斷成長，專業服務中自主機器人的採用不斷增加，以及全球對消費性電子和 5G 網路技術的需求不斷成長。全球嵌入式晶片封裝技術市場前景廣闊，家用電子電器、IT/通訊、汽車和醫療保健市場蘊藏商機。

嵌入式晶片封裝技術市場洞察

Lucintel 預測，在預測期內，軟性基板中的晶片嵌入將經歷最高的成長。

家用電子電器將繼續成為該市場的最大細分市場。

預計北美地區在預測期內將出現最高的成長。

本報告回答了 11 個關鍵問題：

  • Q.1.細分市場中最有前途和高成長的機會為何？
  • Q.2.哪個細分市場將以更快的速度成長？理由為何？
  • Q.3.哪些地區未來會出現更快的成長？理由為何？
  • Q.4.影響市場動態的主要因素有哪些？市場的主要挑戰和業務風險是什麼？
  • Q.5.這個市場的商業風險和競爭威脅為何？
  • Q.6.這個市場有哪些新趨勢？理由為何？
  • Q.7.市場客戶需求有何改變？
  • Q.8.該市場有哪些新發展以及哪些公司處於領先地位？
  • Q.9.這個市場的主要企業有哪些？主要企業採取哪些策略配合措施來發展業務？
  • Q.10.該市場上的競爭產品有哪些？由於材料或產品替代而導致市場佔有率下降的威脅有多大？
  • Q.11.過去年度發生了哪些併購事件，對產業產生了哪些影響？

目錄

第1章 執行摘要

第2章 全球嵌入式晶片封裝技術市場：市場動態

  • 簡介、背景、分類
  • 供應鏈
  • 產業促進因素與挑戰

第3章 2018-2030年市場趨勢及預測分析

  • 宏觀經濟趨勢（2018-2023）與預測（2024-2030）
  • 全球嵌入式晶片封裝技術市場趨勢（2018-2023）與預測（2024-2030）
  • 按平台分類的全球嵌入式晶片封裝技術市場
    • IC 封裝基板中的嵌入式晶片
    • 剛性板中的嵌入式晶片
    • 軟性基板的嵌入式晶片
  • 全球嵌入式晶片封裝技術市場，依最終用途產業
    • 家用電器
    • 資訊科技/通訊
    • 汽車
    • 衛生保健
    • 其他

第4章 2018-2030年市場趨勢及預測分析，依地區

  • 全球嵌入式晶片封裝技術市場，依地區
  • 北美嵌入式晶片封裝技術市場
  • 歐洲嵌入式晶片封裝技術市場
  • 其他區域嵌入式晶片封裝技術市場

第5章 競爭分析

  • 產品系列分析
  • 營運整合
  • 波特五力分析

第6章 成長機會與策略分析

  • 成長機會分析
    • 全球嵌入式晶片封裝技術市場成長機會，依平台
    • 全球嵌入式晶片封裝技術市場成長機會，依最終用途產業
    • 全球嵌入式晶片封裝技術市場成長機會，依區域
  • 全球嵌入式晶片封裝技術市場的新興趨勢
  • 戰略分析
    • 新產品開發
    • 擴大全球嵌入式晶片封裝技術市場的產能
    • 全球嵌入式晶片封裝技術市場的合併、收購與合資企業
    • 認證和許可

第7章 主要企業概況

  • Amkor Technology
  • TDK Corporation
  • Microsemi
  • ASE Group
  • AT&S
  • General Electric
  • Taiwan Semiconductor
  • Infenion Technologies
  • Schweizer Electronic
  • Fujikura
簡介目錄

Embedded Die Packaging Technology Market Trends and Forecast

The future of the global embedded die packaging technology market looks promising with opportunities in the consumer electronic, it and telecommunication, automotive, and healthcare markets. The global embedded die packaging technology market is expected to reach an estimated $0.82 billion by 2030 with a CAGR of 27.1% from 2024 to 2030. The major drivers for this market are growing requirement for circuit miniaturization in the microelectronic devices, rising adoption of autonomous robots for professional services, and increase in demand for consumer electronics and 5G network technology across the globe.

A more than 150-page report is developed to help in your business decisions.

Embedded Die Packaging Technology Market by Segment

The study includes a forecast for the global embedded die packaging technology market by platform, end use industry, and region.

Embedded Die Packaging Technology Market by Platform [Shipment Analysis by Value from 2018 to 2030]:

  • Embedded Die in IC Package Substrate
  • Embedded Die in Rigid Board
  • Embedded Die in Flexible Board

Embedded Die Packaging Technology Market by End Use Industry [Shipment Analysis by Value from 2018 to 2030]:

  • Consumer Electronics
  • IT and Telecommunication
  • Automotive
  • Healthcare
  • Others

Embedded Die Packaging Technology Market by Region [Shipment Analysis by Value from 2018 to 2030]:

  • North America
  • Europe
  • Asia Pacific
  • The Rest of the World

List of Embedded Die Packaging Technology Companies

Companies in the market compete on the basis of product quality offered. Major players in this market focus on expanding their manufacturing facilities, R&D investments, infrastructural development, and leverage integration opportunities across the value chain. With these strategies embedded die packaging technology companies cater increasing demand, ensure competitive effectiveness, develop innovative products & technologies, reduce production costs, and expand their customer base. Some of the embedded die packaging technology companies profiled in this report include-

  • Amkor Technology
  • TDK Corporation
  • Microsemi
  • ASE Group
  • AT&S
  • General Electric
  • Taiwan Semiconductor
  • Infenion Technologies
  • Schweizer Electronic
  • Fujikura

Embedded Die Packaging Technology Market Insights

Lucintel forecasts that embedded die in flexible board is expected to witness highest growth over the forecast period.

Within this market, consumer electronics will remain the largest segment.

North America is expected to witness highest growth over the forecast period.

Features of the Global Embedded Die Packaging Technology Market

Market Size Estimates: Embedded die packaging technology market size estimation in terms of value ($B).

Trend and Forecast Analysis: Market trends (2018 to 2023) and forecast (2024 to 2030) by various segments and regions.

Segmentation Analysis: Embedded die packaging technology market size by platform, end use industry, and region. in terms of value ($B).

Regional Analysis: Embedded die packaging technology market breakdown by North America, Europe, Asia Pacific, and Rest of the World.

Growth Opportunities: Analysis of growth opportunities in different platforms, end use industries, and region.s for the embedded die packaging technology market.

Strategic Analysis: This includes M&A, new product development, and competitive landscape of the embedded die packaging technology market.

Analysis of competitive intensity of the industry based on Porter's Five Forces model.

FAQ

Q.1. What is the embedded die packaging technology market size?

Answer: The global embedded die packaging technology market is expected to reach an estimated $0.82 billion by 2030.

Q.2. What is the growth forecast for the embedded die packaging technology market?

Answer: The global embedded die packaging technology market is expected to grow with a CAGR of 27.1% from 2024 to 2030.

Q.3. What are the major drivers influencing the growth of the embedded die packaging technology market?

Answer: The major drivers for this market are growing requirement for circuit miniaturization in the microelectronic devices, rising adoption of autonomous robots for professional services, and increase in demand for consumer electronics and 5G network technology across the globe.

Q.4. What are the major segments for the embedded die packaging technology market?

Answer: The future of the global embedded die packaging technology market looks promising with opportunities in the consumer electronic, it and telecommunication, automotive, and healthcare markets.

Q.5. Who are the key embedded die packaging technology market companies?

Answer: Some of the key embedded die packaging technology companies are as follows:

  • Amkor Technology
  • TDK Corporation
  • Microsemi
  • ASE Group
  • AT&S
  • General Electric
  • Taiwan Semiconductor
  • Infenion Technologies
  • Schweizer Electronic
  • Fujikura

Q.6. Which embedded die packaging technology market segment will be the largest in future?

Answer: Lucintel forecasts that embedded die in flexible board is expected to witness highest growth over the forecast period.

Q.7. In embedded die packaging technology market, which region is expected to be the largest in next 5 years?

Answer: North America is expected to witness highest growth over the forecast period.

Q.8. Do we receive customization in this report?

Answer: Yes, Lucintel provides 10% customization without any additional cost.

This report answers following 11 key questions:

  • Q.1. What are some of the most promising, high-growth opportunities for the embedded die packaging technology market by platform (embedded die in IC package substrate, embedded die in rigid board, and embedded die in flexible board), by end use industry (consumer electronics, IT and telecommunication, automotive, healthcare, and others), and region. (North America, Europe, Asia Pacific, and the Rest of the World)?
  • Q.2. Which segments will grow at a faster pace and why?
  • Q.3. Which region will grow at a faster pace and why?
  • Q.4. What are the key factors affecting market dynamics? What are the key challenges and business risks in this market?
  • Q.5. What are the business risks and competitive threats in this market?
  • Q.6. What are the emerging trends in this market and the reasons behind them?
  • Q.7. What are some of the changing demands of customers in the market?
  • Q.8. What are the new developments in the market? Which companies are leading these developments?
  • Q.9. Who are the major players in this market? What strategic initiatives are key players pursuing for business growth?
  • Q.10. What are some of the competing products in this market and how big of a threat do they pose for loss of market share by material or product substitution?
  • Q.11. What M&A activity has occurred in the last 5 years and what has its impact been on the industry?

Table of Contents

1. Executive Summary

2. Global Embedded Die Packaging Technology Market : Market Dynamics

  • 2.1: Introduction, Background, and Classifications
  • 2.2: Supply Chain
  • 2.3: Industry Drivers and Challenges

3. Market Trends and Forecast Analysis from 2018 to 2030

  • 3.1. Macroeconomic Trends (2018-2023) and Forecast (2024-2030)
  • 3.2. Global Embedded Die Packaging Technology Market Trends (2018-2023) and Forecast (2024-2030)
  • 3.3: Global Embedded Die Packaging Technology Market by Platform
    • 3.3.1: Embedded Die in IC Package Substrate
    • 3.3.2: Embedded Die in Rigid Board
    • 3.3.3: Embedded Die in Flexible Board
  • 3.4: Global Embedded Die Packaging Technology Market by End Use Industry
    • 3.4.1: Consumer Electronics
    • 3.4.2: IT and Telecommunication
    • 3.4.3: Automotive
    • 3.4.4: Healthcare
    • 3.4.5: Others

4. Market Trends and Forecast Analysis by Region from 2018 to 2030

  • 4.1: Global Embedded Die Packaging Technology Market by Region
  • 4.2: North American Embedded Die Packaging Technology Market
    • 4.2.1: North American Embedded Die Packaging Technology Market by Platform: Embedded Die in IC Package Substrate, Embedded Die in Rigid Board, and Embedded Die in Flexible Board
    • 4.2.2: North American Embedded Die Packaging Technology Market by End Use Industry: Consumer Electronics, IT and Telecommunication, Automotive, Healthcare, and Others
  • 4.3: European Embedded Die Packaging Technology Market
    • 4.3.1: European Embedded Die Packaging Technology Market by Platform: Embedded Die in IC Package Substrate, Embedded Die in Rigid Board, and Embedded Die in Flexible Board
    • 4.3.2: European Embedded Die Packaging Technology Market by End Use Industry: Consumer Electronics, IT and Telecommunication, Automotive, Healthcare, and Others
    • 4.4.1: APAC Embedded Die Packaging Technology Market by Platform: Embedded Die in IC Package Substrate, Embedded Die in Rigid Board, and Embedded Die in Flexible Board
    • 4.4.2: APAC Embedded Die Packaging Technology Market by End Use Industry: Consumer Electronics, IT and Telecommunication, Automotive, Healthcare, and Others
  • 4.5: ROW Embedded Die Packaging Technology Market
    • 4.5.1: ROW Embedded Die Packaging Technology Market by Platform: Embedded Die in IC Package Substrate, Embedded Die in Rigid Board, and Embedded Die in Flexible Board\
    • 4.5.2: ROW Embedded Die Packaging Technology Market by End Use Industry: Consumer Electronics, IT and Telecommunication, Automotive, Healthcare, and Others

5. Competitor Analysis

  • 5.1: Product Portfolio Analysis
  • 5.2: Operational Integration
  • 5.3: Porter's Five Forces Analysis

6. Growth Opportunities and Strategic Analysis

  • 6.1: Growth Opportunity Analysis
    • 6.1.1: Growth Opportunities for the Global Embedded Die Packaging Technology Market by Platform
    • 6.1.2: Growth Opportunities for the Global Embedded Die Packaging Technology Market by End Use Industry
    • 6.1.3: Growth Opportunities for the Global Embedded Die Packaging Technology Market Region
  • 6.2: Emerging Trends in the Global Embedded Die Packaging Technology Market
  • 6.3: Strategic Analysis
    • 6.3.1: New Product Development
    • 6.3.2: Capacity Expansion of the Global Embedded Die Packaging Technology Market
    • 6.3.3: Mergers, Acquisitions, and Joint Ventures in the Global Embedded Die Packaging Technology Market
    • 6.3.4: Certification and Licensing

7. Company Profiles of Leading Players

  • 7.1: Amkor Technology
  • 7.2: TDK Corporation
  • 7.3: Microsemi
  • 7.4: ASE Group
  • 7.5: AT&S
  • 7.6: General Electric
  • 7.7: Taiwan Semiconductor
  • 7.8: Infenion Technologies
  • 7.9: Schweizer Electronic
  • 7.10: Fujikura